KR20100103241A - Light emitting device package and manufacturing method the same - Google Patents
Light emitting device package and manufacturing method the same Download PDFInfo
- Publication number
- KR20100103241A KR20100103241A KR1020090021767A KR20090021767A KR20100103241A KR 20100103241 A KR20100103241 A KR 20100103241A KR 1020090021767 A KR1020090021767 A KR 1020090021767A KR 20090021767 A KR20090021767 A KR 20090021767A KR 20100103241 A KR20100103241 A KR 20100103241A
- Authority
- KR
- South Korea
- Prior art keywords
- metal base
- light emitting
- emitting device
- adhesive member
- metal
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Led Device Packages (AREA)
Abstract
The present invention relates to a light emitting device package and a method of manufacturing the same, and more particularly, the present invention relates to a light emitting device package and a method of manufacturing the light emitting device, in particular LED, which can be reduced in size and excellent in heat radiation performance. In the present invention, the metal base for heat dissipation in which the light emitting device is located is etched in half in the thickness direction, and the surface of the etching surface is repeatedly treated to fill the adhesive member, thereby not being in contact with each other, but being supported by the adhesive member. To separate. Electroplating to form a plating layer on the two metal base and the adhesive member to increase the adhesion between the components. A portion of the plating layer corresponding to the adhesive member is etched to electrically insulate the two metal bases. Then, a circuit operation for electrically connecting the light emitting element to the two metal bases is performed. Through such a process, a printed circuit board is manufactured. Therefore, since the heat of the light emitting device is directly radiated through the metal base, the heat dissipation performance is excellent, and it is not necessary to provide a separate electrode layer and an insulating layer for connecting the electrode to the light emitting device in the metal case, thereby further miniaturizing the product.
Description
The present invention relates to a light emitting device package and a method for manufacturing the same, and more particularly, to a light emitting device package and a method for manufacturing the same, which are excellent in heat dissipation performance of the LED and can be miniaturized by reducing the product thickness.
In general, a light emitting device is a light emitting diode (LED), which is a device used to send and receive signals by converting electrical signals into infrared, visible, or ultraviolet light using the characteristics of compound semiconductors. to be.
LED has the advantages of high efficiency, high-speed response, long life, miniaturization, light weight, low power consumption, energy saving, and carbon dioxide generation and mercury-free light source. It is applied to many fields such as LCD, full color LED display. In addition, the point light source and ultra-small optical devices can freely design lines, planes, and spaces, and thus their fields of application are expected to be sustained in a wide range of fields such as display, signal, display, lighting, bio, telecommunications, mobile phones, LCD, and automotive industries.
Core technologies of the LED packaging process include chip design, structure design, optical design, thermal design, and packaging process technology at the chip level in order to make optimal use of the emitted light. Incorporates packaging technologies that take into account the requirements of the application. The development direction of LED packaging technology is developing in the direction of ultra-thin or ultra-small (backlight), high output (lighting), high integration (display) depending on the type of application products. to be.
The LED chip is manufactured as an optical device through a packaging process, and various LED backlights, LED displays, and LED lights are made using the optical device. At this time, the principle and process technology for packaging the chip are largely large depending on the type of LED application product. Different. That is, the optimum design conditions of packages and modules are changing as the output power of LED optical devices for obtaining high power LED light sources continues to improve, and there are many types of packages because they have diverse applications and no standard specifications. , Surface mount device (SMD), chip on board (COB), and back light unit (BLU).
This LED package is completed by a molding process after the basic die bonding and wire bonding process to complete the light source module.
In order to obtain high output light, the LED package has a problem of high heat generation due to poor heat dissipation performance in the package. Thus, when high heat remains inside the package without heat dissipation, resistance It becomes very high and light efficiency falls. Since there are many thermal resistors between the light emitting device and the heat radiating device, heat generated in the light emitting device is not easily transferred to the outside.
In addition, since the LED package has an electrode installed separately on the metal base, installation of the insulating layer and the electrode layer is essential, thereby increasing the thickness of the product, which increases the manufacturing cost and complicates the manufacturing process.
One aspect of the present invention provides a light emitting device package and a method of manufacturing the same by changing the heat dissipation structure of the light emitting device package to improve the heat dissipation performance for the light emitting device and to reduce the product thickness.
To this end, the light emitting device package according to the embodiment of the present invention includes a first metal base on which the light emitting device is provided, and a second metal base adhered to the first metal base by an adhesive member. And the second metal base are installed to be spaced apart from each other by the adhesive member so that polarities are separated from each other to electrically connect the electrodes of the light emitting device.
At least one of the first metal base and the second metal base may be characterized in that the interface between the adhesive member is curved.
At least one of the first metal base and the second metal base may include at least one inner groove formed on an interface between the adhesive member and the adhesive member.
The at least one inner groove is characterized in that it comprises any one or combination of arc shape or polygonal shape.
The at least one inner groove may be formed in at least one of the thickness direction or the longitudinal direction of the first metal base or the second metal base.
In addition, the method of manufacturing a light emitting device package according to an embodiment of the present invention by preparing a metal base for dissipating heat of the light emitting device, by repeating the process of etching the metal base and injecting an adhesive member on the etching surface Separating the metal base into two metal bases, forming a plating layer on both sides of the two metal bases, and etching a part of the formed plating layer to form an electrode so that the polarities of the two metal bases are separated. It is characterized by including.
Forming a curved etching surface in at least one of the thickness direction or the longitudinal direction of the metal base when etching the metal base to separate the metal base into two metal base.
Forming at least one polygonal or arc-shaped groove formed inward on the etching surface formed in the longitudinal direction of the metal base.
According to an embodiment of the present invention described above, the present invention after separating the metal base for dissipating heat of the light emitting device into two metal bases are separated from each other and spaced apart from each other by an adhesive member, the light emitting device Is connected to each metal base to form a light emitting device package, so heat of the light emitting device is immediately discharged through the metal base without passing through an intermediate medium, so the heat dissipation is excellent and the electrode is connected to the light emitting device in the metal case. For this reason, it is not necessary to provide a separate electrode layer and an insulating layer, thereby further miniaturizing the product.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
1 is a cross-sectional view of a light emitting device package according to an embodiment of the present invention.
As shown in Figure 1, the light emitting device package according to an embodiment of the present invention includes a
The
In addition, the
The
The
In order to increase the adhesion between the
The
The
The
As described above, the heat dissipating metal base for dissipating the heat of the
2 shows a manufacturing process of a light emitting device package according to an embodiment of the present invention. As shown in FIG. 2, the manufacturing process of the light emitting device package according to the exemplary embodiment of the present invention includes preparing a
Hereinafter, the manufacturing process of the light emitting device package will be described in detail with reference to FIGS. 3A to 3H.
3A to 3H are views illustrating a manufacturing process of a light emitting device package according to an embodiment of the present invention.
As shown in FIG. 3A, the light emitting device package according to the exemplary embodiment includes a
As shown in FIG. 3B, the upper surface of the
As shown in FIG. 3C, after the upper surface of the
As shown in FIG. 3D, after etching the upper surface of the metal base, the lower surface of the metal base is etched by the remaining thickness (eg, 1 / 2D) in the thickness direction. In order to increase the adhesion with the
As shown in FIG. 3E, the lower surface of the
By performing the process of FIGS. 3B to 3E, the
As shown in FIG. 3F, the
As shown in FIG. 3g, after the
As shown in FIG. 3H, after the light emitting device package having the above structure is completed, the upper surface of the
In the light emitting device package according to the embodiment of the present invention, adhesion is formed by forming a boundary surface in the thickness direction among the boundary surfaces of the
In addition to the above-described method, the boundary surface in the longitudinal direction of the boundary surface of the
As illustrated in FIG. 4,
In addition, as illustrated in FIG. 5, two
In addition, as illustrated in FIG. 6, arc-shaped
In addition, as shown in FIG. 7, two arc-shaped
1 is a schematic perspective view of a light emitting device package according to an embodiment of the present invention.
2 is a control flowchart illustrating a manufacturing process of a light emitting device package according to an embodiment of the present invention.
3A to 3H are views illustrating a manufacturing process of a light emitting device package according to an embodiment of the present invention.
4 is a view illustrating a structure of a first metal base and a second metal base for improving adhesion in a light emitting device package according to another embodiment of the present invention.
5 is a view showing another structure of the first metal base and the second metal base for improving the adhesion in the light emitting device package according to another embodiment of the present invention.
FIG. 6 is a view illustrating structures of a first metal base and a second metal base for improving adhesion in a light emitting device package according to another embodiment of the present invention.
7 is a view illustrating another structure of the first metal base and the second metal base for improving adhesion in the light emitting device package according to another embodiment of the present invention.
[Description of the Reference Numerals]
10:
10b: second metal base 20: adhesive member
30
50a: first
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090021767A KR101067822B1 (en) | 2009-03-13 | 2009-03-13 | Light emitting device package and manufacturing method the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090021767A KR101067822B1 (en) | 2009-03-13 | 2009-03-13 | Light emitting device package and manufacturing method the same |
Publications (2)
Publication Number | Publication Date |
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KR20100103241A true KR20100103241A (en) | 2010-09-27 |
KR101067822B1 KR101067822B1 (en) | 2011-09-27 |
Family
ID=43008054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020090021767A KR101067822B1 (en) | 2009-03-13 | 2009-03-13 | Light emitting device package and manufacturing method the same |
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Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003163378A (en) | 2001-11-26 | 2003-06-06 | Citizen Electronics Co Ltd | Surface mount light emitting diode and its manufacturing method |
JP2003309292A (en) * | 2002-04-15 | 2003-10-31 | Citizen Electronics Co Ltd | Metal core substrate of surface mounting light emitting diode and its manufacturing method |
KR100620891B1 (en) | 2005-03-21 | 2006-09-06 | 서울옵토디바이스주식회사 | Luminous element and method of manufacturing the same |
KR20070044099A (en) * | 2005-10-24 | 2007-04-27 | 김성진 | Nitride-based light emitting diode and manufacturing method of the same |
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2009
- 2009-03-13 KR KR1020090021767A patent/KR101067822B1/en not_active IP Right Cessation
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