KR20100086708A - 유연한 와이어를 이용한 접촉식 프로브 - Google Patents
유연한 와이어를 이용한 접촉식 프로브 Download PDFInfo
- Publication number
- KR20100086708A KR20100086708A KR1020090006075A KR20090006075A KR20100086708A KR 20100086708 A KR20100086708 A KR 20100086708A KR 1020090006075 A KR1020090006075 A KR 1020090006075A KR 20090006075 A KR20090006075 A KR 20090006075A KR 20100086708 A KR20100086708 A KR 20100086708A
- Authority
- KR
- South Korea
- Prior art keywords
- flexible wire
- probe
- pattern electrode
- wire
- contact
- Prior art date
Links
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Abstract
Description
Claims (3)
- 단선이나 단락 검사를 위해 스캔하는 스캔방향 관성모멘트가 스캔방향의 수직방향 관성모멘트보다 적은 횡단면을 갖는 유연 와이어인 것을 특징으로 하는 유연한 와이어를 이용한 접촉식 프로브.
- 제 1항에 있어서, 상기 유연 와이어는 원형 와이어를 압연하여 형성한 것을 특징으로 하는 유연한 와이어를 이용한 접촉식 프로브.
- 제 1항에 있어서, 상기 유연 와이어의 횡단면은 직사각형상이나 타원형상 중 어느 하나인 것을 특징으로 하는 유연한 와이어를 이용한 접촉식 프로브.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090006075A KR101047519B1 (ko) | 2009-01-23 | 2009-01-23 | 유연한 와이어를 이용한 접촉식 프로브 |
CN201010001836A CN101793914A (zh) | 2009-01-23 | 2010-01-18 | 柔性金属丝制接触式探针 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090006075A KR101047519B1 (ko) | 2009-01-23 | 2009-01-23 | 유연한 와이어를 이용한 접촉식 프로브 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100086708A true KR20100086708A (ko) | 2010-08-02 |
KR101047519B1 KR101047519B1 (ko) | 2011-07-08 |
Family
ID=42586720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090006075A KR101047519B1 (ko) | 2009-01-23 | 2009-01-23 | 유연한 와이어를 이용한 접촉식 프로브 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101047519B1 (ko) |
CN (1) | CN101793914A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101118836B1 (ko) * | 2011-02-11 | 2012-03-16 | 에프컴 코포레이션 | 전극패턴 검사장치 |
KR20210049257A (ko) * | 2019-10-25 | 2021-05-06 | 마이크로 인스펙션 주식회사 | 인쇄회로기판의 검사장치 및 그 제어방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106996995A (zh) * | 2016-01-22 | 2017-08-01 | 国网智能电网研究院 | 一种柔性探针 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1164428A (ja) | 1997-08-27 | 1999-03-05 | Hioki Ee Corp | 部品検査装置 |
KR19990042109U (ko) * | 1998-05-30 | 1999-12-27 | 김영환 | 반도체 웨이퍼 검사용 프로브 팁 어셈블리의 케이블연결구조 |
JP4544810B2 (ja) * | 2002-04-23 | 2010-09-15 | 日本特殊陶業株式会社 | 基板製造方法 |
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2009
- 2009-01-23 KR KR1020090006075A patent/KR101047519B1/ko active IP Right Grant
-
2010
- 2010-01-18 CN CN201010001836A patent/CN101793914A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101118836B1 (ko) * | 2011-02-11 | 2012-03-16 | 에프컴 코포레이션 | 전극패턴 검사장치 |
KR20210049257A (ko) * | 2019-10-25 | 2021-05-06 | 마이크로 인스펙션 주식회사 | 인쇄회로기판의 검사장치 및 그 제어방법 |
Also Published As
Publication number | Publication date |
---|---|
CN101793914A (zh) | 2010-08-04 |
KR101047519B1 (ko) | 2011-07-08 |
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