KR20100123415A - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
KR20100123415A
KR20100123415A KR1020090042627A KR20090042627A KR20100123415A KR 20100123415 A KR20100123415 A KR 20100123415A KR 1020090042627 A KR1020090042627 A KR 1020090042627A KR 20090042627 A KR20090042627 A KR 20090042627A KR 20100123415 A KR20100123415 A KR 20100123415A
Authority
KR
South Korea
Prior art keywords
trace
circuit board
printed circuit
substrate body
preventing member
Prior art date
Application number
KR1020090042627A
Other languages
Korean (ko)
Inventor
박신영
Original Assignee
주식회사 하이닉스반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하이닉스반도체 filed Critical 주식회사 하이닉스반도체
Priority to KR1020090042627A priority Critical patent/KR20100123415A/en
Publication of KR20100123415A publication Critical patent/KR20100123415A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A printed circuit board is disclosed. A printed circuit board for a semiconductor package includes a substrate body, circuit wirings including a borland disposed on one surface of the substrate body and traces connected to the borland, and a crack preventing member formed on a portion of the trace. It is done. According to the present invention, there is an effect that the crack is prevented by reinforcing the trace portion vulnerable to the crack by the crack preventing member.

Description

Printed Circuit Board {PRINTED CIRCUIT BOARD}

The present invention relates to a printed circuit board, and more particularly, to a printed circuit board for preventing a crack of the circuit wiring.

Chip scale semiconductor packages typically include ball grid array (BGA) and fine grid array (FBGA) packages. They use ball-type leads, or conductive solder balls, as terminals for electrically coupling the semiconductor chip to the outside, which are arrayed in a matrix form on the front surface of the printed substrate. FBGA is a type of BGA, which is smaller than BGA and adopts solder balls arranged at very narrow intervals.

Unlike conventional plastic packages, BGA packages use a printed circuit board (PCB) instead of a lead frame. Since the printed circuit board can provide the entire surface opposite to the surface to which the semiconductor chip is bonded as a region in which solder balls can be disposed, there is an advantage in terms of the mounting density of the parent substrate.

Printed circuit boards are widely used in various boards of electronic systems, and play an important role in constructing electrical systems with semiconductor devices. On the other hand, integrated circuits, which are rapidly becoming high speed and highly integrated, have increased the number of input / output terminals in the packaging of semiconductor devices. The density of circuit wiring continues to increase.

1 is a plan view for explaining a printed circuit board according to the prior art.

Referring to FIG. 1, a printed circuit board according to the related art includes a substrate body 10, an opening 11 formed along a center of the substrate body 10, and a bonding finger formed on one surface of the substrate body 10. a circuit pattern 12 including a bonding finger 12A, a ball land 12B, and a trace 12C connecting therebetween, a bonding finger 12A and a borland 12B covering the trace 12C. ) Is provided with a solder resist (not shown).

The bonding fingers 12A are formed along both edges of the opening 11 on one surface of the substrate body 10. Solder balls (not shown) are fused to the lands 12B to electrically couple semiconductor chips (not shown) to the outside. The semiconductor chip is mounted on the other surface opposite to one surface of the substrate body 10 and wire-bonded with the bonding finger 12A through the opening 11.

In such a printed circuit board, a portion where the borland 12B and the trace 12C are connected is very vulnerable to stress, causing cracks.

In order to prevent such a crack, a method of increasing the width of the trace 12C adjacent to the borland 12B is currently used.

However, this method can be used only when a free area for increasing the width of the trace 12C is secured, and as the speed and high integration increase the density of the circuit wiring, it is no longer possible to secure the free area. It is difficult to use.

The present invention provides a printed circuit board for preventing cracks in the circuit wiring.

A printed circuit board according to an embodiment of the present invention includes a circuit board including a substrate body, circuit wirings disposed on one surface of the substrate body and connected to the borland and the borland, and a crack formed on a portion of the trace. And a prevention member.

In the printed circuit board, the crack preventing member is formed on the trace adjacent to the ball land.

In the printed circuit board, the crack preventing member is formed on the curved pattern portion of the trace.

In the printed circuit board, the crack preventing member is characterized in that the metal.

The printed circuit board may further include a solder resist provided on the one surface of the substrate body to cover the crack preventing member and the trace and expose the ball land.

The printed circuit board further comprises an opening disposed in the center of the substrate body, and a bonding finger disposed along the opening on the one surface of the substrate body, wherein the bonding finger of the trace is connected to the ball land. It is characterized in that it is connected to the other end opposite to one end.

The printed circuit board may further include a crack preventing member formed on the trace adjacent to the bonding finger.

The printed circuit board further includes a bonding finger disposed on the other surface opposite to the one surface of the substrate body, and an internal wire penetrating through the one surface and the other surface of the substrate body. It is characterized in that connected to the trace through a wiring.

According to the present invention, since the trace part vulnerable to crack generation is reinforced by the crack preventing member, cracks are prevented.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a cross-sectional view illustrating a printed circuit board according to the first embodiment of the present invention, and FIG. 3 is a plan view showing the printed circuit board according to the first embodiment of the present invention.

2 and 3, the printed circuit board 200 according to the first embodiment of the present invention may include a substrate body 210, a bonding finger 220A disposed on one surface of the substrate body 210, Circuit wiring 220 consisting of the ball land 220B and traces 220C connecting therebetween, the crack preventing member 230 and the solder resist 240 disposed on the trace 220C adjacent to the ball land 220B. ).

In the case of the face down type printed circuit board 200, an opening 211 is formed along the center of the substrate body 210 as illustrated in FIGS. 2 and 3.

Typically, BGA and FBGA packages are classified into a face up type and a face down type according to the direction in which the semiconductor chip is mounted on the substrate. Here, the face up type means that the semiconductor chip is mounted on the substrate so that the active surface of the semiconductor chip faces the substrate, and the face down type means that the semiconductor chip is mounted on the substrate so that the active surface of the semiconductor chip faces the substrate. .

The bonding fingers 220A are disposed along both edges of the opening 211, and the ball lands 220B are spaced apart from the bonding fingers 220A.

The trace 220C has one end connected to the bonding finger 220A and the other end opposite to the one end connected to the ball land 220B.

The crack preventing member 230 is formed on the trace 220C adjacent to the borland 220B. The crack preventing member 230 may be a metal, for example, gold, silver, copper, and an alloy thereof formed through a plating process.

By the crack preventing member 230, the connection portion between the borland 220B and the trace 220C, which are vulnerable to crack generation, is reinforced, thereby preventing cracking at the connection portion between the borland 220B and the trace 220C.

The solder resist 240 is disposed on the substrate body 210 to cover the crack preventing member 230 and the trace 220C and to expose the bonding fingers 220A and the ball lands 220B of each circuit wiring 220.

4 is a cross-sectional view illustrating a printed circuit board according to a second embodiment of the present invention, and FIG. 5 is a plan view illustrating a printed circuit board according to a second embodiment of the present invention.

In the second embodiment, the crack preventing member 230 is formed on the trace 220C having a sharply bent pattern.

The printed circuit board according to the second embodiment of the present invention will be described in more detail with reference to FIGS. 4 and 5 as follows.

4 and 5, the printed circuit board 200 according to the second embodiment of the present invention may include a substrate body 210, a bonding finger 220A formed on one surface of the substrate body 210, Circuit wiring 220 consisting of the borland 220B and the trace 220C connecting therebetween, the crack preventing member 230 and the solder resist formed on the trace 220C having a sharply bent pattern form. 240).

In the case of the face down type printed circuit board 200, an opening 211 is formed along the center of the substrate body 210 as illustrated in FIGS. 4 and 5.

The bonding fingers 220A are disposed along both edges of the opening 211, and the ball lands 220B are spaced apart from the bonding fingers 220A.

One end of the trace 220C is connected to the bonding finger 220A, and the other end of the trace 220C is connected to the ball land 220B.

The trace 220C has a portion in which the pattern is sharply bent due to the limitation of the design. Such a portion is very vulnerable to crack generation.

The crack preventing member 230 is formed on the trace 220C having a sharply bent pattern to prevent the occurrence of cracks in the corresponding portion.

The crack preventing member 230 may be a metal, for example, gold, silver, copper, and an alloy thereof formed through a plating process.

The crack preventing member 230 reinforces a portion of the trace 220C having a sharply bent pattern shape that is susceptible to crack generation, thereby preventing cracks.

Although not shown, the crack preventing member 230 may be formed on the trace 220C adjacent to the borland 220B.

The solder resist 240 is disposed on the substrate body 210 to cover the crack preventing member 230 and the trace 220C and to expose the bonding fingers 220A and the ball lands 220B of each circuit wiring 220.

6 is a cross-sectional view illustrating a printed circuit board according to a third embodiment of the present invention, and FIG. 7 is a plan view illustrating a printed circuit board according to a third embodiment of the present invention.

In the third embodiment, the crack preventing member 230 is disposed on the trace 220C adjacent to the bonding finger 220A.

The printed circuit board according to the third embodiment of the present invention will be described in more detail with reference to FIGS. 6 and 7 as follows.

6 and 7, the printed circuit board 200 according to the third embodiment of the present invention includes a substrate body 210, a bonding finger 220A formed on one surface of the substrate body 210, Circuit wiring 220 consisting of the borland 220B and traces 220C connecting therebetween, a crack preventing member 230 and a solder resist disposed on the trace 220C adjacent to the bonding finger 220A. 240).

In the case of the face down type printed circuit board 200, an opening 211 is formed along the center of the substrate body 210 as illustrated in FIGS. 6 and 7.

The bonding fingers 220A are disposed along both edges of the opening 211, and the ball lands 220B are spaced apart from the bonding fingers 220A.

One end of the trace 220C is connected to the bonding finger 220A, and the other end of the trace 220C is connected to the ball land 220B.

The crack preventing member 230 is formed on the trace 220C adjacent to the bonding finger 220A. The crack preventing member 230 may be a metal, for example, gold, silver, copper, and an alloy thereof formed through a plating process.

The crack preventing member 230 reinforces the connection portion of the bonding finger 220A and the trace 220C, which are vulnerable to crack generation, thereby preventing cracks at the connection portion of the bonding finger 220A and the trace 220C.

Although not illustrated, the crack preventing member 230 may be formed on the trace 220C adjacent to the borland 220B or on the trace 220C having a sharply bent pattern.

The solder resist 240 is disposed on the substrate body 210 to cover the crack preventing member 230 and the trace 220C and to expose the bonding fingers 220A and the ball lands 220B of each circuit wiring 220.

The crack preventing member 230 is not limited in position by the above-described embodiments, and may be formed on all portions of the trace 220C vulnerable to crack generation. For example, the crack preventing member 230 may be formed on the trace 220C disposed at the edge of the substrate body 210 vulnerable to crack generation.

In addition, in the embodiments illustrated in the drawings, only the case where the present invention is applied to a face down type printed circuit board is described, but the present invention is applicable to a face up type printed circuit board.

In this case, the opening 211 is omitted in the configuration of FIGS. 2 to 7, and the internal wiring penetrating one surface and the other surface of the substrate body 210 is provided inside the substrate body 210.

In addition, the bond fingers 220A are not disposed on one surface of the substrate body 210 but disposed on the other surface opposite to the one surface. One end of the trace 220C is connected to the ball land 220B, and the other end opposite to the one end is connected to the bonding finger 220A through an internal wiring provided in the substrate body 210.

As described above in detail, since the portion of the trace 220C, which is vulnerable to crack generation, is reinforced by the crack preventing member 230, cracks are prevented.

In the detailed description of the present invention described above with reference to the embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge in the scope of the present invention described in the claims and It will be appreciated that various modifications and variations can be made in the present invention without departing from the scope of the art.

1 is a plan view for explaining a printed circuit board according to the prior art.

2 is a cross-sectional view illustrating a printed circuit board according to a first embodiment of the present invention.

3 is a plan view illustrating a printed circuit board according to a first exemplary embodiment of the present invention.

4 is a cross-sectional view illustrating a printed circuit board according to a second exemplary embodiment of the present invention.

5 is a plan view illustrating a printed circuit board according to a second exemplary embodiment of the present invention.

6 is a cross-sectional view illustrating a printed circuit board according to a third exemplary embodiment of the present invention.

7 is a plan view illustrating a printed circuit board according to a third exemplary embodiment of the present invention.

<Description of main parts of drawing>

200: printed circuit board

210: substrate body

220: circuit wiring

220A: Bonding Fingers

220B: Borland

220C: Trace

230: crack prevention member

240: solder resist

Claims (8)

A substrate body; Circuit wiring lines including a ball land disposed on one surface of the substrate body and a trace connected to the ball land; and A crack preventing member formed on a portion of the trace; Printed circuit board comprising a. The method of claim 1, And the crack preventing member is formed on the trace adjacent to the ball land. The method of claim 1, And the crack preventing member is formed on a curved pattern portion of the trace. The method of claim 1, The crack preventing member is a semiconductor package, characterized in that the metal. The method of claim 1, And a solder resist provided on the one surface of the substrate body to cover the crack preventing member and the trace and expose the ball land. The method of claim 1, An opening disposed in the center of the substrate body; and Further comprising a bonding finger disposed along the opening on the one surface of the substrate body, The bonding finger is a printed circuit board, characterized in that connected to the other end opposite the one end of the trace connected to the ball land. The method of claim 6, And a crack preventing member formed on the trace adjacent to the bonding finger. The method of claim 1, Bonding fingers disposed on the other surface opposite the one surface of the substrate body; And Internal wiring passing through the one surface and the other surface of the substrate body; More, The bonding finger is connected to the trace through the internal wiring.
KR1020090042627A 2009-05-15 2009-05-15 Printed circuit board KR20100123415A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090042627A KR20100123415A (en) 2009-05-15 2009-05-15 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090042627A KR20100123415A (en) 2009-05-15 2009-05-15 Printed circuit board

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KR20100123415A true KR20100123415A (en) 2010-11-24

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8872340B2 (en) 2012-07-17 2014-10-28 SK Hynix Inc. Substrate for semiconductor package which can prevent the snapping of a circuit trace despite physical deformation of a semiconductor package and semiconductor package having the same
KR101600202B1 (en) * 2014-12-09 2016-03-07 영풍전자 주식회사 Structure of the circuit board
US11508669B2 (en) 2019-08-30 2022-11-22 Nxp B.V. Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8872340B2 (en) 2012-07-17 2014-10-28 SK Hynix Inc. Substrate for semiconductor package which can prevent the snapping of a circuit trace despite physical deformation of a semiconductor package and semiconductor package having the same
KR101600202B1 (en) * 2014-12-09 2016-03-07 영풍전자 주식회사 Structure of the circuit board
US11508669B2 (en) 2019-08-30 2022-11-22 Nxp B.V. Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials

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