JP5952007B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention relates to a technique for processing a disk-shaped substrate.

  Conventionally, a substrate processing apparatus for processing a substrate using a processing liquid such as pure water or a chemical solution has been used. For example, in the substrate processing apparatus of Patent Document 1, a plurality of upright substrates arranged in parallel to each other are used. It arrange | positions in a processing tank and the process by a process liquid is collectively performed with respect to a several board | substrate. At this time, in the apparatus of Patent Document 1, a pair of support members (handling units) that support the substrate from both sides in the horizontal width direction along the main surface of the substrate and support the upright substrate from below. The substrate is transferred to the (support portion), and the claw portion is lowered from above the treatment tank, so that the substrate is immersed in the treatment liquid stored in the treatment tank.

JP 2001-135710 A

  By the way, when the substrate placed on the claw portion enters the processing liquid from outside the processing liquid as in Patent Document 1, an unnecessary object adhering to the claw portion (for example, when the substrate is placed, etc.) (Small unnecessary matter generated by rubbing the part and the substrate) may cause streak-like dirt extending in the vertical direction on the main surface of the substrate. Although it is conceivable that the substrate is transported to the vicinity of the bottom of the processing tank by the pair of support members and the substrate is immersed in the processing liquid, in this case, the substrate can be released by the pair of support members in the vicinity of the bottom. Therefore, it is necessary to increase the width of the treatment tank, and the consumption of the treatment liquid increases.

  The present invention has been made in view of the above problems, and an object thereof is to prevent the occurrence of the streak-like stains on the substrate and reduce the consumption of the processing liquid.

The invention according to claim 1 is a substrate processing apparatus for processing a plate-shaped substrate, wherein a processing tank in which processing liquid is stored, and a claw portion that supports the substrate in an upright state in the processing tank from below. A lifting / lowering unit that raises and lowers the substrate between a liquid processing position in which the claw part is disposed in the vicinity of the bottom of the processing tank and a delivery position in which the claw part is disposed in the vicinity of the upper part of the processing tank. And a pair of support members capable of changing the horizontal width direction along the main surface of the substrate in an upright state, while supporting the substrate, and between the transfer position and the delivery position above the processing tank And a transfer unit that lifts and lowers the substrate, and a control unit that transfers the substrate from the transfer position to the delivery position by the transfer unit, and places the substrate on the claw portion located in the processing liquid. and a section, center the that put in the vertical direction of the substrate disposed in the liquid processing position In downward from location, the inner surface distance between the processing bath in the width direction, the support member the sum of the widths of both support members which is a value obtained by adding the width of the substrate of the transfer portion - than the substrate total width even rather small, the inner surface distance between the top of the processing tank, is possible width support and release of the substrate by the pair of support members.

Invention of claim 2, a substrate processing apparatus according to claim 1, being supported by the claw portion a plurality of substrates of upright aligned in parallel to each other, wherein the processing tank, the liquid processing position And a guide for supporting outer edge portions of the plurality of substrates at a central position in the up-down direction of the plurality of substrates arranged in the vertical direction.

According to a third aspect of the invention, a substrate processing apparatus according to claim 1 or 2, wherein the processing tank is disposed within a chamber having a closable opening at the top, the said processing bath A gas ejection part for ejecting a processing gas toward the substrate disposed at the delivery position in a state where the processing liquid is discharged, the transfer position being above the chamber, and the vertical direction The distance between the liquid processing position and the delivery position is smaller than the width of the substrate.

According to a fourth aspect of the present invention, there is provided a substrate processing method for processing a plate-like substrate in a substrate processing apparatus, wherein the substrate processing apparatus applies a processing tank and an upright substrate in the processing tank from below. A claw portion for supporting the substrate between a liquid processing position where the claw portion is disposed near the bottom of the processing tank and a delivery position where the claw portion is disposed near the upper portion of the processing tank. The substrate is supported by a lifting unit that moves up and down and a pair of support members that can change the horizontal width direction along the main surface of the substrate in an upright state, and the transfer position and the delivery that are above the processing tank and a transfer unit for lifting the substrate between a position, in the lower from the central position among that put in the vertical direction of the substrate disposed the liquid processing position, the inner surface of the processing tank in the width direction The distance between the above is the sum of the widths of the two support members of the transfer section. The support member is a value obtained by adding the width of the plate - smaller than the substrate total width, the inter inner surface distance of the top of the processing tank, be a pair of supporting the support and release is possible width of the substrate by the members The substrate processing method includes: a) storing the processing liquid in the processing tank; b) transferring the substrate from the transfer position to the delivery position by the transfer unit; And placing the substrate on the claw portion.

  According to the present invention, it is possible to prevent streak-like dirt generated on the substrate when the claw portion on which the substrate is placed enters the processing liquid from outside the processing liquid. Further, the substrate can be placed on the claw portion without excessively immersing the transfer portion in the treatment liquid, and the consumption of the treatment liquid can be reduced by downsizing the treatment tank.

In the invention of claim 2 , it is possible to prevent each substrate from being bent and coming into contact with an adjacent substrate. According to the third aspect of the present invention, the height of the chamber can be reduced in the substrate processing apparatus that also performs processing with the processing gas.

It is a top view of a substrate processing unit. It is a figure which shows the internal structure of a drying process part. It is a figure which shows the flow of a process of the board | substrate in a drying process part. It is a figure which shows the apparatus of a comparative example. It is a figure which shows the drying process part which concerns on related technology .

  FIG. 1 is a plan view of the substrate processing unit 1. The substrate processing unit 1 is a so-called batch type apparatus that collectively performs processing with a processing solution such as pure water or a chemical solution on a plurality of disc-shaped silicon substrates 9 (hereinafter simply referred to as “substrates 9”). It is. In FIG. 1, the X direction, the Y direction, and the Z direction perpendicular to each other are indicated by arrows.

  The substrate processing unit 1 is roughly divided into a control unit 10, a cassette holding unit 11, a posture changing unit 12, and a processing unit 2. The cassette holding unit 11, the posture changing unit 12 and the processing unit 2 are divided by the control unit 10. Be controlled. In the cassette holding unit 11, there is a cassette 90 that accommodates a plurality of substrates 9 in a horizontal state (horizontal posture in which the main surface faces the vertical direction) stacked in the vertical direction (vertical direction, Z direction in FIG. 1). Retained. In the posture conversion unit 12, the plurality of substrates 9 before processing are unloaded from the cassette 90, and the postures of the plurality of substrates 9 are converted to an upright state (upright posture in which the main surface faces in the horizontal direction) and are arranged in parallel to each other. A plurality of upright substrates 9 are delivered to the processing unit 2. The plurality of substrates 9 processed by the processing unit 2 are transferred from the processing unit 2 to the posture converting unit 12 in an upright state, and the plurality of substrates 9 are converted into a horizontal state, and then the plurality of substrates are converted. 9 are collectively returned to the cassette 90 of the cassette holder 11.

  The processing unit 2 includes a main transport mechanism 21, a transfer unit cleaning unit 22, a first chemical processing unit 23, a second chemical processing unit 24, and a drying processing unit 3, and includes a first chemical processing unit 23, The 2nd chemical | medical solution process part 24, the drying process part 3, and the transfer part washing | cleaning part 22 are arranged in the Y direction in FIG. 1 in this order. The first chemical liquid processing unit 23 includes a first chemical liquid tank 231 in which a predetermined chemical liquid is stored, a first rinse liquid tank 232 in which a rinse liquid is stored, and the first chemical liquid tank 231 to the first rinse liquid tank 232. And a first lifter 233 that collectively transports the plurality of substrates 9. Similarly to the first chemical solution processing unit 23, the second chemical solution processing unit 24 also includes a second chemical solution tank 241 that stores a predetermined chemical solution, a second rinse solution tank 242 that stores a rinse solution, and a second chemical solution tank. And a second lifter 243 that collectively conveys the plurality of substrates 9 from the 241 to the second rinse liquid tank 242.

  The main transport mechanism 21 includes a transfer unit 211 that supports and lifts the plurality of substrates 9, and a transfer unit moving mechanism 212 that moves the transfer unit 211 in the horizontal Y direction in FIG. The transfer unit 211 includes a pair of support arms 213 arranged at intervals in the Y direction, an arm drive unit that changes the distance between the pair of support arms 213, and an arm that moves the pair of support arms 213 up and down in the Z direction. And an elevating part. A support member 214 that is long in the X direction is provided below each support arm 213, and a plurality of grooves are formed in the support member 214 at a constant pitch in the X direction. The arm drive unit changes the distance between the pair of support members 214 (that is, the distance between the pair of support members 214) by rotating each support arm 213 about an axis parallel to the X direction. .

  In the substrate processing unit 1, a plurality of substrates 9 are transported into the processing unit 2 by the attitude conversion unit 12 in an upright state in which the main surface is parallel to the YZ plane, and a pair of support members 214 capable of changing the interval in the Y direction. Thus, the plurality of substrates 9 are sandwiched from both sides in the Y direction along the main surface of the substrate 9 (more precisely, the edge of the substrate 9 is disposed in the groove) and supported. Actually, the interval between the pair of support members 214 is the width when the plurality of substrates 9 are sandwiched by the pair of support members 214 (the width is smaller than the diameter of the substrate 9 and is hereinafter referred to as “clamping width”). , And a width when the plurality of substrates 9 are released from the pair of support members 214 (a width larger than the diameter of the substrate 9, hereinafter referred to as “release width”).

  The transfer unit cleaning unit 22 includes two cleaning tanks 221 arranged in the Y direction. Each cleaning tank 221 is provided with a nozzle for ejecting cleaning liquid and a nozzle for ejecting nitrogen gas. When the transfer unit 211 is cleaned, the pair of support members 214 (and a part of the support arm 213) are disposed in the two cleaning tanks 221 respectively. Then, the support member 214 is cleaned with the cleaning liquid, and then the cleaning liquid attached to the support member 214 is removed with nitrogen gas (that is, the support member 214 is dried).

  When the substrate 9 is processed in each of the chemical solution processing units 23 and 24, the transfer unit 211 that sandwiches the plurality of substrates 9 is disposed above the chemical solution tanks 231 and 241 and the lifter 233 in the chemical solution tanks 231 and 241 is disposed. , 243 move upward. The lifters 233 and 243 are provided with a plurality of claw portions for supporting the upright substrate 9 from below, and after the substrate 9 abuts the claw portions, the distance between the pair of support members 214 is the release width. The plurality of substrates 9 are transferred from the transfer unit 211 to the lifters 233 and 243. In the chemical processing units 23 and 24, when the lifters 233 and 243 are lowered, a plurality of substrates 9 are arranged in the chemical baths 231 and 241, and processing with the chemicals is performed on the plurality of substrates 9 at a time.

  When the treatment with the chemical solution is completed, the lifters 233 and 243 are moved up, and subsequently moved above the rinse solution tanks 232 and 242. When the lifters 233 and 243 are lowered, the plurality of substrates 9 are arranged in the rinsing liquid tanks 232 and 242, and the treatment with the rinsing liquid is performed on the plurality of substrates 9 at once. When the treatment with the rinsing liquid is completed, the lifters 233 and 243 are raised, and the substrate 9 is disposed above the rinsing liquid tanks 232 and 242. At this time, the transfer unit 211 is also disposed above the rinse liquid tanks 232 and 242, and the plurality of substrates 9 are positioned between the pair of support members 214 whose intervals are widened to the release width. After the distance between the pair of support members 214 is narrowed to the clamping width, the lifters 233 and 243 are lowered to transfer the plurality of substrates 9 from the lifters 233 and 243 to the transfer unit 211.

  FIG. 2 is a diagram showing an internal configuration of the drying processing unit 3, and shows a cross section of the drying processing unit 3 in FIG. 1 cut along a plane perpendicular to the X direction. In addition, in FIG. 2, while showing a part of transfer part 211, the illustration of the parallel oblique line in a detail is abbreviate | omitted. The drying processing unit 3 includes a chamber 4 having an opening 40 at the top while processing the substrate 9 therein. A cover 41 that can be opened and closed is provided in the opening 40. That is, the opening 40 of the chamber 4 can be opened and closed. Inside the chamber 4, there are provided a processing tank 5 in which a predetermined processing liquid is stored, and an elevating part 6 for raising and lowering the substrate 9 in the chamber 4.

  The elevating part 6 has a plurality of claw parts 61 that are long in a direction perpendicular to the paper surface of FIG. 2 (X direction, hereinafter also referred to as “front-rear direction”), and ends of the plurality of claw parts 61 are fixed. A plate-like support main body 62 extending upward from the fixing position of the claw portion 61 and an elevating mechanism (not shown) for moving the support main body 62 in the vertical direction (Z direction) in FIG. In the elevating part 6, a plurality of upright substrates 9 (actually densely arranged in the front-rear direction) arranged in parallel to each other are supported from below by a plurality of claw parts 61. Further, the plurality of claw portions 61 are arranged in the vicinity of the bottom of the processing tank 5 by the lifting mechanism, so that the plurality of substrates 9 on the claw portion 61 are moved to the liquid processing position (the claw indicated by the two-dot chain line in FIG. 2). 2), the plurality of claws 61 are arranged in the vicinity of the upper portion of the processing tank 5, so that the plurality of substrates 9 on the claws 61 are in a delivery position (solid line in FIG. 2). It is located at a position supported by the claw portion 61 indicated by. That is, the lift unit 6 moves the plurality of substrates 9 up and down between the liquid processing position in the processing tank 5 and the delivery position in the vicinity of the upper part of the processing tank 5.

  The processing tank 5 has a substantially box shape with an open top, and the width of the upper part of the processing tank 5 in the Y direction (hereinafter referred to as “width direction”) in FIG. 2 is larger than the width of the lower part. Specifically, the width of the processing tank 5 changes slightly above the center position in the vertical direction of the substrate 9 disposed at the liquid processing position. The distance between the two inner side surfaces 50 of the processing tank 5 facing each other in the width direction is the distance between the inner side surfaces, and the distance between the inner side surfaces at the lower part of the processing tank 5 is approximately equal to the width or diameter of the substrate 9 (exactly speaking, , Slightly larger than the diameter.) In the present embodiment, the diameter of the substrate 9 is, for example, 450 mm (millimeters).

  Further, the distance between the inner side surfaces in the upper part of the processing tank 5 is larger than the total width of the support member and the substrate, which is a value obtained by adding the width of the support members 214 of the transfer unit 211 to the width of the substrate 9, that is, the diameter. The width is such that the pair of support members 214 that support the plurality of substrates 9 can enter. More specifically, the distance between the inner side surfaces in the upper part of the processing tank 5 is greater than the distance between the outer surfaces of the pair of support members 214 (surfaces opposite to the other support member 214) whose distance is widened to the release width. The width is such that the substrate 9 can be supported and released by the pair of support members 214. In each of the two inner side surfaces 50, comb-shaped guides 53 (a plurality of grooves) supporting the outer edge portions of the plurality of substrates 9 at the height of the center position in the vertical direction of the substrate 9 arranged at the liquid processing position. Are arranged at a constant pitch in the front-rear direction. The plurality of substrates 9 disposed at the liquid processing position are supported from below by a plurality of claw portions 61 disposed in the vicinity of the bottom of the processing tank 5 and are guided in the width direction by the guides 53 on the two inner side surfaces 50. Supported from both sides.

  In the vicinity of the bottom of the processing tank 5, a processing liquid nozzle 51 for supplying a processing liquid and a discharge valve 52 attached to the discharge port of the processing tank 5 are provided. The processing liquid nozzle 51 is connected to the processing liquid supply unit, and the discharge valve 52 is connected to the drainage processing unit via a discharge pipe.

  Inside the chamber 4, a plurality of (four in FIG. 1) gas ejection portions 7 that eject gas toward the plurality of substrates 9 at the delivery position are further provided. In each gas ejection portion 7, a plurality of ejection ports are arranged in the front-rear direction, and the gas can be ejected to the plurality of substrates 9 approximately uniformly. Each gas ejection section 7 is connected to a nitrogen gas supply section and an IPA (isopropyl alcohol) vapor supply section via a gas supply pipe which is a gas flow path, and can selectively eject nitrogen gas and IPA vapor. is there. Note that the IPA vapor contains nitrogen gas as a carrier gas.

  Next, processing of the substrate 9 in the drying processing unit 3 will be described with reference to FIG. In the drying processing unit 3, the substrate 9 after the processing in the first or second chemical processing unit 23, 24 is dried. In the processing of the substrate 9 in the drying processing unit 3 of FIG. 2, first, pure water is ejected as a processing liquid from the processing liquid nozzle 51, and the processing liquid is stored in the processing tank 5 (step S11). In addition, the plurality of substrates 9 processed in the chemical processing units 23 and 24 are transferred from the lifters 233 and 243 to the transfer unit 211 as described above (see FIG. 1). By moving in the Y direction, as shown in FIG. 2, the plurality of substrates 9 are transported to a position above the chamber 4 of the drying processing unit 3 (hereinafter referred to as “transport position”). Subsequently, the cover 41 of the chamber 4 is opened and the support arm 213 is lowered, whereby a plurality of substrates 9 are carried into the chamber 4.

  At this time, the processing liquid is filled up to the upper end of the processing tank 5, and the plurality of claw portions 61 at the delivery position are located in the processing liquid. The pair of support members 214 enters the inside of the upper part of the processing tank 5 (that is, enters the processing liquid), and the substrate 9 is transported to a delivery position near the upper part of the processing tank 5, It is placed on the plurality of claw portions 61 (step S12). The distance between the pair of support members 214 is widened to the release width, and then the support arm 213 is raised and retracted from the chamber 4. After retracting the support arm 213, the cover 41 is closed and the chamber 4 is approximately sealed.

  Subsequently, the plurality of substrates 9 are lowered by the elevating unit 6 and placed at the liquid processing position in the processing liquid (step S13). That is, the entirety of the plurality of substrates 9 is immersed in the processing liquid, and the substrate 9 is kept wet. Moreover, in the gas ejection part 7, the vapor | steam of IPA heated by predetermined temperature is ejected by predetermined flow rate. When the IPA vapor is filled in the chamber 4 after a predetermined time has elapsed from the start of the IPA vapor ejection (step S14), the treatment liquid in the treatment tank 5 is discharged in a short time by opening the discharge valve 52. (Step S15). And the some board | substrate 9 raises by the raising / lowering part 6, and is arrange | positioned in a delivery position (step S16). As a result, the IPA vapor is condensed on the surface of the substrate 9.

  Thereafter, the ejection of the IPA vapor is stopped, and the nitrogen gas heated to a predetermined temperature is ejected vigorously from the gas ejection section 7 (step S17). Further, the inside of the chamber 4 is decompressed by a decompression mechanism (not shown) connected to the chamber 4. As described above, in a state in which the processing liquid in the processing tank 5 is discharged (that is, in a state in which no processing liquid is present in the processing tank 5), the gas ejection unit is directed toward the substrate 9 disposed at the delivery position. The nitrogen gas is ejected from 7 and the pressure in the chamber 4 is reduced, so that IPA (including pure water) adhering to the surface of the substrate 9 is efficiently removed in a short time. The delivery position is also a gas processing position for drying the substrate 9 with nitrogen gas.

  When the ejection of nitrogen gas and the decompression of the chamber 4 are continued for a predetermined time, the decompression mechanism is stopped and the flow rate of the nitrogen gas is lowered. When the inside of the chamber 4 returns to atmospheric pressure, the cover 41 is opened. Subsequently, the support arm 213 disposed above the chamber 4 is lowered, and a pair of support members 214 whose intervals are widened to the release width are disposed on both outer sides in the width direction of the plurality of substrates 9 at the delivery position. The After the interval between the pair of support members 214 is narrowed to the clamping width, the elevating unit 6 is lowered, whereby the plurality of substrates 9 are transferred from the elevating unit 6 to the transfer unit 211. The pair of support members 214 is cleaned and dried by the transfer unit cleaning unit 22. Thereafter, when the support arm 213 is raised, the plurality of substrates 9 are unloaded from the chamber 4 and placed at the transfer position (step S18). Thereby, the process of the board | substrate 9 in the drying process part 3 is completed. In this embodiment, when the support member 214 of the transfer unit 211 is not desired to enter the processing liquid, the lifting / lowering unit 6 is raised until the claw unit 61 is completely separated from the liquid surface, and then the substrate is delivered. The operation to be performed can also be selected.

  FIG. 4 is a diagram illustrating an apparatus according to a comparative example. In the apparatus of the comparative example of FIG. 4, the substrate 91 at the delivery position (the substrate indicated by the solid line in FIG. 4) is supported by the claw portion 921 disposed outside the processing liquid in the processing tank 922, so When moving to the liquid processing position (the position of the substrate 91 indicated by the two-dot chain line), the claw portion 921 enters the processing liquid from the outside of the processing liquid and adheres to the claw portion 921 (for example, an unloading substrate). (Small unnecessary material generated by rubbing between the claw portion 921 and the substrate during placement or the like) may cause streak-like dirt extending in the vertical direction on the main surface of the substrate. In addition, when assuming a device of another comparative example that transports the substrate to the vicinity of the bottom of the processing tank and immerses the substrate in the processing liquid by the pair of support members, in such a device, the pair of supports is supported in the vicinity of the bottom. It is necessary to increase the width of the treatment tank so that the substrate can be released by the member, and the consumption of the treatment liquid increases.

  On the other hand, in the substrate processing apparatus realized by the cooperation of the drying processing unit 3, the transfer unit 211, and the control unit 10, the processing tank 5 has a central position in the vertical direction of the substrate 9 arranged at the liquid processing position. The distance between the inner side surfaces is smaller than the total width of the support member and the substrate, which is a value obtained by adding the sum of the widths of the two support members 214 of the transfer unit 211 to the width of the substrate 9, that is, the diameter. Then, when the substrate 9 is transferred from the transfer position above the processing tank 5 to the delivery position near the top of the processing tank 5 by the transfer section 211, the transfer section 211 is processed without being excessively immersed in the processing liquid. The substrate 9 is placed on the claw portion 61 located in the liquid. In such a substrate processing apparatus, it is possible to prevent streak-like dirt that may occur on the substrate when the claw portion on which the substrate is placed enters the processing liquid from outside the processing liquid. . Further, the consumption of the processing liquid can be reduced by downsizing the processing tank.

  In the apparatus of the comparative example in FIG. 4, the distance between the liquid processing position and the delivery position (the distance between the centers of the substrate indicated by the two-dot chain line and the substrate indicated by the solid line in FIG. 4) is the substrate. Since it is larger than the diameter, the height of the chamber 923 is increased. Therefore, in the apparatus for a large substrate, there is a possibility that trouble may occur in the transportation of the apparatus itself (transportation from the manufacturing place of the apparatus to the use place).

  On the other hand, in the drying processing unit 3, the substrate 9 is transferred from the transfer unit 211 to the claw unit 61 in a state where the claw unit 61 is disposed in the processing tank 5, and the liquid processing position and the delivery position in the vertical direction are transferred. Is smaller than the diameter of the substrate 9. Accordingly, the height of the chamber 4 can be reduced in the substrate processing apparatus that performs processing with the processing liquid and the processing gas, and an increase in the size of the substrate processing apparatus used for processing a large substrate can be suppressed (described later). The same applies to the drying processing unit 3a in FIG.

  By the way, when supporting a plurality of large-sized substrates 9 arranged in parallel with each other only by the claw portions 61, each substrate 9 is bent during the processing and comes into contact with the adjacent substrate 9, and is formed on the substrate 9. The pattern may be damaged. On the other hand, in the drying processing unit 3, the processing tank 5 has a guide 53 that supports the outer edge portions of the plurality of substrates 9 at the center position in the vertical direction of the plurality of substrates 9 arranged at the liquid processing position. Each substrate 9 can be prevented from bending and coming into contact with the adjacent substrate 9. In addition, it is difficult to provide such a guide in the apparatus of the other comparative example in which the substrate is transported to the vicinity of the bottom of the processing tank and the substrate is immersed in the processing liquid.

FIG. 5 is a diagram showing a drying processing unit according to the related art of the present invention . The drying processing unit 3a in FIG. 5 is different from the drying processing unit 3 in FIG. 2 only in the shape of the processing tank 5a. Other configurations are substantially the same as those in FIG. 2, and the same reference numerals are given to the same configurations.

  In the processing tank 5a of the drying processing unit 3a, the distance between the inner side surfaces, which is the distance between the inner side surfaces 50 facing in the width direction (Y direction), is constant throughout the processing tank 5a in the vertical direction. Approximately equal to the diameter (exactly, slightly larger than the diameter). In other words, in the entire processing tank 5a in the vertical direction, the distance between the inner side surfaces is the support member-substrate total width, which is a value obtained by adding the sum of the widths of both support members 214 of the transfer unit 211 to the diameter of the substrate 9. The width of the pair of support members 214 that support the plurality of substrates 9 is not allowed to enter. Also in the processing tank 5a, as in the processing tank 5, the guide 53 that supports the outer edges of the plurality of substrates 9 is disposed at the liquid processing position (the substrate 9 indicated by a two-dot chain line in FIG. 5). Is provided at a central position in the vertical direction.

  When the substrate 9 is transferred from the transfer position to the delivery position, as shown by the solid line in FIG. 5, the substrate is placed on the claw portion 61 positioned in the processing liquid without immersing the support member 214 in the processing liquid. 9 is placed. Therefore, when the claw portion on which the substrate is placed enters the processing liquid from outside the processing liquid, streak-like dirt generated on the substrate is prevented, and the support member 214 that supports the substrate 9 is provided from outside the processing liquid. It is also possible to prevent contamination (which may occur) on the substrate 9 when entering the processing liquid. Moreover, since the processing tank 5a is further reduced in size as compared with the processing tank 5 of FIG. 2, the consumption of the processing liquid can be further reduced. On the other hand, in the processing tank 5 of FIG. 2, the distance between the liquid processing position and the delivery position in the vertical direction can be shortened compared to the processing tank 5 a of FIG. be able to.

Above Symbol substrate processing apparatus, various modifications are possible.

  In the above embodiment, in the processing tanks 5 and 5a of both FIG. 2 and FIG. 5, the distance between the inner side surfaces of the processing tanks 5 and 5a is lower than the center position in the vertical direction of the substrate 9 disposed at the liquid processing position. Although the distance is smaller than the total width of the support member and the substrate, depending on the design of the treatment tank (for example, in order to secure a space for arranging the large treatment liquid nozzle 51), the distance between the inner surfaces in the vicinity of the bottom of the treatment tank 5a The distance may be larger than the total width of the support member and the substrate. That is, the distance between the inner side surfaces of the processing tank is required to be smaller than the total width of the support member and the substrate at least at the center position in the vertical direction of the substrate 9 disposed at the liquid processing position.

  The substrate processing apparatus may process only one substrate 9, and in this case, the volume of the processing tank can be further reduced.

  In the drying processing units 3 and 3a, a processing liquid other than pure water may be ejected from the processing liquid nozzle 51. Moreover, in gas ejection part 7, gas other than nitrogen gas and the vapor | steam of IPA may be ejected.

  The above-described method of placing the substrate on the claw portion located in the treatment liquid by the transfer portion while the distance between the (in part) inner surfaces of the treatment tank is smaller than the total width of the support member and the substrate is hydrofluoric acid. You may employ | adopt in the process part (for example, said chemical | medical solution process parts 23 and 24) which processes the board | substrate 9 using chemical | medical solutions, such as (HF). Note that the chemical solution processing units 23 and 24 in FIG. 1 are not provided with a gas ejection unit and a chamber.

  The substrate 9 processed in the substrate processing apparatus is not limited to a silicon substrate, and may be another type of substrate such as a glass substrate.

  The configurations in the above-described embodiments and modifications may be combined as appropriate as long as they do not contradict each other.

3, 3a Drying processing section 4 Chamber 5, 5a Processing tank 6 Lifting section 7 Gas ejection section 9 Substrate 10 Control section 211 Transfer section 214 Support member 40 Opening 50 Inner side surface 53 Guide 61 Claw section S11, S12 Step

Claims (4)

A substrate processing apparatus for processing a plate-shaped substrate,
A treatment tank in which treatment liquid is stored;
A claw portion that supports a substrate in an upright state in the processing tank from below, a liquid processing position where the claw portion is disposed near the bottom of the processing tank, and the claw portion is near the top of the processing tank An elevating part that elevates and lowers the substrate between a delivery position arranged in
The substrate is supported by a pair of support members capable of changing a horizontal width direction interval along the main surface of the substrate in an upright state, and between the transfer position and the delivery position above the processing tank. A transfer section for raising and lowering the substrate;
A control unit configured to transfer the substrate from the transfer position to the delivery position by the transfer unit and place the substrate on the claw unit located in the processing liquid;
With
In downward from central position within that put in the vertical direction of the substrate disposed in the liquid processing position, the inner surface distance between the processing bath in the width direction, the sum of the widths of both support members of the transfer unit the support member is a value obtained by adding the width of the substrate - rather smaller than the substrate total width,
The substrate processing apparatus , wherein the distance between the inner side surfaces of the upper portion of the processing tank is a width that allows the substrate to be supported and released by the pair of support members . The substrate processing apparatus according to claim 1 ,
A plurality of upright substrates arranged in parallel to each other are supported by the claw portions,
The substrate processing apparatus, wherein the processing tank includes a guide that supports outer edge portions of the plurality of substrates at a central position in the vertical direction of the plurality of substrates disposed at the liquid processing position. The substrate processing apparatus according to claim 1 or 2,
A chamber having an opening that can be opened and closed at an upper portion thereof, wherein the processing tank is disposed inside;
In a state where the processing liquid in the processing tank is discharged, a gas ejection unit that ejects a processing gas toward the substrate disposed at the delivery position;
Further comprising
The transfer position is above the chamber;
The substrate processing apparatus, wherein a distance between the liquid processing position and the delivery position in the vertical direction is smaller than a width of the substrate. A substrate processing method for processing a plate-like substrate in a substrate processing apparatus,
The substrate processing apparatus is
A treatment tank;
A claw portion that supports a substrate in an upright state in the processing tank from below, a liquid processing position where the claw portion is disposed near the bottom of the processing tank, and the claw portion is near the top of the processing tank An elevating part that elevates and lowers the substrate between a delivery position arranged in
The substrate is supported by a pair of support members capable of changing a horizontal width direction interval along the main surface of the substrate in an upright state, and between the transfer position and the delivery position above the processing tank. A transfer section for raising and lowering the substrate;
With
In downward from central position within that put in the vertical direction of the substrate disposed in the liquid processing position, the inner surface distance between the processing bath in the width direction, the sum of the widths of both support members of the transfer unit Less than the support member-substrate total width, which is a value added to the width of the substrate,
The distance between the inner side surfaces of the upper portion of the processing tank is a width capable of supporting and releasing the substrate by the pair of support members,
The substrate processing method comprises:
a) storing a processing solution in the processing tank;
b) transporting the substrate from the transport position to the delivery position by the transfer unit, and placing the substrate on the claw portion located in the processing liquid;
A substrate processing method comprising:

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