KR20100108877A - Method of setting inspection area - Google Patents

Abstract

PURPOSE: A set up method of a check field, which compensates the distortion of a measurement target, is provided to accurately set a check field about a measurement target by compensating the distortion of a measurement target based on the change amount of the measurement target due to distortion. CONSTITUTION: A set up method of a check field is as follows. The measurement target is arranged on a stage(S110). Information data about the measurement target is gathered(S120). Image data about the measurement target is obtained(S130). One or more feature object is selected based on the information data and image data about the measurement target(S140). A parameter value about feature variable of selected target is extracted respectively from information data and image data(S150).

Description

Inspection Area Setting Method {METHOD OF SETTING INSPECTION AREA}

The present invention relates to a method for setting an inspection area, and more particularly, to a method for setting an inspection area of a measurement object of a shape measuring device.

Generally, at least one printed circuit board (PCB) is provided in an electronic device. The printed circuit board generally includes a base substrate, and includes various circuit elements such as a circuit pattern formed on the base substrate, a connection pad part, and a driving chip electrically connected to the connection pad part.

In general, a shape measuring device is used to confirm that the various circuit elements as described above are properly formed or disposed on the printed circuit board.

The conventional shape measuring apparatus sets a predetermined inspection region (or region of interest (ROI)) to inspect whether a predetermined circuit element is properly formed in the inspection region. At this time, the inspection area must be set correctly at a desired position, so that inspection of the circuit element requiring inspection can be performed properly.

However, a measurement object, such as a printed circuit board, may cause distortion such as warp and distortion of the base substrate, and warpage of the base substrate may cause height deviation of the base substrate and formation of a vertical inclination. Warping of the base substrate causes formation of a horizontal inclination of the base substrate.

Therefore, the conventional method for setting the inspection area that actually sets the area where the circuit element should be present as the inspection area does not adequately reflect the distortion of the measurement object as described above. There is a certain difference from the existing position.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a method for setting an inspection area that compensates for distortion of a measurement object.

According to an exemplary embodiment of the present invention, a method of setting an inspection area includes arranging a measurement object on a stage, importing information data on the measurement object, obtaining image data on the measurement object, Selecting at least one feature object based on the image data for the measurement object and the information data for the measurement object, a variable value for at least one feature variable of the selected feature object from the information data and the image data Extracting the respective values, calculating a change amount of the measurement object using the variable value and the quantified conversion formula, and setting a test area by compensating the calculated change amount.

For example, the feature object may include at least one of a point, a line, and a figure. In addition, the measurement object may include a printed circuit board, and the feature object may include at least one of a pattern, a hole, a shape of a circuit element, and a corner point formed on the printed circuit board.

In one embodiment, the method of setting the inspection area may include acquiring the information data from the CAD information recording the shape of the object to be measured before the importing of the information data, and learning acquired by the learning mode. The method may further include at least one of obtaining the information data from the information.

In an embodiment, the acquiring of the image data of the measurement object may include irradiating the measurement object with a light source for measuring two-dimensional images and capturing two-dimensional image data by capturing a reflection image of the irradiated light. It may include the step of obtaining.

In another embodiment, the acquiring of the image data of the object to be measured may include irradiating the object to be measured using a light source for measuring a three-dimensional image, and imaging the reflected image of the irradiated light to make three-dimensional image data. And obtaining two-dimensional image data by averaging the three-dimensional image data.

As an example, the feature variable may include at least one of a coordinate of a point, a slope of a line, a size of a line, and a difference between coordinates between two points.

For example, the change amount of the measurement object may include at least one of a change amount of a vertical slope, a change amount of a height, a change amount of a horizontal slope, and a change amount of a position. In this case, the amount of change of the vertical slope may be compensated by checking the geometric deformation of the measurement object by comparing the three-dimensional information data for the measurement object and the measured three-dimensional image data of the measurement object.

The setting method of the inspection area may include a change and a slope of a position between the variable value of the information data and the variable value of the image data before calculating the change amount of the measurement object using the variable value and the quantified conversion formula. The method may further include setting the conversion formula using at least one of a change in size, a change in size, and a degree of deformation. The setting of the conversion formula may include setting a coordinate space corresponding to a feature object of the information data as a first coordinate space, and setting a coordinate space corresponding to a feature object of the image data as a second coordinate space. And expressing at least one coordinate transformation relation among the change of the position, the change of the slope, the change of the magnitude, and the degree of deformation from the first coordinate space to the second coordinate space, respectively, using a first-order equation including an unknown. The setting of the inspection area may include expressing the variable value of the feature object of the information data and the variable value of the feature object of the image data by the first conversion equation, and the unknown number included in the first conversion equation. Acquiring an equation to determine the conversion formula and to determine the change amount using the determined conversion formula. It may comprise the step of setting the inspection area is compensated for distortion.

According to another exemplary embodiment of the present invention, a method of setting an inspection area includes arranging a measurement object on a stage, importing information data including a plurality of first feature objects for the measurement object, and the measurement object. Obtaining image data including a plurality of second feature objects, extracting at least one of the first feature objects of the information data, and a second corresponding to the extracted first feature objects of the image data; Extracting a feature object, comparing the positions of the extracted first feature object with the extracted second feature object, and adding the size, the horizontal tilt, and the vertical tilt of the first feature object and the second feature object; Comparing any one or more of the values to calculate the change amount of the measurement object, and setting the inspection area based on the change amount Include.

For example, the feature object may include at least one of a point, a line, and a figure. In addition, the measurement object may include a printed circuit board, and the feature object may include at least one of a pattern, a hole, a shape of a circuit element, and a corner point formed on the printed circuit board.

In one embodiment, the method for setting the inspection area may include acquiring the information data from CAD information recording a shape of the measurement object and learning information obtained by a learning mode before the importing of the information data. The method may further include at least one of obtaining the information data.

In an embodiment, the acquiring of the image data of the measurement object may include irradiating the measurement object with a light source for measuring two-dimensional images and capturing two-dimensional image data by capturing a reflection image of the irradiated light. It may include the step of obtaining.

In another embodiment, the acquiring of the image data of the object to be measured may include irradiating the object to be measured using a light source for measuring a three-dimensional image, and imaging the reflected image of the irradiated light to make three-dimensional image data. And obtaining two-dimensional image data by averaging the three-dimensional image data.

According to the present invention, since the inspection area of the measurement object can be accurately compensated by reflecting the change amount of the measurement object due to geometric distortion, through this, the inspection area for the measurement object can be set accurately.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a conceptual diagram illustrating an exemplary three-dimensional shape measuring apparatus using a method for setting an inspection area according to an embodiment of the present invention.

Referring to FIG. 1, a three-dimensional shape measuring apparatus using the method for setting an inspection region according to the present embodiment includes a measurement stage unit 100, an image photographing unit 200, first and second illumination units 300 and 400, The image acquirer 500, the module controller 600, and the central controller 700 may be included.

The measurement stage unit 100 may include a stage 110 for supporting the measurement object 10 and a stage transfer unit 120 for transferring the stage 110. In the present exemplary embodiment, the measurement object 10 is moved by the stage 110 with respect to the image capturing unit 200 and the first and second lighting units 300 and 400. The measuring position at can be changed.

The image capturing unit 200 is disposed above the stage 110 and receives the light reflected from the measurement object 10 to measure an image of the measurement object 10. That is, the image capturing unit 200 receives the light emitted from the first and second lighting units 300 and 400 and reflected from the measuring object 10 to take a plane image of the measuring object 10. .

The image capturing unit 200 may include a camera 210, an imaging lens 220, a filter 230, and a lamp 240. The camera 210 receives the light reflected from the measurement object 10 to take a planar image of the measurement object 10. For example, one of a CCD camera and a CMOS camera may be employed. The imaging lens 220 is disposed under the camera 210 to form light reflected from the measurement object 10 in the camera 210. The filter 230 is disposed below the imaging lens 220 to filter the light reflected from the measurement object 10 to provide the imaging lens 220, and for example, a frequency filter, a color filter, and light. It may be made of any one of the intensity control filter. The lamp 240 may be disposed in a circle below the filter 230 to provide light to the measurement object 10 to capture a specific image such as a two-dimensional shape of the measurement object 10. .

For example, the first lighting unit 300 may be inclined with respect to the stage 110 supporting the measurement object 10 on the right side of the image capturing unit 200. The first lighting unit 300 may include a first lighting unit 310, a first grating unit 320, a first grating transfer unit 330, and a first condensing lens 340. The first lighting unit 310 is composed of an illumination source and at least one lens to generate light, the first grating unit 320 is disposed below the first lighting unit 310 to the first illumination The light generated in the unit 310 is changed into the first lattice pattern light having the lattice pattern. The first grating transfer unit 330 is connected to the first grating unit 320 to transfer the first grating unit 320, for example, one of the PZT (Piezoelectric) transfer unit or fine linear transfer unit It can be adopted. The first condenser lens 340 is disposed under the first grating unit 320 to condense the first grating pattern light emitted from the first grating unit 320 to the measurement object 10.

The second lighting unit 400 may be disposed to be inclined with respect to the stage 110 supporting the measurement object 10 on the left side of the image capturing unit 200, for example. The second lighting unit 400 may include a second lighting unit 410, a second grating unit 420, a second grating transfer unit 430, and a second condensing lens 440. Since the second lighting unit 400 is substantially the same as the first lighting unit 300 described above, detailed descriptions thereof will be omitted.

The first lighting unit 300 irradiates the N first grating pattern lights to the measurement target 10 while the first grating transfer unit 330 moves the first grating unit 320 N times in sequence. In this case, the image capturing unit 200 may photograph the N first pattern images by sequentially receiving the N first grating pattern lights reflected from the measurement object 10. In addition, the second lighting unit 400 moves N second grid pattern lights to the measurement target 10 while the second grid transfer unit 430 moves the second grid unit 420 sequentially N times. When irradiating, the image capturing unit 200 may photograph the N second pattern images by sequentially applying the N second grid pattern lights reflected from the measurement object 10. Here, N is a natural number, for example, may be 4.

Meanwhile, in the present embodiment, only the first and second lighting units 300 and 400 are described as an illumination device for generating the first and second grid pattern lights. Alternatively, the number of the lighting units may be three or more. That is, the grid pattern light irradiated to the measurement object 10 may be irradiated from various directions, and various kinds of pattern images may be photographed. For example, when three lighting units are arranged in an equilateral triangle shape around the image capturing unit 200, three grid pattern lights may be applied to the measurement object 10 in different directions, and four lighting units may be applied. When they are arranged in a square shape around the image capturing unit 200, four grid pattern lights may be applied to the measurement object 10 in different directions.

The image acquisition unit 500 is electrically connected to the camera 210 of the image capturing unit 200 to obtain and store the pattern images from the camera 210. For example, the image acquisition unit 500 includes an image system that receives and stores the N first pattern images and the N second pattern images photographed by the camera 210.

The module controller 600 is electrically connected to and controlled by the measurement stage unit 100, the image capturing unit 200, the first lighting unit 300, and the second lighting unit 400. The module controller 600 includes, for example, a lighting controller, a grid controller, and a stage controller. The lighting controller generates light by controlling the first and second lighting units 310 and 410, respectively, and the grid controller controls the first and second grid transfer units 330 and 430, respectively. The second grid units 320 and 420 are moved. The stage controller may control the stage transfer unit 120 to move the stage 110 up, down, left, and right.

The central control unit 700 is electrically connected to the image acquisition unit 500 and the module control unit 600 to control each. Specifically, the central control unit 700 receives the N first pattern images and the N second pattern images from the image system of the image acquisition unit 500, processes them, and processes the three-dimensional image of the object to be measured. The shape can be measured. In addition, the central controller 700 may control the lighting controller, the grid controller, and the stage controller of the module controller 600, respectively. As such, the central control unit may include an image processing board, a control board, and an interface board.

In order to measure the shape of the printed circuit board employed as the measurement target 10 using the three-dimensional shape measuring apparatus as described above, first, an inspection area for measurement is set. When the inspection area is set, the three-dimensional shape measuring apparatus measures the inside of the inspection area based on the inspection area.

Hereinafter, a method of setting the inspection area will be described in more detail.

2 is a flowchart illustrating a method of setting an inspection area according to an exemplary embodiment of the present invention.

1 and 2, in order to set the inspection area according to an exemplary embodiment of the present invention, the measurement object 10 is first disposed on the stage 110 (S110). The measurement object 10 may include, for example, a printed circuit board.

Subsequently, information data on the measurement object 10 is loaded (S120). The information data refers to data that is a reference of the measurement object 10. The information data includes reference positions and shapes of various circuit elements formed or disposed on the measurement object 10. In other words, the information data includes the position and shape of the circuit element disposed on the measurement object 10 theoretically.

In one embodiment, the information data may be obtained from CAD information that records the shape of the measurement object. The CAD information includes design information of the measurement object.

In another embodiment, the information data may be obtained from learning information obtained by the learning mode. The learning mode may include, for example, sequentially searching for board information in a database, performing a training of a bare board if there is no board information, and learning a bare board and completing board information according to a bare board. If is calculated, it can be implemented in the same manner as the step of storing the board information in the database.

That is, the learning mode is to acquire the design reference information of the printed circuit board by learning the bare board of the printed circuit board, it is possible to obtain the information data by obtaining the learning information through the learning mode.

Next, image data for the measurement object is acquired (S130). The image data means data about an image of the measurement object 10. For example, the image is a two-dimensional image. The image data includes positions and shapes of formation of various circuit elements that are actually formed or disposed on the measurement object 10. That is, the image data includes the position and shape of the circuit element is actually formed.

FIG. 3 is a flowchart illustrating an embodiment of a specific process of obtaining image data of a measurement target in the method of setting an inspection region of FIG. 2.

1 to 3, in order to obtain image data of the measurement object 10, first, the measurement object is irradiated using a light source for measuring two-dimensional images (S132a). The light source for measuring the 2D image may include the circular lamp 240 shown in FIG. 1 as an example. Alternatively, the 3D shape measuring apparatus shown in FIG. 1 may include a 2D image measuring light source for various purposes, and the 2D image measuring light source may be applied to the light source for measuring the 2D image.

Subsequently, two-dimensional image data is obtained by imaging the reflected image of the irradiated light (S132b). Specifically, the light generated from the light source for measuring the two-dimensional image is irradiated to the measurement object 10, and when the irradiated light is reflected from the measurement object 10, the reflected image is the image shown in FIG. Two-dimensional image data may be obtained by imaging by the photographing unit 200.

4 is a flowchart illustrating another embodiment of a specific process of acquiring image data of a measurement target in the method of setting an inspection region of FIG. 2.

1, 2 and 4, in order to obtain image data of the measurement object 10, first, the measurement object is irradiated to the measurement object by using a light source for measuring a height-based three-dimensional image (S134a). . The light source for measuring the 3D image may include, for example, a first lighting unit 300 and a second lighting unit 400 shown in FIG. 1. Alternatively, the light source for measuring the 3D image based on height may include three or more lighting units as described with reference to FIG. 1.

Subsequently, the reflection image of the irradiated light is captured to obtain height-based three-dimensional image data (S134b). Specifically, the pattern light generated from the light source for measuring the height-based three-dimensional image is irradiated to the measurement object 10, and when the irradiated pattern light is reflected from the measurement object 10, it shows the reflected image The image capturing unit 200 illustrated in FIG. 1 captures a pattern image. As described with reference to FIG. 1, the pattern image acquired by the image capturing unit 200 is stored in the image capturing unit 500, and the central control unit 700 processes the pattern image based on the height of the 3D image. Data can be obtained.

Next, averaging the height-based three-dimensional image data to obtain two-dimensional image data (S134c). Even if the image data based on the three-dimensional height does not directly include the two-dimensional image data, the two-dimensional image data can be easily obtained by averaging the image data based on the three-dimensional height.

In this case, a specific equation for obtaining the 2D image data by averaging the height-based 3D image data is as follows.

In the above formula, i denotes a luminance value obtained by the image capturing unit 200 in the process of acquiring the height-based 3D image data, and a and b denote average values and amplitudes of the luminance, respectively. For example, in the case of obtaining height-based 3D image data for four grid pattern lights, a may be obtained as shown in the above equation, and may be used as a value of 2D image data.

Referring back to FIGS. 1 and 2, at least one feature object is selected by comparing image data of the measurement object 10 and information data of the measurement object 10 (S140).

5 is a plan view illustrating a feature object in the method of setting an inspection region of FIG. 2.

1, 2, and 5, the feature object 20 is an object to measure the amount of change between the image data and the information data, which will be described later, and exists on the measurement object 10. The feature object 20 may in principle be any object present on the measurement object 10, for example, a point and a line such as a point 22, a line 24, and a rectangle 26. It may include at least one of the figures to include. In this case, the line may include both a straight line and a curve, and the figure may include a mathematically defined figure as well as a mathematically defined figure such as a circle or a polygon.

In selecting the feature object 20, an object that is easy to measure the change amount and frequently appears on the measurement object 10 may be selected as the feature object 20. For example, when the measurement object 10 is a printed circuit board, at least one of patterns, holes, shapes of various circuit elements, and corner points of the patterns may be formed on the printed circuit board. It can be selected as the feature object 20.

On the other hand, by comparing the image data and the information data for the measurement object 10, an object existing in both the image data and the information data can be selected as the feature object (20).

Next, variable values of at least one feature variable of the selected feature object 20 are extracted from the information data and the image data, respectively (S150).

As an example, the feature variable may include at least one of a coordinate of a point, a slope of a line, a size of a line, and a difference between coordinates between two points. When the feature object 20 is a point 22, the feature variable may be a coordinate of the point 22, a radius of the point 22, or the like. When the feature object 20 is a line 24, the feature variable is a coordinate of both end points of the line 24, the coordinates of the center of the line 24, the slope of the line 24, the line ( 24, the width of the line 24, and the like. When the feature object 20 is a figure, for example, a rectangle 26, the feature variable is a coordinate of each vertex of the rectangle 26, a slope of each side of the rectangle 26, and a shape of the rectangle 26. The length of each side and the difference in coordinates between the vertices of the rectangle 26 may be.

Subsequently, the change amount of the measurement object 10 is calculated using the variable value and the quantified conversion formula (S160).

The conversion formula is a formula for mathematically converting the information data into the image data. For example, the transformation formula may include a coordinate transformation formula according to an affine transformation or a perspective transformation in which a point correspondence relationship in an n-dimensional space is represented by a first-order equation.

The amount of change of the measurement object 10 refers to the degree of distortion of the measurement object 10 generated by bending, warping, and the like. The amount of change of the measurement object 10 may be caused by the geometrical distortion in measurement that occurs when the measurement object 10 is measured. For example, the amount of change of the measurement object 10 may be caused by geometric distortion caused by bending, distortion, or the like of the measurement object 10.

6 to 12 are conceptual views for explaining the amount of change of the measurement object according to the geometric distortion of the measurement object.

6 to 11, the amount of change of the measurement object 10 may include the amount of change of the vertical slope AV, the amount of change H, the amount of change of the horizontal slope AH, and the position (x, y). It may include at least one of the amount of change ((x1-x0, y1-y0)).

6 is a side view illustrating a state in which various geometric distortions exist in the measurement object 10. FIG. 7 is a side view illustrating a state in which a change amount AV of the vertical tilt is removed from among the various geometric distortions. FIG. 8 is a side view illustrating a state in which a change amount AV of height is removed among the geometric distortions of FIG. 7. Reference numeral 50 denotes an ideal plane, which corresponds to the information data. 9 is a plan view of FIG. 8. FIG. 10 is a plan view illustrating a state in which the variation AH of the horizontal slope is removed among the geometric distortions of FIG. 9. FIG. 11 is a plan view illustrating a state in which the amount of change ((x1-x0, y1-y0)) of the position ((x, y)) of the geometric distortions of FIG. 10 is removed. FIG. 11 illustrates the change amount of the vertical slope (AV), the change in height (H), the change in horizontal slope (AH) and the position ((x, y)) among the various geometric distortions ((x1-x0, y1-). y0)) is removed. FIG. 12 is a plan view projecting the measurement object 10 illustrated in FIG. 6. Therefore, FIG. 11 shows an example of the information data, and FIG. 12 corresponding to FIG. 6 shows an example of the image data.

In FIG. 12, since the left side of the measurement object 10 is located closer to the image capturing unit 200 (see FIG. 1) than the right side, the left side of the image data is larger. In addition, since both the left and right sides are located closer than the abnormal plane 50, the image is larger than the actual size.

In other words, in this case, when the measurement object 10 is photographed by the geometric distortion of its own, the left side is larger than the right side in the image capturing unit 200 as described above, and is measured in a trapezoid-like shape as described above. By comparing the three-dimensional information data for the height-based measurement object 10 and the measured three-dimensional image data of the measurement object 10, the geometric deformation of the measurement object according to the perspective transformation, that is, the The deformation of the vertical tilt change amount of the measurement object 10 may be confirmed and compensated for.

On the other hand, in one embodiment, the conversion formula may be set using at least one of a change in position, a change in slope, a change in size, and a degree of deformation between the variable value of the information data and the variable value of the image data. That is, as described above, the information data shown as an example in FIG. 11 and the image data shown as an example in FIG. 12 generate a change in position, a change in inclination, a change in size, a degree of deformation, and the like. In this case, the degree of deformation is a change generated by perspective deformation or projection deformation.

These changes can be set in advance by the conversion formula. That is, the coordinate space corresponding to the feature object of the information data of FIG. 11 is set to the first coordinate space, for example, (X, Y) space, and the coordinate space corresponding to the feature object of the image data of FIG. 2 Set the coordinate space, for example (U, V) space. Subsequently, at least one coordinate transformation relation among the change of the position, the change of the slope, the change of the magnitude, and the degree of deformation from the first coordinate space to the second coordinate space is expressed as a first-order transformation equation. In general, the type and the degree of change also vary according to the time point at which the measurement object 10 is measured and the position of the measurement object 10, and the type and the degree of change also change when the measurement object 10 is changed. The transform coefficients constituting the linear transform equation are unknown, but the transform formula may be set in advance.

1 and 2, next, the inspection area is set by compensating the calculated change amount (S170). That is, since the amount of change of the measurement object 10 is caused by the geometric distortion during the measurement, it is possible to correctly set the deviation inspection area.

For example, when the information data is loaded (S120) and the image data is acquired (S130), the variable value of the feature object of the information data and the variable value of the feature object of the image data are converted into the first conversion equation. After the expression, the unknown formula included in the first-order equation may be obtained to determine the conversion formula. When the conversion formula is determined, the inspection region in which distortion due to the change amount is compensated may be set using the conversion formula.

According to the method of setting the inspection area according to the present invention as described above, since the change amount of the measurement object can be compensated by reflecting the change amount of the measurement object 10 due to the geometric distortion of the measurement object, thereby, the measurement object You can set the inspection area for.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, the above description and the drawings below should be construed as illustrating the present invention, not limiting the technical spirit of the present invention.

1 is a conceptual diagram illustrating an exemplary three-dimensional shape measuring apparatus using a method for setting an inspection area according to an embodiment of the present invention.

2 is a flowchart illustrating a method of setting an inspection area according to an exemplary embodiment of the present invention.

FIG. 3 is a flowchart illustrating an embodiment of a specific process of obtaining image data of a measurement target in the method of setting an inspection region of FIG. 2.

4 is a flowchart illustrating another embodiment of a specific process of acquiring image data of a measurement target in the method of setting an inspection region of FIG. 2.

5 is a plan view illustrating a feature object in the method of setting an inspection region of FIG. 2.

6 to 12 are conceptual views for explaining the amount of change of the measurement object according to the geometric distortion of the measurement object.

<Short Description of Main Drawing Numbers>

10: measuring object 20: characteristic object

50: ideal plane 100: measuring stage part

200: image capturing unit 300: first lighting unit

400: second lighting unit 500: image acquisition unit

600: module control unit 700: central control unit

AH: change in horizontal tilt AV: change in vertical tilt

H: change in height

Claims (17)

Placing the measurement object on the stage; Importing information data on the measurement object; Obtaining image data of the measurement object; Selecting at least one feature object based on the image data on the measurement object and the information data on the measurement object; Extracting variable values for at least one feature variable of the selected feature object from the information data and the image data, respectively; Calculating an amount of change of the measurement object using the variable value and the quantified conversion formula; And And setting an inspection area by compensating for the calculated change amount. The method of claim 1, And the feature object comprises at least one of a point, a line, and a figure. The method of claim 1, The measurement object includes a printed circuit board, The feature object may include at least one of a pattern, a hole, a shape of a circuit element, and a corner point formed on the printed circuit board. The method of claim 1, wherein prior to the step of importing the information data, Acquiring the information data from CAD information recording the shape of the measurement object; And And at least one of acquiring the information data from the learning information acquired by the learning mode. The method of claim 1, wherein the obtaining of the image data of the measurement object comprises: Irradiating the measurement object with a light source for measuring a two-dimensional image; And And acquiring two-dimensional image data by capturing the reflected image of the irradiated light. The method of claim 1, wherein the obtaining of the image data of the measurement object comprises: Irradiating the measurement object with a light source for measuring a three-dimensional image; Capturing the reflected image of the irradiated light to obtain 3D image data; And And averaging the three-dimensional image data to obtain two-dimensional image data. The method of claim 1, wherein the feature variable, And at least one of a coordinate of a point, a slope of a line, a size of a line, and a difference between coordinates of two points. The method of claim 1, wherein the change amount of the measurement object, And a change amount of a vertical slope, a change amount of a height, a change amount of a horizontal tilt, and a change amount of a position. The method of claim 8, wherein the amount of change in the vertical slope, And comparing the three-dimensional information data of the measurement object with the measured three-dimensional image data of the measurement object, and confirming and compensating for the geometric deformation of the measurement object. The method of claim 1, Before calculating the amount of change of the measurement object using the variable value and the quantified conversion formula, And setting the conversion formula using at least one of a change in position, a change in slope, a change in size, and a degree of deformation between the variable value of the information data and the variable value of the image data. How to set up the inspection area. The method of claim 10, Setting the conversion formula, Setting a coordinate space corresponding to a feature object of the information data as a first coordinate space; Setting a coordinate space corresponding to a feature object of the image data as a second coordinate space; And Expressing at least one coordinate transformation relation among the change of the position, the change of the slope, the change of the magnitude, and the degree of deformation from the first coordinate space to the second coordinate space, respectively; The setting of the inspection area, Expressing the variable value of the feature object of the information data and the variable value of the feature object of the image data by the first conversion formula; Determining the conversion formula by obtaining the unknown value included in the first conversion equation; And And setting an inspection area in which distortion by the change amount is compensated using the determined conversion formula. Placing the measurement object on the stage; Importing information data including a plurality of first feature objects for the measurement object; Acquiring image data including a plurality of second feature objects for the measurement object; Extracting at least one of the first feature objects of the information data; Extracting a second feature object corresponding to the extracted first feature object from the image data; Compare the positions of the extracted first feature object and the extracted second feature object, and compare at least one of a size, a horizontal tilt, and a vertical tilt value of the first feature object and the second feature object. Calculating an amount of change of the measurement object; And And setting an inspection area based on the amount of change. The method of claim 12, And the first and second feature objects include at least one of a point, a line, and a figure. The method of claim 12, The measurement object includes a printed circuit board, And the first and second feature objects include at least one of a pattern, a hole, a shape of a circuit element, and a corner point formed on the printed circuit board. The method of claim 12, wherein prior to the step of importing the information data, Acquiring the information data from CAD information recording the shape of the measurement object; And And at least one of acquiring the information data from the learning information acquired by the learning mode. The method of claim 12, wherein the obtaining of the image data of the measurement object comprises: Irradiating the measurement object with a light source for measuring a two-dimensional image; And And acquiring two-dimensional image data by capturing the reflected image of the irradiated light. The method of claim 12, wherein the obtaining of the image data of the measurement object comprises: Irradiating the measurement object with a light source for measuring a 3D image; Capturing the reflected image of the irradiated light to obtain 3D image data; And And averaging the three-dimensional image data to obtain two-dimensional image data.

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