KR20100091031A - Apparatus and method for cleaning substrae, and facility for cleanig substrate using the same - Google Patents

Abstract

PURPOSE: An apparatus and a method for cleaning substrates, and a facility for cleaning the substrates using the same are provided to improve a substrate cleaning power by applying the pressure of cleaning pads to the substrates. CONSTITUTION: A transferring unit(110) transfers substrates to a first direction. A cleaning unit is arranged on a transferring path. The cleaning unit pressurizes a rotating cleaning head to the substrates to eliminate foreign materials from the substrates. The cleaning unit includes an upper cleaning unit(220a) and a lower cleaning unit(220b). The upper cleaning unit is arranged on the upper side of the transferring path. The lower cleaning unit is arranged on the lower side of the transferring path.

Description

Substrate cleaning apparatus and method, and substrate cleaning equipment using the same {APPARATUS AND METHOD FOR CLEANING SUBSTRAE, AND FACILITY FOR CLEANIG SUBSTRATE USING THE SAME}

The present invention relates to an apparatus and method for cleaning a substrate, and more particularly, to a substrate cleaning apparatus and method for removing foreign matter on the substrate by pressing a rotating cleaning pad to the substrate, and a substrate cleaning equipment using the same.

Recently, TFT-LCDs have been spotlighted as various display devices due to various advantages such as small size / light weight, wide viewing angle, low power consumption, and the like.

The TFT-LCD manufacturing process is largely divided into a TFT process, a color filter (hereinafter referred to as CF) process, a cell process, and a module process. Among them, the cell process is a process of manufacturing a TFT-LCD cell (Cell) by bonding a liquid crystal between the TFT process and two glass substrates subjected to the CF process, and then cutting the glass. After the cell process, it is made to the actual panel size level and then moved to the module process. The module process is the final process to make the finished panel. The polarizer, PCB, and backlight unit are attached to the TFT-LCD cell made of the cell process, and the state of such a state is called a TFT-LCD module. In other words, the TFT-LCD module is a unit set in a state in which the TFT-LCD panel and the PCB can be electrically conductive to each other by TCP.

Here, the polarizing plates attached to both surfaces of the TFT-LCD panel selectively serve to allow only the light oscillating in a certain direction to be incident and transmitted to the outside, thereby assisting the TFT-LCD to exhibit a good display function. As described above, in the product completed as the TFT-LCD module after the polarizer is attached, defective products due to foreign matter (dust, particles, adherent foreign matters, etc.) on the TFT-LCD cell surface are generated.

The present invention is to provide a substrate cleaning apparatus and method that can more efficiently clean the foreign matter on the substrate, and to provide a substrate cleaning equipment using the same.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a substrate cleaning apparatus according to the present invention includes a transfer unit for transferring a substrate in a first direction; And a cleaning unit provided on a movement path of the substrate to be transferred by the transfer unit, and pressing a rotating cleaning head to the substrate to remove foreign substances from the substrate.

A substrate cleaning apparatus according to the present invention having the configuration as described above, wherein the cleaning unit comprises: an upper surface cleaning unit provided on an upper portion of the substrate movement path to remove foreign substances on the upper surface of the substrate to be transferred; And a lower surface cleaning unit provided below the substrate movement path to remove foreign substances on the lower surface of the substrate to be transferred.

The upper surface cleaning unit and the lower surface cleaning unit may be disposed to face each other with respect to the substrate to be transferred.

The upper surface cleaning unit and the lower surface cleaning unit may be disposed to be spaced apart from each other along the first direction.

The cleaning head includes a disk-shaped cleaning pad in surface contact with the substrate, a holder to which the cleaning pad is coupled, and the upper surface cleaning unit and the lower surface cleaning unit include a rotation drive member for rotating the holder, and the holder. It may further include a first linear drive member for moving in the vertical direction.

The shaft connecting the holder to the rotation drive member is formed with a first flow path through which a cleaning liquid supplied from the outside flows, a second flow path is formed in the holder to communicate with the first flow path, and the cleaning pad has the second flow path. A discharge port connected to the flow path may be formed.

A plurality of cleaning heads may be provided, and the plurality of cleaning heads may be disposed to cover an entire width area of the substrate facing a second direction perpendicular to the first direction.

The plurality of cleaning heads may be arranged side by side adjacent to each other along the second direction.

The plurality of cleaning heads may be arranged in two rows to form a zigzag shape along the second direction.

Cleaning heads located at positions opposite to each other in the second direction among the plurality of cleaning heads may be disposed such that a circumference of a bottom surface of the cleaning pad contacts an edge of the first direction of the substrate.

The display apparatus may further include a second linear driving member configured to move the cleaning heads positioned along the second direction along the second direction.

Rollers positioned between the rows of the second direction in which the cleaning heads are arranged and disposed to face the substrate, the rollers supporting upper and lower surfaces of the substrate; And it may include a roller driving member for rotating the rollers.

A cushion pad attached to an upper surface of the cleaning pad to buffer when the cleaning pad is pressed against the substrate; And a metal plate attached to an upper surface of the cushion pad, wherein the discharge hole formed in the cleaning pad extends through the cushion pad and the plate, and the holder is detachably detachable by magnetic force. Magnets may be installed to engage.

A plurality of fixing pins protrude from the bottom surface of the holder, and holes for inserting the fixing pins may be formed in the cushion pad and the plate.

First flow path grooves extending from the discharge port to the edge may be formed in the bottom surface of the cleaning pad, and the cleaning liquid may flow through the first and second flow paths, the discharge port, and the first flow path grooves.

The first flow path grooves may have a streamline shape extending radially.

Circular second flow path grooves connecting the first flow path grooves may be formed on a bottom surface of the cleaning pad.

The first linear drive member includes a cylinder for providing a linear driving force to the holder and a pneumatic supply for providing pneumatic pressure for driving the cylinder, wherein the pneumatic supply pushes the piston in the cylinder in a direction away from the substrate. A first pneumatic line providing a first pneumatic pressure; A second pneumatic line providing a second pneumatic pressure greater than the first pneumatic pressure to push the piston in the cylinder in a direction toward the substrate; It may be installed in the second pneumatic line, and may include a regulator for exhausting the air in the second pneumatic line or to adjust the flow rate of the air provided to the second pneumatic line.

The regulator includes a sensing member for detecting air pressure in the second pneumatic line; And a valve for exhausting air in the second supply line when the pressure in the second pneumatic line detected by the sensing member is greater than the second pneumatic pressure.

The regulator is supplied to the second pneumatic line such that the air pressure in the second pneumatic line reaches the second pneumatic pressure when the pressure in the second pneumatic line detected by the sensing member is less than the second pneumatic pressure. Air flow can be adjusted.

And supporting roller members disposed to support the substrate at positions facing the upper surface cleaning unit and the lower surface cleaning unit with respect to the substrate, wherein each of the supporting roller members has a lengthwise direction in the first direction. Facing in the second vertical direction, the support roller members may be arranged parallel along the first direction.

And a bending preventing member supporting a central portion of the supporting roller members so as to prevent the bending of the supporting roller members due to the pressing force of the upper cleaning unit and the lower cleaning unit, wherein the bending preventing member is based on the supporting roller members. Rollers positioned to face the substrate and disposed between the adjacent support roller members and in contact with a central portion of the support roller members; And a housing accommodating the rollers and rotatably supporting the rollers.

The cleaning unit is provided on either side of the upper and lower sides of the substrate, the cleaning head includes a disk-shaped cleaning pad in contact with the substrate and the holder, the cleaning pad is coupled, the cleaning unit is It may further include a rotation drive member for rotating the holder, and a first linear drive member for moving the holder in the vertical direction.

The shaft connecting the holder to the rotation drive member is formed with a first flow path through which a cleaning liquid supplied from the outside flows, a second flow path is formed in the holder to communicate with the first flow path, and the cleaning pad has the second flow path. A discharge port connected to the flow path may be formed.

A plurality of cleaning heads are disposed to cover the entire width of the substrate in a second direction perpendicular to the first direction, and the plurality of cleaning heads are arranged in two rows to form a zigzag shape along the second direction. Can be.

Cleaning heads at positions opposite to each other in the second direction among the plurality of cleaning heads are disposed such that a circumference of a bottom surface of the cleaning pad contacts an edge in the first direction of the substrate. The apparatus may further include a second linear driving member configured to move the cleaning heads positioned along the second direction along the second direction.

Support roller members disposed to support the substrate at a position facing the cleaning unit with respect to the substrate, the support roller members having a longitudinal direction facing the second direction and parallel to the first direction; And a bending prevention member for supporting a central portion of the supporting roller members to prevent the bending of the supporting roller members due to the pressing force of the cleaning unit, wherein the bending preventing member faces the substrate with respect to the supporting roller members. Rollers positioned and disposed between the adjacent support roller members and in contact with a central portion of the support roller members; And a housing accommodating the rollers and rotatably supporting the rollers.

In order to achieve the above object, the substrate cleaning apparatus according to the present invention comprises a main cleaning unit for removing foreign matter on the substrate by using the substrate cleaning apparatus of any one of claims 1 to 27; A rinse unit for cleaning the substrate passing through the main cleaning unit; And it characterized in that it comprises a drying unit for drying the substrate washed in the rinse portion.

In the substrate cleaning apparatus according to the present invention having the configuration as described above, the substrate cleaning apparatus is disposed adjacent to the front end of the main cleaning portion, further comprising a brush cleaning portion for cleaning the substrate to be loaded into the main cleaning portion with a roll brush. can do.

The apparatus may further include a brush cleaner disposed between the main cleaner and the rinse unit to clean the substrate cleaned by the main cleaner with a roll brush.

A cleaning liquid tank for storing the cleaning liquid; A first nozzle provided on an upper portion of the substrate to be transferred in the brush cleaning unit and discharging a cleaning liquid to the substrate; A second nozzle provided on an upper portion of the substrate to be transferred in the main cleaning unit and discharging a cleaning liquid to the substrate; A cleaning liquid supply line connecting the cleaning liquid tank to the first and second nozzles; And a heater disposed on the cleaning solution supply line and heating the cleaning solution.

The cleaning liquid supply line may be connected to the cleaning unit to supply the cleaning liquid to the cleaning unit in the main cleaning unit.

A first recovery line for recovering the cleaning liquid drained from the brush cleaning unit to the cleaning liquid tank; And a second recovery line for recovering the cleaning liquid drained from the main cleaning unit to the cleaning liquid tank.

The cleaning solution may be an organic solution, and the cleaning solution may be deionized water.

In order to achieve the above object, the substrate cleaning method according to the present invention is characterized in that the substrate is transported, and the rotating cleaning pad is pressed on the transported substrate to clean the substrate.

In the substrate cleaning method according to the present invention having the features as described above, by pressing the cleaning pad in a direction facing each other about the substrate on the transfer path of the substrate, the upper and lower surfaces of the substrate to be transferred at the same time It can be washed.

The cleaning pad may be pressed in a direction crossing each other about the substrate on the transfer path of the substrate to sequentially clean the upper and lower surfaces of the substrate to be transferred.

The plurality of cleaning pads are provided on the upper and lower portions of the substrate to be transferred, and the plurality of cleaning pads are arranged in two rows to form a zigzag shape along a direction perpendicular to the transfer direction of the substrate. The position of the cleaning pad at the point which is opposed in the direction perpendicular | vertical to the conveyance direction of the said board | substrate can be moved according to the width | variety of the said board | substrate to be cleaned.

The substrate may be cleaned while supplying a high temperature cleaning liquid to the substrate through a discharge hole formed in the center of the cleaning pad.

The high temperature cleaning liquid may be an organic solution in a temperature range of 20 to 50 ℃.

The high temperature cleaning liquid may be deionized water in the temperature range of 40 ~ 80 ℃.

According to the present invention, the surface cleaning force can be improved by applying a strong surface pressure to the substrate by the pressing force of the cleaning pad.

According to the present invention, the cleaning force of the substrate can be improved by increasing the number of times the foreign matter on the substrate and the cleaning pad are contacted by the rotation of the cleaning pad.

Moreover, according to this invention, the whole surface of a board | substrate can be wash | cleaned evenly by wash | cleaning a board | substrate using a some cleaning pad.

Moreover, according to this invention, since a board | substrate is conveyed in the state which contacted the upper and lower surfaces of a board | substrate, a board | substrate can be transported stably.

Further, according to the present invention, by supporting the support roller members three points supporting the cleaning unit, it is possible to prevent sagging of the support roller members.

Moreover, according to this invention, the fixing force of a sticking foreign material to the board | substrate can be weakened using a high temperature washing | cleaning liquid, and a board | substrate cleaning efficiency can be improved.

In addition, according to the present invention, since the attachment and detachment of the cleaning pad is easy, the operation time can be improved by shortening the time required for replacement.

In addition, according to the present invention, the cleaning liquid flows from the center of the bottom of the cleaning pad to the edge to facilitate the removal of foreign substances during cleaning, and the removed foreign substances can be smoothly discharged.

Further, according to the present invention, the cleaning pads of the cleaning units can maintain a constant pressing force to uniformly clean the surface of the substrate.

Hereinafter, a substrate cleaning apparatus and method according to a preferred embodiment of the present invention and a substrate cleaning apparatus using the same will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

(Example)

In the present embodiment, the substrate may be a TFT-LCD cell (Cell) in which a liquid crystal is injected therebetween after bonding and cutting two glasses that have undergone a TFT process and a CF process, and the substrate cleaning apparatus and method of the present invention. The substrate cleaning equipment using the same may be used for a cleaning process for a flat substrate, in particular, a cleaning process performed immediately before attaching the polarizing plates to both surfaces of the substrate in a module process.

1 is a schematic cross-sectional view showing an example of a substrate cleaning apparatus 1 according to the present invention.

Referring to FIG. 1, the substrate cleaning apparatus 1 includes a loader unit 10, a cleaning processing unit 20, and an unloader unit 30. The loader unit 10, the cleaning processing unit 20, and the unloader unit 30 may be arranged side by side in a line. The loader unit 10 loads the substrate S to be cleaned by the cleaning processing unit 20. The cleaning processing unit 20 performs a cleaning process of the substrate S. Then, the unloader unit 30 unloads the substrate S cleaned from the cleaning processing unit 20.

In detail, the cleaning processing unit 20 may include a brush cleaning unit 100, a main cleaning unit 200, a rinse unit 300, and a drying unit 400. The brush cleaner 100, the main cleaner 200, the rinse unit 300, and the dryer 400 may be arranged in a line. The substrate S is washed while being moved to the brush cleaner 100 and the main cleaner 200, and the cleaned substrate is moved to the rinse unit 300 to be cleaned and then moved to the drying unit 400 to be dried. .

The brush cleaner 100 may be disposed adjacent to the front end of the main cleaner 200, and the foreign matter on the substrate S to be loaded into the main cleaner 200 may be cleaned using the brush cleaner unit 120. Remove it automatically. The main cleaning unit 200 secondly removes foreign matter (eg, adherent foreign matter) on the substrate S that is not removed from the brush cleaning unit 100 using the cleaning unit 220. The configuration and function of the cleaning unit 220 will be described later in detail.

1 illustrates a case where the brush cleaner 100 is disposed in front of the main cleaner 200, in contrast, the brush cleaner 100 is a rear end of the main cleaner 200, that is, the main cleaner ( 200 may be disposed between the rinse unit 300. In this case, the main cleaning unit 200 primarily removes foreign matter on the substrate, and the brush cleaning unit 100 secondly removes foreign matter on the substrate cleaned by the main cleaning unit 200.

The rinse unit 300 cleans the substrate cleaned by the brush cleaner 100 and the main cleaner 200 using a rinse liquid. The first nozzle 320 provided at the front end of the rinse unit 300 may supply deionized water mixed with gas such as air to the substrate S, and the second nozzle 340 provided at the rear end may be detached. Ionized water can be supplied to the substrate (S).

The drying unit 400 supplies a dry gas onto the substrate S washed by the rinse unit 300 to dry the residual moisture on the substrate S. The drying nozzle 420 provided to the drying unit 400 may dry the substrate S by supplying heated air, heated nitrogen gas, or heated inert gas. Optionally, the drying nozzle 420 may supply an organic solvent such as isopropyl alcohol to the substrate S, and then supply heated air or the like to the substrate S to dry the substrate S.

2 is an enlarged view of the brush cleaner 100 and the main cleaner 200 of FIG. 1, and FIG. 3 is a plan view of the main cleaner of FIG. 2.

2 and 3, the brush cleaner 100 includes a substrate transfer unit 110, a brush cleaner unit 120, and first nozzles 130. The substrate transfer unit 110 has a plurality of transfer shafts 112 and rollers 114. The transfer shafts 112 are disposed above and below the substrate S on a path through which the substrate S is transferred. The conveying shafts 112 face the direction perpendicular to the conveying direction of the substrate, and the conveying shafts 112 are arranged side by side parallel to each other along the conveying direction of the substrate.

Each transfer shaft 112 is coupled with a roller 114 in contact with the substrate (S). The roller 114 has a length corresponding to the width of the substrate S, and is installed to surround the transfer shaft 112 along the longitudinal direction of the transfer shaft 112.

The transfer shafts 112 are connected to a power transmission member (not shown), such as a belt-pull assembly or gear assembly, and the power transmission member (not shown) receives a driving force from the driving member (not shown). When the conveying shaft 112 and the roller 114 disposed on the upper and lower portions of the conveying path of the substrate are rotated by the driving member and the power transmitting member, the substrate S is caused by friction between the roller 114 and the upper and lower surfaces of the substrate S. FIG. Is transported.

The brush cleaning unit 120 has a brush 122 and a brush shaft 124. The brush 122 contacts the substrate S to physically remove contaminants from the substrate S. The brush 122 has a length corresponding to the width of the substrate S, and is disposed at the upper and lower portions of the substrate transfer path in parallel with the longitudinal direction of the transfer shaft 122. The brush shaft 124 may be fixedly coupled to both ends of the brush 122, and a driving member such as a motor may be connected to the brush shaft 124.

The first nozzles 130 are provided on the substrate to be transferred in the brush cleaner 100, and discharge the cleaning liquid toward the substrate. The cleaning solution may be an organic solution such as Tetra Methyl Ammonium Hydroxide (TMAH) or deionized water.

The main cleaning unit 200 includes a substrate transfer unit 210, cleaning units 220 (220a and 220b), and second nozzles 230. The substrate transfer unit 210 has a plurality of transfer shafts 212 and rollers 214. The transfer shafts 212 are disposed above and below the substrate S on a path through which the substrate S is transferred. The conveying shafts 212 are oriented in a direction perpendicular to the conveying direction of the substrate S, and the conveying shafts 112 are arranged parallel to each other along the conveying direction of the substrate S. Both ends of the transfer shafts 212 are rotatably supported by the bearing member 213. Hereinafter, the conveyance direction of the board | substrate S is called 1st direction, and the direction perpendicular | vertical to the conveyance direction of the board | substrate S on the board | substrate S plane is called a 2nd direction.

Each transfer shaft 212 is coupled with a roller 214 in contact with the substrate (S). The roller 214 has a length corresponding to the width of the substrate S, and is installed to surround the transfer shaft 112 along the longitudinal direction of the transfer shaft 212.

The transfer shafts 212 are connected to a power transmission member 215, such as a belt-pulley assembly or gear assembly, and the power transmission member 215 is connected to a drive member 216, such as a motor, to receive driving force. When the transfer shafts 212 and the rollers 214 disposed above and below the transfer path of the substrate S are rotated by the driving member 216 and the power transmission member 215, the rollers 214 and the substrate ( S) The substrate S is transferred in the first direction by friction between the upper and lower surfaces.

The cleaning units 220 (220a and 220b) are provided above and below the moving path of the substrate transferred by the substrate transfer unit 210, and press the rotating cleaning heads 220a-1 and 220a-2 to the substrate. Remove foreign substances such as sticky foreign matter on the bed.

The second nozzles 230 are provided on the substrate to be transferred in the main cleaner 200, and discharge the cleaning liquid toward the substrate. The cleaning solution may be an organic solution such as Tetra Methyl Ammonium Hydroxide (TMAH) or deionized water.

The first nozzles 130 of the brush cleaner 100 and the second nozzles 230 of the main cleaner 200 are supplied with the cleaning liquid from the cleaning liquid supply member 240. The cleaning liquid supply member 240 has a cleaning liquid tank 242 that stores the cleaning liquid. The cleaning liquid tank 242 is connected to the first nozzles 130 and the second nozzles 230 by the cleaning liquid supply line 241. The filter 243, the pump 244, and the heater 245 are disposed on the cleaning liquid supply line 241. The filter 243 filters the cleaning liquid supplied to the first nozzles 130 and the second nozzles 230. The pump 244 pumps the cleaning liquid provided from the cleaning liquid tank 242 to the first nozzles 130 and the second nozzles 230. The heater 245 heats the cleaning liquid provided from the cleaning liquid tank 242 to the process temperature.

The heater 245 may be installed in the cleaning liquid supply line 241 as shown in FIG. 2, and may also be installed in the cleaning liquid tank 242. When an organic solution such as Tetra Methyl Ammonium Hydroxide (TMAH) is used as the cleaning liquid, the heater 245 may heat the organic solution so that the organic solution maintains a temperature range of 20 to 50 ° C. And when deionized water is used as the cleaning liquid, the heater 245 may heat the deionized water so that the deionized water maintains a temperature range of 40 ~ 80 ℃.

When the cleaning liquid heated at the above temperature is supplied to the substrate S, the adherent foreign matter on the substrate S can be more efficiently removed. That is, since the heat of the cleaning liquid not only weakens the binding force between the molecules of the adherent foreign matter, but also significantly reduces the adhesion between the adherent foreign matter and the substrate, the adherent foreign matter on the substrate S can be more effectively removed.

The cleaning liquid tank 242 may be connected to a first recovery line 246 for recovering the cleaning liquid drained from the brush cleaning part 100, and a second recovery line 247 for recovering the cleaning liquid drained from the main cleaning part 200. Can be. The cleaning liquid recovered to the cleaning liquid tank 242 through the first recovery line 246 and the second recovery line 247 is again passed through the heater 245, the pump 244, and the filter 243 to the first nozzles ( 130 may be supplied to the second nozzles 230.

The cleaning solution supply member 240 may supply the cleaning solution to the cleaning units 220a and 220b, which will be described later.

The cleaning units 220a and 220b provided to the main cleaning unit 200 may be provided above and below the moving path of the substrate, and are adhered to the substrate by rotating the cleaning heads 220a-1 and 220a-2 to fix the foreign matter on the substrate. Remove it. The cleaning units 220a and 220b may include an upper surface cleaning unit 220a and a lower surface cleaning unit 220b. The upper surface cleaning unit 220a is provided at an upper portion of the substrate movement path, and removes foreign substances on the upper surface of the substrate to be transferred. The lower surface cleaning unit 220b is provided below the substrate movement path, and removes foreign substances from the lower surface of the substrate to be transferred.

The upper surface cleaning unit 220a and the lower surface cleaning unit 220b may be disposed to face each other with respect to the substrate S to be transferred, as shown in FIG. 2. Since the upper surface cleaning unit 220a and the lower surface cleaning unit 220b have a symmetrical structure facing each other with respect to the substrate being transported, the following description will be given by referring to the upper surface cleaning unit 220a as an example, and to the lower surface cleaning unit 220b. The description is omitted. 3, only cleaning heads 220a-1 and 220a-2 of the components of the upper surface cleaning unit 220a are illustrated in FIG. 3, and the components of the upper surface cleaning unit 220a are shown in detail in FIGS. 4 to 7. It is.

The upper surface cleaning unit 220a has a plurality of cleaning heads 220a-1 and 220a-2. The cleaning heads 220a-1 and 220a-2 may be disposed to cover the entire width area of the substrate facing the second direction. For example, the cleaning heads 220a-1 and 220a-2 may be arranged in two rows to form a zigzag shape along the second direction, as shown in FIG. 3.

In this case, the cleaning heads located at the points of the cleaning heads 220a-1 arranged in the first row at an opposite point along the second direction are arranged at the circumference of the bottom surface of the cleaning pad (reference numeral 225 in FIG. 4). May be disposed to contact the edge of the first direction of the substrate. In addition, the cleaning heads 220a-2 disposed in the second row may be disposed to correspond to the space between the cleaning heads 220a-1 disposed in the first row.

The cleaning heads 220a-1 and 220a-2 may be moved in the second direction by a second linear driving member (reference numeral 228b of FIG. 4) to be described later. This is to move the positions of the cleaning heads 220a-1 and 220a-2 to the width of the substrate to be cleaned when the size of the substrate to be cleaned varies.

When the cleaning heads 220a-1 and 220a-2 are arranged in two rows as shown in FIG. 3, a roller for transferring the substrate is disposed between the rows of the cleaning heads 220a-1 and 220a-2. Can be. The rollers are disposed to face each other to support the upper and lower surfaces of the substrate, and are rotated by the power transmission member 215 and the driving member 216 to transfer the substrate in the first direction. As such, the reason for arranging the rollers between the rows of the cleaning heads 220a-1 and 220a-2 is because of the influence of the pressing force on the substrate of the upper surface cleaning unit 220a and the lower surface cleaning unit 220b on the transfer of the substrate. To reduce the

In the above description, the case in which the cleaning heads 220a-1 and 220a-2 are arranged in two rows has been described as an example. Alternatively, the cleaning heads may be arranged adjacent to each other along the second direction.

4 is a view showing the cleaning unit shown in FIG. 5 is an enlarged view of a main part of the cleaning unit shown in FIG. 4, and FIG. 6 is a view showing the main part separately from FIG. 5, and FIG. 7 is a view showing a bottom surface of the cleaning pad of FIG. 6. to be.

4 to 7, each of the cleaning heads 220a-1 and 220a-2 includes a disk-shaped cleaning pad 225 contacting the substrate and a holder 221 to which the cleaning pad 225 is coupled. Include. The holder 221 is connected to the rotation drive member 227 by the shaft 226, and the shaft 227 is formed with a first flow path 226a through which a cleaning liquid supplied from the outside flows. The cleaning solution supply line 241 of the cleaning solution supply member 240 described above is connected to the first flow path 226a.

A cushion pad 224 and a metal plate 223 are interposed between the holder 221 and the cleaning pad 225. The cushion pad 224 is attached to the upper surface of the cleaning pad 225 and acts as a buffer when the cleaning pad 225 is pressed against the substrate. The metal plate 223 is attached to the upper surface of the cushion pad 224. The holder 221 is provided with a magnet 222 such that the plate 223 is detachably coupled to the holder 221 by magnetic force. In addition, the protrusion 223a is formed to protrude on one side of the plate 223, and the protrusion 223a is a part held by the operator when the plate 223 is separated from the holder 221.

When the plate 223 is coupled to the holder 221, a plurality of fixing pins 221a protrude from the bottom surface of the holder 221 so that the holder 221 and the plate 223 can be aligned, and the plate 223 is provided. Holes 223c into which the fixing pins 221a are inserted are formed in the hole. Holes 224c are formed in the cushion pad 224 at positions aligned with the holes 223c formed in the plate 223, and ends of the fixing pins 221a are inserted into the holes 224c of the cushion pad 224. .

The second flow path 221b is formed in the holder 221 so as to communicate with the first flow path 226a of the shaft 226, and the discharge port 225b is formed in the cleaning pad 225. In addition, holes 223b and 224b are formed in the plate 223 and the cushion pad 224 to connect the second flow path 221b of the holder 221 and the discharge port 225b of the cleaning pad 225.

First flow path grooves 225a-1 and second flow path grooves 225a-3 are formed on the bottom surface of the cleaning pad 225. The first flow path grooves 225a-1 extend radially from the discharge port 225b to the edge. The first flow path grooves 225a-1 may be formed in a streamline shape so that the cleaning liquid discharged from the discharge port 225b is quickly exited. The second flow path grooves 225a-3 are formed in the shape of concentric circles. The second flow path grooves 225a-3 connect the first flow path grooves 225a-1 to each other so that the cleaning liquid can communicate with the first flow path grooves 225a-1. In addition, streamlined third flow path grooves 225a-2 may be formed between the first flow path grooves 225a-1.

As shown in FIG. 4, a first connecting member 229a is coupled to one side of the rotation driving member 227, and first linear driving members 228a and 250 are connected to the first connecting member 229a. The first linear driving members 228a and 250 move the first connection member 229a in the vertical direction so that the cleaning head is moved in the vertical direction. The second connection member 229b is coupled to the other side of the rotation driving member 227, and the second linear drive member 228b is coupled to the second connection member 229b. The second linear drive member 228b linearly moves the second connecting member 229b in the second direction so that the cleaning head is moved in the second direction.

FIG. 8 is a view for explaining a cylinder and a pneumatic supply part of the first linear driving member of FIG. 4.

Referring to FIG. 8, the first linear drive members 228a and 250 include a cylinder 228a for providing a linear driving force to the cleaning head, and a pneumatic supply unit 250 for providing pneumatic pressure for driving the cylinder 228a. do. The pneumatic supply 250 has an air source 251, which is connected to the cylinder 228a by a first pneumatic line 252 and a second pneumatic line 253.

The first pneumatic line 252 provides a first pneumatic pressure to one side of the piston 229a in the cylinder 228a to push the cleaning head away from the substrate. A first regulator 254 is installed in the first pneumatic line 252, and the first regulator 254 adjusts a flow rate of air provided to the first pneumatic line 252, so that the first pneumatic line 252 is provided. The pressure inside is kept constant at the first pneumatic pressure.

The second pneumatic line 253 provides a second pneumatic pressure to the other side of the piston 229a in the cylinder 228a to push the cleaning head in the direction towards the substrate. At this time, the second pneumatic pressure should be greater than the first pneumatic pressure provided on the opposite side of the piston 229a. The second regulator 255 is provided with a second regulator 255 and a valve 256. The second regulator 255 regulates the supply flow rate of the air provided to the second pneumatic line 253 to constantly flow the pressure in the second pneumatic line 253 to the second pneumatic pressure. The valve 256 opens and closes the flow of air in the second pneumatic line 253.

The second regulator 255 has a sensing member 255a for detecting air pressure in the second pneumatic line 253 and a pressure in the second pneumatic line 253 detected by the sensing member 255a is less than the second pneumatic pressure. If large, it has a valve 255b for exhausting air in the second supply line.

When the cleaning head is pressurized to the substrate by the second pneumatic pressure provided from the second pneumatic line 253, if a force is applied to the piston 229a by the bending of the substrate, the pressure in the second pneumatic line 253 becomes zero. 2 It rises above pneumatic pressure and the pressing force of the cleaning head rises. At this time, the pressure detection signal in the second pneumatic line 253 sensed by the sensing member 255a is transmitted to the controller (not shown), and the controller (not shown) opens the valve 255b to open the second pneumatic line ( 253 allows for air to be exhausted.

On the contrary, when the cleaning head is pressed to the substrate by the second pneumatic pressure provided from the second pneumatic line 253, if the piston 229a moves further than the working distance by the bending of the substrate, the second pneumatic line 253 ), The pressure inside the) drops lower than the second pneumatic pressure, and the pressing force of the cleaning head drops. At this time, the pressure detection signal in the second pneumatic line 253 detected by the sensing member 255a is transmitted to the controller (not shown). The controller (not shown) operates the second regulator 255 such that the air flow rate supplied to the second pneumatic line 253 increases until the air pressure in the second pneumatic line 253 reaches the second pneumatic pressure. To control.

By the operation of the pneumatic supply unit 250 as described above, when the cleaning head cleans the substrate, the cleaning head can pressurize the substrate at a predetermined pressure.

In the above, the case where the upper surface cleaning unit 220a and the lower surface cleaning unit 220b are arrange | positioned facing each other centering | focusing on the conveyance board | substrate S was demonstrated as an example. However, the upper surface cleaning unit 220a and the lower surface cleaning unit 220b may be disposed to be spaced apart from each other along the first direction, as shown in FIG. 9. In addition, as shown in FIG. 10, only the top cleaning unit 220a may be provided, and although not shown in the drawing, only the bottom cleaning unit 220b may be provided.

9 and 10, support roller members 260a and 260b for supporting the substrate may be installed at positions facing the upper surface cleaning unit 220a and / or the lower surface cleaning unit 220b around the substrate. . The support roller members 260a and 260b support opposite surfaces of the substrate pressing surface so that the flatness of the substrate is maintained when the upper cleaning unit 220a and / or the lower cleaning unit 220b pressurizes the substrate.

As shown in FIG. 11, the support roller members 260a face in a second direction whose longitudinal direction is perpendicular to the first direction, and the support roller members 260a are disposed in parallel along the first direction. The support roller members 260a have a transfer shaft 264 and a roller 262, both ends of which are rotatably supported by bearing members 265 and 266.

And, bending to support the central portion of the support roller members 260a and 260b so as to prevent the bending of the support roller members 260a and 260b due to the pressing force of the upper surface cleaning unit 220a and / or the lower surface cleaning unit 220b. Prevention members 270a and 270b are provided. The anti-bending member 270a has rollers 272 and a housing 274. The rollers 272 are positioned to face the substrate with respect to the support roller members 260a, are disposed between neighboring support roller members 260a, and contact the central portions of the support roller members 260a. The rollers 272 are received in the housing 272, which housing 272 rotatably supports the rollers 272.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

The drawings described below are for illustrative purposes only and are not intended to limit the scope of the invention.

1 is a schematic cross-sectional view showing an example of a substrate cleaning apparatus according to the present invention.

FIG. 2 is an enlarged view of the brush cleaner and the main cleaner of FIG. 1.

3 is a plan view of the main cleaning unit shown in FIG. 2.

4 is a view showing the cleaning unit shown in FIGS. 2 and 3.

5 is an enlarged view illustrating main parts of the cleaning unit illustrated in FIG. 4.

FIG. 6 is a view illustrating the main parts of FIG. 5 separated from each other.

7 is a view illustrating a bottom surface of the cleaning pad of FIG. 6.

FIG. 8 is a view for explaining a cylinder and a pneumatic supply part of the first linear driving member of FIG. 4.

9 and 10 show another arrangement structure of the cleaning units.

FIG. 11 is a plan view of a portion “A” of FIG. 9.

<Description of Symbols for Main Parts of Drawings>

100: brush cleaning unit 200: main cleaning unit

220a, 220b: cleaning unit 225: cleaning pad

227: rotation drive member

Claims (42)

A transfer unit for transferring the substrate in the first direction; And A cleaning unit provided on a movement path of the substrate conveyed by the transfer unit, and pressing a rotating cleaning head to the substrate to remove foreign substances from the substrate Substrate cleaning apparatus comprising a. The method of claim 1, The cleaning unit, An upper surface cleaning unit provided above the substrate movement path to remove foreign substances on the upper surface of the substrate to be transferred; And A lower surface cleaning unit provided below the substrate movement path to remove foreign substances on the lower surface of the substrate to be transferred Substrate cleaning apparatus comprising a. The method of claim 2, And the upper surface cleaning unit and the lower surface cleaning unit are disposed to face each other with respect to the substrate to be conveyed. The method of claim 2, And the upper surface cleaning unit and the lower surface cleaning unit are disposed to be spaced apart from each other along the first direction. The method according to claim 3 or 4, The cleaning head includes a disk-shaped cleaning pad in surface contact with the substrate, and a holder to which the cleaning pad is coupled. And the upper surface cleaning unit and the lower surface cleaning unit further include a rotation driving member for rotating the holder and a first linear driving member for moving the holder in the vertical direction. The method of claim 5, The shaft for connecting the holder to the rotation drive member is formed with a first flow path for the cleaning liquid supplied from the outside, A second flow path is formed in the holder to communicate with the first flow path, And a discharge hole connected to the second flow path in the cleaning pad. The method of claim 6, The cleaning head is provided in plurality, And the plurality of cleaning heads are disposed to cover an entire width area of the substrate facing a second direction perpendicular to the first direction. The method of claim 7, wherein And the plurality of cleaning heads are arranged side by side adjacent to each other along the second direction. The method of claim 7, wherein And the plurality of cleaning heads are arranged in two rows to form a zigzag shape along the second direction. The method of claim 9, The cleaning heads at positions opposite to each other in the second direction among the plurality of cleaning heads may be disposed such that a circumference of a bottom surface of the cleaning pad contacts an edge of the first direction of the substrate. The substrate cleaning apparatus. The method of claim 10, And a second linear drive member for moving the cleaning heads along the second direction, wherein the cleaning heads are positioned in the opposite direction along the second direction. The method of claim 9, Rollers positioned between the rows of the second direction in which the cleaning heads are arranged and disposed to face the substrate, the rollers supporting upper and lower surfaces of the substrate; And And a roller drive member for rotating the rollers. The method of claim 6, A cushion pad attached to an upper surface of the cleaning pad to buffer when the cleaning pad is pressed against the substrate; And Further comprising a metal plate attached to the upper surface of the cushion pad, The discharge port formed in the cleaning pad extends to pass through the cushion pad and the plate, And a magnet is installed in the holder such that the plate is detachably coupled by a magnetic force. The method of claim 13, A plurality of fixing pins protrude from the bottom surface of the holder, And a hole into which the fixing pins are inserted in the cushion pad and the plate. The method of claim 6, First flow path grooves extending from the discharge port to the edge are formed on the bottom surface of the cleaning pad. And the cleaning liquid flows through the first and second flow paths, the discharge port, and the first flow path grooves. The method of claim 15, And the first flow path grooves have a radially extending streamline shape. The method of claim 15, And a second circular flow path groove connecting the first flow path grooves is formed on a bottom surface of the cleaning pad. The method of claim 5, The first linear drive member includes a cylinder for providing a linear driving force to the holder, and a pneumatic supply for providing a pneumatic pressure for driving the cylinder, The pneumatic supply unit, A first pneumatic line providing a first pneumatic pressure to push the piston in the cylinder away from the substrate; A second pneumatic line providing a second pneumatic pressure greater than the first pneumatic pressure to push the piston in the cylinder in a direction towards the substrate; A regulator installed in the second pneumatic line and configured to exhaust air in the second pneumatic line or to adjust a supply flow rate of air provided to the second pneumatic line Substrate cleaning apparatus comprising a. The method of claim 18, The regulator, A sensing member for detecting air pressure in the second pneumatic line; And A valve for exhausting air in the second supply line when the pressure in the second pneumatic line detected by the sensing member is greater than the second pneumatic Substrate cleaning apparatus comprising a. The method of claim 19, The regulator is supplied to the second pneumatic line such that the air pressure in the second pneumatic line reaches the second pneumatic pressure when the pressure in the second pneumatic line detected by the sensing member is less than the second pneumatic pressure. Substrate cleaning apparatus, characterized in that for adjusting the air flow rate. The method of claim 4, wherein Further comprising support roller members disposed to support the substrate in a position facing the upper surface cleaning unit and the lower surface cleaning unit with respect to the substrate, Wherein each of the support roller members faces a second direction whose length direction is perpendicular to the first direction, and wherein the support roller members are disposed in parallel along the first direction. The method of claim 21, Further comprising a bending preventing member for supporting the central portion of the support roller members to prevent the bending of the support roller members by the pressing force of the upper surface cleaning unit and the lower surface cleaning unit, The bending prevention member, Rollers positioned to face the substrate with respect to the support roller members, disposed between neighboring support roller members, and in contact with a central portion of the support roller members; And A housing housing the rollers and rotatably supporting the rollers Substrate cleaning apparatus comprising a. The method of claim 1, The cleaning unit is provided on either side of the top and bottom of the substrate, The cleaning head includes a disk-shaped cleaning pad in surface contact with the substrate, and a holder to which the cleaning pad is coupled. The cleaning unit further comprises a rotation driving member for rotating the holder and a first linear driving member for moving the holder in the vertical direction. The method of claim 23, The shaft for connecting the holder to the rotation drive member is formed with a first flow path for the cleaning liquid supplied from the outside, A second flow path is formed in the holder to communicate with the first flow path, And a discharge hole connected to the second flow path in the cleaning pad. The method of claim 24, A plurality of cleaning heads are disposed to cover the entire width area of the substrate in a second direction perpendicular to the first direction, And the plurality of cleaning heads are arranged in two rows to form a zigzag shape along the second direction. The method of claim 25, Cleaning heads at positions opposite to each other in the second direction among the plurality of cleaning heads are disposed such that the circumference of the bottom surface of the cleaning pad contacts the edge of the first direction of the substrate, And a second linear drive member for moving the cleaning heads along the second direction, wherein the cleaning heads are positioned in the opposite direction along the second direction. The method of claim 25, Support roller members disposed to support the substrate at a position facing the cleaning unit with respect to the substrate, the support roller members having a longitudinal direction facing the second direction and parallel to the first direction; And Further comprising a bending prevention member for supporting the central portion of the support roller members to prevent the bending of the support roller members by the pressing force of the cleaning unit, The bending prevention member, Rollers positioned to face the substrate with respect to the support roller members and disposed between adjacent support roller members, the rollers being in contact with a central portion of the support roller members; And A housing housing the rollers and rotatably supporting the rollers Substrate cleaning apparatus comprising a. A main cleaning unit for removing foreign substances on the substrate by using the substrate cleaning apparatus according to any one of claims 1 to 27; A rinse unit for cleaning the substrate passing through the main cleaning unit; And Drying unit for drying the substrate washed in the rinse portion Substrate cleaning equipment comprising a. 29. The method of claim 28, And a brush cleaner disposed adjacent to the front end of the main cleaner and cleaning the substrate to be loaded into the main cleaner with a roll brush. 29. The method of claim 28, And a brush cleaner disposed between the main cleaner and the rinse, for cleaning the substrate cleaned by the main cleaner with a roll brush. The method of claim 29 or 30, A cleaning liquid tank for storing the cleaning liquid; A first nozzle provided on an upper portion of the substrate to be transferred in the brush cleaning unit and discharging a cleaning liquid to the substrate; A second nozzle provided on an upper portion of the substrate to be transferred in the main cleaning unit and discharging a cleaning liquid to the substrate; A cleaning liquid supply line connecting the cleaning liquid tank to the first and second nozzles; And A heater disposed on the cleaning liquid supply line and heating the cleaning liquid Substrate cleaning equipment characterized in that it further comprises. The method of claim 31, wherein And the cleaning liquid supply line is connected to the cleaning unit to supply the cleaning liquid to the cleaning unit in the main cleaning unit. 33. The method of claim 32, A first recovery line for recovering the cleaning liquid drained from the brush cleaning unit to the cleaning liquid tank; And A second recovery line for recovering the cleaning liquid drained from the main cleaning unit to the cleaning liquid tank; Substrate cleaning equipment characterized in that it further comprises. The method of claim 33, wherein And said cleaning liquid is an organic solution. The method of claim 33, wherein The cleaning solution is a substrate cleaning equipment, characterized in that the deionized water. Transfer the substrate, And cleaning the substrate by pressing a rotating cleaning pad onto the transferred substrate. 37. The method of claim 36, And cleaning the upper and lower surfaces of the substrate to be transported by pressing the cleaning pad in a direction facing each other about the substrate on a transport path of the substrate. 39. The method of claim 37, And cleaning the upper and lower surfaces of the substrate to be transported by pressing the cleaning pads in a staggered direction around the substrate on a transport path of the substrate. The method of claim 37 or 38, A plurality of cleaning pads are provided on the upper and lower portions of the substrate to be transported, and the plurality of cleaning pads are arranged in two rows to form a zigzag shape along a direction perpendicular to the transport direction of the substrate. A substrate cleaning method, characterized in that for moving the position of the cleaning pad in the position of the plurality of cleaning pad in the opposite direction in the direction perpendicular to the transfer direction of the substrate in accordance with the width of the substrate to be cleaned. . 40. The method of claim 39, And cleaning the substrate while supplying a high temperature cleaning liquid to the substrate through a discharge port formed in the center of the cleaning pad. 41. The method of claim 40, The high temperature cleaning liquid is a substrate cleaning method, characterized in that the organic solution in the temperature range of 20 ~ 50 ℃. 41. The method of claim 40, The high temperature cleaning liquid is a substrate cleaning method, characterized in that the deionized water in the temperature range of 40 ~ 80 ℃.

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