KR101216453B1 - Inspection method of measuring object - Google Patents
Inspection method of measuring object Download PDFInfo
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- KR101216453B1 KR101216453B1 KR1020100060945A KR20100060945A KR101216453B1 KR 101216453 B1 KR101216453 B1 KR 101216453B1 KR 1020100060945 A KR1020100060945 A KR 1020100060945A KR 20100060945 A KR20100060945 A KR 20100060945A KR 101216453 B1 KR101216453 B1 KR 101216453B1
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- shadow
- measurement object
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- amplitude
- substrate
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Abstract
The present invention relates to a measurement object inspection method for inspecting the mounting state of the measurement object, according to the measurement object inspection method of the present invention, to irradiate the pattern light in a plurality of directions to the substrate on which the measurement object is formed N times, Shoot. Subsequently, a visibility map for each direction of the substrate is generated using N images for each direction photographed, and a shadow area for each direction of the measurement object is obtained from the visibility map for each direction. Subsequently, the obtained shadow area by direction is compensated, and the shadow map is generated by merging the compensated shadow areas by direction. Accordingly, it is possible to increase the reliability of the shadow area acquisition and to improve the inspection reliability of the mounting state of the measurement object.
Description
The present invention relates to a measuring object inspection method, and more particularly to a measuring object inspection method for inspecting a measurement object formed on a printed circuit board.
In general, at least one printed circuit board (PCB) is provided in an electronic device, and various kinds of electronic components are formed on the printed circuit board.
In order to verify the reliability of the board on which the electronic components are mounted, it is necessary to inspect the mounting state of the electronic component. In order to inspect the mounting state of the electronic component, it is important to accurately set an area of the measurement object.
Conventionally, two-dimensional images have been taken to photograph an object to set an area of a measurement object. However, the operation of setting the area of the measurement object in the two-dimensional image is sensitive to the color or illumination of the device, making it difficult to distinguish the measurement object from the surroundings, even when the dimension of the measurement object is changed. It is difficult to determine the area of. In addition, when there is noise in an image, for example, when a pattern or silk is formed on a substrate other than the measurement object, it is difficult to determine the measurement object, and noise by a camera may appear, and an adjacent area such as a pad area may be caused. May be confused with the part.
Therefore, a method for inspecting a measurement object using a method for extracting a region of the measurement object that can prevent the above-described problems is required.
Accordingly, the problem to be solved by the present invention is to provide a measuring object inspection method that can accurately extract the desired measurement object.
In accordance with an aspect of the present invention, a method for inspecting a measurement object includes irradiating a patterned light N times in a plurality of directions to a substrate on which a measurement object is formed and photographing it with a camera, using the N images for each direction photographed. Generating a visibility map for each direction of the substrate, obtaining a shadow area for each direction of the measurement object from the vision map for each direction, compensating the obtained shadow area for each direction, and the Merging the compensated directional shadow areas to produce a shadow map. The visibility map has a ratio Vi (x, y) = Bi (x,) to an average Ai (x, y) of an amplitude Bi (x, y) in the brightness signal of the image photographed for each pixel. y) / Ai (x, y)).
As an example for compensating the shadow area, each pixel is multiplied by an amplitude (Bi (x, y)) for the obtained shadow area for each direction. If the amplitude ((Bi (x, y)) at each pixel of the shadow area is equal to or less than a predetermined reference value, the shadow is set.
The three-dimensional shape inspection method may further include obtaining at least one of size and position information of the measurement object from the shadow map.
According to another aspect of the present invention, a method for inspecting a measurement object includes irradiating light from a plurality of directions to a substrate on which a measurement object is formed to obtain amplitude maps for each direction, and a reference value having a predetermined amplitude in the amplitude maps for each direction. Determining shadow areas according to the following, and extracting shadow areas for each direction, and generating shadow maps by merging the shadow areas for each direction. In order to obtain the amplitude maps, the grid pattern light phase shifted in each direction may be irradiated over a plurality of times.
The method may further include acquiring at least one or more information of the size, position, and rotation information of the measurement object from the shadow map to examine the mounting state of the measurement object. The method may further include generating a template for confirming whether the object corresponds to the measurement object in comparison with the shadow map.
According to the method of inspecting the measurement object, noise of the shadow area can be reduced as much as possible by compensating the shadow area for each direction obtained from the direction-by-visibility map using the amplitude information, thereby making it possible to determine the mounting state of the measurement object. Can improve the inspection reliability.
In addition, by extracting the shadow region using the direction-specific amplitude map with less noise than the direction-specific visibility map, the reliability of the shadow region extraction can be improved.
In addition, even when the height of the measurement object exceeds the measurement range, the area of the measurement object may be accurately extracted using the visibility map.
1 is a conceptual diagram illustrating an exemplary three-dimensional shape measuring apparatus used in the method for inspecting a measurement object according to an embodiment of the present invention.
2 is a plan view illustrating a part of a substrate on which a measurement object is mounted.
3 is a flowchart illustrating a method for inspecting a measurement object according to an embodiment of the present invention.
4 is a diagram illustrating direction-specific visibility maps.
5 is a diagram illustrating direction-specific amplitude maps.
FIG. 6 is a diagram illustrating direction-specific compensation maps for compensating a shadow area for each direction.
FIG. 7 illustrates a shadow map generated by merging the compensated shadow areas for each direction. FIG.
8 is a flowchart illustrating a measurement object inspection method according to another embodiment of the present invention.
The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.
Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art, and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
1 is a conceptual diagram illustrating an exemplary three-dimensional shape measuring apparatus used in the method for inspecting a measurement object according to an embodiment of the present invention.
Referring to FIG. 1, a three-dimensional shape measuring apparatus according to an embodiment of the present invention includes a
The
The
The
The
The three-dimensional shape measuring apparatus having such a configuration irradiates light to the
Hereinafter, a method of inspecting a measurement object such as an electronic component formed on a printed circuit board using the three-dimensional shape measuring apparatus as described above will be described in detail.
2 is a plan view showing a portion of a substrate on which a measurement object is mounted, FIG. 3 is a flowchart illustrating a method of inspecting a measurement object according to an embodiment of the present invention, and FIG. 4 is a view illustrating visibility maps for each direction. FIG. 5 is a diagram illustrating amplitude maps for each direction, and FIG. 6 is a diagram showing direction compensation maps for which a shadow area for each direction is compensated for, and FIG. 7 is a diagram for a shadow map generated by merging the compensated shadow areas for each direction. to be.
1, 2, and 3, in order to inspect a state in which a
In detail, when the plurality of
The visibility map means a ratio of an average (A i (x, y)) of amplitude (B i (x, y)) in an intensity signal of an image photographed for each pixel. In general, it tends to increase as the reflectance increases. The visibility (V i (x, y)) is defined as follows.
V i (x, y) = B i (x, y) / A i (x, y)
N brightness signals I i 1 , I i 2 ,... At each position i (x, y) of the XY coordinate system from the N phase-specific images taken by the
For example, when N = 4, the visibility can be calculated as follows.
The 3D shape measuring apparatus may generate the direction-specific visibility maps shown in FIG. 4 and the direction-specific amplitude maps shown in FIG. 5 using the visibility information and the amplitude information calculated through the above method.
Referring to FIG. 6, after generating the direction-specific visibility maps, the direction-
Thereafter, the
By compensating the shadowed
After compensating the
On the other hand, compensation of the shadow area may be performed for each shadow area for each direction obtained after obtaining the shadow area for each direction in the visibility map for each direction (S130). Alternatively, merging shadow areas for each direction is different. After generating the shadow map (S150), the shadow area may be compensated on the generated shadow map.
Thereafter, the mounting state of the
Meanwhile, a step of generating a template for confirming whether the
In the present exemplary embodiment, the case of irradiating light in four directions, that is, the case of using four
8 is a flowchart illustrating a three-dimensional shape measuring method according to another exemplary embodiment of the present invention.
Referring to FIG. 8, in order to inspect the mounting state of the
Subsequently, the
Thereafter, the
Meanwhile, in generating the shadow map, instead of using the direction-by-direction visibility map or the direction-specific amplitude map as in the previous two embodiments, the plurality of grid pattern images photographed in each direction are converted into 2D images. You can also create shadow maps. In the process of converting a plurality of grid pattern images into a 2D image, a grid pattern may appear on the 2D image. The grid pattern on the 2D image may be removed by summing brightness values of two images having a phase difference of 180 ° among the plurality of grid pattern images. In addition, the grid pattern on the 2D image may be removed by summing the brightness values of the grid pattern images for which the sum of phase differences is 360 °.
In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.
110: first lighting unit 120: second lighting unit
130: camera 140: stage
150
154: shadow area 156: noise area
Claims (9)
Generating a visibility map for each direction of the substrate by using the N images for each direction photographed;
Acquiring a shadow area for each direction of the measurement object from the visibility map for each direction;
Compensating for the obtained shadow area for each direction; And
Merging the compensated shadow areas for each direction to generate a shadow map. (N is a natural number of 2 or more)
The visibility map has a ratio Vi (x, y) = Bi (x,) to an average Ai (x, y) of an amplitude Bi (x, y) in the brightness signal of the image photographed for each pixel. y) / Ai (x, y))
The average Ai (x, y) satisfies the following equation,
Visibility (Vi (x, y)) is a measurement object inspection method characterized by the following equation.
(Here, (I i 1 , I i 2 , ..., I i N ) is extracted at each position (i (x, y)) of the XY coordinate system from the N phase-specific images captured by the camera 130. N brightness signals, and represents the case where N is 4)
And multiplying each pixel by an amplitude ((Bi (x, y)) for the obtained shadow area for each direction.
And if the amplitude ((Bi (x, y)) of each pixel of the obtained shadow area for each direction is less than or equal to a predetermined reference value, set the shadow to a shadow.
And obtaining at least one of size and position information of the measurement object from the shadow map.
Extracting shadow areas by direction by determining an area having an amplitude less than or equal to a predetermined reference value from the amplitude maps by direction as a shadow area; And
Merging the shadow areas for each direction to generate a shadow map.
And irradiating a plurality of grating pattern light phase shifted in each direction to obtain the amplitude maps.
And inspecting a mounting state of the measurement object by acquiring at least one or more information of the size, position, and rotation information of the measurement object from the shadow map.
And generating a template for confirming whether the object corresponds to the measurement object in comparison with the shadow map.
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100060945A KR101216453B1 (en) | 2010-06-28 | 2010-06-28 | Inspection method of measuring object |
DE102010064635.0A DE102010064635B4 (en) | 2009-07-03 | 2010-07-02 | Method for examining a measurement object |
DE102010030859.5A DE102010030859B4 (en) | 2009-07-03 | 2010-07-02 | A method of inspecting a target mounted on a substrate |
JP2010151711A JP5256251B2 (en) | 2009-07-03 | 2010-07-02 | Inspection method of measurement object |
TW102148712A TWI467128B (en) | 2009-07-03 | 2010-07-02 | Method for inspecting measurement object |
TW099121806A TWI432699B (en) | 2009-07-03 | 2010-07-02 | Method for inspecting measurement object |
US12/829,670 US8369603B2 (en) | 2009-07-03 | 2010-07-02 | Method for inspecting measurement object |
CN201010224622.4A CN101943572B (en) | 2009-07-03 | 2010-07-05 | Method for inspecting measurement object |
CN201210445858.XA CN102980533B (en) | 2009-07-03 | 2010-07-05 | Method for inspecting measurement object |
US13/679,390 US8548224B2 (en) | 2009-07-03 | 2012-11-16 | Method for inspecting measurement object |
US13/936,065 US8724883B2 (en) | 2009-07-03 | 2013-07-05 | Method for inspecting measurement object |
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KR1020100060945A KR101216453B1 (en) | 2010-06-28 | 2010-06-28 | Inspection method of measuring object |
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KR1020120090671A Division KR101311255B1 (en) | 2012-08-20 | 2012-08-20 | Inspection method of measuring object |
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KR101216453B1 true KR101216453B1 (en) | 2012-12-28 |
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