KR20110017521A - Unit for transferring a substrate and apparatus for processing a substrate having the unit - Google Patents

Unit for transferring a substrate and apparatus for processing a substrate having the unit Download PDF

Info

Publication number
KR20110017521A
KR20110017521A KR1020090075027A KR20090075027A KR20110017521A KR 20110017521 A KR20110017521 A KR 20110017521A KR 1020090075027 A KR1020090075027 A KR 1020090075027A KR 20090075027 A KR20090075027 A KR 20090075027A KR 20110017521 A KR20110017521 A KR 20110017521A
Authority
KR
South Korea
Prior art keywords
substrate
substrates
posts
chamber
transfer
Prior art date
Application number
KR1020090075027A
Other languages
Korean (ko)
Inventor
유재현
윤창로
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020090075027A priority Critical patent/KR20110017521A/en
Publication of KR20110017521A publication Critical patent/KR20110017521A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Robotics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The substrate transfer unit of the substrate processing apparatus includes a base, a pair of posts, and a plurality of support bars. Posts are provided on the base spaced apart by a distance greater than the width of the substrate to pass through the substrate. The support bars are fixed to be spaced apart by a predetermined interval along the vertical direction of the posts on opposite sides of the posts, and support the substrate so that the substrates are stacked in the vertical direction.

Description

Unit for transferring a substrate and apparatus for processing a substrate having the unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer unit and a substrate processing apparatus having the same, and more particularly, to a substrate transfer unit and a substrate processing apparatus having the same, for carrying out a processing process for the substrate.

In general, the liquid crystal display device and the solar cell device are formed by repeatedly performing unit processes such as a deposition process, a photo process, an etching process, and a cleaning process on a substrate such as glass. The above processes are each performed in a substrate processing apparatus.

According to the related art, the substrate processing apparatus is provided with a load lock chamber in which the substrates are waiting, a process chamber in which a process for the substrate is performed, and a space between the load lock chamber and the process chamber to provide a space for transferring the substrates. It includes a transfer chamber. The transfer chamber is provided with a substrate transfer robot that transfers the substrates of the load lock chamber to the process chamber or transfers the substrates of the process chamber to the load lock chamber.

Since the substrate processing apparatus includes the process chamber, the transfer chamber, and the load lock chamber, the layout of the substrate processing apparatus is long and takes up a lot of space. In addition, the layout of the substrate processing apparatus is long, which takes a long time for the substrate to be transferred from the load lock chamber to the process chamber. Therefore, the process efficiency of the substrate processing apparatus can be lowered.

The present invention provides a substrate transfer unit that is easy to mount a substrate.

The present invention provides a substrate processing apparatus having the substrate transfer unit.

The substrate transfer unit according to the present invention has a base and a pair of posts provided on the base spaced apart by a distance larger than the width of the substrate so that the substrate passes and the upper and lower sides of the posts on opposite sides of the posts. A plurality of support bars may be fixed to be spaced apart by a predetermined distance along a direction and support the substrate so that the substrate is stacked in the vertical direction.

According to one embodiment of the invention, the posts are provided to be movable in a direction parallel to the upper surface of the base.

According to one embodiment of the present invention, each post is fixed to the first post and the support bar provided in the base, it can be connected to the first post to be movable in the vertical direction.

A substrate processing apparatus according to the present invention includes a process chamber providing a space for processing a plurality of substrates, a transfer chamber provided at one side of the process chamber, and providing a space for transferring the substrates, and an interior of the transfer chamber. And a substrate transfer unit configured to transfer the substrates to the process chamber or to transfer the substrates from the process chamber, wherein the substrate transfer unit includes a base disposed on a bottom surface of the transfer chamber and the substrate passes therethrough. A pair of posts spaced apart by an interval greater than the width of the substrate and provided on the base to be movable in parallel with the upper surface of the base and the side surfaces of the posts facing each other along a vertical direction of the post The substrate is spaced apart by an interval, and the substrate is laminated in the vertical direction It may include a plurality of support bars for supporting.

According to one embodiment of the invention, the substrate transfer apparatus is provided on one side of the transfer chamber, further comprises a transfer arm for transferring the substrate with the substrate transfer unit, the transfer arm is space between the posts The substrates may be loaded into the support bars or unloaded from the support bars.

According to the invention, the substrate can be loaded directly into the substrate transfer unit of the transfer chamber. Therefore, the substrate processing apparatus can be configured as a process chamber and a transfer chamber without a load lock chamber in which the substrate is waiting. Therefore, the layout of the substrate processing apparatus can be reduced to reduce the space occupied by the substrate processing apparatus.

In addition, the substrate may be transferred to the process chamber immediately after loading the substrate in the substrate transfer unit, thereby reducing the time required to transfer the substrate to the process chamber. Therefore, the process efficiency of the said substrate processing apparatus can be improved.

Hereinafter, a substrate transfer unit and a substrate processing apparatus having the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate processing apparatus 100 is to perform a processing process on a plurality of substrates 10, and includes a process chamber 110, a transfer chamber 120, a substrate transfer unit 130, and Transfer arm 140.

The process chamber 110 provides a space for performing a processing process on the substrates 10. The process chamber 110 may have a hollow box shape.

Although not shown, a gas supply unit may be connected to the process chamber 110. The gas supply unit supplies a gas for treating the substrates 10 to the process chamber 110 according to the type of processing performed in the process chamber 110. For example, when the treatment process is a deposition process, the gas supply unit supplies a source gas for deposition to the process chamber 110. When the treatment process is an etching process, the gas supply unit supplies an etching gas to the process chamber 110.

The process chamber 110 has support members 112 for supporting the substrates 10. The support members 112 are formed of a plurality of pairs, and are provided on one side wall of the process chamber 110. The support members 112 extend in a direction parallel to the bottom surface of the process chamber 110, and are spaced apart by a predetermined interval along the vertical direction of the one side wall. Therefore, the substrates 10 may be stacked in the vertical direction by the support members 112. The treatment process is performed in the process chamber 110 in a state in which the substrates 10 are stacked in the vertical direction.

In addition, the process chamber 110 has a first gate 114 for entering and exiting the substrate 10. The first gate 114 is provided on the other side wall of the process chamber 110 opposite to the side wall on which the support members 112 are provided. The substrates 10 may enter and exit at the same time through the first gate 114.

The transfer chamber 120 is disposed to contact the process chamber 110. For example, the transfer chamber 120 is disposed to contact the other side wall having the first gate 114. The transfer chamber 120 provides a space for transferring the substrates 10 to the process chamber 110 or for transporting the substrates 10 from the process chamber 110.

The transfer chamber 120 has a second gate 122. The second gate 122 is disposed on one side wall of the transfer chamber 120 to face the first gate 114. The substrates 10 enter and exit the transfer chamber 120 through the second gate 122.

The substrate transfer unit 130 is provided inside the transfer chamber 120, transfers the substrates 10 to the process chamber 110, and transfers the substrates 10 on which the treatment process is completed to the process chamber. It returns from 110.

FIG. 2 is a perspective view illustrating the substrate transfer unit illustrated in FIG. 1.

1 and 2, the substrate transfer unit 130 includes a base 131, a pair of posts 133, and a plurality of support bars 135.

The base 131 is disposed on the bottom of the transfer chamber 120. The base 131 has a rectangular flat plate shape.

The first guide rail 132 is provided on the base 131 and extends between the first gate 114 and the second gate 122.

The pair of posts 133 are disposed on both sides of an upper surface of the base 131 adjacent to the second gate 122. The spacing between the posts 133 is greater than the width of the substrates 10. Thus, the substrates 10 may pass between the posts 133.

A connection member 134 is provided on the base 131 to connect the posts 133. In addition, the connection member 134 may move on the base 131 along the first guide rail 132. Accordingly, the posts 133 may also move to be parallel to the top surface of the base 131.

The posts 133 each include a first post 133a, a second guide rail 133b, and a second post 133c.

The first post 133a is disposed on the base 131.

The second guide rail 133b is disposed along an up and down direction of the first post 133a on an inner side surface of the first post 133a facing each other.

The second post 133 is connected to the inner surface of the first post 133a and may move in the vertical direction along the second guide rail 133b.

The support bars 135 are fixed to a surface where the posts 133 face each other, specifically, a surface where the second posts 133c face each other. The support bars 135 are formed of a plurality of pairs, extend in a direction parallel to the upper surface of the base 131, and are spaced apart by a predetermined interval along the vertical direction of the second post 133c. The support bars 135 support both bottom surfaces of the substrates 10. Therefore, the support bars 135 may support the substrates 10 stacked in the vertical direction.

On the other hand, the support bars 135 may be coated with a material having a high friction force. Examples of such materials include teflon, rubber, and the like. Therefore, the substrates 10 may be prevented from being separated from the support bars 135.

As the posts 133 move in parallel with the upper surface of the base 131, the substrates 10 supported by the support bars 135 also move toward the process chamber 110 or the process chamber 110. Can be returned.

In addition, as the second posts 133c move in the vertical direction, the substrates 10 supported by the support bars 135 may also move in the vertical direction. Accordingly, the substrate transfer unit 130 loads the substrates 10 into the support members 112 of the process chamber 110, or loads the substrates 10 into the support member 112 of the process chamber 110. Can be unloaded from

The vertical spacing of the support bars 135 is substantially the same as the vertical space of the support members 112. When the vertical spacing of the support bars 135 is different from each other, the substrates 10 supported by the support bars 135 are stably loaded on the support members 112. Difficult to do

In addition, the horizontal spacing of the support bars 135 may be different from the horizontal spacing of the support members 112. For example, the horizontal spacing of the support bars 135 may be wider than the horizontal spacing of the support members 112. Therefore, when the support bars 135 move up and down for loading and unloading the substrates 10, the support bars 135 may be prevented from colliding with the support member 112.

Although the support bars 135 are described as directly supporting the substrates 10, a plurality of protrusions protruding from the support bars 135 toward opposite support bars 135 of the same height are provided. The protrusions may support the substrates 10.

The transfer arm 140 is disposed on one side of the transfer chamber 120. For example, the transfer arm 140 is disposed on one side of the second gate 122. The transfer arm 140 transfers the substrate transfer unit 130 and the substrates 10 through the second gate 122.

The transfer chamber 120 provides a space for transferring the substrates 10 to the process chamber 110 or for transporting the substrates 10 from the process chamber 110. Since the spacing between the posts 133 is greater than the width of the substrates 10, the transfer arm 140 may support the jib bars of the substrate transfer unit 130 through the spaces between the posts 133. The substrates 10 may be directly loaded into the 135, or the substrates 10 may be directly unloaded from the support bar 135.

Accordingly, the substrate processing apparatus 100 may configure a layout only to the process chamber 110 and the transfer chamber 120 without a separate load lock chamber that provides a space for waiting the substrates 10. . Therefore, the layout of the substrate processing apparatus 100 may be reduced to reduce the space occupied by the substrate processing apparatus 100.

In addition, since the substrate 10 is directly loaded into the substrate transfer unit 130, the time required for transferring the substrates 10 to the process chamber 110 may be reduced. Therefore, the process efficiency of the substrate processing apparatus 100 can be improved.

Hereinafter, the operation of the substrate processing apparatus 100 will be described.

First, the second gate 122 of the transfer chamber 120 is opened, and the transfer arm 140 directly loads the substrates 10 into the support bars 135 through the spaces between the posts 133. The transfer arm 140 may load the substrates one by one or multiple at the same time.

When the substrates 10 are loaded on the support bars 135, the second gate 122 is blocked and the first gate 114 of the process chamber 110 is opened. Thereafter, the posts 133 move toward the process chamber 110 to transfer the substrate 10 into the process chamber 110. Next, the substrates 10 supported by the support bars 135 are loaded on the support members 112 while the second posts 133c move downward.

When the substrates 10 are loaded on the support members 112, the posts 133 are moved away from the process chamber 110 and the first gate 114 is blocked. Thereafter, a process of treating the substrates 10 is performed in the process chamber 110.

When the treatment process is completed, the first gate 114 of the process chamber 110 is opened. Thereafter, the posts 133 are moved toward the process chamber 110 to position the support bars 135 inside the process chamber 110. Next, the substrates 10 supported by the support members 112 are loaded on the support bars 135 while the second posts 133c move upward.

When the substrates 10 having completed the processing process are supported by the support bars 135, the posts 133 are moved away from the process chamber 110 to move the substrates 10 to the transfer chamber 120. ).

Thereafter, the first gate 114 is blocked and the second gate 122 is opened. The transfer arm 140 unloads the substrates 10 directly from the support bars 135 through a space between the posts 133.

Since the substrates 10 are directly loaded into the substrate transfer unit 130 through the spaces between the posts 133 as described above, the time required for transferring the substrates 10 to the process chamber 110 may be reduced. It may be reduced, and the process efficiency of the substrate processing apparatus 100 may be improved.

According to the invention, the substrate can be loaded directly into the substrate transfer unit of the transfer chamber. Therefore, the substrate processing apparatus can be configured as a process chamber and a transfer chamber without a load lock chamber in which the substrate is waiting. Therefore, the layout of the substrate processing apparatus can be reduced to reduce the space occupied by the substrate processing apparatus.

In addition, the substrate may be transferred to the process chamber immediately after loading the substrate in the substrate transfer unit, thereby reducing the time required to transfer the substrate to the process chamber. Therefore, the process efficiency of the said substrate processing apparatus can be improved.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating the substrate transfer unit illustrated in FIG. 1.

Explanation of symbols on the main parts of the drawings

100 substrate processing apparatus 110 process chamber

112: support member 114: first gate

120: transfer chamber 122: second gate

130: substrate transfer unit 132: base

134: post 134a: first post

134b: second post 136: support bar

10: substrate

Claims (5)

Base; A pair of posts provided on the base spaced apart by an interval greater than the width of the substrate so that the substrate passes; And A plurality of support bars which are fixed to the side surfaces of the posts facing each other by a predetermined interval along the vertical direction of the post and support the substrate so that the substrate is stacked in the vertical direction Transfer unit. The substrate transfer unit of claim 1, wherein the posts are movable in a direction parallel to an upper surface of the base. The method of claim 1, wherein each of the posts, A first post provided in the base; And The support bar is fixed, the substrate transfer unit, characterized in that connected to the first post to be movable in the vertical direction. A process chamber providing space for processing a plurality of substrates; A transfer chamber provided at one side of the process chamber and providing a space for transferring the substrates; And A substrate transfer unit provided inside the transfer chamber and transferring the substrate between the process chamber and the transfer chamber, The substrate transfer unit A base disposed at the bottom of the transfer chamber; A pair of posts spaced apart from each other by a width greater than the width of the substrate so as to pass through the substrate, and movable on the base in a direction parallel to an upper surface of the base; And A plurality of support bars which are fixed on the opposite surface of the posts at regular intervals along the vertical direction of the post and support the substrate so that the substrates are stacked in the vertical direction. Device. According to claim 4, It is provided on one side of the transfer chamber, further comprising a transfer arm for transferring the substrate with the substrate transfer unit, And the transfer arm loads the substrates into the support bars or unloads the substrates from the support bars through the spaces between the posts.
KR1020090075027A 2009-08-14 2009-08-14 Unit for transferring a substrate and apparatus for processing a substrate having the unit KR20110017521A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090075027A KR20110017521A (en) 2009-08-14 2009-08-14 Unit for transferring a substrate and apparatus for processing a substrate having the unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090075027A KR20110017521A (en) 2009-08-14 2009-08-14 Unit for transferring a substrate and apparatus for processing a substrate having the unit

Publications (1)

Publication Number Publication Date
KR20110017521A true KR20110017521A (en) 2011-02-22

Family

ID=43775490

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090075027A KR20110017521A (en) 2009-08-14 2009-08-14 Unit for transferring a substrate and apparatus for processing a substrate having the unit

Country Status (1)

Country Link
KR (1) KR20110017521A (en)

Similar Documents

Publication Publication Date Title
KR100514624B1 (en) Substrate sorting device and method
JP6039260B2 (en) Substrate transfer system
KR100577622B1 (en) Device for temporarily loading, keeping and unloading a container
JP5068738B2 (en) Substrate processing apparatus and method
JP4711770B2 (en) Conveying apparatus, vacuum processing apparatus, and conveying method
KR101229010B1 (en) Substrate processing system
KR101999439B1 (en) Substrate alignment apparatus, substrate processing apparatus, substrate arrangement apparatus, substrate alignment method, substrate processing method, and substrate arrangement method
JP2005033180A (en) Cassette for housing glass plate
JP2012023195A (en) Substrate processing apparatus, and substrate transfer method
KR102025472B1 (en) Posture changing device
KR100855203B1 (en) Test Tray and Test Handler Device using the same
KR20110127448A (en) Substrate processing apparatus
KR101812221B1 (en) Apparatus for stocking work
KR20110017521A (en) Unit for transferring a substrate and apparatus for processing a substrate having the unit
KR101239825B1 (en) cassette unit for LCD glass carrying
JP2013184717A (en) Substrate transporting tray, method of transporting substrate, method of taking out substrate, and method of storing substrate
JP2009029604A (en) Substrate carrying device
JP5952007B2 (en) Substrate processing apparatus and substrate processing method
CN107564830B (en) Semiconductor processing equipment group and semiconductor processing equipment
JP2007039158A (en) Conveying device and vacuum treatment device
KR200469263Y1 (en) Glass substrate transport apparatus
KR100909988B1 (en) Carrier transfer device and substrate cleaning system having same
JP3483842B2 (en) Wafer cleaning apparatus and wafer cleaning method
KR101034375B1 (en) Transfer robot and apparatus for processing a substrate having the transfer robot
JP5877878B2 (en) Work loader

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application