KR20100119815A - 탄소 나노튜브의 전기화학 증착 방법 - Google Patents

탄소 나노튜브의 전기화학 증착 방법 Download PDF

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Publication number
KR20100119815A
KR20100119815A KR1020107021576A KR20107021576A KR20100119815A KR 20100119815 A KR20100119815 A KR 20100119815A KR 1020107021576 A KR1020107021576 A KR 1020107021576A KR 20107021576 A KR20107021576 A KR 20107021576A KR 20100119815 A KR20100119815 A KR 20100119815A
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KR
South Korea
Prior art keywords
anode
cathode
composite
substrate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107021576A
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English (en)
Korean (ko)
Inventor
질리안 알테아 마리아 레이놀즈
밍 젱
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 이 아이 듀폰 디 네모아 앤드 캄파니 filed Critical 이 아이 듀폰 디 네모아 앤드 캄파니
Publication of KR20100119815A publication Critical patent/KR20100119815A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4407—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained by polymerisation reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/448—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications characterised by the additives used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4484—Anodic paints
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/04—Electrophoretic coating characterised by the process with organic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
    • H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H10K10/84—Ohmic electrodes, e.g. source or drain electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/125—Deposition of organic active material using liquid deposition, e.g. spin coating using electrolytic deposition e.g. in-situ electropolymerisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221—Carbon nanotubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/761—Biomolecules or bio-macromolecules, e.g. proteins, chlorophyl, lipids or enzymes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Metallurgy (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Battery Electrode And Active Subsutance (AREA)
KR1020107021576A 2008-02-29 2009-02-27 탄소 나노튜브의 전기화학 증착 방법 Withdrawn KR20100119815A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3250508P 2008-02-29 2008-02-29
US61/032,505 2008-02-29

Publications (1)

Publication Number Publication Date
KR20100119815A true KR20100119815A (ko) 2010-11-10

Family

ID=41056554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107021576A Withdrawn KR20100119815A (ko) 2008-02-29 2009-02-27 탄소 나노튜브의 전기화학 증착 방법

Country Status (5)

Country Link
US (1) US20100326834A1 (https=)
JP (1) JP2011518095A (https=)
KR (1) KR20100119815A (https=)
CN (1) CN102144050A (https=)
WO (1) WO2009111290A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8225704B2 (en) * 2010-01-16 2012-07-24 Nanoridge Materials, Inc. Armor with transformed nanotube material
US20110177322A1 (en) * 2010-01-16 2011-07-21 Douglas Charles Ogrin Ceramic articles and methods
US9273398B2 (en) 2010-01-16 2016-03-01 Nanoridge Materials, Inc. Metallized nanotubes
JP6159564B2 (ja) * 2013-04-23 2017-07-05 田中貴金属工業株式会社 センサー用電極およびその製造方法
CN110857217A (zh) * 2018-08-23 2020-03-03 天津大学 硼掺杂碳纳米管薄膜及其制备方法和应用
JP7190694B2 (ja) * 2018-12-06 2022-12-16 株式会社マルアイ Ｒｆｉｄの導電性パターンの製造方法
CN110128890B (zh) * 2019-06-04 2021-04-02 江南大学 一种杂化丙烯酸电泳涂料及其制备方法
CN120119303B (zh) * 2025-04-18 2026-03-06 哈尔滨工业大学 一种ITO-CNTs共掺杂的抗静电热管理双层涂层及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857799A (en) * 1986-07-30 1989-08-15 Sri International Matrix-addressed flat panel display
US5015912A (en) * 1986-07-30 1991-05-14 Sri International Matrix-addressed flat panel display
JP3730476B2 (ja) * 2000-03-31 2006-01-05 株式会社東芝 電界放出型冷陰極及びその製造方法
EP1315191B1 (en) * 2001-11-23 2007-08-22 Samsung SDI Co. Ltd. Composite for paste including carbon nanotubes, electron emitting device using the same, and manufacturing method thereof
JP3857156B2 (ja) * 2002-02-22 2006-12-13 株式会社日立製作所 電子源用ペースト、電子源およびこの電子源を用いた自発光パネル型表示装置
WO2004005193A2 (en) * 2002-07-03 2004-01-15 Xintek, Inc. Fabrication and activation processes for nanostructure composite field emission cathodes
MXPA06003797A (es) * 2003-10-15 2006-06-14 Ciba Sc Holding Ag Proceso para imprimir materiales de fibra textil de acuerdo con el proceso de impresion por chorro de tinta.
CN1875075A (zh) * 2003-10-31 2006-12-06 东亚合成株式会社 水性油墨
JP3972107B2 (ja) * 2004-03-26 2007-09-05 国立大学法人信州大学 カーボンナノチューブと高分子を用いた電子放出源の製法
US7947371B2 (en) * 2004-11-05 2011-05-24 E. I. Du Pont De Nemours And Company Single-walled carbon nanotube composites
US20060124028A1 (en) * 2004-12-09 2006-06-15 Xueying Huang Inkjet ink compositions comprising carbon nanotubes
US7867616B2 (en) * 2005-06-17 2011-01-11 Honda Motor Co., Ltd. Carbon single-walled nanotubes as electrodes for electrochromic glasses
US20060286047A1 (en) * 2005-06-21 2006-12-21 Lowe David J Methods for determining the sequence of a peptide motif having affinity for a substrate
CN101617383A (zh) * 2007-02-24 2009-12-30 纳幕尔杜邦公司 碳纳米管的电化学沉积方法

Also Published As

Publication number Publication date
JP2011518095A (ja) 2011-06-23
CN102144050A (zh) 2011-08-03
WO2009111290A3 (en) 2010-09-10
US20100326834A1 (en) 2010-12-30
WO2009111290A2 (en) 2009-09-11

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PA0105 International application

Patent event date: 20100928

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid