KR20100106139A - Heat sink for packaging light emitting device - Google Patents

Abstract

PURPOSE: A heat sink for packaging a light emitting device is provided to obtain an excellent radiation effect by increasing the surface area of the heat sink. CONSTITUTION: A heat radiation projection(210) comprises first and second heat radiation protrusion groups(211,213). The heat radiation projections of the first and second heat radiation protrusion groups have different height. The first heat radiation projection group has highest heat radiation projection. Each heat radiation projection and a pin is thinner than the heat radiation projection of a conventional heat sink.

Description

Heat sink for packaging light emitting device

The present invention relates to a heat sink, and more particularly to a heat sink for a light emitting device package.

A heat sink refers to a device for dissipating heat emitted from circuit elements such as power semiconductor elements used in electronic devices. It is a device that must be provided in a computer or the like that includes a CPU that performs high-speed operation as well as industrial electronics.

The importance of heat sinks capable of effectively dissipating heat dissipated in display devices or devices incorporating highly integrated circuits is increasing day by day.

In particular, light emitting diodes (LEDs) are required to have luminous power of several tens of lumens or more in order to be used in applications such as lighting sources. The light output of the light emitting diode is generally proportional to the input power, and the increase in the input power increases the junction temperature of the light emitting diode. Therefore, heat sink is very important as a structure for preventing an increase in junction temperature of a light emitting diode due to an increase in input power.

Most large-capacity LED modules have large heat sinks, and if the thermal sinks do not thermally stabilize, the LED chip is thermally shocked, causing a decrease in brightness and ultimately shortening the life of the LED module.

An object of the present invention is to provide a heat sink for a light emitting device package with increased heat dissipation efficiency and reduced volume.

According to an aspect of the present invention, in the heat sink which is a conductive substrate, the conductive substrate includes a heat radiating protrusion having a plurality of heat radiating protrusion groups, the heat radiating protrusions are assembled, constituting the plurality of heat radiating protrusion groups In the thermal radiation period, a heat sink for a light emitting device package having different heights is provided.

Among the plurality of thermal projection groups, a thermal radiation projection group having the largest average height of the thermal projections is arranged in the center of the thermal radiation projections, and the thermal projections are arranged radially from the center in the order of the thermal radiation projection groups having the lowest average height of the thermal projections. Can be.

The plurality of thermal radiation projection groups may include a first thermal radiation projection group having the largest average height of the thermal projection projections and a second thermal projection projection group having a smaller average height of the thermal projection projections than the first thermal projection projection group. The first heat radiating protrusion group may be disposed at the center of the heat radiating protrusion part, and the second heat radiating protrusion group may be disposed around the radial direction except for the first heat radiating protrusion group.

And a third heat radiating protrusion group having an average height of a heat radiating protrusion smaller than the second heat radiating protrusion group, wherein the third heat radiating protrusion group includes the first heat radiating protrusion group and the second heat radiating protrusion group. It can be arranged around the radial except.

The light emitting device may be a light emitting diode (LED).

The surface area of the heat sink for heat radiation is much increased, so the heat dissipation effect is excellent. It is possible to miniaturize the heat sink and prevent the life of the light emitting element from being lowered.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers, such as second and first, may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding components will be given the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted.

Figure 1a is a plan view showing a heat sink for a conventional light emitting device package, Figure 1b is a rear view and Figure 1c is a side view.

1A and 1B, the heat sink 100 for a light emitting device package includes a plurality of heat radiating protrusions. The heat sink 100 for the light emitting device package is generally used a metal material excellent in thermal conductivity and electrical conductivity.

Referring to FIG. 1C, a thermal radiator is disposed over almost the entire area of the top surface of the heat sink 100. The lower portion of the heat sink 100 for a light emitting device package may include a printed circuit board for mounting a light emitting device or other circuits.

2 is a plan view of an example of a heat sink for a light emitting device package according to the present embodiment, FIG. 3 is a rear view and FIG. 4 is a sectional view.

2 and 3, the heat sink 200 for a light emitting device package includes a heat radiating protrusion 210 having a plurality of heat radiating protrusions. The heat sink 200 including the heat radiating protrusion 210 may be manufactured through a mold process. Each of the heat radiating protrusions of the heat radiating protrusion 210 may be disposed in a form for maximizing heat radiation through the air. For example, each of the plurality of thermal radiating protrusions may be spaced apart from each other at uniform intervals.

The number of protrusions or pins of the heat radiating protrusion 210 is preferably higher than that of the conventional heat sink. For example, if the number of protrusions in the conventional heat sink is 14, the number of protrusions of the heat radiating protrusion 210 according to the present embodiment may be larger than this. For example, the number of protrusions of the heat radiating protrusion 210 may be 17.

The heat sink 200 for the light emitting device package is made of a metal material having excellent thermal conductivity and electrical conductivity, and a heat dissipation substrate used for heat dissipation of a general electrical device may be used. Preferably made of aluminum, copper or an alloy of both.

As shown in the figure, the heat sink 200 for a light emitting device package may be manufactured in various shapes such as an oval, a triangle, a square, a rhombus, in addition to a circular shape.

Referring to FIG. 4, the thermal radiation projection unit 210 includes a plurality of thermal radiation projection groups 211 and 213, and constitutes thermal radiation projections and thermal radiation projection group 213 constituting the thermal radiation projection group 211. The thermal projections are different heights. The first thermal radiation projection group 213 having the largest height of the thermal radiation projections and the thermal radiation projection having a smaller height of the thermal projection projections than the first thermal projection projection group 213 form the meeting second thermal projection projection group 211. Equipped. Each of the heat radiating protrusions or pins is preferably thinner than the heat radiating protrusions of the conventional heat sink. Thinner thicknesses of thermal radiation projections may be included. As shown, the height of all the thermal projections in the first thermal projection group 213 is the same, the height of all the thermal projections in the second thermal projection group 211 is the same. However, the height of each thermal radiator in a group may be different. The average height of the thermal projections of the first thermal projection group 213 is higher than the average height of the thermal projections of the second thermal projection group 211. The average height of the thermal projections of the first thermal projection group 213 may be 10% to 60% higher than the average height of the thermal projections of the second thermal projection group 211.

The first heat radiating protrusion group 213 may be disposed at the center of the heat radiating protrusion 210, and the second heat radiating protrusion group 211 may be disposed around the radial direction except for the first heat radiating protrusion group 213. .

Here, although a plurality of heat radiation protrusion groups 211 and 213 having different heights of heat radiation protrusions are shown, the number of such heat radiation protrusion groups may vary. Those skilled in the art can appropriately select the number of thermal radiation projection groups in consideration of the size of the heat sink or the number of packaging of the light emitting device.

In the case where the number of the thermal radiation projection groups is larger than that shown in FIG. 4, the thermal projection projection group having the largest average height of the thermal projections among the plurality of thermal projection projection groups is disposed in the center of the thermal projection projection and the thermal projection projections are arranged. The group of thermal spinnerets may be arranged radially from the center in order of the group of thermal spinnerets having an average height of.

The heat radiating protrusions 210 may be spaced apart from each other by the heat radiating protrusions at predetermined intervals to easily enter and exit the air, and radiate heat generated from the light emitting device to the outside. Each of the thermal projections in the first thermal projection group 213 and the second thermal projection group 211 may be spaced apart from each other at a uniform interval. The surface area for thermal radiation of the heat sink 200 is increased through the plurality of thermal radiation projection groups having different heights of the thermal radiation projections, and the plurality of thermal projection projection groups having different heights of the thermal projections are light emitting devices. Maximize external radiation of generated heat from In the heat sink 200 according to the present embodiment, the heat radiating protrusion 210 may have a smaller area than that of the conventional heat sink. Although the area occupied by the heat radiating protrusion 210 is smaller, the heat dissipation efficiency is increased through the plurality of heat radiating protrusion groups 211 and 213 having different heights.

The lower portion of the heat sink 200 for the light emitting device package may include a substrate (not shown) for mounting a light emitting device or other circuit. The substrate may be the same material as the heat sink 200 or different materials may be used.

For example, a printed circuit board (PCB) may be used as a substrate for mounting a light emitting device or other circuits. Preferably, the printed circuit board may be a metal printed circuit board (PCB). Metal printed circuit boards have better heat dissipation effects than conventional printed circuit boards.

5 is a cross-sectional view of another example of a heat sink for a light emitting device package according to the present embodiment.

Referring to FIG. 5, the heat sink 300 for a light emitting device package includes a heat radiating protrusion 310 having a plurality of heat radiating protrusion groups 311, 313, and 315 having different heights of the heat radiating protrusions. As shown in FIG. 2, each of the heat radiating protrusions of the heat radiating protrusion 310 may be disposed in a form for maximizing heat radiation through the air.

The first thermal radiation projection group 315 having the largest height of the thermal radiation projection, the thermal radiation projection having a smaller height of the thermal projection projection than the first thermal projection projection group 315, the second thermal projection projection group 313 and The heat radiation protrusion having a smaller height of the heat radiation protrusion than the second heat radiation protrusion group 313 includes the third heat radiation protrusion group 311. The average height of the thermal projections of the second thermal projection group 313 is greater than the average height of the thermal projections of the third thermal projection group 311, and the average of the thermal projections of the first thermal projection group 315. The height is larger than the average height of the thermal projections of the second thermal projection group 313. The average height of the thermal projections of the second thermal projection group 213 may be 10% to 60% greater than the average height of the thermal projections of the third thermal projection group 215. The average height of the thermal projections of the first thermal projection group 315 may be 10% to 30% greater than the average height of the thermal projections of the second thermal projection group 313.

The first thermal projection group 315 is disposed in the center of the thermal projections 310 and the second thermal projection group 313 is disposed around the radial except for the first thermal projection group 315, The three heat radiating protrusion groups 311 may be disposed around the radial direction except for the first heat radiating protrusion group 315 and the second heat radiating protrusion group 313.

Here, three heat radiating protrusion groups having different heights of the heat radiating protrusions are shown, but the number of heat radiating protrusion groups may vary. Those skilled in the art can appropriately select the number of thermal radiation projection groups in consideration of the size of the heat sink or the number of packaging of the light emitting device.

The lower portion of the heat sink 300 for the light emitting device package may include a substrate (not shown) for mounting a light emitting device or other circuit. The substrate may be the same material as the heat sink 300 or different materials may be used.

6 is a diagram illustrating an example of a package of a light emitting device using the heat sink according to the present embodiment.

Referring to FIG. 6, the packaging of the light emitting device includes a heat sink 510, a printed circuit board 520, and a light emitting device 530 according to the present embodiment.

The heat sink 510 according to the present exemplary embodiment includes a heat radiating protrusion 515 made of a metal material having excellent thermal conductivity and electrical conductivity, and having a plurality of heat radiating protrusion groups having different heights of the heat radiating protrusions. The printed circuit board 520 is closely attached to the heat sink 510 according to the present embodiment. The light emitting device 530 or other circuits are mounted on the printed circuit board 520. The light emitting device 530 may be attached to the printed circuit board 520 as a chip on board (COB). Here, the light emitting device may be a light emitting diode, a cold cathode fluorescent lamp or a high temperature cathode fluorescent lamp. Preferably, the light emitting element is a light emitting diode. In addition to the light emitting device 530, the number may be smaller or larger. The printed circuit board 520 may be formed of another substrate having the same or different material as that of the heat sink 200. The light emitting device 530 or other circuits may be connected by using an insulating layer and an electrode without using a separate substrate on the heat sink 510.

A molding unit (not shown) may be mounted on the heat sink 510 to protect the light emitting device 530 while the light emitting device 530 is packaged. Such molding may be formed through an injection process using an epoxy resin.

As shown, the heat sink according to the present embodiment has a large surface area capable of dissipating heat through a plurality of groups of thermal projections having different heights of thermal projections, and promotes convection of air to effectively release heat. Can be.

Although the present invention has been described above with reference to the embodiments, it will be apparent to those skilled in the art that the present invention may be modified and changed in various ways without departing from the spirit and scope of the present invention. I can understand. Therefore, the present invention is not limited to the above-described embodiment, and the present invention will include all embodiments within the scope of the following claims.

Figure 1a is a plan view showing a heat sink for a conventional light emitting device package, Figure 1b is a rear view and Figure 1c is a side view.

2 is a plan view of an example of a heat sink for a light emitting device package according to the present embodiment.

3 is a rear view of an example of a heat sink for a light emitting device package according to the present embodiment.

4 is a cross-sectional view of an example of a heat sink for a light emitting device package according to the present embodiment.

5 is a cross-sectional view of another example of a heat sink for a light emitting device package according to the present embodiment.

6 is a diagram illustrating an example of a package of a light emitting device using the heat sink according to the present embodiment.

<Explanation of symbols for the main parts of the drawings>

200: heatsink

210: heat radiation projection

211: second thermal projection group

213: first thermal radiation projection group

Claims (8)

In a heat sink that is a conductive substrate, The conductive substrate may include a heat radiating protrusion having a plurality of heat radiating protrusion groups in which heat radiating protrusions are gathered. The method of claim 1, Among the plurality of thermal projection groups, a thermal radiation projection group having the largest average height of the thermal projections is arranged in the center of the thermal radiation projections, and the thermal projections are arranged radially from the center in the order of the thermal radiation projection groups having the lowest average height of the thermal projections. Heat sink for a light emitting device package, characterized in that. The method of claim 1, The plurality of thermal radiation projection groups may include a first thermal radiation projection group having the largest average height of the thermal projection projections and a second thermal projection projection group having a smaller average height of the thermal projection projections than the first thermal projection projection group. The first heat radiating protrusion group is disposed in the center of the heat radiating protrusion, and the second heat radiating protrusion group is disposed around the radial area except the first heat radiating protrusion group. . The method of claim 3, wherein Further comprising a third group of thermal projections having a smaller average height of the thermal projections than the second thermal projection group, The third heat radiating protrusion group is disposed in the radial periphery except for the first heat radiating protrusion group and the second heat radiating protrusion group. The method of claim 1, The light emitting device is a heat sink for a light emitting device package, characterized in that the light emitting diode (LED). The method of claim 1, The printed circuit board (Printed Circuit Board) is in close contact with the conductive substrate and the light emitting device is a heat sink for a light emitting device package, characterized in that is packaged through the printed circuit board. The method of claim 6, The light emitting device is a heat sink for a light emitting device package, characterized in that the printed circuit board is packaged as a Chip On Board (COB). The method of claim 1, The conductive substrate is a heat sink for a light emitting device package, characterized in that made of aluminum, copper or an alloy of both.

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