JP2022077220A - Cleaning module and wafer processing device - Google Patents

Abstract

To provide a cleaning module capable of improving cleanability of a wafer in simple structure, and a wafer processing device.SOLUTION: A cleaning module includes: a first transport mechanism 210-1 for transporting a wafer WF in a state where a polished face is turned downward, to a downstream-side wafer delivery position 418 along a transport path 405; an ultrasonic cleaning tub 440 which is disposed at a position away from the transport path 405, for cleaning the wafer WF in the state where the polished face is turned downward; a moving machine 420 for moving the wafer WF between the wafer delivery position 418 of the transport path 405 and the ultrasonic cleaning tub 440; and a second transport mechanism 210-2 for transporting the wafer WF which is moved from the ultrasonic cleaning tub 440 to the wafer delivery position 418 by the moving machine 420, further to the downstream side along the transport path 405.SELECTED DRAWING: Figure 6

Description

The present application relates to a cleaning module and a substrate processing apparatus.

In the manufacture of semiconductor devices, substrate processing equipment is used to flatten the surface of the substrate. Substrates used in the manufacture of semiconductor devices are often disk-shaped. In addition to semiconductor devices, there is an increasing demand for flatness when flattening the surface of square substrates such as CCL substrates (Copper Clad Laminate substrates), PCB (Printed Circuit Board) substrates, photomask substrates, and display panels. ing.

For example, in Patent Document 1, a polishing process is performed with the surface to be polished of the substrate facing downward, and after polishing, a cleaning liquid is sprayed onto both sides of the substrate transported along the transport path to clean the substrate, and after cleaning. A substrate processing apparatus for drying a substrate conveyed along a transport path is disclosed. However, a residue such as a slurry generated by polishing may be attached to the polished substrate, and there is a possibility that the residue cannot be sufficiently removed only by spraying the cleaning liquid on both sides of the substrate. In this regard, for example, Patent Document 2 discloses that a substrate is cleaned by immersing the substrate in a cleaning liquid in a vertical posture and irradiating both sides of the substrate with ultrasonic waves.

Japanese Unexamined Patent Publication No. 2020-9987 Japanese Unexamined Patent Publication No. 2003-104544

For example, the conventional technique disclosed in Patent Document 1 may not sufficiently remove the residue adhering to the substrate. Therefore, in order to improve the cleaning power of the substrate, the substrate cleaning technique described in Patent Document 2 is combined. This is possible, but it is not preferable because the structure of the entire device is complicated.

That is, the polishing process of the substrate is generally performed with the surface to be polished of the substrate facing down as described in Patent Document 1, or the surface to be polished of the substrate facing upward. Therefore, since the substrate after the polishing treatment is in a horizontal posture, when the substrate is immersed in a cleaning liquid in a vertical posture and ultrasonically cleaned as described in Patent Document 2, the posture of the substrate is used. A mechanism is required to make the device vertical, which complicates the structure of the entire device. In addition to this, when the substrate is ultrasonically cleaned in a vertical position, even if the residue adhering to the upper part of the substrate is peeled off by ultrasonic waves, it sinks downward in the cleaning liquid and reattaches to the lower part of the substrate. There is also a risk of doing so.

Therefore, one object of the present application is to realize a cleaning module and a substrate processing apparatus capable of improving the cleaning power of a substrate with a simple structure.

According to one embodiment, the first transport mechanism for transporting the substrate with the surface to be polished facing downward to the substrate transfer position on the downstream side along the transport path is located at a position away from the transport path. A cleaning tank for cleaning the substrate that is arranged and with the surface to be polished facing downward, and a transfer machine for transferring the substrate between the substrate transfer position of the transport path and the cleaning tank. Disclosed is a cleaning module including a second transport mechanism for transporting a substrate transferred from the cleaning tank to the substrate transfer position further downstream along the transport path by the transfer machine. Ru.

It is a top view which shows the whole structure of the substrate processing apparatus by one Embodiment. It is a side view which shows typically the transport module by one Embodiment. It is a perspective view which shows the transport module by one Embodiment. It is a perspective view which shows typically the polishing module by one Embodiment. It is a top view which shows typically the cleaning module by one Embodiment. It is a perspective view which shows typically the cleaning module by one Embodiment. It is a side view, a plan view, and a sectional view schematically showing the transfer machine by one Embodiment. It is a side view which shows typically the transfer machine by one Embodiment. It is a side view which shows typically the scrub cleaning mechanism by one Embodiment. It is a side view which shows typically the scrub cleaning mechanism by one Embodiment. It is a side view schematically showing the pressing mechanism by one Embodiment.

Hereinafter, embodiments of the cleaning module and the substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, the same or similar elements are designated by the same or similar reference numerals, and duplicate description of the same or similar elements may be omitted in the description of each embodiment. In addition, the features shown in each embodiment can be applied to other embodiments as long as they do not contradict each other.

FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus 1000 according to the embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes a load module 100, a transfer module 200, a polishing module 300, a cleaning module 400, a drying module 500, and an unload module 600. In the illustrated embodiment, the transport module 200 has two transport modules 200A, 200B, and the polishing module 300 has two polishing modules 300A, 300B. In one embodiment, each of these modules can be formed independently. By forming these modules independently, it is possible to easily form the substrate processing apparatus 1000 having different configurations by arbitrarily combining the number of each module. Further, the board processing device 1000 includes a control device 900, and each component of the board processing device 1000 is controlled by the control device 900. In one embodiment, the control device 900 can be composed of a general computer including an input / output device, an arithmetic unit, a storage device, and the like.

<Load module>
The load module 100 is a module for introducing the substrate WF before the processing such as polishing and cleaning into the substrate processing apparatus 1000. In one embodiment, the load module 100 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) mechanical device interface standard (IPC-SMEMA-9851).

In the illustrated embodiment, the transport mechanism of the load module 100 has a plurality of transport rollers 202 (first transport rollers) and a plurality of roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1, three transfer rollers 202 are attached to each roller shaft 204. The substrate WF is arranged on the transfer roller 202, and the substrate WF is transferred by the rotation of the transfer roller 202. The mounting position of the transport roller 202 on the roller shaft 204 can be arbitrary as long as it can stably transport the substrate WF. However, since the transfer roller 202 comes into contact with the substrate WF,
The transport roller 202 should be arranged so as to come into contact with a region where there is no problem even if it comes into contact with the substrate WF to be processed. In one embodiment, the transport roller 202 of the load module 100 can be made of a conductive polymer. In one embodiment, the transport roller 202 is electrically grounded via a roller shaft 204 or the like. This is to prevent the substrate WF from being charged and damaging the electronic devices and the like on the substrate WF. Further, in one embodiment, the load module 100 may be provided with an ionizer (not shown) in order to prevent charging of the substrate WF.

<Transfer module>
The substrate processing apparatus 1000 shown in FIG. 1 includes two transport modules 200A and 200B. Since the two transfer modules 200A and 200B can have the same configuration, they will be collectively referred to as the transfer module 200 below.

FIG. 2 is a side view schematically showing the transport module 200 according to the embodiment. FIG. 3 is a perspective view schematically showing the transport module 200 according to the embodiment. In FIG. 3, for the sake of clarity in the illustration, the upper transfer roller (second transfer roller) 290 and its drive mechanism, which will be described later, are omitted. The illustrated transfer module 200 includes a plurality of transfer rollers (first transfer rollers) 202 for transporting the substrate WF. By rotating the transport roller 202, the substrate WF on the transport roller 202 can be transported in a predetermined direction. The transport roller 202 of the transport module 200 may be formed of a conductive polymer or a non-conductive polymer. The transfer roller 202 is attached to a roller shaft (first roller shaft) 204 and is driven by a motor 208 via a gear 206. In one embodiment, the motor 208 can be a servomotor and the gear 206 can be a gear type, but can also be a magnet gear. Further, the transport module 200 shown in the figure includes a guide roller 212 that supports the side surface of the substrate WF during transport.

As shown in FIGS. 2 and 3, the transport module 200 has a pusher 230. The pusher 230 is configured so that the substrate WF on the plurality of transfer rollers 202 can be lifted away from the plurality of transfer rollers 202. Further, the pusher 230 is configured so that the held substrate WF can be delivered to the transfer roller 202 of the transfer module 200.

As shown in FIG. 2, the transport module 200 has a stopper 220. The stopper 220 is connected to the stopper moving mechanism 222, and the stopper 220 can enter the transport path of the substrate WF moving on the transport roller 202. When the stopper 220 is located in the transport path of the substrate WF, the side surface of the substrate WF moving on the transport roller 202 may come into contact with the stopper 220 to stop the moving substrate WF at the position of the stopper 220. can. Further, when the stopper 220 is in a position retracted from the transport path of the substrate WF, the substrate WF can move on the transport roller 202. The stop position of the board WF by the stopper 220 is a position (board transfer position) where the pusher 230 can receive the board WF on the transfer roller 202.

The transfer module 200 of the present embodiment has a sensor 216 for detecting the presence / absence of the substrate WF at a predetermined position on the transfer roller 202. The sensor 216 can be any type of sensor, for example an optical sensor. In the embodiment shown in FIG. 2, seven sensors 216 (216a to 216 g) are provided in the transport module 200. In one embodiment, the operation of the transport module 200 can be controlled according to the detection of the substrate WF by these sensors 216a to 216 g. As shown in FIG. 2, the transfer module 200 has an inlet shutter 218 that can be opened and closed to receive the substrate WF in the transfer module 200.

The sensor 216a is provided on the inlet side of the transport module 200. When the sensor 216a confirms that the back of the substrate WF has passed, the inlet shutter 218 can be closed. After that, the substrate WF is conveyed by the transfer roller 202 while monitoring the position of the substrate WF by the sensor 216b arranged on the downstream side of the sensor 216a. At this time, the stopper 220 is moved into the transport path of the substrate WF by the stopper moving mechanism 222. The substrate WF transported on the transport roller 202 comes into contact with the stopper 220 and stops. Further, the sensor 216c is arranged at the position of the stopper 220, and when the sensor 216c detects the substrate WF, the operation of the transport roller 202 is stopped. The substrate WF stopped at the position of the stopper 220 (the substrate transfer position) is transferred to the top ring 302 of the polishing module 300 via the pusher 230.

The transport module 200 shown in FIGS. 2 and 3 has a cleaning mechanism. As shown in FIGS. 2 and 3, the cleaning mechanism has a cleaning nozzle 284. The cleaning nozzle 284 has an upper cleaning nozzle 284a arranged on the upper side of the transport roller 202 and a lower cleaning nozzle 284b arranged on the lower side. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b are connected to a source of cleaning liquid (not shown). The upper cleaning nozzle 284a is configured to supply the cleaning liquid to the upper surface of the substrate WF transported on the transport roller 202. The lower cleaning nozzle 284b is configured to supply the cleaning liquid to the lower surface of the substrate WF transported on the transport roller 202. The upper cleaning nozzle 284a and the lower cleaning nozzle 284b have a width equal to or wider than the width of the substrate WF conveyed on the transfer roller 202, and the substrate WF is conveyed on the transfer roller 202 to convey the substrate. The entire surface of the WF is configured to be cleaned. As shown in FIGS. 2 and 3, the cleaning mechanism is located downstream of the substrate transfer region of the transport module 200.

As shown in FIG. 2, in the region where the substrate WF is not delivered by the pusher 230, the upper transport roller 290 is arranged on the transport roller 202. The upper transfer roller 290 is connected to a power source and is configured to be rotatable. In one embodiment, the upper transfer roller 290 is configured to be driven by a gear 206 and a motor 208, similar to the transfer roller 202.

<Polishing module>
FIG. 4 is a perspective view schematically showing the polishing module 300 according to the embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes two polishing modules 300A and 300B. Since the two polishing modules 300A and 300B can have the same configuration, they will be collectively referred to as the polishing module 300 below.

As shown in FIG. 4, the polishing module 300 includes a polishing table 350 and a top ring 302. The polishing table 350 is supported by the table shaft 351. The polishing table 350 is adapted to rotate around the axis of the table shaft 351 by a drive unit (not shown), as shown by the arrow AC. A polishing pad 352 is attached to the polishing table 350. The top ring 302 holds the substrate WF and presses against the polishing pad 352. The top ring 302 is rotationally driven by a drive source (not shown). The substrate WF is polished by being held by the top ring 302 and pressed against the polishing pad 352.

As shown in FIG. 4, the polishing module 300 includes a polishing liquid supply nozzle 354 for supplying a polishing liquid or a dressing liquid to the polishing pad 352. The polishing liquid is, for example, a slurry. The dressing liquid is, for example, pure water. Further, as shown in FIG. 4, the polishing table 350 and the table shaft 351 have a passage 353 for supplying the polishing liquid.
Is provided. The passage 353 communicates with the opening 355 on the surface of the polishing table 350. A through hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 of the polishing table 350, and the polishing liquid passing through the passage 353 is polished from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352. It is supplied to the surface of the pad 352. Further, the polishing module 300 includes a dresser 356 for conditioning the polishing pad 352. Further, the polishing module 300 includes an atomizer 358 for injecting a liquid or a mixed fluid of a liquid and a gas toward the polishing pad 352. The liquid ejected from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

The top ring 302 is supported by the top ring shaft 304. The top ring 302 is configured to rotate about the axis of the top ring shaft 304 by a drive unit (not shown), as shown by an arrow AB. Further, the top ring shaft 304 can be moved in the vertical direction by a drive mechanism (not shown).

The substrate WF is held by vacuum suction on the surface of the top ring 302 facing the polishing pad 352. At the time of polishing, the polishing liquid is supplied from the polishing liquid supply nozzle 354 and / or from the through hole 357 of the polishing pad 352 to the polishing surface of the polishing pad 352. Further, at the time of polishing, the polishing table 350 and the top ring 302 are rotationally driven. The substrate WF is polished by being pressed against the polished surface of the polishing pad 352 by the top ring 302.

As shown in FIG. 4, the top ring shaft 304 is connected to the arm 360, and the arm 360 can swing about the rotation shaft 362. During polishing of the substrate WF, the arm 360 may be fixed or rocked so that the top ring 302 passes through the center of the polishing pad 352. Further, during polishing of the substrate WF, the arm 360 may be fixed or swung so that the substrate WF covers the through hole 357 of the polishing pad 352. As shown in FIG. 1, the swingable arm 360 allows the top ring 302 to move towards the transfer module 200. By moving the top ring 302 to the board delivery position of the transfer module 200, the top ring 302 can receive the board WF from the pusher 230. Further, after polishing the substrate WF with the polishing module 300, the substrate WF can be handed over from the top ring 302 to the pusher 230.

<Cleaning Module> The substrate processing apparatus 1000 of the present embodiment is a cleaning module for removing residues such as slurry that cannot be completely cleaned by the cleaning mechanism (upper cleaning nozzle 284a and lower cleaning nozzle 284b) of the transport module 200 from the substrate WF. It is equipped with 400. FIG. 5 is a plan view schematically showing a cleaning module according to an embodiment. FIG. 6 is a perspective view schematically showing a cleaning module according to an embodiment.

As shown in FIG. 5, the substrate WF polished by the polishing module 300 is carried into the cleaning module 400 via the inlet shutter 410 with the surface to be polished facing downward. As shown in FIG. 6, the cleaning module 400 is a first transport mechanism for transporting the substrate WF with the surface to be polished facing down to the substrate transfer position 418 on the downstream side along the linear transport path 405. It is equipped with 210-1. The cleaning module 400 includes an ultrasonic cleaning tank 440 arranged at a position separated from the transport path 405 in a direction orthogonal to the transport path 405. The ultrasonic cleaning tank 440 is a cleaning tank for cleaning the substrate WF with the surface to be polished facing downward. The cleaning module 400 includes a transfer machine 420 for transferring the substrate WF between the substrate transfer position 418 of the transport path 405 and the ultrasonic cleaning tank 440. Further, the cleaning module 400 is a second transfer mechanism 210 for further downstream side along the transfer path 405 of the substrate WF transferred from the ultrasonic cleaning tank 440 to the substrate transfer position 418 by the transfer machine 420. It has -2. In the region where the substrate WF is not delivered by the transfer machine 420, the upper transfer roller 290 is arranged on the transfer roller 202, but for the sake of clarity in the illustration, the upper transfer is shown in FIGS. 5 and 6. The roller 290 and its drive mechanism are omitted.

FIG. 7 is a side view, a plan view, and a cross-sectional view schematically showing the transfer machine according to the embodiment. FIG. 7A is a side view seen from the direction A in FIG. FIG. 7B is a side view of FIG. 6 as viewed from the B direction. 7 (C) is a plan view seen from the direction C in FIG. 7 (B). 7 (D) is a plan view seen from the D direction in FIG. 7 (B). 7 (E) is a cross-sectional view taken along the line EE in FIG. 7 (B). FIG. 8 is a side view schematically showing the transfer machine according to one embodiment. In addition, in FIG. 7 (C), FIG. 7 (D), and FIG. 7 (E), the substrate WF is omitted for the sake of clarity of illustration.

As shown in FIG. 8, the cleaning module 400 includes a first transport mechanism 210-1 configured to transport the substrate WF to the substrate transfer position 418. The first transfer mechanism 210-1 includes a plurality of rotatable roller shafts 204 arranged at intervals along the transfer direction of the substrate WF under the transfer path of the substrate WF. Further, the first transfer mechanism 210-1 includes a plurality of rotatable upper roller shafts 291 arranged at intervals along the transfer direction of the substrate WF on the upper side of the transfer path of the substrate WF. Further, the first transport mechanism 210-1 includes a transport roller 202 configured to support and transport the surface to be polished (lower surface) of the substrate WF. In this embodiment, three transfer rollers 202 are attached to each roller shaft 204. Further, the first transport mechanism 210-1 includes an upper transport roller 290 configured to sandwich and transport the substrate WF together with the transport roller 202. In this embodiment, three upper transfer rollers 290 are attached to each upper roller shaft 291. At the board transfer position 418, the upper roller shaft 291 and the upper transfer roller 290 are not provided for the substrate transfer, but only the roller shaft 204 and the transfer roller 202 are provided. The roller shaft 204 and the transfer roller 202 at the substrate transfer position 418 convey the substrate WF to the substrate transfer position 418 and also convey the ultrasonically cleaned substrate WF further downstream from the substrate transfer position 418, so that the first transfer is performed. The function of the mechanism 210-1 and the function of the second transfer mechanism 210-2 are combined.

In one embodiment, the transport roller 202 and the top transport roller 290 of the cleaning module 400 can be made of a conductive polymer. The transfer roller 202 and the upper transfer roller 290 are electrically grounded via the roller shaft 204, the upper roller shaft 291 and the like. This is to prevent the substrate WF from being charged and damaging the substrate WF. Since the transfer roller 202 and the upper transfer roller 290 are driven by the gear 206 and the motor 208 in the same manner as those described in the transfer module 200, detailed description of the structure and the drive mechanism will be omitted.

As shown in FIGS. 7 and 8, the transfer machine 420 provides an accommodation space 435 for accommodating the substrate WF conveyed to the substrate transfer position 418 along the transfer path 405 by the first transfer mechanism 210-1. Includes a containment mechanism 430 to form. The accommodating mechanism 430 includes a support member 431 for supporting the surface to be polished of the substrate WF, an upper member 432 facing the support member 431 above the support member 431 at a distance, and the support member 431 and the upper member 432. Includes a column member 433 to be connected. The accommodation space 435 is formed by the support member 431, the upper member 432, and the pillar member 433. A protrusion 434 that comes into contact with the surface to be polished of the substrate WF is provided on the support member 431.

Further, as shown in FIG. 8, the accommodating mechanism 430 includes an inlet 437 for carrying the substrate WF into the accommodating space 435 and a first shutter 436 for opening and closing the inlet 437. Further, the accommodation mechanism 430 includes an outlet 439 for carrying out the substrate WF from the accommodation space 435, and a second shutter 438 for opening and closing the outlet 439. The accommodation mechanism 430 is shown in FIG. 8 (A).
), When the substrate WF is carried into the accommodation space 435, the second shutter 438 is moved downward to close the exit 439, and the first shutter 436 is made to stand by upward to enter. It is configured to open 437. Further, as shown in FIG. 8B, the accommodation mechanism 430 is configured to move the first shutter 436 downward and close the entrance 437 when the substrate WF is carried into the accommodation space 435. The transfer machine 420 includes an elevating mechanism 428 for elevating and lowering the accommodating mechanism 430. The elevating mechanism 428 can be realized by a known mechanism such as a motor. As shown in FIG. 8C, the transfer machine 420 holds the substrate WF by moving the accommodation mechanism 430 upward by the elevating mechanism 428 when the substrate WF is carried into the accommodation space 435 and the inlet 437 is closed. It is configured to do.

As shown in FIG. 6, the transfer machine 420 is attached to a transfer shaft 422 extending in a direction orthogonal to the transfer path 405 so as to move the accommodation mechanism 430 between the substrate transfer position 418 and the ultrasonic cleaning tank 440. Includes a moving mechanism 424 configured to move the containment mechanism 430 along. The moving mechanism 424 can be realized by a known mechanism such as a motor. The transfer machine 420 is configured to hold the substrate WF transferred to the substrate transfer position 418 by the accommodating mechanism 430 and to carry it directly above the ultrasonic cleaning tank 440 by the moving mechanism 424.

The transfer machine 420 includes a tilting mechanism 426 for tilting the accommodating mechanism 430. The tilt mechanism 426 can be realized by a known mechanism such as a tilt mechanism. When the transfer machine 420 carries the substrate WF directly above the ultrasonic cleaning tank 440, the transfer machine 420 tilts the substrate WF by the tilting mechanism 426. The tilting mechanism 426 does not tilt the substrate WF so as to be vertically oriented, but tilts the substrate WF in a range of, for example, 20 degrees or less, preferably 10 degrees or less, so that the surface to be polished of the substrate WF is directed downward. Maintain the state. The transfer machine 420 immerses the substrate WF in the ultrasonic cleaning tank 440 by lowering the accommodating mechanism 430 by the elevating mechanism 428 in a state where the substrate WF is tilted. By slightly tilting the substrate WF and controlling the charging speed to the ultrasonic cleaning tank 440 to a relatively gentle speed by the elevating mechanism 428, the transfer machine 420 can transfer the substrate to the substrate by the cleaning liquid at the time of immersion in the substrate. The resistance can be reduced and the substrate WF can be immersed in the ultrasonic cleaning tank 440. Therefore, even a substrate having a side length of more than 500 mm can be cleaned with less damage to the substrate.

As shown in FIG. 5, the ultrasonic cleaning tank 440 includes an ultrasonic irradiator 442 for applying ultrasonic waves to the substrate WF immersed in the cleaning liquid contained in the ultrasonic cleaning tank 440. The ultrasonic cleaning tank 440 can clean the residue such as slurry adhering to the surface to be polished and the back surface of the substrate WF by irradiating ultrasonic waves from the ultrasonic irradiator 442. According to this embodiment, since a mechanism for changing the posture of the substrate WF in the vertical direction is not required, the cleaning module 400 having a simple structure can be realized. Further, according to the present embodiment, in addition to cleaning by the cleaning mechanism (upper cleaning nozzle 284a and lower cleaning nozzle 284b) of the transport module 200, cleaning in the ultrasonic cleaning tank 440 is also performed, so that the cleaning power of the substrate WF can be improved. Can be improved. Further, according to the present embodiment, since the ultrasonic cleaning tank 440 performs ultrasonic cleaning of the substrate WF and removal of the substrate in a state where the posture of the substrate WF is tilted, the substrate WF is in a state where the posture of the substrate WF is vertically oriented. It is possible to prevent the residue exfoliated from the substrate WF from adhering to the substrate WF again as compared with the case of cleaning.

The transfer machine 420 can move the accommodating mechanism 430 in the roll direction by using the tilting mechanism 426 while cleaning the substrate WF in the ultrasonic cleaning tank 440. As a result, the portion where the substrate WF comes into contact with the protrusion 434 of the accommodating mechanism 430 can be shifted, so that it is possible to prevent the remaining cleaning. Further, for the same purpose of preventing unwashed residue, the accommodating mechanism 430 may be swung by reciprocating along the transfer shaft 422 using the moving mechanism 424.

As shown in FIG. 5, the cleaning module 400 includes two scrub cleaning mechanisms 450A and 450B arranged on the substrate transfer downstream side of the substrate transfer position of the transfer path 405. Since the two scrub cleaning mechanisms 450A and 450B can have the same configuration, they will be collectively referred to as the scrub cleaning mechanism 450 below.

FIG. 9 is a side view schematically showing a scrub cleaning mechanism according to an embodiment. FIG. 10 is a side view schematically showing the position of the roll sponge of the scrub cleaning mechanism according to the embodiment. As shown in FIG. 9, the cleaning module 400 includes a second transfer mechanism 210-2. Since the second transport mechanism 210-2 has the same configuration as the first transport mechanism 210-1, detailed description thereof will be omitted. The scrub cleaning mechanism 450 has a first roll sponge 451-1 that comes into contact with the surface to be polished of the substrate WF conveyed by the second transfer mechanism 210-2 and rotates at a predetermined rotation speed by a rotation mechanism (not shown). , A lifting mechanism 453 for raising and lowering the first roll sponge 451-1 via the load cell 459-1. Further, the scrub cleaning mechanism 450 has a second roll sponge 451-2 that comes into contact with the back surface of the substrate WF conveyed by the second transfer mechanism 210-2 and rotates at a predetermined rotation speed by a rotation mechanism (not shown). , A roll holder 454 for holding the second roll sponge 451-2. Further, the scrub cleaning mechanism 450 conveys the elevating mechanism 455 for raising and lowering the second roll sponge 451-2 via the load cell 459-2 attached to the roll holder 454, and the second roll sponge 451-2. Includes a horizontal drive mechanism 457 for driving along a shaft 452 extending parallel to the road 405. The first roll sponge 451-1 and the second roll sponge 451-2 are arranged so as to face each other with the second transport mechanism 210-2 interposed therebetween. The elevating mechanism 453, the elevating mechanism 455, and the horizontal drive mechanism 457 can be realized by a known mechanism such as a motor. The elevating mechanism 453 and the elevating mechanism 455 may elevate the first roll sponge 451-1 and the second roll sponge 451-2 vertically symmetrically with respect to the substrate WF, or may elevate the first roll sponge 451-1 and the second roll sponge 451-2 individually.

The load cell 459-1 is a measuring instrument that measures the force of pressing the first roll sponge 451-1 against the substrate WF by the elevating mechanism 453. The load cell 459-2 is a measuring instrument that measures the force of pressing the second roll sponge 451-2 against the substrate WF by the elevating mechanism 455. When the first roll sponge 451-1 and the second roll sponge 451-2 are individually raised and lowered, the scrub cleaning mechanism 450 uses the substrate of the first roll sponge 451-1 based on the measured value of the load cell 459-1. It is configured to control the pressing force on the WF in a closed loop. Similarly, the second roll sponge 451-2 is closed-loop controlled based on the measured value of the load cell 459-2. For example, the scrub cleaning mechanism 450 positions the first roll sponge 451-1 and the second roll sponge 451-2 so that the measured values of the load cell 459-1 and the load cell 459-2 become preset specified values. Can be controlled. Further, when the first roll sponge 451-1 and the second roll sponge 451-2 are moved up and down symmetrically with respect to the substrate WF, the scrub cleaning mechanism 450 refers to the load cell 459-1 as the measured value used for the closed loop control. Alternatively, the load cell 459-2 may be referred to. However, referring to either the load cell 459-1 or the load cell 459-2, the substrate WF hits one of the first roll sponge 451-1 and the second roll sponge 451-2 due to warpage or the like. The situation may not be detected. For example, when the closed loop control is performed based on the measured value of the load cell 459-2, scrub cleaning is performed even if the substrate WF is not in contact with the first roll sponge 451-1 and the upper surface of the substrate WF cannot be cleaned. The mechanism 450 cannot detect this. Therefore, the scrub cleaning mechanism 450 controls the positions of the first roll sponge 451-1 and the second roll sponge 451-2 based on the average value of the measured value of the load cell 459-1 and the measured value of the load cell 459-2. It can be carried out. In this case, when the substrate WF hits one side, the measured value of either the load cell 459-1 or the load cell 459-2 becomes 0, and the average value thereof is also halved. Then, the scrub cleaning mechanism 450 controls to increase the pressing force by bringing the first roll sponge 451-1 and the second roll sponge 451-2 close to the substrate WF. As a result, it is possible to recover from the situation where the substrate WF is one-sided, and the scrub cleaning mechanism 450 can clean both the upper and lower surfaces of the substrate WF. Further, in the scrub cleaning mechanism 450, when the difference between the measured value of the load cell 459-1 and the load cell 459-2 and the preset specified value exceeds the threshold value, the first roll sponge 451-1 and the second roll sponge 451 Feedback control of the position of -2 can be performed. This is because there is a possibility of hunting when feedback control is performed even though the difference between the measured values of the load cells 459-1 and the load cells 459-2 and the preset specified values is small. Further, it is conceivable that the measured values of the load cell 459-1 and the load cell 459-2 include the steps of the first roll sponge 451-1 and the second roll sponge 451-2 and the vibration of the substrate WF as noise. Therefore, the scrub cleaning mechanism 450 can also be used for position control by obtaining a moving average of measured values.

As shown in FIG. 9, the scrub cleaning mechanism 450 is used to spray the cleaning liquid onto the surface to be polished of the substrate WF when the substrate WF is roll-cleaned using the first roll sponge 451-1. Includes a cleaning nozzle 456-1. Further, the scrub cleaning mechanism 450 provides a plurality of second cleaning nozzles 456-2 for spraying the cleaning liquid onto the back surface of the substrate WF when the substrate WF is roll-cleaned using the second roll sponge 451-2. include.

As shown in FIG. 9, the scrub cleaning mechanism 450 includes a first cleaning mechanism 458-1 for contacting the first roll sponge 451-1 to clean the first roll sponge 451-1. Further, the scrub cleaning mechanism 450 includes a second cleaning mechanism 458-2 for contacting the second roll sponge 451-2 to clean the second roll sponge 451-2. The first and second cleaning mechanisms 458-1 and 458-2, for example, can be composed of a quartz plate for removing dirt such as dust adhering to the roll sponge by contacting with the roll sponge. Not limited to this.

The first cleaning mechanism 458-1 and the second cleaning mechanism 458-2 are arranged so as not to face each other with the second transport mechanism 210-2 interposed therebetween, that is, the substrate is conveyed so as not to overlap in the vertical direction. They are located in different directions. This is because when the second cleaning mechanism 458-2 is placed directly above the first cleaning mechanism 458-1, the dirt adhering to the second roll sponge 451-2 becomes on the first roll sponge 451-1. This is because there is a risk of falling and contaminating the first roll sponge 451-1. By arranging the first cleaning mechanism 458-1 and the second cleaning mechanism 458-2 so as not to overlap in the vertical direction as in the present embodiment, dirt adhering to the second roll sponge 451-2 It is possible to prevent the contamination of the first roll sponge 451-1 due to the above.

As shown in FIG. 10, the first roll sponge 451-1 and the second roll sponge 451-2 are arranged at the roll cleaning position 450a except during cleaning of the substrate WF. When the substrate WF is conveyed to the scrub cleaning mechanism 450, the first roll sponge 451-1 and the second roll sponge 451-2 move to the substrate cleaning position 450c via the cleaning preparation position 450b and the substrate. Clean the WF. When the cleaning of the substrate WF is completed, the first roll sponge 451-1 and the second roll sponge 451-2 move to the roll cleaning position 450a via the cleaning preparation position 450b.

Next, a pressing mechanism for strengthening the cleaning power of the substrate WF in the scrub cleaning mechanism 450 will be described. As shown in FIG. 10, in the region where the scrub cleaning mechanism 450 is arranged, the second transfer mechanism 210-2 is configured to press the upper transfer roller 290 toward the transfer path of the substrate WF. The pressing mechanism 211 is included. This is due to the problem that in the scrub cleaning mechanism 450 of the present embodiment, an external force acts on the substrate WF by cleaning with the first roll sponge 451-1 and the second roll sponge 451-2, which hinders the transfer of the substrate. This is to correspond. Specifically, the substrate WF is washed by pressing the rotating first roll sponge 451-1 and the second roll sponge 451-2. During cleaning, by rotationally driving the roller shaft 204 and the upper roller shaft 291, traction (driving force due to adhesive friction) is applied to the substrate WF from the transfer roller 202 and the upper transfer roller 290 that are in contact with the substrate WF, and the substrate WF. Is transported. By transporting the substrate WF while cleaning it in this way, the entire surface of the substrate is cleaned.

At the time of cleaning, the substrate WF, the transfer roller 202 and the upper transfer roller 290 are in the grip state, and the substrate WF does not slip with respect to the transfer roller 202 and the upper transfer roller 290, and the substrate WF is sandwiched between them as indicated by arrows AD. It is conveyed in the transfer direction indicated by the arrow AE of the transfer path 405 along the outer peripheral speeds of the transfer roller 202 and the upper transfer roller 290 that rotate in the opposite direction. On the other hand, the first roll sponge 451-1 and the second roll sponge 451-2 slip while rotating clockwise or counterclockwise with respect to the substrate WF, whereby the first roll sponge 451-1 And a second roll sponge 451-2 rubs the surface of the substrate WF to clean the substrate WF. That is, the maximum frictional force between the substrate WF and the transfer roller 202 and the upper transfer roller 290 is larger than the maximum frictional force between the substrate WF and the first roll sponge 451-1 and the second roll sponge 451-2. The transfer roller 202 and the upper transfer roller 290 grip the WF, and the first roll sponge 451-1 and the second roll sponge 451-2 are slipping, and this relationship must always hold during cleaning. There is.

Here, in order to improve the cleaning performance, it is assumed that the first roll sponge 451-1 and the second roll sponge 451-2 are pressed more strongly against the substrate WF. At this time, it is assumed that the maximum frictional force between the first roll sponge 451-1 and the second roll sponge 451-2 and the substrate WF also increases and exceeds the maximum frictional force between the transfer roller 202 and the upper transfer roller 290 and the substrate WF. Then, the substrate WF grips the first roll sponge 451-1 and the second roll sponge 451-2, and the transfer roller 202 and the upper transfer roller 290 slip with respect to the substrate WF. Then, since the first roll sponge 451-1 and the second roll sponge 451-2 do not rub the surface of the substrate WF, the cleaning performance is extremely deteriorated.

When the first roll sponge 451-1 and the second roll sponge 451-2 are in the gripped state with respect to the substrate WF, the first roll sponge 451-1 and the second roll sponge 451-2 are transferred by the transfer roller 202. And if it rotates faster than the upper transfer roller 290, the substrate WF is postponed. On the contrary, if the first roll sponge 451-1 and the second roll sponge 451-2 rotate in the reverse direction to the transfer roller 202 and the upper transfer roller 290, the substrate WF is pushed back and the substrate WF is not carried out. In any case, since the first roll sponge 451-1 and the second roll sponge 451-2 do not rub the surface of the substrate WF, the cleaning performance is hardly exhibited.

The simplest way to avoid this problem is to suppress the pressing force of the first roll sponge 451-1 and the second roll sponge 451-2 against the substrate WF to suppress the pressing force of the first roll sponge 451-1 and the second roll sponge 451-1 and the second roll sponge 451-2. There is a thing to suppress the maximum frictional force between the roll sponge 451-2 and the substrate WF. However, since the cleaning performance of the first roll sponge 451-1 and the second roll sponge 451-2 is limited by this method, it may not be possible to sufficiently clean the substrate depending on the degree of contamination of the substrate WF.

In order to solve the above problem, the maximum friction between the substrate WF and the transfer roller 202 and the upper transfer roller 290 can be increased by pressing the upper transfer roller 290 against the substrate WF and applying a load. As a result, even if the first roll sponge 451-1 and the second roll sponge 451-2 are strongly pressed against the substrate WF, the transfer roller 202 and the upper transfer roller 290 are gripped by the substrate WF, and the substrate WF is conveyed. It becomes possible to wash. In this embodiment, an example in which the upper transfer roller 290 is strongly pressed against the substrate WF is shown, but the transfer roller 202 may be strongly pressed against the substrate WF, and the upper transfer roller 290 and the transfer roller 202 may be pressed strongly. You may press both of them strongly against the substrate WF.

FIG. 11 is a side view schematically showing the pressing mechanism according to the embodiment. 11 (A) shows a side view of the pressing mechanism, and FIG. 11 (B) shows a cross-sectional view taken along the line BB in FIG. 11 (A). Regarding the pressing method of the upper transfer roller 290, since the upper roller shaft 291 and the upper transfer roller 290 are rotating, it is difficult to directly apply an external force. Therefore, as shown in FIG. 11, a load may be applied to the bearing holder 207 holding the bearing 205 at both ends of the upper roller shaft 291. Since the target of pressing is the upper transfer roller 290, the upper transfer roller 290 can be pressed against the substrate WF by pressing the upper transfer roller 290 downward through the bearing holder 207 and the upper roller shaft 291.

The timing of pressing the upper transfer roller 290 against the substrate WF will be described. The upper transfer roller 290 that is already in contact with the substrate WF may be pressed against the substrate WF, but if a load is applied to the upper transfer roller 290 that is not yet in contact with the substrate WF, the substrate WF is transferred upward. It becomes impossible to enter between the roller 290 and the transport roller 202. That is, it is necessary to sequentially apply a load to a plurality of upper transport rollers 290 according to the position of the substrate WF to be transported.

Since the timing of applying the load is different for each of the plurality of upper transfer rollers 290, it is not possible to press all the upper transfer rollers 290 at once, and a structure for individually pressing is required. Further, since it is necessary to switch the pressing state according to the conveying position of the substrate WF, the method of constantly applying preload to the pressing mechanism of the upper conveying roller 290 by using a spring or the like is not suitable.

Based on the above, as a pressing mechanism for the upper transfer roller 290, a method such as driving a motor or a solenoid by electric power or pressing by pneumatic pressure can be considered. Since it is necessary to individually press a plurality of upper transfer rollers 290, when a motor, a solenoid, or an air cylinder is used, it is necessary to install these mechanisms on all the upper transfer rollers 290. If there is not enough space around the upper transfer roller 290, a cylinder using a diaphragm can be used to compactly accommodate the pressing mechanism. Therefore, in the present embodiment, the pressing mechanism 211 using the diaphragm cylinder is adopted. As shown in FIG. 11B, the pressing mechanism 211 transmits the piston 217 for pressing the bearing holder 207, the cylinder 215 that can slide and move up and down while holding the piston 217, and the pressure to the piston 217. The diaphragm 214 for the purpose is provided. The cylinder 215 is formed with a hole 213 for supplying the compressed fluid to the diaphragm 214. A fluid such as compressed gas, hydraulic oil, or water is supplied to the hole 213 through a joint or the like to apply pressure, and the diaphragm 214 receiving the pressure presses the piston 217 against the bearing holder 207. The pressing mechanism 211 is provided on each of the plurality of upper transport rollers 290. Each pressing mechanism 211 is configured to press the substrate WF when the substrate WF is conveyed between the transfer roller 202 and the upper transfer roller 290.

With a structure like this embodiment, the structure of the pressing mechanism can be made smaller than when an air cylinder or a motor is used. Further, by connecting only a tube to each diaphragm cylinder and controlling the compressed fluid to be supplied by a solenoid valve or the like, the piston 217 can be easily switched between the pressed state and the open state. In this way, the first roll sponge 451-1 and the second roll sponge 451 are increased by sequentially pressing the plurality of upper transfer rollers 290 against the transferred substrate WF to increase the maximum frictional force between the two. Even if -2 is strongly pressed against the substrate WF for cleaning, the upper transfer roller 290 can be gripped by the substrate WF to convey the substrate WF as intended, and the first roll sponge 451-1 and the first roll sponge 451-1 and the first. High cleaning performance can be exhibited by the roll sponge 451-2 of 2.

As shown in FIGS. 1 and 9, the cleaning module 400 includes a rinse cleaning mechanism 460 arranged on the substrate transfer downstream side of the scrub cleaning mechanism 450 of the transfer path 405. The rinse cleaning mechanism 460 is provided on the back surface of the substrate WF and the first rinse liquid supply nozzle 462-1 for supplying the rinse liquid (for example, pure water) to the surface to be polished of the substrate WF cleaned by the scrub cleaning mechanism 450. It includes a second rinse liquid supply nozzle 462-2 for supplying the rinse liquid. The substrate WF is cleaned with a rinsing solution by the rinsing cleaning mechanism 460. The substrate WF cleaned by the rinse cleaning mechanism 460 is carried out from the cleaning module 400 via the outlet shutter 470 shown in FIG. In this embodiment, an example is shown in which both ultrasonic cleaning by the ultrasonic cleaning tank 440 and roll cleaning by the scrub cleaning mechanism 450 are performed on the substrate WF, and then rinse cleaning is performed by the rinse cleaning mechanism 460. , Not limited to this. Depending on the material of the substrate WF, the type of dirt adhering to the substrate WF, the size of the substrate WF, and the like, the cleaning module 400 may perform only ultrasonic cleaning and then rinse cleaning, or only roll cleaning. It is also possible to perform a rinse wash after performing the above. Further, the ultrasonic cleaning tank 440 and the scrub cleaning mechanism 450 may include a system for supplying a chemical solution. This makes it possible to realize a cleaning module 400 that can use both a physical cleaning method and a chemical cleaning method. Further, the cleaning module 400 may include a plurality of ultrasonic cleaning tanks 440. As a result, the types of cleaning liquids that can be used can be increased, so that various residues adhering to the substrate can be dealt with, and the throughput of the cleaning module 400 can be improved.

<Drying module>
The drying module 500 shown in FIG. 1 is a device for drying the substrate WF. In the substrate processing apparatus 1000 shown in FIG. 1, the drying module 500 dries the substrate WF cleaned by the cleaning portion of the transport module 200 after being polished by the polishing module 300. As shown in FIG. 1, the drying module 500 is arranged downstream of the cleaning module 400.

The drying module 500 has a nozzle 530 for injecting gas toward the substrate WF transported on the transport roller 202. The gas can be, for example, compressed air or nitrogen. The substrate WF can be dried by blowing off the water droplets on the conveyed substrate WF with the drying module 500.

<Unload module>
The unload module 600 shown in FIG. 1 is a module for carrying out the substrate WF after processing such as polishing and cleaning to the outside of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in FIG. 1, the unload module 600 receives the substrate after being dried by the drying module 500. As shown in FIG. 1, the unload module 600 is arranged downstream of the drying module 500. In one embodiment, the unload module 600 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) mechanical device interface standard (IPC-SMEMA-9851).

Although some embodiments of the present invention have been described above, the above-described embodiments of the present invention are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination or omission of the claims and the components described in the specification is possible within the range in which at least a part of the above-mentioned problems can be solved, or in the range in which at least a part of the effect is exhibited. Is.

In one embodiment, the present application includes a first transport mechanism for transporting a substrate with the surface to be polished facing downward to a substrate transfer position on the downstream side along a transport path, and a position separated from the transport path. A cleaning tank for cleaning the substrate with the surface to be polished facing downward, and a transfer machine for transferring the substrate between the substrate transfer position of the transport path and the cleaning tank. Disclosed is a cleaning module including a second transfer mechanism for transporting a substrate transferred from the cleaning tank to the substrate transfer position further downstream along the transfer path by the transfer machine. do.

In the present application, as one embodiment, the transfer machine includes a storage mechanism for forming a storage space for storing a substrate transported to the substrate delivery position along the transfer path, and the storage mechanism is the same. An inlet for carrying the board into the accommodation space, a first shutter for opening and closing the entrance, an outlet for carrying the substrate out of the accommodation space, and a second for opening and closing the outlet. Disclosed is a cleaning module, including a shutter.

In the present application, as an embodiment, the transfer machine includes an elevating mechanism for raising and lowering the accommodating mechanism, and a moving mechanism for moving the accommodating mechanism between the substrate transfer position and the cleaning tank. Disclosed is a cleaning module comprising a tilting mechanism for tilting the accommodating mechanism.

The present application discloses, as an embodiment, a cleaning module in which the cleaning tank includes an ultrasonic irradiator for applying ultrasonic waves to a substrate immersed in a cleaning liquid contained in the cleaning tank.

The present application is, as an embodiment, a first aspect in which the substrate is arranged on the downstream side of the substrate transfer position of the transfer path and rotates in contact with the surface to be polished of the substrate conveyed by the second transfer mechanism. Disclosed is a cleaning module further comprising a scrub cleaning mechanism comprising a roll sponge and a second roll sponge that rotates in contact with the back surface of the substrate.

In one embodiment, the scrub cleaning mechanism contacts a first cleaning mechanism for contacting the first roll sponge to clean the first roll sponge, and the second roll sponge. Disclose a cleaning module, further comprising a second cleaning mechanism for cleaning the second roll sponge.

In the present application, as one embodiment, the first roll sponge and the second roll sponge are arranged so as to face each other with the second transport mechanism interposed therebetween, and the first cleaning mechanism and the second cleaning mechanism are arranged. The mechanism discloses a cleaning module which is arranged so as not to face each other across the second transport mechanism.

In the present application, as an embodiment, in the region where the scrub cleaning mechanism is arranged, the second transfer mechanism sandwiches the transfer path with a plurality of first roller shafts arranged along the transfer path. A plurality of second roller shafts arranged to face the plurality of first roller shafts, a plurality of first transfer rollers attached to the plurality of first roller shafts, and the plurality of first rollers. The plurality of second transport rollers attached to the two roller shafts, and at least one of the plurality of first transport rollers and the plurality of second transport rollers are individually transported according to the transport position of the substrate. Disclosed is a cleaning module, including a plurality of pressing mechanisms configured to press in the direction of the road.

The present application is, as an embodiment, a rinse for supplying a rinse liquid to the surface to be polished and the back surface of a substrate which is arranged on the downstream side of the scrub cleaning mechanism of the transport path and cleaned by the scrub cleaning mechanism. Disclosed is a cleaning module, further comprising a cleaning mechanism.

The present application comprises, as an embodiment, a polishing module configured to polish a substrate, and a cleaning module according to any one of the above, configured to clean a substrate polished by the polishing module. Disclosed is a substrate processing apparatus comprising a drying module configured to dry a substrate cleaned by the cleaning module.

202 Transfer roller 204 Roller shaft 210-1 First transfer mechanism 210-2 Second transfer mechanism 211 Pressing mechanism 290 Upper transfer roller 291 Upper roller shaft 400 Cleaning module 405 Transfer path 420 Transfer machine 422 Transfer shaft 424 Movement mechanism 426 Tilt mechanism 428 Elevating mechanism 430 Accommodation mechanism 435 Accommodation space 436 First shutter 437 Entrance 438 Second shutter 439 Exit 440 Ultrasonic cleaning tank 442 Ultrasonic cleaner 450 Scrub cleaning mechanism 451-1 First roll sponge 451- 2 Second roll sponge 458-1 First cleaning mechanism 458-2 Second cleaning mechanism 460 Rinse cleaning mechanism 500 Drying module 1000 Substrate processing device WF Substrate

Claims (10)

A first transport mechanism for transporting the substrate with the surface to be polished facing downward to the substrate transfer position on the downstream side along the transport path, and
A cleaning tank arranged at a position away from the transport path and for cleaning the substrate with the surface to be polished facing downward, and a cleaning tank.
A transfer machine for transferring a substrate between the substrate transfer position of the transport path and the cleaning tank, and a transfer machine.
A second transfer mechanism for transporting the substrate transferred from the cleaning tank to the substrate transfer position further downstream along the transfer path by the transfer machine.
Including cleaning module. The transfer machine includes a storage mechanism that forms a storage space for housing a substrate conveyed to the substrate transfer position along the transfer path.
The accommodation mechanism opens and closes an inlet for carrying the substrate into the accommodation space, a first shutter for opening and closing the entrance, an outlet for carrying the substrate out of the accommodation space, and the outlet. A second shutter for, including,
The cleaning module according to claim 1. The transfer machine has an elevating mechanism for raising and lowering the accommodation mechanism, a moving mechanism for moving the accommodation mechanism between the substrate transfer position and the cleaning tank, and an inclination of the accommodation mechanism. Including tilting mechanism,
The cleaning module according to claim 2. The cleaning tank includes an ultrasonic irradiator for applying ultrasonic waves to a substrate immersed in a cleaning liquid contained in the cleaning tank.
The cleaning module according to any one of claims 1 to 3. A first roll sponge that is arranged on the downstream side of the substrate transfer from the substrate transfer position of the transfer path and rotates in contact with the surface to be polished of the substrate conveyed by the second transfer mechanism, and the back surface of the substrate. Further includes a scrub cleaning mechanism, including a second roll sponge, which rotates in contact with.
The cleaning module according to any one of claims 1 to 4. The scrub cleaning mechanism is a first cleaning mechanism for contacting the first roll sponge to clean the first roll sponge, and the second roll sponge in contact with the second roll sponge. Further includes a second cleaning mechanism for cleaning,
The cleaning module according to claim 5. The first roll sponge and the second roll sponge are arranged so as to face each other with the second transport mechanism interposed therebetween.
The first cleaning mechanism and the second cleaning mechanism are arranged so as not to face each other with the second transport mechanism interposed therebetween.
The cleaning module according to claim 6. In the region where the scrub cleaning mechanism is arranged, the second transfer mechanism includes a plurality of first roller shafts arranged along the transfer path and the plurality of first rollers sandwiching the transfer path. A plurality of second roller shafts arranged to face the shaft, a plurality of first transport rollers attached to the plurality of first roller shafts, and a plurality of second roller shafts attached to the plurality of second roller shafts. A plurality of second transport rollers, and at least one of the plurality of first transport rollers and the plurality of second transport rollers are individually pressed in the direction of the transport path according to the transport position of the substrate. Consists of multiple pressing mechanisms, including,
The cleaning module according to any one of claims 5 to 7. Further including a rinsing cleaning mechanism, which is arranged on the downstream side of the substrate transport with respect to the scrub cleaning mechanism of the transport path and for supplying the rinse liquid to the surface to be polished and the back surface of the substrate cleaned by the scrub cleaning mechanism.
The cleaning module according to any one of claims 5 to 8. A polishing module configured to polish the substrate, and
The cleaning module according to any one of claims 1 to 8, which is configured to clean the substrate polished by the polishing module.
A drying module configured to dry the substrate cleaned by the cleaning module, and a drying module.
Including substrate processing equipment.

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