KR101216453B1 - Inspection method of measuring object - Google Patents

Inspection method of measuring object Download PDF

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Publication number
KR101216453B1
KR101216453B1 KR1020100060945A KR20100060945A KR101216453B1 KR 101216453 B1 KR101216453 B1 KR 101216453B1 KR 1020100060945 A KR1020100060945 A KR 1020100060945A KR 20100060945 A KR20100060945 A KR 20100060945A KR 101216453 B1 KR101216453 B1 KR 101216453B1
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South Korea
Prior art keywords
shadow
measurement object
map
amplitude
substrate
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KR1020100060945A
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Korean (ko)
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KR20120000610A (en
Inventor
정중기
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주식회사 고영테크놀러지
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Priority to KR1020100060945A priority Critical patent/KR101216453B1/en
Application filed by 주식회사 고영테크놀러지 filed Critical 주식회사 고영테크놀러지
Priority to TW102148712A priority patent/TWI467128B/en
Priority to DE102010064635.0A priority patent/DE102010064635B4/en
Priority to DE102010030859.5A priority patent/DE102010030859B4/en
Priority to JP2010151711A priority patent/JP5256251B2/en
Priority to TW099121806A priority patent/TWI432699B/en
Priority to US12/829,670 priority patent/US8369603B2/en
Priority to CN201010224622.4A priority patent/CN101943572B/en
Priority to CN201210445858.XA priority patent/CN102980533B/en
Publication of KR20120000610A publication Critical patent/KR20120000610A/en
Priority to US13/679,390 priority patent/US8548224B2/en
Application granted granted Critical
Publication of KR101216453B1 publication Critical patent/KR101216453B1/en
Priority to US13/936,065 priority patent/US8724883B2/en

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Abstract

The present invention relates to a measurement object inspection method for inspecting the mounting state of the measurement object, according to the measurement object inspection method of the present invention, to irradiate the pattern light in a plurality of directions to the substrate on which the measurement object is formed N times, Shoot. Subsequently, a visibility map for each direction of the substrate is generated using N images for each direction photographed, and a shadow area for each direction of the measurement object is obtained from the visibility map for each direction. Subsequently, the obtained shadow area by direction is compensated, and the shadow map is generated by merging the compensated shadow areas by direction. Accordingly, it is possible to increase the reliability of the shadow area acquisition and to improve the inspection reliability of the mounting state of the measurement object.

Description

Inspection method of measuring object {INSPECTION METHOD OF MEASURING OBJECT}

The present invention relates to a measuring object inspection method, and more particularly to a measuring object inspection method for inspecting a measurement object formed on a printed circuit board.

In general, at least one printed circuit board (PCB) is provided in an electronic device, and various kinds of electronic components are formed on the printed circuit board.

In order to verify the reliability of the board on which the electronic components are mounted, it is necessary to inspect the mounting state of the electronic component. In order to inspect the mounting state of the electronic component, it is important to accurately set an area of the measurement object.

Conventionally, two-dimensional images have been taken to photograph an object to set an area of a measurement object. However, the operation of setting the area of the measurement object in the two-dimensional image is sensitive to the color or illumination of the device, making it difficult to distinguish the measurement object from the surroundings, even when the dimension of the measurement object is changed. It is difficult to determine the area of. In addition, when there is noise in an image, for example, when a pattern or silk is formed on a substrate other than the measurement object, it is difficult to determine the measurement object, and noise by a camera may appear, and an adjacent area such as a pad area may be caused. May be confused with the part.

Therefore, a method for inspecting a measurement object using a method for extracting a region of the measurement object that can prevent the above-described problems is required.

Accordingly, the problem to be solved by the present invention is to provide a measuring object inspection method that can accurately extract the desired measurement object.

In accordance with an aspect of the present invention, a method for inspecting a measurement object includes irradiating a patterned light N times in a plurality of directions to a substrate on which a measurement object is formed and photographing it with a camera, using the N images for each direction photographed. Generating a visibility map for each direction of the substrate, obtaining a shadow area for each direction of the measurement object from the vision map for each direction, compensating the obtained shadow area for each direction, and the Merging the compensated directional shadow areas to produce a shadow map. The visibility map has a ratio Vi (x, y) = Bi (x,) to an average Ai (x, y) of an amplitude Bi (x, y) in the brightness signal of the image photographed for each pixel. y) / Ai (x, y)).

As an example for compensating the shadow area, each pixel is multiplied by an amplitude (Bi (x, y)) for the obtained shadow area for each direction. If the amplitude ((Bi (x, y)) at each pixel of the shadow area is equal to or less than a predetermined reference value, the shadow is set.

The three-dimensional shape inspection method may further include obtaining at least one of size and position information of the measurement object from the shadow map.

According to another aspect of the present invention, a method for inspecting a measurement object includes irradiating light from a plurality of directions to a substrate on which a measurement object is formed to obtain amplitude maps for each direction, and a reference value having a predetermined amplitude in the amplitude maps for each direction. Determining shadow areas according to the following, and extracting shadow areas for each direction, and generating shadow maps by merging the shadow areas for each direction. In order to obtain the amplitude maps, the grid pattern light phase shifted in each direction may be irradiated over a plurality of times.

The method may further include acquiring at least one or more information of the size, position, and rotation information of the measurement object from the shadow map to examine the mounting state of the measurement object. The method may further include generating a template for confirming whether the object corresponds to the measurement object in comparison with the shadow map.

According to the method of inspecting the measurement object, noise of the shadow area can be reduced as much as possible by compensating the shadow area for each direction obtained from the direction-by-visibility map using the amplitude information, thereby making it possible to determine the mounting state of the measurement object. Can improve the inspection reliability.

In addition, by extracting the shadow region using the direction-specific amplitude map with less noise than the direction-specific visibility map, the reliability of the shadow region extraction can be improved.

In addition, even when the height of the measurement object exceeds the measurement range, the area of the measurement object may be accurately extracted using the visibility map.

1 is a conceptual diagram illustrating an exemplary three-dimensional shape measuring apparatus used in the method for inspecting a measurement object according to an embodiment of the present invention.
2 is a plan view illustrating a part of a substrate on which a measurement object is mounted.
3 is a flowchart illustrating a method for inspecting a measurement object according to an embodiment of the present invention.
4 is a diagram illustrating direction-specific visibility maps.
5 is a diagram illustrating direction-specific amplitude maps.
FIG. 6 is a diagram illustrating direction-specific compensation maps for compensating a shadow area for each direction.
FIG. 7 illustrates a shadow map generated by merging the compensated shadow areas for each direction. FIG.
8 is a flowchart illustrating a measurement object inspection method according to another embodiment of the present invention.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a conceptual diagram illustrating an exemplary three-dimensional shape measuring apparatus used in the method for inspecting a measurement object according to an embodiment of the present invention.

Referring to FIG. 1, a three-dimensional shape measuring apparatus according to an embodiment of the present invention includes a stage 140 for supporting and transferring a substrate 150 on which a measurement object is formed, and one for irradiating light onto the substrate 150. The camera 130 photographs an image of the first lighting unit 110 and the substrate 150. In addition, the 3D shape measuring apparatus may further include a second lighting unit 120 installed adjacent to the stage 140 to irradiate light to the substrate 150 separately from the first lighting unit 110.

The first lighting unit 110 is an illumination for measuring a three-dimensional shape of a measurement object formed on the substrate 150, and irradiates a light having a predetermined shape inclined at a predetermined angle with respect to the substrate 150. For example, the first lighting unit 110 pitch-transmits the light source 112 for generating light, the grating element 114 and the grating element 114 for converting light from the light source 112 into grating pattern light. And a projection lens 118 for projecting the grating pattern light converted by the grating transfer mechanism 116 and the grating element 114 onto the measurement object. The grating element 114 may be transferred by 2π / N through a grating transfer mechanism 116 such as a piezo actuator (PZT) for phase shift of the grating pattern light. Here, N is a natural number of 2 or more. The first lighting unit 110 having such a configuration irradiates the grid pattern light toward the substrate 150 at every transfer while sequentially transferring the grid elements 114 through the grid transfer mechanism 116. Each time the grid element 114 is transferred, an image of the substrate 150 is photographed.

The first lighting unit 110 is provided with a plurality so as to be spaced apart at a predetermined angle along the circumferential direction around the camera 130 in order to increase the measurement accuracy. For example, four first lighting units 110 may be spaced apart at an angle of 90 degrees along the circumferential direction with respect to the camera 130, or eight may be spaced apart at an angle of 45 degrees.

The second lighting unit 120 is formed in a circular ring shape and is installed adjacent to the stage 140. The second lighting unit 120 irradiates the substrate 150 with light for initial alignment of the substrate 150 or setting an inspection area. For example, the second lighting unit 120 may include a fluorescent lamp for generating white light, or may include a red light emitting diode, a green light emitting diode, and a blue light emitting diode for generating red, green, and blue light, respectively.

The camera 130 is disposed on the stage 140, and receives the light reflected from the substrate 150 to take an image of the substrate 150. For example, the camera 130 captures an image of the substrate 150 by irradiating the grid pattern light of the first lighting unit 110, and captures an image of the substrate 150 by irradiating light of the second lighting unit 120. Shoot. The camera 130 may include either a CCD camera or a CMOS camera for image capturing.

The three-dimensional shape measuring apparatus having such a configuration irradiates light to the substrate 150 using the first lighting unit 110 or the second lighting unit 120, and the substrate 150 on which the measurement object is formed through the camera 130. By taking an image of), the three-dimensional and two-dimensional images of the substrate 150 are measured. Meanwhile, the three-dimensional shape measuring apparatus shown in FIG. 1 is merely an example, and may be changed to various configurations including one or more first lighting units 110 and a camera 130.

Hereinafter, a method of inspecting a measurement object such as an electronic component formed on a printed circuit board using the three-dimensional shape measuring apparatus as described above will be described in detail.

2 is a plan view showing a portion of a substrate on which a measurement object is mounted, FIG. 3 is a flowchart illustrating a method of inspecting a measurement object according to an embodiment of the present invention, and FIG. 4 is a view illustrating visibility maps for each direction. FIG. 5 is a diagram illustrating amplitude maps for each direction, and FIG. 6 is a diagram showing direction compensation maps for which a shadow area for each direction is compensated for, and FIG. 7 is a diagram for a shadow map generated by merging the compensated shadow areas for each direction. to be.

1, 2, and 3, in order to inspect a state in which a measurement object 152 such as an electronic component is mounted on the substrate 150, first, a plurality of substrates on the measurement object 152 are formed. The pattern light is irradiated N times from the direction, and the image of the substrate 150 is photographed by the camera 130 (S110). Here, N is a natural number of 2 or more. Thereafter, a visibility map for each direction of the substrate 150 is generated using N images of each direction photographed by the camera 130 (S120).

In detail, when the plurality of first lighting units 110 sequentially irradiates light toward the substrate 150, the camera 130 sequentially photographs images for each direction, and generates a direction-specific visibility map therefrom. do. In this case, the 3D shape measuring apparatus may acquire an image for each direction through a multi-channel phase shift moiré method. For example, a plurality of grating pattern light phase-shifted in each direction through each of the first lighting units 110 is irradiated onto the substrate 150, and the phase of the substrate 150 is transmitted through the camera 130 at each irradiation. After photographing the star images, a direction-specific visibility map is generated from the plurality of phase-specific images. Meanwhile, an amplitude map for each direction may be generated from the plurality of phase-specific images.

The visibility map means a ratio of an average (A i (x, y)) of amplitude (B i (x, y)) in an intensity signal of an image photographed for each pixel. In general, it tends to increase as the reflectance increases. The visibility (V i (x, y)) is defined as follows.

V i (x, y) = B i (x, y) / A i (x, y)

N brightness signals I i 1 , I i 2 ,... At each position i (x, y) of the XY coordinate system from the N phase-specific images taken by the camera 130 for each channel. , I i N ) and the average A i (x, y) and viability (V i (x, y)) are calculated using the N-bucket algorithm.

For example, when N = 4, the visibility can be calculated as follows.

Figure 112010041272854-pat00001

Figure 112010041272854-pat00002

The 3D shape measuring apparatus may generate the direction-specific visibility maps shown in FIG. 4 and the direction-specific amplitude maps shown in FIG. 5 using the visibility information and the amplitude information calculated through the above method.

Referring to FIG. 6, after generating the direction-specific visibility maps, the direction-specific shadow area 154 of the measurement object 152 is obtained from the direction-specific visibility map (S130). Since the measurement object 152 formed on the substrate 150 has a predetermined height, when the light is irradiated to be inclined at a predetermined angle by the first lighting unit 110, the shadow area 154 is opposite to the measurement object 152. Is generated. For example, since the shadow area 154 has a relatively low brightness compared to other areas, the shadow area 154 is displayed in black on the direction-specific visibility map and the direction-specific amplitude map.

Thereafter, the shadow area 154 for each direction obtained above is compensated for (S140). Visibility (V i (x, y)) is a region with a low amplitude (B i (x, y)) if the mean (A i (x, y)) is very low (e.g., 0.xxx). As shown in FIG. 4, the noise area 156 that appears bright in the actual shadow area 154 may be generated. Thus, the shadow area 154 for each direction is compensated for to remove the noise area 156. One example of a method of compensating the shadowed area 154 for each direction is to multiply each pixel by the amplitude B i (x, y) for the shadowed area 154 for each direction. Another example of a method of compensating the shadow area 154 for each direction is to set the pixel as a shadow when the amplitude B i (x, y) at each pixel of the shadow area 154 for each direction is less than or equal to a preset reference value. It is.

By compensating the shadowed areas 154 for each direction in this manner, a large number of noise areas 156 in the shadowed areas 154 for each direction may be removed, thereby obtaining more reliable shadowed areas 154 for each direction. Can be. In addition, even when the height of the measurement object exceeds the measurement range, the area of the measurement object may be accurately extracted using the visibility map.

After compensating the directional shadow areas 154, the compensated directional shadow areas 154 are merged to generate a shadow map as illustrated in FIG. 7 (S150). Since the actual measurement object 152 and the shadow area 154 around the measurement object 152 have a relatively large gray level difference on the shadow map, the area of the measurement object 152 can be easily set. For example, on the shadow map, the measurement object 152 may be displayed in a bright color while the shadow area 154 may be displayed in a dark color. In contrast, the measurement object 152 may be displayed in a dark color and the shadow area. 154 may be displayed in bright colors.

On the other hand, compensation of the shadow area may be performed for each shadow area for each direction obtained after obtaining the shadow area for each direction in the visibility map for each direction (S130). Alternatively, merging shadow areas for each direction is different. After generating the shadow map (S150), the shadow area may be compensated on the generated shadow map.

Thereafter, the mounting state of the measurement object 152 may be inspected using the shadow map. In detail, the size, position and rotation information of the measurement object 152 may be obtained from the generated shadow map, and the mounting state of the measurement object 152 may be inspected using at least one of the information. For example, since the CAD data containing the basic information about the substrate 150 contains information such as the position and size of the measurement object 152, the information value in the CAD data is compared with the information value obtained from the shadow map. By doing this, it is possible to inspect whether or not the mounting state of the measurement target 152 is defective.

Meanwhile, a step of generating a template for confirming whether the measurement object 152 corresponds to the generated shadow map may be added. The template may be generated by reading the measurement object 152 information from the CAD data, or by measuring and storing the measured object 152 using the measurement device. In comparing the shadow map and the template, if the difference between the shadow map and the template is within the margin of error, it is regarded as the measurement object. At this time, the error range can be set by the user.

In the present exemplary embodiment, the case of irradiating light in four directions, that is, the case of using four first lighting units 110 is described. However, the present invention is not limited thereto, and the number of light irradiation directions may vary.

8 is a flowchart illustrating a three-dimensional shape measuring method according to another exemplary embodiment of the present invention.

Referring to FIG. 8, in order to inspect the mounting state of the measurement object 152, first, the substrate 150 on which the measurement object 152 is formed is irradiated with light from a plurality of directions, and thus amplitude according to directions as shown in FIG. 5. (amplitude) maps are acquired (S210). Since the method of obtaining the amplitude maps for each direction has been described above, a detailed description thereof will be omitted.

Subsequently, the shadow areas 154 for each direction are extracted by determining a region having an amplitude less than or equal to a predetermined reference value in the amplitude maps for each direction as a shadow area (S220). Since the shadow area generally has a relatively low amplitude compared to other areas, the area having an amplitude value less than or equal to the appropriate reference value may be determined as the shadow area. As described above, by extracting the shadow region using the direction-specific amplitude map with less noise than the direction-specific visibility map, the reliability of the shadow region extraction can be improved.

Thereafter, the shadow regions 154 for each direction are merged to generate a shadow map (S230). Since the description of the shadow map has been described above with reference to FIG. 7, it will be omitted. In addition, the present embodiment may include the step of inspecting the mounting state of the measurement object using the shadow map, and the step of generating a template, as in the previous embodiment.

Meanwhile, in generating the shadow map, instead of using the direction-by-direction visibility map or the direction-specific amplitude map as in the previous two embodiments, the plurality of grid pattern images photographed in each direction are converted into 2D images. You can also create shadow maps. In the process of converting a plurality of grid pattern images into a 2D image, a grid pattern may appear on the 2D image. The grid pattern on the 2D image may be removed by summing brightness values of two images having a phase difference of 180 ° among the plurality of grid pattern images. In addition, the grid pattern on the 2D image may be removed by summing the brightness values of the grid pattern images for which the sum of phase differences is 360 °.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

110: first lighting unit 120: second lighting unit
130: camera 140: stage
150 substrate 152 measurement object
154: shadow area 156: noise area

Claims (9)

Irradiating the patterned light onto the substrate on which the measurement object is formed in N directions each time and photographing the same with a camera;
Generating a visibility map for each direction of the substrate by using the N images for each direction photographed;
Acquiring a shadow area for each direction of the measurement object from the visibility map for each direction;
Compensating for the obtained shadow area for each direction; And
Merging the compensated shadow areas for each direction to generate a shadow map. (N is a natural number of 2 or more)
The method of claim 1,
The visibility map has a ratio Vi (x, y) = Bi (x,) to an average Ai (x, y) of an amplitude Bi (x, y) in the brightness signal of the image photographed for each pixel. y) / Ai (x, y))
The average Ai (x, y) satisfies the following equation,
Figure 112012066458624-pat00011

Visibility (Vi (x, y)) is a measurement object inspection method characterized by the following equation.
Figure 112012066458624-pat00012

(Here, (I i 1 , I i 2 , ..., I i N ) is extracted at each position (i (x, y)) of the XY coordinate system from the N phase-specific images captured by the camera 130. N brightness signals, and represents the case where N is 4)
The method of claim 2, wherein the compensating for the shadow area comprises:
And multiplying each pixel by an amplitude ((Bi (x, y)) for the obtained shadow area for each direction.
The method of claim 2, wherein the compensating for the shadow area comprises:
And if the amplitude ((Bi (x, y)) of each pixel of the obtained shadow area for each direction is less than or equal to a predetermined reference value, set the shadow to a shadow.
The method of claim 1,
And obtaining at least one of size and position information of the measurement object from the shadow map.
Irradiating light from a plurality of directions on a substrate on which a measurement object is formed to obtain amplitude maps for each direction;
Extracting shadow areas by direction by determining an area having an amplitude less than or equal to a predetermined reference value from the amplitude maps by direction as a shadow area; And
Merging the shadow areas for each direction to generate a shadow map.
The method according to claim 6,
And irradiating a plurality of grating pattern light phase shifted in each direction to obtain the amplitude maps.
The method according to claim 6,
And inspecting a mounting state of the measurement object by acquiring at least one or more information of the size, position, and rotation information of the measurement object from the shadow map.
The method according to claim 6,
And generating a template for confirming whether the object corresponds to the measurement object in comparison with the shadow map.
KR1020100060945A 2009-07-03 2010-06-28 Inspection method of measuring object KR101216453B1 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
KR1020100060945A KR101216453B1 (en) 2010-06-28 2010-06-28 Inspection method of measuring object
DE102010064635.0A DE102010064635B4 (en) 2009-07-03 2010-07-02 Method for examining a measurement object
DE102010030859.5A DE102010030859B4 (en) 2009-07-03 2010-07-02 A method of inspecting a target mounted on a substrate
JP2010151711A JP5256251B2 (en) 2009-07-03 2010-07-02 Inspection method of measurement object
TW102148712A TWI467128B (en) 2009-07-03 2010-07-02 Method for inspecting measurement object
TW099121806A TWI432699B (en) 2009-07-03 2010-07-02 Method for inspecting measurement object
US12/829,670 US8369603B2 (en) 2009-07-03 2010-07-02 Method for inspecting measurement object
CN201010224622.4A CN101943572B (en) 2009-07-03 2010-07-05 Method for inspecting measurement object
CN201210445858.XA CN102980533B (en) 2009-07-03 2010-07-05 Method for inspecting measurement object
US13/679,390 US8548224B2 (en) 2009-07-03 2012-11-16 Method for inspecting measurement object
US13/936,065 US8724883B2 (en) 2009-07-03 2013-07-05 Method for inspecting measurement object

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