KR20100093339A

KR20100093339A - Cleaning apparatus for liner

Info

Publication number: KR20100093339A
Application number: KR1020090012480A
Authority: KR
Inventors: 정길호
Original assignee: 엘지이노텍 주식회사
Priority date: 2009-02-16
Filing date: 2009-02-16
Publication date: 2010-08-25

Abstract

An embodiment relates to a semiconductor manufacturing apparatus.

Semiconductor manufacturing apparatus according to the embodiment includes a liner separated from the reaction chamber; A liner chamber containing the liner; A brush part including a brush in contact with a portion of an inner circumference of the liner; And a liner rotating part including a rotating plate that supports and rotates the liner.

Description

LINER CLEANING APPARATUS {CLEANING APPARATUS FOR LINER}

Embodiments relate to a liner cleaning device.

The semiconductor device may be manufactured through a deposition process, a photo process, an etching process, and a diffusion process, and at least one semiconductor device may be formed when these processes are repeated several times several times. In particular, the deposition process is an essential process requiring improvement in the reproducibility and reliability of semiconductor device fabrication, such as a sol-gel method, a sputtering method, an electroplating method, and an evaporation method. , A process of forming the processed film on a semiconductor substrate by a chemical vapor deposition method, a molecular beam epitaxy method, an atomic layer deposition method, or the like.

Among them, the chemical vapor deposition method is most commonly used because the deposition characteristics such as step coverage, uniformity, and mass productivity of the thin film formed on the semiconductor substrate are superior to other deposition methods. Such chemical vapor deposition methods include LPCVD (Low Pressure Chemical Vapor Deposition), APCVD (Atmospheric Pressure Chemical Vapor Deposition), LTCVD (Low Temperature Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), MOCVD (Metal Organic Chemical Vapor Deposition) ) And the like.

For example, the MOCVD is a process of forming a metal compound on a semiconductor substrate using a thermal decomposition reaction of an organic metal. In recent years, as semiconductor devices are highly integrated and high performance is required, new materials are required to be introduced. After the MOCVD process is performed on the semiconductor substrate, residual gases and reaction products present in the chemical vapor deposition facility are introduced. A cleaning and purging process is performed to remove this. Accordingly, the chemical vapor deposition process such as the MOCVD process is a process for introducing a raw material into the reaction chamber in a gaseous state to deposit a predetermined film quality through a chemical reaction on a semiconductor substrate.

Like this, semiconductors are produced as a product by going through the process of making a wafer. Therefore, if an error occurs in the process of performing each process or does not meet the level required in each step, it is difficult to release as a product. In particular, since semiconductors are very sensitive to contamination such as dust, dust, particles, and the like, an appropriate solution is required.

The embodiment provides a liner cleaning device capable of cleaning the liner used in the reaction chamber.

The embodiment has the effect that the operator does not need to directly clean the liner used in the reaction chamber.

Since the embodiment automatically cleans the liner, time and space loss can be reduced.

Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings.

1 is a cross-sectional view of a semiconductor manufacturing apparatus according to an embodiment, and FIG. 2 is a perspective view of the liner of FIG. 1.

Referring to FIG. 1, the semiconductor manufacturing apparatus 100 includes a reaction chamber 120, an exhaust pipe 121, a driving shaft 150, a shower head 170, and a source supply unit 175.

The reaction chamber 120 is a process chamber and includes a susceptor 140, a heating unit 160, and a liner 130. At least one pocket 142 is formed in the susceptor 140, and a wafer is loaded in the pocket 142.

The heating means 160 may be implemented as a heater to heat the lower portion of the susceptor 140.

The susceptor 140 is coupled to the drive shaft 150, and the drive shaft 150 rotates the susceptor 140 at a predetermined speed.

The shower head 170 is a head of the reaction chamber 120, which is open or closed. Here, the shower head 170 is coupled to the top of the reaction chamber 120 in a hinged manner, for example, and is opened or closed from the reaction chamber 120 at the start and end of the run. An exhaust pipe 121 is formed at one side of the reaction chamber 120.

The metal source supplied from the source supply unit 175 is injected into the reaction chamber 120. The source supply unit 175 supplies various metal sources required for semiconductor manufacturing. The metal source may be a gas such as nitrogen (N ₂ ) or ammonia (NH ₃ ) and a metal organic precursors gas when a nitride film (eg, an LED device or an LD device) is deposited on the wafer. And the like. The metal sources may be supplied along different paths, but are not limited thereto. In addition, the structure for supplying the source to the showerhead 170 may be changed, but is not limited thereto.

In addition, the shower head 170 may be formed with a temperature sensor for measuring the wafer temperature, a water flow path for heat radiation, but is not limited thereto.

The liner 130 may be defined as a liner or a vertical shield, and the material may be formed of quartz, a metal plate, or the like. The liner 130 is formed in a cylindrical shape to surround the susceptor 140 between the inner wall of the reaction chamber 120 and the susceptor 140. The liner 130 prevents the inner wall of the reaction chamber 120 from reacting with the source gas, and prevents reaction byproducts, ie, particles, from being deposited on the inner wall of the reaction chamber 120. Accordingly, particles P1 are deposited on the inner circumference of the liner 130 as shown in FIG. 2.

In order to remove particles adhered to the inner circumference of the liner 130, after separating the liner 130 from the reaction chamber 120, the liner 130 is cleaned using a liner cleaning device.

3 is a view showing a liner cleaning apparatus according to an embodiment.

Referring to FIG. 3, the liner cleaning device 200 may include a liner chamber 201, an air supply unit 210, a brush unit 220, a liner rotating unit 230, and an air discharge unit 240.

The liner chamber 201 may be formed to a size such that the top cover 203 is opened and closed, and almost all kinds of liners 130 used in the semiconductor manufacturing apparatus may be inserted or removed.

An air supply unit 210 and a brush unit 220 are disposed at one side of the liner chamber 201, an air discharge unit 240 is disposed at the other side, and a liner rotating unit 230 is disposed at the bottom thereof. The positions of the air supply unit 210, the brush unit 220, and the air discharge unit 240 may be changed, but are not limited thereto.

The air supply unit 210 includes a first pump 211, a discharge connection pipe 215, and a discharge port 213. The first pump 211 discharges pressurized air, and the discharge connection pipe ( 215 supplies the air discharged by the first pump 211 into the liner chamber 201 through the discharge port 213.

The discharge connection tube 215 may be partially formed in a flexible tube and / or bent form (eg, "A" shape), in which case the liner 130 extends to a predetermined position in the liner chamber 201, for example, the liner 130. It can be used to extend to the inside.

The brush part 220 includes a fixing part 221, a support part 222, a brush stand 223, and a brush 225 fixed to the liner chamber 201.

The fixing part 221 fixes the brush part 220 to the liner chamber 201 and may be coupled to one side of the support part 222 by a hinge 222A. That is, the fixing portion 221 is hinged to the support portion 222, and supports the left / right rotation, the up / down rotation of the support portion 222. In addition, the support part 222 may be coupled to the structure that can be attached / detached from the fixing part 221.

The support portion 222 has a screw thread 227 is formed at the bottom, so that the upper portion of the brush base 223 is screwed to the screw line 227. That is, the brush stand 223 can be replaced. In addition, the support part 222 and the brush stand 223 may be integrally formed.

The brush stand 223 is disposed in the vertical downward direction, and corresponds to any position of the inner circumference of the liner 130, and the brush 225 protruding outwardly is part of the inner circumference of the liner 130. Contact.

The discharge port 213 may be coupled to the brush holder 223.

The liner rotating part 230 includes a motor 231, a rotating shaft 233, a rotating plate 235, and a jig 237.

The motor 231 may be controlled to the forward rotation and / and reverse rotation, to provide a predetermined rotational force, the rotating shaft 233 is rotated by the motor 231, the rotation of the rotary plate 235 of the end The shaft is coupled to the center, and rotates the rotating plate 235. The rotating plate 235 is a circular shape for supporting the liner 130, for example, a disk shape, and a jig 237 spaced apart from each other at predetermined intervals is installed at an outer circumference thereof. The jig 237 is to hold the bottom of the liner 130. The jig 237 may be coupled to the rotating plate 235 in a sliding structure capable of moving left / right positions according to the diameter of the liner 130.

The air outlet 240 includes a suction port 241, a suction connector 243, a filter 245, and a second pump 247, and the suction port 241 is inside the liner 130. The suction connector 243 may be a tube type, that is, a flexible tube or a tube of “a” shape, which may extend from the inner periphery of the liner chamber 201 to the inside of the liner 130. have. A filter 245 is connected to the suction connector 243, and the filter 245 filters the particles P1 sucked through the suction connector 243, and the second pump 247 The filter 245 is connected to the filter 245 through an auxiliary pipe 248 to suck air inside the liner chamber 201.

Referring to the operation of the liner cleaning device, when the liner 130 is installed in the liner chamber 201, the liner 130 is mounted on the rotating plate 235 and fixed by the jig 237. The brush stand 223 of the brush unit 220 is rotated at a predetermined angle to face a portion of the inner circumference of the liner 130. In this case, the brush 225 of the brush stand 223 is in the liner 130. Partial contact with the peripheral part.

Thereafter, air is supplied into the liner chamber 201 through the discharge port 213 of the air supply unit 210, and the motor 231 of the liner rotating unit 230 rotates. At this time, the rotation shaft 233 is rotated by the rotation of the motor 231, and the rotating plate 135 is rotated together with the liner 130 by the rotation of the rotation shaft 233.

At this time, as the liner 130 rotates, particles attached to the inner circumference of the liner 130 are separated from the liner 130 by the brush 225 of the brush stand 233. In this case, the air discharge unit 240 sucks the particles P1 through the suction port 241 by the second pump 247, and filters through the filter 245.

According to the rotational speed of the motor 231 and the degree of contact of the brush 225, the particles P1 attached to the inner circumference of the liner 130 may be effectively removed and the suction force of the second pump 247 may be reduced. As a result, the removed particles P1 may be collected by the filter 245.

The liner cleaning device can protect the operator from environmental contaminants because the operator does not clean the liner directly. In addition, the brush 225 can be easily replaced, and since the liner is automatically cleaned, time and space loss can be reduced.

Although the technical spirit of the present invention has been described in detail according to the above-described preferred embodiment, it should be noted that the above-described embodiments are for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various implementations are possible within the scope of the technical idea of the present invention.

1 is a view showing a semiconductor manufacturing apparatus.

2 is a perspective view of the liner of FIG. 1.

3 is a view showing a liner cleaning apparatus according to an embodiment.

Claims

A liner separated from the reaction chamber;

A liner chamber containing the liner;

A brush part including a brush in contact with a portion of an inner circumference of the liner;

And a liner rotating part including a rotating plate to support and rotate the liner.

The method of claim 1,

An air discharge unit having a discharge connection pipe for discharging air into the liner chamber at one side of the liner chamber;

The other side of the liner chamber includes a liner cleaning device including an air inlet having a suction connection for sucking the air in the liner chamber.

The method according to claim 1 or 2,

The brush unit is fixed to the liner chamber; A brush holder formed at one side of the brush; One end is coupled to the fixing portion liner cleaning device including a support for supporting the brush stand.

The method of claim 3,

The brush stand is a liner cleaning device coupled to the removable structure from the support.

The method of claim 3,

And the support part is hinged to the fixing part.

The method according to claim 1 or 2,

The liner rotating unit comprises a motor; A rotating shaft connected to the motor to rotate the rotating plate; And a plurality of jigs supporting the liner around the rotating plate.

The method of claim 2,

At least one of the discharge connector and the suction connector comprises a flexible tube.

The method of claim 2,

Liner cleaning device comprising a filter connected to the suction connector.