KR20100089107A - Vacuum processing apparatus and vacuum transfer apparatus - Google Patents

Abstract

(Problem) In a cluster tool, conveyance capability is improved, without extending the longitudinal space of a platform below.
(Solution means) In the platform PF, the first transfer robot 16L is a transfer main body 48L that can slide on the left guide rail 46L, and a transfer that can slide in the offset direction (X direction). Slider-type carrier arm capable of pivoting in the base 50L, the horizontal plane, moving straight in the direction parallel to the radius of the pivot circle, and supporting one semiconductor wafer W ( 52L). The second transfer robot 16R also has the same configuration and function as the first transfer robot 16L except that the direction of movement or movement of each part is symmetrical.

Description

VACUUM PROCESSING APPARATUS AND VACUUM TRANSFER APPARATUS}

TECHNICAL FIELD This invention relates to the vacuum processing apparatus and vacuum conveying apparatus of a cluster tool system.

As one form of the vacuum processing apparatus which has a vacuum conveyance chamber, the cluster tool system is well known. The cluster tool method is also referred to as a multi-chamber method, in which a plurality of process chambers for performing a predetermined process under reduced pressure are arranged around a vacuum platform in order to achieve coherence, coupling, or complexation of processes. It is employ | adopted by the semiconductor manufacturing apparatus as a reference (for example, refer patent document 1).

 Generally, in a cluster tool, one to-be-processed object is conveyed to a some process chamber and can receive the same kind or a different kind of vacuum process continuously. In semiconductor device manufacturing, CVD (chemical vapor growth), sputtering, dry etching, dry cleaning and the like are typical vacuum treatments performed in a cluster tool.

Since the object to be processed that spans the plurality of process chambers as described above is carried out through the platform, the interior of the platform is always maintained at a reduced pressure. The platform is also connected to the load lock chamber of the air / vacuum interface via a gate valve to return the unprocessed object from the air space to this platform and to carry out a series of vacuumed objects from the platform to the air space. do. In the interior of the platform, a vacuum conveying device is formed between the respective process chambers or the load lock chambers to take over the substrate under reduced pressure. This type of vacuum conveying apparatus has a stretchable conveying arm for carrying in and out of the object to be processed to each process chamber or load lock chamber, and is capable of pivoting the conveying arm depending on the access destination.

However, in the cluster tool type vacuum processing apparatus, the platform is elongated by extending the platform in the inner depth direction while reducing or maintaining the width size of the entire apparatus as viewed from the load port side where the object cassette is inserted and exported. The layout in which the process chamber is expanded along the sides to increase the number of chambers mounted in the entire apparatus has become a trend as a method that can advantageously cope with an increase in the size of the semiconductor wafer (see Patent Document 2, for example).

Thus, when the number of mounting process chambers increases, the burden of a vacuum conveying apparatus becomes large and it becomes a subject that the conveyance capability of the vacuum conveying apparatus side cannot be traced to the preprocessing capability of the processing apparatus side.

In this regard, in the conventional cluster tool for forming one vacuum transfer robot in the platform, the stay time of one object to be processed in each chamber and the time before and after the stay for each of the plurality of process modules connected to the platform. A vacuum having two conveying arms in the same order as each object to be treated is set to have substantially the same length of the module cycle time plus the additional busy time at which the function of the module is blocked due to the object to be treated. The transfer robot traverses their plurality of process modules, picks up the finished workpiece to one transfer arm in access to each process module and alternately picks up another subsequent workpiece to the other transfer arm. The method of carrying in (place; place) is employ | adopted (for example, refer patent document 3).

However, such a circuit pick-and-place method has a sufficient function for the transfer operation of the transfer robot when the processing time of each process module is sufficiently long compared with the transfer time, but it is difficult to cope with the transfer robot if the processing time is short. Lower transfer efficiency and throughput are lowered. On the other hand, if post-treatment (for example, purging, cleaning, etc.) performed in the process module takes a long time immediately after the processed object is removed (picked), the transfer robot places a place on the untreated object to be carried. In order to perform the operation, the process waits in front of the process module until the post-processing ends, and the long wait time greatly reduces the throughput of the entire system.

 Further, as described above, the number of mounting of process modules (process chambers) tends to increase, and it is now limited to process all substrate transfer operations in the platform with one vacuum transfer robot.

MEANS TO SOLVE THE PROBLEM In order to overcome the limitation of the conveyance capability of the platform which uses one vacuum conveyance robot in a cluster tool, the present inventors found two movable stages or arms in a narrow common conveyance space by two movable stage drive mechanisms in a platform. Patent document 4 proposes a vacuum processing apparatus in which the mechanism is moved in the vertical direction and the horizontal direction so as to enable the positional exchange of each other in the vertical direction without interfering with each other in the horizontal state.

Japanese Patent Application Laid-open No. Hei 8-46013 Japanese Patent Laid-Open No. 2007-112720 Japanese Patent Laid-Open No. 2006-190894 Japanese Patent Laid-Open No. 2004-265947

The conventional vacuum processing apparatus disclosed in the patent document 4 is a method of operating two conveying robots substantially simultaneously in the platform, whereby the conveying efficiency and throughput can be improved, but there are still some problems to be improved. have.

First, since each movable stand drive mechanism adopts the form of the longitudinal articulated robot which has a base below and can expand and contract on a vertical (vertical) surface, a large space is required in the vertical direction. In addition, above the moving table drive mechanism, two sets of moving tables and arm mechanisms are moved in the up-down direction so as to exchange positions. Here, the normal position of the arm mechanism is set to the height corresponding to the object loading-in / out port of the process chamber. For this reason, the movable base drive mechanism (particularly the base) is operated in a position space lower than that of the process chamber.

However, recent process modules are designed to use large-capacity Automatic Pressure Control (APC) valves in vacuum exhaust systems, which require enough space to protrude from the bottom of the process chamber to the platform side. As a result, the platform has to leave a lower space lower than the process chamber for the process module and cannot be used for the transport mechanism.

That is, the structure which forms the movable platform drive mechanism which employ | adopts the form of a longitudinal articulated robot as mentioned above on a platform becomes difficult to employ | adopt.

Secondly, when exchanging or replacing the height positions of the two moving tables in the platform, particles may adhere to the processing object because other moving tables pass over the object to be supported by each moving table. .

Thirdly, since the acceleration acts upward when the movable table is moved downward, the holding force to the target object is weakened, and there is a fear that the object is slipped (position shifted).

In addition, the mobile stand drive mechanism (multi-joint robot) not only requires a large operating space as described above, but also has a large scale in itself and is difficult to implement costly.

SUMMARY OF THE INVENTION The present invention has been made in view of the problems of the prior art, and in a cluster tool, a vacuum which greatly improves the carrying capacity by a vacuum transfer robot having a simple and efficient mechanism and operation without extending the longitudinal space of the platform downward. A processing apparatus and a vacuum conveying apparatus are provided.

The vacuum processing apparatus of this invention is one or more vacuum processing chambers which are formed adjacent to the vacuum conveyance chamber in which a room is maintained in a pressure reduction state, and the to-be-processed object in the room under reduced pressure, and is processed. And 1 which is formed adjacent to the vacuum conveyance chamber, and which the room is selectively switched to a standby state or a reduced pressure state, and temporarily attracts a workpiece to be transferred between the atmospheric space and the vacuum conveyance chamber. 1st and 2nd formed in the said vacuum conveyance chamber for conveying a to-be-processed object between a dog or several load lock chamber and between the said load lock chamber and any one said vacuum processing chamber, or between said different vacuum processing chambers. The vacuum transfer robot has a vacuum transfer robot, and the first and second vacuum transfer robots are viewed from the load lock chamber side, and the left transfer area of the vacuum transfer chamber and It is comprised so that the inside of the said vacuum conveyance chamber may respectively move on the 1st and 2nd conveyance paths extended in an inner depth direction in a right conveyance area, respectively, The said 1st vacuum conveyance robot is all the said vacuum adjacent to the said left conveyance area Access to the processing chamber and to at least one of the vacuum processing chambers adjacent to the right conveying area and to at least one of the load lock chambers is possible for carrying in or out of the object, and the second vacuum conveying robot is provided. Is carried in or out of a workpiece to all the vacuum processing chambers adjacent to the right conveyance area, to the at least one vacuum processing chamber adjacent to the left conveyance area, and to the at least one load lock chamber. It was made to be accessible configuration for.

Moreover, the vacuum conveying apparatus of this invention is formed in the circumference | surroundings of the vacuum conveyance chamber in which a room is maintained in a reduced pressure state, adjacent to the said vacuum conveyance chamber, and the one or more in which predetermined process is performed to a to-be-processed object in the room under reduced pressure. One or a plurality of vacuum processing chambers adjacent to the conveying chamber, the interior of which is selectively switched to a standby state or a reduced pressure state, and temporarily holding a workpiece to be transferred between the atmospheric space and the vacuum conveying chamber. A vacuum processing apparatus for arranging a load lock chamber, wherein the vacuum transfer apparatus is formed in the vacuum transfer chamber to transfer an object to be processed between the vacuum transfer chamber and the vacuum processing chamber or the load lock chamber. Viewed from the lock chamber side, respectively, in the depth direction in the vacuum conveyance chamber left conveyance area and the right conveyance area, respectively. First and second vacuum transfer robots configured to move in the vacuum transfer chamber on the first and second transfer paths, respectively, wherein the first vacuum transfer robot includes all of the above adjacent to the left transfer area; Access to the vacuum processing chamber and to at least one of the vacuum processing chambers adjacent to the right conveying area and to at least one of the load lock chambers is possible for carrying in or out of the object, and the second vacuum conveying is possible. The robot carries or unloads a target object to all the vacuum processing chambers adjacent to the right conveyance area, to the at least one vacuum processing chamber adjacent to the left conveyance area, and to the at least one load lock chamber. The configuration is accessible.

In the vacuum processing apparatus or the vacuum conveying apparatus of this invention, in a vacuum conveyance chamber, while a 1st vacuum conveying robot makes it possible to protrude to the right conveyance area, making the left conveyance area a main operation area, on the other hand, a 2nd vacuum conveyance is carried out. The robot is also capable of being protruded to the left conveyance area while using the right conveyance area as the main operation area. That is, in a very suitable embodiment of the present invention, the first vacuum transfer robot can arbitrarily switch between a basic posture in which all of the left transfer area is accommodated in the left transfer area, and a posture projected from the left transfer area to the right transfer area. The 2nd vacuum conveyance robot is comprised so that the basic attitude | position which can be accommodated and moved in all in the right conveyance area, and the attitude | position coming out to the left conveyance area from the right conveyance area can be changed arbitrarily.

The 1st and 2nd vacuum conveyance robot in one very suitable aspect of this invention is the 1st and 2nd conveyance main body comprised so that the inside of a vacuum conveyance chamber can be moved on a 1st and 2nd conveyance path, respectively, and an inner depth direction. The first and second conveyance pedestals mounted on the first and second conveyance bodies, respectively, so as to be able to move in a horizontal offset direction intersecting with each other, and can pivot in a horizontal plane, The first and second conveyance arms are respectively mounted on the first and second conveyance bases so as to be able to move straight in a parallel direction, and have first and second conveyance arms respectively configured to support the object to be processed.

In a very suitable embodiment of the present invention, since the first and second vacuum transfer robots use the left and right transfer areas as the main operating areas, the first and second transfer bodies slide on the first and second transfer paths, respectively. It is comprised so that it may move, and it may move on the 1st and 2nd conveyance path, mutually staggered.

Moreover, in another very suitable aspect, in order that a 1st vacuum conveyance robot can protrude from a left conveyance area to a right conveyance area, the 1st conveyance expectation is the 1st double acting accommodation accommodated in a left conveyance area. It is possible to move between a position and a 1st sliding position protruding from a left conveyance area to a right conveyance area. Further, in order to allow the second vacuum transfer robot to protrude from the right transfer area to the left transfer area, the second transfer expectation via is moved from the second double acting position accommodated in the right transfer area and the right transfer area to the left transfer area. It is possible to move between the 2nd king positions which come out. In this case, it is preferable that the 1st and 2nd conveyance bases are respectively mounted in the 1st and 2nd conveyance main body so that a slide movement is possible in an offset direction.

In the present invention, the first vacuum transfer robot can access not only all the vacuum processing chambers adjacent to the left transfer area, but also can access at least one vacuum processing chamber adjacent to the right transfer area and at least one rod. It is accessible to lock room. On the other hand, the second vacuum transfer robot not only has access to all the vacuum processing chambers adjacent to the right transfer area, but also has access to at least one vacuum processing chamber adjacent to the left transfer area and also has access to at least one load lock chamber. It is possible.

By combining the transfer functions of the first and second vacuum transfer robots as described above, both of them are continuously operated, so that one of the transfer robots first takes out the object to be processed in just in time for any of the process chambers, Later, the other side (in some cases, one side again) can bring in another to-be-processed object in just in time.

In addition, in this invention, each part of a 1st and 2nd vacuum conveyance robot, ie, a conveyance main body, a conveyance base, and a conveyance arm performs a slide operation or a rotational movement in a horizontal direction, and extends in a longitudinal (vertical) direction as mentioned above. (I) Since no stretching or swinging movements are performed, a large operating space is not required in the longitudinal (vertical) direction. Thereby, the vacuum conveyance chamber longitudinal direction size can be made small. Moreover, in a vacuum conveyance chamber, since the member of a conveyance mechanism does not pass on the to-be-processed object, there is little possibility that a particle adheres to a to-be-processed object. Moreover, in a vacuum conveyance chamber, since the acceleration (especially upward acceleration) of a longitudinal (vertical) direction is not given to a to-be-processed object, a to-be-processed object can be stably supported on a conveyance arm.

In addition, in the case where each part of the transfer robot is a horizontal slide / horizontal swing type mechanism as described above, it is easy to arrange the drive source (preferably all of the drive sources) of each part outside the vacuum processing chamber, thereby providing electric cables. It is not necessary to enclose the joint duct or the flexible tube which accommodates the inside in a vacuum processing chamber, and the movement range and slide stroke of a conveyance robot can be enlarged.

According to the vacuum processing apparatus or the vacuum conveying apparatus of this invention, a mechanism and operation are simple and efficient by a vacuum conveying robot by extending the longitudinal space of a platform downward in a cluster tool by the above structure and operation | movement. The carrying capacity can be greatly improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a rough plan view which shows the structure of the vacuum processing apparatus of the cluster tool system in one Embodiment of this invention.
FIG. 2 is a schematic cross-sectional view schematically showing the longitudinal layout around the platform (vacuum transfer chamber) in the vacuum processing apparatus.
3 is a perspective view showing the configuration of first and second vacuum transfer robots formed in the platform of the vacuum processing apparatus.
4 is a plan view schematically showing one step of wafer loading / exporting operations of the first and second vacuum transfer robots in the platform in the embodiment.
5 is a plan view schematically illustrating one step of wafer loading / exporting operations of the first and second vacuum transfer robots.
6 is a plan view schematically illustrating one step of a wafer loading / unloading operation of the first and second vacuum transfer robots.
7 is a plan view schematically illustrating one step of a wafer loading / unloading operation of the first and second vacuum transfer robots.
8 is a plan view schematically illustrating one step of wafer loading / exporting operations of the first and second vacuum transfer robots.
9 is a plan view schematically illustrating one step of a wafer loading / unloading operation of the first and second vacuum transfer robots.
10 is a plan view schematically illustrating one step of a wafer loading / unloading operation of the first and second vacuum transfer robots.
Fig. 11 is a schematic plan view showing a first pattern according to the mutual positional relationship of the first and second transfer robots operating simultaneously in the platform.
12 is a plan view schematically illustrating a second pattern according to the mutual positional relationship of the first and second transfer robots.
Fig. 13 is a schematic plan view showing a third pattern according to the mutual positional relationship of the first and second transfer robots simultaneously operating in the platform.
14 is a plan view schematically illustrating a fourth pattern according to the mutual positional relationship of the first and second transfer robots.
It is an exploded perspective view which shows the structure of the arm drive mechanism in embodiment.
It is a partial cross section side view which shows the structure of the principal part of the said arm drive mechanism.
It is a perspective view which shows the drive mechanism for slidingly moving a conveyance base in an offset direction in the conveyance robot of embodiment.
It is sectional drawing which shows the cross-sectional structure of the spline shaft used for the drive mechanism of FIG.

Best Mode for Carrying Out the Invention [

EMBODIMENT OF THE INVENTION Hereinafter, the preferred embodiment of this invention is described with reference to an accompanying drawing.

In FIG. 1, the whole structure of the vacuum processing apparatus of the cluster tool system which concerns on one Embodiment of this invention is shown. This vacuum processing apparatus is a vacuum platform (vacuum conveying chamber) which is installed in a clean room and has a pentagon-shaped shape in which a pair of sides extending in the device depth direction (Y direction in the drawing) is about twice as long as the other sides (PF) 6 vacuum process chambers (vacuum processing chamber) (PC ₁ , PC ₂ , PC ₃ , PC ₄ , PC ₅ , PC ₆ ) and two load lock chambers (LLC _a , LLC _b ) Is arranged in a cluster shape.

In more detail, in the platform PF, the first and second process chambers PC ₁ and PC _{2 are} provided on the long side of the left side in the clockwise order of the drawing through the gate valves GV ₁ and GV ₂ , respectively. And third and fourth process chambers PC ₃ and PC ₄ are connected to the left and right hypotenuses through gate valves GV ₃ and GV ₄ . Are connected, respectively, the fifth and the long side of the right side 6. The process chamber (PC _5, PC ₆₎ and the gate valves are each connected via a (GV _5, GV _6), the amount (兩) the base load lock chamber (LLC _a , LLC _b ) are divided into left and right sides and are connected via gate valves GV _a and GV _b , respectively.

Each process chamber (PC ₁ ~PC ₆₎ is connected to the vacuum exhaust device 10 and a dedicated (Fig. 2), the interior is maintained at a constant reduced pressure state of the variable pressure. Typically, as shown in FIG. 2, the to-be-processed object, for example, the semiconductor wafer W is raised on the holding stage 12 arrange | positioned in the center part of a room, and predetermined | prescribed power (process gas, high frequency) Etc.) is used to perform required sheet treatment, for example, vacuum deposition such as CVD, ALD (Atomic Layer Deposition) or sputtering, heat treatment, cleaning of the semiconductor wafer surface, dry etching, and the like.

The platform PF is connected to a dedicated vacuum exhaust device 14 (FIG. 2), and the room is normally maintained at a constant pressure at a constant pressure. In the room, two vacuum transfer robots 16L and 16R which can each independently perform a wafer transfer operation are provided. The configuration and operation of these vacuum transfer robots 16L and 16R will be described later in detail.

The load lock chambers LLC _a and LLC _b are each connected to a dedicated vacuum exhaust device (not shown) via an on / off valve, and can switch the room at any time to either an atmospheric pressure state or a vacuum state. On the opposite side from the platform PF, the load lock chambers LLC _a , LLC _b are connected to the loader conveyance chamber LM under atmospheric pressure through the door valves DV _a , DV _b , respectively. In the central portion of the interior of the load lock chambers LLC _a and LLC _b , a water tap 18 for raising a semiconductor wafer W is placed.

The load port LP and the orientation flat alignment mechanism ORT are formed adjacent to the loader conveyance chamber LM. The load port LP is used for the input and export of the wafer cassette CR which can accommodate, for example, 25 semiconductor wafers W in one batch between the external carriers. Here, the wafer cassette CR is configured as a box or pod such as SMIF (Standard Mechanical Interface) or FOUP (Front Opening Unified Pod). The orientation flat alignment mechanism ORT is used to align the orientation flat or notch of the semiconductor wafer W in a predetermined position or direction.

The atmospheric transfer robot 20 formed in the loader conveyance chamber LM has a pair of telescopic transport arms 22 and 24 which can be moved horizontally on the linear guide 28 of the linear motor 26. In addition, it is possible to lift and turn, so that the semiconductor wafer W is interposed between the load port LP, the orientation flat alignment mechanism ORT, and the load lock chambers LLC _a , LLC _b , and the unit of wafer (or batch unit). Return to Here, the atmospheric transfer robot 20 moves the semiconductor wafer W into the loader transfer chamber LM in the open state of the LP door 25 formed on the front surface of each wafer cassette CR. Bring in The linear guide 28 is composed of, for example, a magnet made of a permanent magnet, a magnetic coil for driving, a scale head, and the like, and is used to command from a main controller 30 or a standby carrier controller (not shown). Therefore, linear motion control of the atmospheric transfer robot 20 is performed.

2 shows the longitudinal layout around the platform PF. In the figure, PC _L and PC _R represent process chambers disposed adjacent to the left side and the right side of the platform PF, respectively. The process chambers PC _L and PC _R are included in process modules PM _L and PM _R in which a hardware type for performing a required vacuum sheet processing is unitized. In the process module PM _{L on the} left side, below the process chamber PC _L , an exhaust pipe 32 constituting the vacuum exhaust device 10, an APC valve 34, and a vacuum pump (for example, a turbo molecular pump) 36 is disposed. Here, the APC valve 34 has a large transverse size and protrudes below the platform PF. The process module PM _{R on the} right side also has substantially the same layout and size as the process module PM _{L on the} left side.

The platform PF has a size equal to or close to the process chambers PC _L and PC _R in the longitudinal direction. The space 38 directly below the platform PF has a sufficient margin so that the exhaust pipe 40 and the vacuum pump 42 constituting the vacuum exhaust device 14 are formed, so that the process modules PM _L , from PM _R) and allows the APC valve 34 protrudes inward. The space 38 is also used for maintenance of the platform PF and the process modules PM _L and PM _R.

3 shows the configuration of two vacuum transfer robots (hereinafter simply abbreviated as "conveyance robots") 16L and 16R formed in the platform PF. The conveyance space in the platform PF is divided into left and right halves functionally from the load lock chambers LLC _a , LLC _b (FIG. 1) side, and the conveyance area TE _{L on the} left side and the conveyance area TE _{R on the} right side are identified. ), The left guide rail 46L and the right guide rail 46R, which extend in the inner depth direction (Y direction), are laid on the bottom. 16 L of 1st (left) conveyance robots operate on the left guide rail 46L, and 16 R of 2nd (right) conveyance robots operate on the right guide rail 46R.

The first transfer robot 16L is a rectangular parallelepiped transfer body 48L configured to slide in the platform PF on the left guide rail 46L, and a horizontal offset perpendicular to the inner depth direction (Y direction). 50L of the rectangular parallelepiped shape mounted in the conveyance main body 48L so that it can slide in a direction (X direction), and it can turn in a horizontal plane, and can move linearly in the direction parallel to the radius of a ship member. It is mounted on the conveyance base 50L so that it has the slider arm (non-extension type | mold) conveyance arm 52L comprised so that it can support one semiconductor wafer W.

The conveying main body 48L is driven straight by, for example, a ball screw mechanism 54L. 54 L of this ball screw mechanism is couple | bonded with the motor 58L arrange | positioned at the end of the feed screw 56L outside the platform PF. A ball screw (not shown) for screwing the feed screw 56L is attached to the conveyance main body 48L.

50 L of conveyance bases are made to be able to slide in the offset direction (X direction) by the guide rail 60L and the ball screw mechanism 62L attached to the upper surface of 48 L of conveyance main bodies, for example. The drive source of the ball screw mechanism 62L, that is, the motor (not shown in FIG. 3) can also be attached to the transport main body 48L, but can also be disposed outside the platform PF as described later (FIG. 17). ).

The structure of the conveyance arm 52L and the arm main body 55L is explained in full detail later. (FIGS. 15-16).

The second transfer robot 16R also has the same configuration and function as the first transfer robot 16L except that the direction of movement or movement of each part is symmetrical. In the figure, each element of the second transfer robot 16R has the same number as that of the element of the first transfer robot 16L corresponding thereto, and is denoted by replacing "L" with "R".

In FIG. 3, wafer in / out ports M ₁ , M ₂ , M ₃ , M ₄ , M ₅ , M ₆ , and M _a which are formed on the side surfaces at predetermined intervals in the circumferential direction of the platform PF. , M _b ) are connected to the gate valves GV ₁ , GV ₂ , GV ₃ , GV ₄ , GV ₅ , GV ₆ , GV _a , and GV _b (FIG. 1), respectively.

Here will be described a basic wafer transfer sequence to receive a series of processes in the cluster tool in one piece of a semiconductor wafer (W _i) in the wafer cassette (CR) put into the load ports (LP). The main control part 30 controls each part in an apparatus directly or indirectly through a local controller (not shown) in order to execute this wafer conveyance sequence.

The atmosphere transportation robot 20 of the loader, the transport chamber (LM) is in from the wafer cassette (CR) on the load ports (LP) taking out one sheet of semiconductor wafer (W _i), the semiconductor wafer (W _i), the orientation flat It is conveyed to the alignment mechanism ORT to make orientation flat alignment, and after it is finished, it transfers to any one of load lock chambers LLC _a , LLC _b , for example, left load lock chamber LLC _a . The first of the transfer destination from which the left load-lock chambers (LLC _a) is at atmospheric pressure receiving a semiconductor wafer (W _i), and vacuum-sucking the room after imported, the semiconductor wafer in a reduced pressure state (W _i) to the platform (PF) ( Left) Handed over to the transfer robot 16L.

The taken out from a first transport robot (16L), the carrier arm by the reciprocating sliding movement, and from a (52L) a double-acting position and wangdong position, the semiconductor wafer (W _i) a load lock chamber left (LLC _a), 1 beonjjae Import into the process chamber (eg PC ₁ ). In the process chamber PC ₁ , the sheet processing of the first process is performed under predetermined process conditions (gas, pressure, electric power, time, etc.) according to a preset recipe.

After the single wafer processing of the first process ends, and carried out of the first or the second is any one of the transport robot (16L, 16R), the semiconductor wafer (W _i) of the process chamber (PC _1), the taken out one the semiconductor wafer (W _i) is subsequently brought into the second process chamber (for example, PC _2). 2 in the second process chamber (PC _2), is a single wafer processing in the second step is performed at a predetermined process condition according to a predetermined recipe.

If termination is single wafer processing in the second step, the first or the second is any one of the transport robot (16L, 16R), and out the semiconductor wafer (W _i) from the second process chamber (PC _2), the export one either returned to the semiconductor wafer (W _i) a, then when when the process is brought into the third process chamber (e.g., PC _3), there is no next process load lock chamber (LLC _a, LLC _b) do. Even when the process is performed in the third and subsequent process chambers (for example, PC ₅ ), when one of the first or second transfer robots 16L and 16R has a next step, g imported into the PC ₆₎ and, when there is no next process is returned back to any one of the load lock chamber (LLC _{a, b} LLC).

When imported into either (e.g. LLC _b) a plurality of process chamber is a load lock chamber, the semiconductor wafer (W _i) receiving the series of processes from (PC _1, PC ₂ ‥) within the cluster tool, as described above, The interior of this load lock chamber LLC _b is switched from a reduced pressure state to an atmospheric pressure state. After that, the atmosphere transportation robot 20 in the loader, the transport chamber (LM), to take out the semiconductor wafer (W _i) from the load lock chamber (LLC _b) the atmospheric pressure is returned back to the wafer cassette (CR). Also, in the load lock chamber (LLC _a, LLC _b) it may be performed for heating or cooling treatment in an atmosphere desired for the semiconductor wafer (W _i) being stayed.

As described above, the vacuum processing apparatus of a cluster tool system is, by sequentially transmitting the one semiconductor wafer (W _i) through the reduced pressure under the platform (PF) to a plurality of process chambers, set in the art semiconductor wafer (W _i) of the It is possible to continuously perform the vacuum treatment inline, and in particular, in the vacuum thin film forming process, different film forming processes can be performed continuously in a plurality of process chambers, whereby a desired thin film can be laminated and formed inline.

Next, with reference to FIGS. 4-10, the basic wafer loading / unloading operation | movement of the 1st and 2nd conveyance robot 16L, 16R in the platform PF in this embodiment is demonstrated. By way of example, from a first transport robot (16L) to the fifth process chamber (PC ₅₎ to the semiconductor wafer (W _i) operation, and a second transport robot (16R) is a sixth process chamber (PC ₆₎ which carry the in parallel to this operation exports the another semiconductor wafer (W _j) will be described with respect to the scene is performed at the same time. In this scene and also in any scene, when at least one of the transfer robots 16L and 16R is operated, the main controller 30 controls each part in the apparatus directly or indirectly through a local controller (not shown). do.

First, as shown in Fig. 4, a first transport robot (16L) is, while supporting the semiconductor wafer (W _i) with the carrier arm (52L) to move the slide to the left side guide rails (46L), the process chamber (PC ₅ Stop at approximately the front of). On the other hand, the second transfer robot 16R slides on the right guide rail 46R with the transfer arm 52R in an empty state, and stops at approximately the front of the process chamber PC ₆ . do.

In addition, in FIG. 4, the 1st and 2nd conveyance robot 16L, 16R has taken the basic posture, respectively. That is, the conveyance base 50L, 50R is in the original position (double acting position) on the conveyance main body 48L, 48R, and the conveyance arms 52L, 52R have an inner depth direction (on the conveyance base 50L, 50R) ( In parallel with the Y direction) and in the same position as the turning radius (minimum position). In this basic position, the first transfer robot 16L can move freely in the left transfer area TE _L in the inner depth direction (Y direction) without deviating from the right transfer area TE _R. . Moreover, the 2nd conveyance robot 16R can move freely in the inside conveyance area TE _R in an inner depth direction (Y direction), without protruding to the left conveyance area TE _L. Therefore, both the transfer robots 16L and 16R can be mutually crossed, and one side can also cross the other.

After stopping in the substantially front of the process chamber PC ₅ as mentioned above, the 1st conveyance robot 16L conveys the conveyance base 50L as shown in FIG. 5 from said basic attitude, 48 L of conveyance main bodies. ) And slides to the right by a predetermined stroke so as to protrude to the right conveyance area (TE _R ). On the other hand, the second transport robot (16R), the front of the process chamber (PC _6), so that the from the basic position, out becomes empty, the conveying forward (50R) on the carrier body (48R) in the left conveying area (TE _L) It moves to the left by a predetermined stroke.

Next, as shown in FIG. 6, 16 L of 1st conveyance robots rotate the conveyance arm 52L by the predetermined angle (about 90 degrees) counterclockwise on the conveyance base 50L, and semiconductor the wafer (W _i) a support arm and the leading end (end effector) that orients the wafer transfer port (M ₅₎ (Fig. 3). The second transfer robot 16R also pivots the transfer arm 52R on the transfer base 50R by a predetermined angle (about 90 °) in the clockwise direction of the drawing, and the arm tip portion (end effector) in a ball (no-load) state. To the wafer entry / exit M ₆ (FIG. 3). Immediately after this, the gate valves GV ₅ and GV ₆ are opened, respectively.

Next, as shown in FIG. 7, the first transfer robot 16L moves the transfer arm 52L straight forward by a predetermined stroke (moves), and the semiconductor wafer ( ₅ ) is placed in the fifth process chamber PC ₅ . import W _i) to, the mounting table (geonnenda the semiconductor wafer (W _i) of the above 12). Here, the process chamber, the lift, which is provided with a (PC ₅₎ pin (lift pin) mechanism (not shown), received by placing the semiconductor wafer (W _i) from the top of the mounting table 12 at the pin tip, and then the semiconductor down the wafer (W _i) and place on the mounting table 12. On the other hand, the second transfer robot 16R moves the transfer arm 52R straight forward by a predetermined stroke, and inserts the end effector of the transfer arm 52R into the sixth process chamber PC ₆ . The semiconductor wafer W _j is received from a lift pin mechanism (not shown) on the mounting table 12.

Subsequently, as shown in FIG. 8, the 1st conveyance robot 16L moves back (backwards) the conveyance arm 52L which became empty (no load) state, and returns it to the platform PF, and process chamber PC ₅₎ completes the operation to bring the semiconductor wafer (W _i). The second transfer robot 16R moves (backwards) the transfer arm 52R supporting the semiconductor wafer W _j back to the platform PF and returns the semiconductor wafer (from the process chamber PC ₆ ). W _j ) to complete the export operation.

After that, the first and second transfer robots 16L and 16R respectively move to the next destination according to the transfer recipe, and perform the required wafer loading and unloading operations. For example, afterwards, the first transfer robot 16L is programmed to carry out another semiconductor wafer W _k from the third process chamber PC ₃ , and the second transfer robot 16R is programmed to perform a semiconductor wafer ( It is assumed that the operation of bringing W _j ) into the left load lock chamber LLC _b is programmed.

In this case, as shown in Figure 9, a first transport robot (16L), the holding is released, becomes empty, the transport path expected (50L) carrying area (TE _R) right of the conveying unit (48L) to the third process chamber ( ₃ ) and the conveyance arm 52L is rotated by a predetermined angle (about 120 °) in the counterclockwise direction as shown in the drawing so as to approach (PC ₃ ) to the inner depth direction (Y direction). ) Is pointed at the wafer entry / exit M ₃ (FIG. 3). On the other hand, the second transfer robot 16R pivots the transfer arm 52R by a predetermined angle (about 90 °) in the clockwise direction of the drawing.

Next, as shown in FIG. 10, the 1st conveyance robot 16R moves (removes) the conveyance arm 52L forward by a predetermined stroke, and moves the end effector of the conveyance arm 52L to a 3rd process. Insert into chamber (PC ₃ ). Meanwhile, the second transfer robot 16R returns the transfer base 50L to the original position on the transfer main body 48R and moves the end effector of the transfer arm 52R supporting the semiconductor wafer W _j to the right of the load lock chamber. It faces toward the front of (LLC _b ), ie, the wafer in / out port M _b (FIG. 3).

Although not shown in the figure, the first transfer robot 16L moves the transfer arm 52L, which has received the semiconductor wafer W _k , straight back (backwards) by a predetermined stroke, and thus the third process chamber PC _3. ), The operation of carrying out the semiconductor wafer W _k is completed. On the other hand, the second transfer robot 16R moves (moves) the transfer arm 52R straight forward by a predetermined stroke, and moves the semiconductor wafer W _j to the water stand 18 in the right load lock chamber LLC _b . ), The conveyance arm 52R which became empty (no load) is moved straight (backward), and the operation | movement which carries in the semiconductor wafer W _j to the right load lock chamber LLC _b is completed.

After that, the first and second transfer robots 16L and 16R perform the wafer transfer operation scheduled for each other without interfering with each other according to the transfer recipe.

In this embodiment, there are four patterns in the mutual positional relationship when the first and second transfer robots 16L and 16R simultaneously operate in the platform PF.

In the first pattern, as shown in FIG. 11, the first transfer robot 16L operates in the rear transfer area RE, and the second transfer robot 16R moves to the front transfer area ( FE) is a case operating in. In addition, when the conveyance space in the platform PF is divided into approximately half in the inner depth direction (Y direction), the conveyance space of the front half is viewed from the load lock chambers LLC _a , LLC _b side and the front conveyance area FE. ) And the inside half conveyance space is made into the rear conveyance area RE.

In this 1st pattern, 16 L of 1st conveyance robots operate each part (conveyance main body 48L, conveyance base 50L, conveyance arm 52L), and it is 2nd, 3rd, 4th, and The fifth process chambers PC ₂ , PC ₃ , PC ₄ , and PC ₅ can be arbitrarily accessed to carry in / out of the semiconductor wafer W. On the other hand, the second transport robot (16R) is that each part (conveying body (48R), the conveying forward (50R), the carrier arm (52R)) by operating the first, the sixth process chamber (PC _1, PC ₆₎ And the right side load lock chamber LLC _b can be arbitrarily accessed to carry in / out of the semiconductor wafer W. FIG.

As shown in FIG. 12, in the second pattern, the first transport robot 16L moves in the front transport area FE, and the second transport robot 16R moves in the rear transport area as opposed to the first pattern. It is a case operating in RE). In this case, the first transfer robot 16L arbitrarily accesses the first and sixth process chambers PC ₁ and PC ₆ and the left load lock chamber LLC _a to carry in / out of the semiconductor wafer W. Can be. In addition, the second transfer robot 16R arbitrarily accesses the _second , _third , _fourth , and fifth process chambers PC ₂ , PC ₃ , PC ₄ , and PC ₅ to carry in / carry out of the semiconductor wafer W. Can be done.

As shown in FIG. 13, the third pattern is a case in which the first and second transfer robots 16L and 16R move together in the front transfer area FE. In this case, the first transfer robot 16L can access only the left load lock chamber LLC _a to carry in / out of the semiconductor wafer W, and the second transfer robot 16R can move the right load lock chamber ( It is possible to carry in / out of the semiconductor wafer W by accessing only LLC _b ).

As shown in FIG. 14, the fourth pattern is a case in which the first and second transfer robots 16L and 16R move together in the rear transfer area RE. In this case, both of the transfer robots 16L and 16R can only move on the respective transfer paths 46L and 46R (FIGS. 1 to 11) in the basic position. However, as described above, they can move in the same direction or in opposite directions, and can be staggered.

As described above, in the vacuum processing apparatus of the cluster tool, a plurality of (six) process chambers PC _{1 to} PC ₆ and a plurality of (two) load lock chambers (LLC) are adjacent to the platform PF. _a , LLC _b ) are disposed, and first and second transfer robots 16L and 16R are formed in the platform PF.

16 _{L of} 1st conveyance robots can also be protruded to the right conveyance area TE _R , making the left conveyance area TE _L of the platform PF the main operation area, and the right load lock chamber LLC _b All chambers (PC _{1 to} PC ₆ , LLC _a ) except for) can be accessed for wafer loading and unloading. On the other hand, while the 2nd conveyance robot 16R makes the right conveyance area TE _R of the platform PF the main operation area, it can also be protruded to the left conveyance area TE _L , and the left load lock chamber ( All chambers (PC _{1 to} PC ₆ , LLC _b ) except for LLC _a ) can be accessed for wafer loading and unloading.

Each of the transport robot (16L, 16R) is, in one access, to be performed which of the import or export of the semiconductor wafer (W) only, and exported either the semiconductor wafer (W _i) by a so-called pick and place operation that It is not possible to carry out the same operation as bringing in another semiconductor wafer W _j alternately with. However, any degree with respect to the first transport by suitably combining the four parallel operation pattern (Fig. 11 to Fig. 14), a continuous operation the amount of the transport robot (16L, 16R), the process chamber (PC ₁ ~PC ₆₎ robot (16L, 16R) that of a different one of the just-in-time out which the semiconductor wafer (W _i), and after (is again one as the case may be) can be taken to another semiconductor wafer (W _j) with just-in-time have.

The wafer transfer system is advantageously functions particularly in this embodiment, directly to the unprocessed and alternately taken out after the process chamber (PC ₁ ~PC ₆₎ the semiconductor wafer (W _i) after the treatment of any of the It is a case where the semiconductor wafer W _j cannot be carried in. Typically, the post-treatment (for example, cleaning process) performed in the absence of a wafer immediately after the original vacuum sheet processing in a certain process chamber (for example, PC ₄ ) requires a long time. In this case, in this embodiment, until the process chamber, the semiconductor wafer (W _i) to a transport robot for example, the left side transport robot (16L) taken out after the processing from the (PC ₄₎ is, after processing has been completed the process chamber ( without the need to wait in front of the PC _4), when just the semiconductor wafer (W _i) as the other process chamber (e.g., to be the processing of the following step performed imported into the PC _5), or there is no next process left loadlock Can be transferred to the chamber LLC _a . Then, immediately after the post-processing is completed in the process chamber PC ₄ , the right transfer robot 16R (or the left transfer robot 16L) accesses the process chamber PC _{4 at} just in time to process the unprocessed semiconductor wafer. You can import (W _j ).

In addition, when the inner depth size of the platform PF is further increased, and the cluster tool which arrange | positions three or more process chambers PC in each of the left and right long sides is used, the operating space of the vacuum conveying apparatus in the platform PF is inside. Since it is greatly enlarged in the depth direction, the advantage of this invention which operates two conveyance robots 16L and 16R as mentioned above becomes further remarkable.

Next, the arm drive mechanism 64 for driving the conveying arm 52L (52R) mounted in the conveyance robot 16L (16R) of this embodiment is demonstrated.

As shown to FIG. 15 and FIG. 16, this arm drive mechanism 64 is formed over conveyance base 50L (50R) and the arm main body 55L (55R). More specifically, the swing drive motor 68, the straight drive motor 70, and the first gear mechanism 72 are formed on the transport base 50L (50R) side, and the arm body 55L (55R) is provided. The 2nd gear mechanism 74 and the ball screw mechanism 76 are formed in the side, and the connecting rod 78 is formed vertically between the conveyance base 50L (50R) and the arm main body 55L (55R). .

In the conveyance base 50L (50R), the 1st gear mechanism 72 has the internal horizontal rotating shaft 80 and the external horizontal rotating shaft 82 of a coaxial cylindrical structure. As shown in FIG. 16, bearings 86 are formed between the inner horizontal rotating shaft 80 and the outer horizontal rotating shaft 82 and between the inner horizontal rotating shaft 80 and the core 84, respectively. It is.

A spur gear 88 is fixed to one end of the outer horizontal rotation shaft 82, and a spur gear 90 is fixed to one end of the inner horizontal rotation shaft 80 outwardly in the axial direction thereof. In these spur gears 88 and 90, spur gears 92 and 94 connected to the swing drive motor 68 and the straight drive motor 70 are respectively screwed in.

A bevel gear 96 is fixed to the other end of the outer horizontal rotating shaft 82, and a bevel gear 98 is fixed to the other end of the inner horizontal rotating shaft 80 in the axial direction outward. Bevel gears 100 and 102 attached to the lower end of the connecting rod 78 are screwed to these bevel gears 96 and 98, respectively.

The connecting rod 78 has an inner vertical rotating shaft 104 and an outer vertical rotating shaft 106 of a coaxial cylindrical structure. As shown in FIG. 16, between the inner vertical rotation axis 104 and the outer vertical rotation axis 106, between the inner vertical rotation axis 104 and the core shaft 108, the outer vertical rotation axis 106 and the conveyance base 50L A bearing 110 is formed between the ceiling plates of 50R), respectively. The bevel gear 100 is fixed to one end (lower end) of the outer vertical rotation shaft 106, and the bevel gear 102 is fixed to one end (lower end) of the inner vertical rotation shaft 104 outwardly in the axial direction thereof.

The other end (upper end) of the outer vertical rotation shaft 106 is fixed to the bottom plate of the arm main body 55L (55R), and the inner vertical rotation axis in the axial outer side (upper), that is, the arm main body 55L (55R). Bevel gear 112 is fixed to the other end (upper end) of 104. Bevel gears 112 of the second gear mechanism 74 are screwed into the bevel gears 112.

In the arm main body 55L (55R), the 2nd gear mechanism 74 has the cylindrical horizontal rotating shaft 116. As shown in FIG. As shown in FIG. 16, the bearing 120 is formed between the horizontal rotating shaft 116 and the core shaft 118. As shown in FIG.

The bevel gear 114 is fixed to one end of the horizontal rotation shaft 116, and the spur gear 122 is fixed to the other end. The spur gear 126 fixed to one end of the feed screw 124 of the ball screw mechanism 74 is screwed into this spur gear 122.

The conveying arm 52L (52R) consists of one board body, The ball screw 128 which screw-engages with the feed screw 124 is attached to the base end part. In addition, a guide rail 130 extending in parallel with the feed screw 124 is formed, and the guide portion 132 sliding on the guide rail 130 is also attached to the proximal end of the transfer arm 52L (52R). have.

In the arm drive mechanism 64 of such a structure, when the turning drive motor 68 is operated, the rotation drive force will become spur gear 92 → spur gear 88 → external horizontal rotation shaft 82 → bevel gear 96. → The bevel gear 100 is transmitted to the external vertical rotational shaft 106, and the arm main body 55L (55R) rotates integrally with this by rotating the external vertical rotational shaft 106. By controlling the rotation direction and the rotation amount of the motor 68, the turning direction (clockwise / counterclockwise direction) and the turning angle of the arm main body 55L (55R) can be controlled.

In addition, when the linear drive motor 70 is operated, the rotational driving force is spur gear 94 → spur gear 90 → inner horizontal rotary shaft 80 → bevel gear 98 → bevel gear 102 → inner vertical. Transfer to the feed screw 124 of the ball screw mechanism 76 via the rotating shaft 104 → bevel gear 112 → bevel gear 114 → horizontal rotating shaft 116 → spur gear 122 → spur gear 126. As the feed screw 124 rotates, the transfer arm 52L (52R) slides in the arm longitudinal direction, that is, in the radial direction of the linear member. By controlling the rotation direction and rotation amount of the motor 70, the movement direction (forward / reverse) and the stroke of the conveyance arm 52L (52R) can be controlled.

In this embodiment, each part of conveyance robot 16L, 16R, ie, conveyance main body 48L (48R), conveyance base 50L (50R), and conveyance arm 52L (52R), slides or rotates in a horizontal direction. It is the structure which performs a movement, and since it does not perform any extending | stretching and stretching | movement movement in the longitudinal (vertical) direction, and a turning movement at all, it does not require a large operating space in a longitudinal (vertical) direction. As a result, the longitudinal size of the platform PF can be reduced, and the APC valve 34 provided in the side process module PM as shown above is popped into the space 38 directly below the platform (FIG. 2). Layout to come out is enabled. Moreover, in the platform PF, since the member of the conveyance mechanism does not pass on the semiconductor wafer W, the possibility that a particle adheres to the semiconductor wafer W is eliminated. In addition, in the platform PF, since the acceleration (especially the upward acceleration) in the longitudinal (vertical) direction is not imparted to the semiconductor wafer W, the semiconductor wafer W is formed on the transfer arm 52L (52R). Can be kept stable.

Moreover, in the structure which unites each part of the conveyance robot 16L, 16R by the horizontal slide / horizontal swing type mechanism like this embodiment, it is easy to arrange the drive source of each part outside the platform PF, and accordingly There is no need to surround the joint duct or the flexible pipe which accommodates the electric cables in the platform PF, and there is an advantage that the movement range and the slide stroke of the transfer robots 16L and 16R can be largely taken.

For example, as shown to FIG. 17 and FIG. 18, in the mechanism for sliding the conveyance base 50L (50R) in an offset direction (X direction) on the conveyance main body 48L (48R), a conveyance base ( The spline shaft 142, the spur gear 144, the spur gear 146, and the horizontal rotating shaft 148 between the ball screw mechanism 62L (62R) on the 50L (50R) side and the electric motor 140 as a driving source. ), The electric motor 140 can be disposed outside the platform PF by interposing the transmission mechanism 154 composed of the bevel gear 150 and the bevel gear 152.

In FIG. 17, the spur gear 146, the horizontal rotating shaft 148, and the bevel gear 150 are integral gear mechanisms 156 and are connected to the conveying main body 48L (48R). As shown in FIG. 18, the outer periphery of the spline shaft 142 is provided with the groove 158 extended in an axial direction, and the spur gear 144 is a shaft with the gear mechanism 156 along this groove 158. Can move in the direction.

As mentioned above, although highly suitable embodiment of this invention was described, this invention is not limited to said embodiment, A various deformation | transformation and a change are possible within the range of the technical idea.

For example, the slide movement of each part in conveyance robot 16L, 16R does not necessarily need to be a straight line, but can also bend as needed.

In addition, in the above-described embodiment, two load lock chambers LLC _a , at the base of the pentagonal platform PF are provided. LLC _b ) is arranged left and right, so that the first transfer robot 16L can access only the load lock chamber LLC _a on the left side, and the second transfer robot 16R can access only the load lock chamber LLC _{b on the} right side. It was configured to be accessible. However, for example, the base side of the platform PF is deformed into two hypotenuses of an isosceles triangle (the platform PF is hexagonal) and the load lock chambers LLC _a , LLC _b ), both the transfer robots 16L and 16R are connected to both load lock chambers LLC _a ,. LLC _b ) it is also possible to make access to anything.

In addition, although not shown in figure, if there is room in the space in platform PF, the structure provided with two or more conveying arms 52L (52R) in both or one of conveyance robot 16L, 16R is also possible. In that case, for example, with one access to the process chamber, the processed semiconductor wafer is taken out (picked) using one transfer arm, and the unprocessed semiconductor wafer is carried in using the other transfer arm. The so-called pick & place operation is also possible.

The to-be-processed object in this invention is not limited to a semiconductor wafer, For example, it may be an FPD board | substrate, and the arbitrary to-be-processed object which receives arbitrary processes by the vacuum processing apparatus of a cluster tool may be sufficient.

PF: Platform (vacuum return room)
PC _{1 to} PC ₆ : process chamber
LLC _a , LLC _b : Load Lock Chamber
GV _{1 to} GV ₆ , GV _a , GV _b : gate valve
16a: first vacuum transfer robot
16b: second vacuum transfer robot
46L: left guide rail
46R: right guide rail
48L (48R): conveying body
50L (50R): expectation of return
52L (52R): Carrying Arm
55L (55R): Arm Body
64: arm conveying mechanism

Claims (15)

A vacuum conveyance chamber in which the room is kept at a reduced pressure,
One or a plurality of vacuum processing chambers formed adjacent to the vacuum transfer chamber and subjected to a predetermined treatment to the processing target object in a room under reduced pressure;
One or more which are formed adjacent to the said vacuum conveyance chamber, the room is selectively switched to a standby state or a reduced pressure state, and temporarily attracts the to-be-processed object transferred between an atmospheric space and the said vacuum conveyance chamber. With load lock rooms,
First and second vacuum transfer robots formed in the vacuum transfer chamber for transferring the object to be processed between the load lock chamber and any one of the vacuum processing chambers or between different vacuum processing chambers.
With
The said vacuum conveyance chamber is respectively carried out by the said 1st and 2nd vacuum conveyance robot on the 1st and 2nd conveyance paths extended in an inner depth direction in the left conveyance area and the right conveyance area of the said vacuum conveyance chamber, respectively, when seen from the said load lock chamber side. Configured to move you around,
The first vacuum transfer robot has features for all the vacuum processing chambers adjacent to the left transfer area, at least one of the vacuum processing chambers adjacent to the right transfer area, and for at least one of the load lock chambers. Access for import or export of Riche,
The second vacuum transfer robot has features for all the vacuum processing chambers adjacent to the right transfer area, at least one vacuum processing chamber adjacent to the left transfer area, and at least one load lock chamber. Accessible vacuum processing apparatus for import or export of liche. The method of claim 1,
The first vacuum transfer robot is configured to be able to arbitrarily switch between a basic posture in which all of the left transfer area is accommodated and movable, and a posture coming out from the left transfer area to the right transfer area,
And the second vacuum transfer robot is configured to be able to arbitrarily switch between a basic posture in which all of the inside of the right transfer area can move and a posture coming out of the right transfer area to the left transfer area. The method of claim 1,
The first and second vacuum transfer robot,
First and second transport bodies configured to move in the vacuum transport chamber on the first and second transport paths, respectively;
First and second conveying pedestals mounted on the first and second conveying bodies, respectively, so as to be movable in a horizontal offset direction intersecting with the inner depth direction;
First and second mounted on the first and second conveyance bases to be able to pivot in a horizontal plane and to move straight in a direction parallel to the radius of the turning circle, and configured to support a workpiece 2 bounce arms
Vacuum processing apparatus each having. The method of claim 3,
The said 1st and 2nd conveyance main body is a vacuum processing apparatus which slides on the said 1st and 2nd conveyance path, respectively. The method of claim 3,
The said 1st and 2nd conveyance main body is a vacuum processing apparatus which can move on the said 1st and 2nd conveyance path, mutually alternately. The method of claim 3,
The said 1st conveyance expectation is movable between the 1st double-acting position accommodated in the said left conveyance area, and the 1st sliding position protruding from the said left conveyance area to the said right conveyance area. and,
The said 2nd conveyance expectation is a vacuum processing apparatus which can move between the 2nd double acting position accommodated in the said right conveyance area, and the 2nd reciprocating position which protrudes from the said right conveyance area to the said left conveyance area. The method of claim 3,
The said 1st and 2nd conveyance base is respectively mounted to the said 1st and 2nd conveyance main body so that a slide movement is possible in the said offset direction. The method of claim 3,
The said 1st and 2nd conveyance arm is a vacuum processing apparatus which has the end effector which can respectively support one to-be-processed object. The method of claim 3,
The said 1st and 2nd conveyance arm is a vacuum processing apparatus which has the end effector which can support a some to-be-processed object, respectively. The method of claim 3,
The conveying main body is formed at a position higher than a bottom of the vacuum processing chamber. The method of claim 1,
And all driving sources used for the first and second vacuum transfer robots are formed outside the vacuum transfer chamber. The method of claim 1,
The vacuum processing apparatus in which at least one said vacuum processing chamber WHEREIN: The predetermined post-processing is performed in the state in which there is no to-be-processed object indoors immediately after the process target object is carried out. One or a plurality of vacuum processing chambers which are formed adjacent to the vacuum conveying chamber around the vacuum conveying chamber in which the room is maintained in a reduced pressure state and are subjected to a predetermined process to the object to be processed in a room under reduced pressure, and are adjacent to the conveying chamber. And a chamber, wherein the room is selectively switched to a standby state or a reduced pressure state, and in which the one or a plurality of load lock chambers for temporarily holding the object to be transferred between the waiting space and the vacuum transfer chamber are arranged. A vacuum conveying apparatus formed in said vacuum conveying chamber for carrying out delivery of a target object between said vacuum conveying chamber and said vacuum processing chamber or said load lock chamber,
First and second structures configured to move in the vacuum conveyance chamber, respectively, on the first and second conveyance paths extending in the inner depth direction in the left conveyance area and the right conveyance area of the vacuum conveyance chamber, respectively, as viewed from the load lock chamber side. Equipped with a vacuum transfer robot,
The first vacuum transfer robot has features for all the vacuum processing chambers adjacent to the left transfer area, at least one of the vacuum processing chambers adjacent to the right transfer area, and for at least one of the load lock chambers. Access for import or export of Riche,
The second vacuum transfer robot has features for all the vacuum processing chambers adjacent to the right transfer area, at least one vacuum processing chamber adjacent to the left transfer area, and at least one load lock chamber. Accessible vacuum conveying device for import or export of liche. The method of claim 13,
The first vacuum transfer robot is configured to be able to arbitrarily switch between a basic posture in which all of the left transfer area is accommodated and movable, and a posture coming out from the left transfer area to the right transfer area,
The said 2nd vacuum conveyance robot is comprised so that the basic attitude | position which can be accommodated and moved in all in the said right conveyance area, and the attitude | position coming out to the left conveyance area from the said right conveyance area can be changed arbitrarily. The method of claim 13,
The first and second vacuum transfer robot,
First and second transport bodies configured to move in the vacuum transport chamber on the first and second transport paths, respectively;
First and second conveyance bases mounted on the first and second conveyance bodies, respectively, so as to be movable in a horizontal offset direction intersecting the inner depth direction;
First and second mounted on the first and second conveyance bases to be able to pivot in a horizontal plane and to move straight in a direction parallel to the radius of the turning circle, and configured to support a workpiece 2 bounce arms
Vacuum conveying apparatus each having a.

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