KR101067822B1 - Light emitting device package and manufacturing method the same - Google Patents

Light emitting device package and manufacturing method the same Download PDF

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Publication number
KR101067822B1
KR101067822B1 KR1020090021767A KR20090021767A KR101067822B1 KR 101067822 B1 KR101067822 B1 KR 101067822B1 KR 1020090021767 A KR1020090021767 A KR 1020090021767A KR 20090021767 A KR20090021767 A KR 20090021767A KR 101067822 B1 KR101067822 B1 KR 101067822B1
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KR
South Korea
Prior art keywords
metal base
light emitting
emitting device
adhesive member
metal
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KR1020090021767A
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Korean (ko)
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KR20100103241A (en
Inventor
안복만
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안복만
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Priority to KR1020090021767A priority Critical patent/KR101067822B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting device package and a method of manufacturing the same, and more particularly, the present invention relates to a light emitting device package and a method of manufacturing the light emitting device, in particular LED, which can be reduced in size and excellent in heat radiation performance. In the present invention, the metal base for heat dissipation in which the light emitting device is located is etched in half in the thickness direction, and the surface of the etching surface is repeatedly treated to fill the adhesive member, thereby not being in contact with each other, but being supported by the adhesive member. To separate. Electroplating to form a plating layer on the two metal base and the adhesive member to increase the adhesion between the components. A portion of the plating layer corresponding to the adhesive member is etched to electrically insulate the two metal bases. Then, a circuit operation for electrically connecting the light emitting element to the two metal bases is performed. Through such a process, a printed circuit board is manufactured. Therefore, since the heat of the light emitting device is directly radiated through the metal base, the heat dissipation performance is excellent, and it is not necessary to provide a separate electrode layer and an insulating layer for connecting the electrode to the light emitting device in the metal case, thereby further miniaturizing the product.

Description

LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THE SAME}

The present invention relates to a light emitting device package and a method for manufacturing the same, and more particularly, to a light emitting device package and a method for manufacturing the same, which are excellent in heat dissipation performance of the LED and can be miniaturized by reducing the product thickness.

In general, a light emitting device is a light emitting diode (LED), which is a device used to send and receive signals by converting electrical signals into infrared, visible, or ultraviolet light using the characteristics of compound semiconductors. to be.

LED has the advantages of high efficiency, high-speed response, long life, miniaturization, light weight, low power consumption, energy saving, and carbon dioxide generation and mercury-free light source. It is applied to many fields such as LCD, full color LED display. In addition, the point light source and ultra-small optical devices can freely design lines, planes, and spaces, and thus their fields of application are expected to be sustained in a wide range of fields such as display, signal, display, lighting, bio, telecommunications, mobile phones, LCD, and automotive industries.

Core technologies of the LED packaging process include chip design, structure design, optical design, thermal design, and packaging process technology at the chip level in order to make optimal use of the emitted light. Incorporates packaging technologies that take into account the requirements of the application. The development direction of LED packaging technology is developing in the direction of ultra-thin or ultra-small (backlight), high output (lighting), high integration (display) depending on the type of application products. to be.

The LED chip is manufactured as an optical device through a packaging process, and various LED backlights, LED displays, and LED lights are made using the optical device. At this time, the principle and process technology for packaging the chip are largely large depending on the type of LED application product. Different. That is, the optimum design conditions of packages and modules are changing as the output power of LED optical devices for obtaining high power LED light sources continues to improve, and there are many types of packages because they have diverse applications and no standard specifications. , Surface mount device (SMD), chip on board (COB), and back light unit (BLU).

This LED package is completed by a molding process after the basic die bonding and wire bonding process to complete the light source module.

In order to obtain high output light, the LED package has a problem of high heat generation due to poor heat dissipation performance in the package. Thus, when high heat remains inside the package without heat dissipation, resistance It becomes very high and light efficiency falls. Since there are many thermal resistors between the light emitting device and the heat radiating device, heat generated in the light emitting device is not easily transferred to the outside.

In addition, since the LED package has an electrode installed separately on the metal base, installation of the insulating layer and the electrode layer is essential, thereby increasing the thickness of the product, which increases the manufacturing cost and complicates the manufacturing process.

One aspect of the present invention provides a light emitting device package and a method of manufacturing the same by changing the heat dissipation structure of the light emitting device package to improve the heat dissipation performance for the light emitting device and to reduce the product thickness.

To this end, the light emitting device package according to the embodiment of the present invention includes a first metal base on which the light emitting device is provided, and a second metal base adhered to the first metal base by an adhesive member. And the second metal base are installed to be spaced apart from each other by the adhesive member so that polarities are separated from each other to electrically connect the electrodes of the light emitting device.

At least one of the first metal base and the second metal base may be characterized in that the interface between the adhesive member is curved.

At least one of the first metal base and the second metal base may include at least one inner groove formed on an interface between the adhesive member and the adhesive member.

The at least one inner groove is characterized in that it comprises any one or combination of arc shape or polygonal shape.

The at least one inner groove may be formed in at least one of the thickness direction or the longitudinal direction of the first metal base or the second metal base.

In addition, the method of manufacturing a light emitting device package according to an embodiment of the present invention by preparing a metal base for dissipating heat of the light emitting device, by repeating the process of etching the metal base and injecting an adhesive member on the etching surface Separating the metal base into two metal bases, forming a plating layer on both sides of the two metal bases, and etching a part of the formed plating layer to form an electrode so that the polarities of the two metal bases are separated. It is characterized by including.

Forming a curved etching surface in at least one of the thickness direction or the longitudinal direction of the metal base when etching the metal base to separate the metal base into two metal base.

Forming at least one polygonal or arc-shaped groove formed inward on the etching surface formed in the longitudinal direction of the metal base.

According to an embodiment of the present invention described above, the present invention after separating the metal base for dissipating heat of the light emitting device into two metal bases are separated from each other and spaced apart from each other by an adhesive member, the light emitting device Is connected to each metal base to form a light emitting device package, so heat of the light emitting device is immediately discharged through the metal base without passing through an intermediate medium, so the heat dissipation is excellent and the electrode is connected to the light emitting device in the metal case. For this reason, it is not necessary to provide a separate electrode layer and an insulating layer, thereby further miniaturizing the product.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a cross-sectional view of a light emitting device package according to an embodiment of the present invention.

As shown in Figure 1, the light emitting device package according to an embodiment of the present invention includes a metal base 10 for heat radiation.

The metal base 10 is formed of a thermally conductive metal having high heat dissipation capability, for example, copper or aluminum. For example, the metal base 10 is formed of a copper plate having a thickness of about 0.5 mm to 1.6 mm.

In addition, the metal base 10 includes a first metal base 10a and a second metal base 10b. The first metal base 10a and the second metal base 10b are connected by the insulating adhesive member 20. At this time, the interface between the adhesive member 20 of the first metal base 10a and the interface between the adhesive member 20 of the second metal base 10b are curved. This is to improve the adhesion between the first metal base (10a) and the second metal base (10b) compared to the linear interface.

The adhesive member 20 is provided on opposing surfaces of the first metal base 10a and the second metal base 10b. The first metal base 10a and the second metal base 10b are horizontally spaced apart from each other by the adhesive member 20.

The adhesive member 20 is made of an insulating resin. The adhesive member 20 may use a pressure-sensitive adhesive member 20 (PSA), a prepreg, a thermosetting curing agent, and the like, in addition to the resin, which may be electrically insulated. The adhesive member 20 is attached to the first metal base 10a and the second metal base 10b by heating and pressing.

In order to increase the adhesion between the first metal base 10a, the second metal base 10b, and the adhesive member 20, and to increase the wire bonding property of the first metal base 10a and the second metal base 10b. Both surfaces of the structure of the first metal base 10a and the second metal base 10b attached by the adhesive member 20 are electroplated. The first metal base 10a and the second metal are partially etched by etching the plating layer 30 in the longitudinal direction on the adhesive member 20 so that the first metal base 10a and the second metal base 10b serve as electrodes. The base 10b is electrically insulated.

The light emitting device 40 is attached to the first metal base 10a by a thermally conductive adhesive. The light emitting device 40 may be provided on the first metal base 10a by a chip mounting pad. The chip mounting pad is to provide a mounting area for mounting the light emitting device 40. The pad for chip mounting may be formed by patterning copper foil on the first metal base 10a.

The light emitting device 40 is soldered to the upper portion of the first metal base 10a. Since the light emitting device 40 is directly bonded to the first metal base 10a, heat generated from the light emitting device 40 may be more effectively emitted to the outside, and an adhesive layer such as epoxy may be formed to form the light emitting device 40. Compared with the attached film, the heat transfer can be prevented from being delayed in the adhesive layer, so the heat dissipation performance is excellent.

The first metal base 10a is connected to the first electrode of the light emitting device 40 through the first conductive wire 50a. The second metal base 10b is connected to the second electrode of the light emitting device 40 through the second conductive wire 50b. The first conductive wire 50a is wire bonded to the first metal base 10a and the first electrode of the light emitting device 40, and the second conductive wire 50b is the second metal base 10b and the light emitting device 40. Wire-bonded to the second electrode. Since the light emitting device 40 is directly connected to the first metal base 10a and the second metal base 10b, the thickness of the light emitting device package can be greatly reduced, so that the light emitting device 40 can be miniaturized and the manufacturing process can be very simple. That is, conventionally, in order to form a separate electrode on the upper surface of the metal base, the insulating layer and the electrode layer must be sequentially formed and then etched and surface treated, but in one embodiment of the present invention, the first metal base 10a and the second metal. Since the base 10b itself serves as a heat dissipation and an electrode, it is not necessary to form an existing insulating layer and an electrode layer, thereby reducing the thickness of the product and simplifying the manufacturing process.

As described above, the heat dissipating metal base for dissipating the heat of the light emitting element 40 to the outside is etched and separated into the first metal base 10a and the second metal base 10b, and then the adhesive member is formed on each etching surface. 20 is injected to connect the first metal base 10a and the second metal base 10b. Then, copper plating the upper and lower surfaces of the first metal base (10a) and the second metal base (10b) connected by the adhesive member 20, the partial plating layer 30 on the adhesive member 20 in the longitudinal direction The light emitting device package is completed by etching to electrically insulate the first metal base 10a and the second metal base 10b. In the light emitting device package thus completed, the light emitting device 40 is soldered and bonded on the first metal base 10a, and the electrode, the first metal base 10a, and the second metal base 10b of the light emitting device 40 are respectively. After the wire is bonded to the printed circuit board by heat pressing the printed circuit board (PCB) through the thermal pad on the lower surface of the light emitting device package.

2 shows a manufacturing process of a light emitting device package according to an embodiment of the present invention. As shown in FIG. 2, the manufacturing process of the light emitting device package according to the exemplary embodiment of the present invention includes preparing a metal base 10, and etching the upper surface of the metal base 10. ), The process of injecting the adhesive member 20 to the etched upper surface of the metal base 120, the process of etching the lower surface corresponding to the upper surface of the metal base 10 (130), the etched lower portion of the metal base Injecting the adhesive member 20 into the surface 140, forming a plating layer on both surfaces of the structure in which the adhesive member 20 is injected into the etched upper and lower surfaces of the metal base 150, and partially etching the plating layer. The light emitting device package is manufactured through a process (160) for forming a light and a process (170) for surface treatment after electrode formation.

Hereinafter, the manufacturing process of the light emitting device package will be described in detail with reference to FIGS. 3A to 3H.

3A to 3H are views illustrating a manufacturing process of a light emitting device package according to an embodiment of the present invention.

As shown in FIG. 3A, the light emitting device package according to the exemplary embodiment includes a metal base 10 that emits heat from the light emitting device 40 to the outside. The metal base 10 is made of a thermally conductive metal having high heat dissipation capability such as copper or aluminum.

As shown in FIG. 3B, the upper surface of the metal base 10 is etched by a predetermined thickness (eg, 1 / 2D, D: metal base thickness) in the thickness direction. At this time, in order to increase the adhesion with the adhesive member 20 to be described later the etching surface is made of a curved form. In addition, the surface of the upper etching surface of the metal base 10 can be roughened as a method for further increasing the adhesion.

As shown in FIG. 3C, after the upper surface of the metal base 10 is etched, the adhesive member 20 is filled in the upper etching surface of the metal base 10. As this adhesive member 20, electrically insulating resin is used, for example.

As shown in FIG. 3D, after etching the upper surface of the metal base, the lower surface of the metal base is etched by the remaining thickness (eg, 1 / 2D) in the thickness direction. In order to increase the adhesion with the adhesive member 20, the etching surface is formed in the same curved shape as above. In addition, the surface of the lower etching surface of the metal base 10 can be roughened as a method for further increasing the adhesion. As described above, the metal base 10 is physically separated into the first metal base 10a and the second metal base 10b by etching the upper and lower surfaces of the metal base.

As shown in FIG. 3E, the lower surface of the metal base 10 is etched and then the adhesive member 20 of the same material filled in the upper etching surface of the metal base 10 on the lower etching surface of the metal base 10. Fill it.

By performing the process of FIGS. 3B to 3E, the metal base 10 is physically separated into the first metal base 10a and the second metal base 10b. That is, the first metal base 10a and the second metal base 10b are spaced apart from each other by the adhesive member 20.

As shown in FIG. 3F, the metal base 10 is etched in half in the thickness direction, and the surface of the etching surface is treated, and then the process of filling the adhesive member 20 is repeated to avoid contact with each other, but by the adhesive member 20. After separating into two metal bases that are supported, electroplating is performed on both surfaces of the structure in which the first metal base 10a and the second metal base 10b are connected by the adhesive member 20 to form the plating layer 30. do. The plating layer 30 increases the adhesion between the adhesive member 20 and the first metal base 10a and the adhesive member 20 and the second metal base 10b. In addition, the plating layer 30 increases the wire bonding property of the first metal base 10a and the second metal base 10b.

As shown in FIG. 3g, after the first metal base 10a and the second metal base 10b are electroplated on both surfaces of the structure connected by the adhesive member 20, the plating layer 30 is formed. In order to allow the first metal base 10a and the second metal base 10b to serve as electrodes, the first metal base is partially etched by etching the plating layer 30 in the longitudinal direction on the adhesive member 20 so that the polarity is separated. 10a and the second metal base 10b are electrically insulated from each other. At this time, even if the plating layer 30 is partially etched, since the vicinity of the adhesive member 20 is in contact with the remaining plating layer 30 (G-G1), the adhesiveness is maintained in a high state.

As shown in FIG. 3H, after the light emitting device package having the above structure is completed, the upper surface of the first metal base 10a is soldered and bonded to the upper surface of the plating layer 30 corresponding to the upper surface of the first metal base 10a more specifically. The first electrode (for example, the anode) of the light emitting device 40 is electrically connected to the plating layer 30 on the first metal base 10a through the first conductive wire 50a, and the first of the light emitting device 40 The second electrode (eg, the cathode) is electrically connected to the plating layer 30 on the second metal base 10b through the second conductive wire 50b to install the light emitting device 40 in the light emitting device package. Thereafter, the light emitting device package in which the light emitting device 40 is installed is applied to a product by installing the light emitting device package on a printed circuit board through a thermal pad.

In the light emitting device package according to the embodiment of the present invention, adhesion is formed by forming a boundary surface in the thickness direction among the boundary surfaces of the first metal base 10a and the boundary surface of the second metal base 10b with the adhesive member 20. The adhesion area with the member 20 is increased to increase the bearing force between the first metal base 10a and the second metal base 10b.

In addition to the above-described method, the boundary surface in the longitudinal direction of the boundary surface of the first metal base 10a and the boundary of the second metal base 10b is formed in a curve such that the adhesion area with the adhesive member 20 is increased, but in various numbers and shapes. It may have a groove formed inside the interface. This groove is formed so that the inner diameter of the interface is larger than the inner diameter of the interface inlet so that the adhesion area is increased to improve the adhesion.

As illustrated in FIG. 4, grooves 11a and 11b having a polygonal shape in the longitudinal direction may be formed in the first metal base 10a and the second metal base 10b, respectively. The polygonal grooves 11a and 11b may be selectively formed on either side.

In addition, as illustrated in FIG. 5, two polygonal grooves 12a, 13a, 12b, and 13b may be formed in the first metal base 10a and the second metal base 10b in the longitudinal direction, respectively. have. The two polygonal grooves 12a and 13a and 12b and 13b may be selectively formed on either side.

In addition, as illustrated in FIG. 6, arc-shaped grooves 14a and 14b may be formed in the first metal base 10a and the second metal base 10b in the longitudinal direction, respectively. The arc-shaped grooves 14a and 14b may be selectively formed on either side.

In addition, as shown in FIG. 7, two arc-shaped grooves 15a, 16a, 15b, and 16b are spaced apart in the longitudinal direction from the first metal base 10a and the second metal base 10b. Each can be formed. The two arc-shaped grooves 15a, 16a, 15b, 16b described above may be selectively formed on either side.

1 is a schematic perspective view of a light emitting device package according to an embodiment of the present invention.

2 is a control flowchart illustrating a manufacturing process of a light emitting device package according to an embodiment of the present invention.

3A to 3H are views illustrating a manufacturing process of a light emitting device package according to an embodiment of the present invention.

4 is a view illustrating a structure of a first metal base and a second metal base for improving adhesion in a light emitting device package according to another embodiment of the present invention.

5 is a view showing another structure of the first metal base and the second metal base for improving the adhesion in the light emitting device package according to another embodiment of the present invention.

FIG. 6 is a view illustrating structures of a first metal base and a second metal base for improving adhesion in a light emitting device package according to another embodiment of the present invention.

7 is a view illustrating another structure of the first metal base and the second metal base for improving adhesion in the light emitting device package according to another embodiment of the present invention.

[Description of the Reference Numerals]

10: metal base 10a: first metal base

10b: second metal base 20: adhesive member

30 plating layer 40 light emitting element

50a: first conductive wire 50b: second conductive wire

Claims (8)

delete A first metal base provided with a light emitting element; A second metal base adhered to the first metal base by an adhesive member, The first metal base and the second metal base are provided to be spaced apart from each other by the adhesive member so that the polarities are separated from each other to electrically connect the electrodes of the light emitting device, At least one of the first metal base and the second metal base is a light emitting device package comprising a curved interface between the adhesive member. The method of claim 2, At least one of the first metal base and the second metal base has at least one inner groove formed on the interface between the adhesive member and the light emitting device package. The method of claim 3, The at least one inner groove is a light emitting device package comprising any one or combination of arc shape or polygonal shape. 5. The method of claim 4, The at least one inner groove is formed in at least one of the thickness direction or the longitudinal direction of the first metal base or the second metal base. Preparing a metal base for dissipating heat of the light emitting device; Etching the metal base and injecting an adhesive member on the etching surface to separate the metal base into two metal bases; Forming plating layers on both sides of the two metal bases; And forming an electrode by etching a portion of the formed plating layer to separate polarities of the two metal bases. The method of claim 6, Manufacturing a light emitting device package comprising forming a curved etching surface in at least one of a thickness direction or a length direction of the metal base when etching the metal base to separate the metal base into two metal bases. Way. The method of claim 7, wherein Method of manufacturing a light emitting device package comprising forming at least one polygonal or arc-shaped groove formed inward on the etching surface formed in the longitudinal direction of the metal base.
KR1020090021767A 2009-03-13 2009-03-13 Light emitting device package and manufacturing method the same KR101067822B1 (en)

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Application Number Priority Date Filing Date Title
KR1020090021767A KR101067822B1 (en) 2009-03-13 2009-03-13 Light emitting device package and manufacturing method the same

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KR101067822B1 true KR101067822B1 (en) 2011-09-27

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163378A (en) 2001-11-26 2003-06-06 Citizen Electronics Co Ltd Surface mount light emitting diode and its manufacturing method
JP2003309292A (en) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd Metal core substrate of surface mounting light emitting diode and its manufacturing method
KR100620891B1 (en) 2005-03-21 2006-09-06 서울옵토디바이스주식회사 Luminous element and method of manufacturing the same
KR20070044099A (en) * 2005-10-24 2007-04-27 김성진 Nitride-based light emitting diode and manufacturing method of the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163378A (en) 2001-11-26 2003-06-06 Citizen Electronics Co Ltd Surface mount light emitting diode and its manufacturing method
JP2003309292A (en) * 2002-04-15 2003-10-31 Citizen Electronics Co Ltd Metal core substrate of surface mounting light emitting diode and its manufacturing method
KR100620891B1 (en) 2005-03-21 2006-09-06 서울옵토디바이스주식회사 Luminous element and method of manufacturing the same
KR20070044099A (en) * 2005-10-24 2007-04-27 김성진 Nitride-based light emitting diode and manufacturing method of the same

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