KR20100079466A - Method for fabricating of light emitting diode - Google Patents
Method for fabricating of light emitting diode Download PDFInfo
- Publication number
- KR20100079466A KR20100079466A KR1020080137965A KR20080137965A KR20100079466A KR 20100079466 A KR20100079466 A KR 20100079466A KR 1020080137965 A KR1020080137965 A KR 1020080137965A KR 20080137965 A KR20080137965 A KR 20080137965A KR 20100079466 A KR20100079466 A KR 20100079466A
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- layer
- light emitting
- metal mask
- cladding layer
- conductive
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Abstract
A method of manufacturing a light emitting diode is provided. The light emitting diode manufacturing method includes forming a buffer clad layer on a substrate, forming a metal mask pattern on the buffer clad layer, growing a first conductive clad layer on the metal mask pattern, and simultaneously forming the buffer clad layer. Etching a portion in contact with a lower portion of the metal mask pattern, forming a second conductive cladding layer on the first conductive cladding layer to form the first conductive cladding layer and the second conductive cladding layer Forming a light emitting structure having a; and separating the substrate from the light emitting structure.
Description
The present invention relates to a light emitting diode, and more particularly to a method of manufacturing a light emitting diode.
Recently, in order to implement a high output light emitting diode, a vertical light emitting diode is proposed to replace a conventional horizontal light emitting diode. Vertical light emitting diodes have the advantage of increasing efficient heat dissipation and light output through separation of the substrate and light emitting diodes.
However, the substrate used in the light emitting diode is an electrically insulator, and has a problem in that mechanical and chemical processing is difficult because it has excellent hardness characteristics due to covalent bonding.
Therefore, a heterogeneous substrate was formed by forming a conductive thin film on the substrate, and the substrate and the light emitting diode were separated by removing the conductive thin film using a laser. However, the high power laser used to separate the substrate damages the light emitting diode and causes a problem such as cracking.
An object of the present invention for solving the above problems is to provide a method of manufacturing a light emitting diode that can reduce the damage of the light emitting diode.
The present invention for achieving the above object is to form a buffer clad layer on a substrate, to form a metal mask pattern on the buffer clad layer, to grow a first conductive type clad layer on the metal mask pattern Simultaneously etching a portion of the buffer clad layer in contact with the lower portion of the metal mask pattern, forming a second conductive clad layer on the first conductive clad layer to form the first conductive clad layer and the second conductive clad layer; It provides a light emitting diode manufacturing method comprising the step of forming a light emitting structure having a conductive cladding layer and separating the substrate from the light emitting structure.
The etching of the buffer clad layer may be performed by a chemical reaction between the gas used in the growth of the first conductive clad layer and the buffer clad layer. The gas may comprise hydrogen. The metal mask pattern may be formed using tungsten or molybdenum.
The light emitting diode manufacturing method may further include removing the metal mask pattern after separating the substrate from the light emitting structure.
The method of manufacturing a light emitting diode includes forming a first electrode and a second electrode electrically connected to each of the first conductive cladding layer and the second conductive cladding layer after the step of separating the substrate from the light emitting structure. It may further include.
As described above, when the substrate is separated from the light emitting structure by using the chemical reaction of the gas and the buffer clad layer used in the growth of the first conductivity type cladding layer, the damage of the light emitting diode is reduced compared to the conventional method of removing the substrate using the laser. There is an effect that can be reduced.
In addition, the first conductive cladding layer disposed on the metal mask patterns may have a very low defect density because the propagation of defects is blocked by the metal mask patterns.
With reference to the accompanying drawings, it will be described in detail a preferred embodiment of the present invention. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Hereinafter, the same reference numerals are used for the same components in the drawings, and duplicate descriptions of the same components are omitted.
1A to 1G are schematic views illustrating a method of manufacturing a light emitting diode according to an embodiment of the present invention.
Referring to FIG. 1A, a
The
The
Referring to FIG. 1B, a
The
As a result,
The metal layer may be formed using electron beam deposition or sputtering, and the patterning may be performed using a photolithography method, a dry etching method, or a wet etching method. The
Referring to FIG. 1C, a first
The first
The first
In general, defects tend to propagate more easily in the vertical direction than in the horizontal direction. However, the horizontally grown single crystal layer formed as described above, in particular, the first conductive
The ELO method can be performed using MOCVD, MOVPE, LPE, MBE or HVPE techniques. When the first
Heat treatment may be performed to form the first
The etching of the
As an example, when the gas is hydrogen, the
As a result, the
Referring to FIG. 1D, an
The
However, the
Referring to FIG. 1E, the second
The second
Referring to FIG. 1F, the
After separating the
As described above, when the
After removing the
Referring to FIG. 1G, a
The
The light emitting diode manufactured as described above may have an uneven surface of the lower portion of the first
2 is an SEM image showing a state in which a buffer clad layer is selectively removed according to an embodiment of the present invention. The buffer clad layer and the first conductive clad layer were formed using GaN, and the metal mask pattern was formed using tungsten.
Referring to FIG. 2, the
The void 15 formed by removing the
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that
1A to 1G are schematic views illustrating a method of manufacturing a light emitting diode according to an embodiment of the present invention.
2 is an SEM image showing a state in which a buffer clad layer is selectively removed according to an embodiment of the present invention.
<Description of the symbols for the main parts of the drawings>
10
13: metal mask pattern 14: first conductive clad layer
15: void 16: active layer
18: second conductivity type clad layer 22: first electrode
24: second electrode
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020080137965A KR101108244B1 (en) | 2008-12-31 | 2008-12-31 | Method for Fabricating of Light Emitting Diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080137965A KR101108244B1 (en) | 2008-12-31 | 2008-12-31 | Method for Fabricating of Light Emitting Diode |
Publications (2)
Publication Number | Publication Date |
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KR20100079466A true KR20100079466A (en) | 2010-07-08 |
KR101108244B1 KR101108244B1 (en) | 2012-01-31 |
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KR1020080137965A KR101108244B1 (en) | 2008-12-31 | 2008-12-31 | Method for Fabricating of Light Emitting Diode |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101106136B1 (en) * | 2009-08-26 | 2012-01-20 | 서울옵토디바이스주식회사 | Method of fabricating semiconductor substarte and method of fabricating lighe emitting device |
KR101155773B1 (en) * | 2010-06-09 | 2012-06-12 | 삼성엘이디 주식회사 | Method for manufacturing vertical light emitting diode and vertical light emitting diode prepared by using the method |
KR101229832B1 (en) * | 2009-08-26 | 2013-02-04 | 서울옵토디바이스주식회사 | Method of fabricating semiconductor substarte and method of fabricating lighe emitting device |
KR101220433B1 (en) * | 2009-06-10 | 2013-02-04 | 서울옵토디바이스주식회사 | Semiconductor substarte, method of fabricating the same, semiconductor device and method of fabricating the same |
KR101237969B1 (en) * | 2011-07-13 | 2013-02-28 | 주식회사 판크리스탈 | Semi-polar or Non-polar Nitride Semiconductor Substrate, Device, and Method for Manufacturing the Same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8294172B2 (en) | 2002-04-09 | 2012-10-23 | Lg Electronics Inc. | Method of fabricating vertical devices using a metal support film |
JP4879614B2 (en) * | 2006-03-13 | 2012-02-22 | 住友化学株式会社 | Method for manufacturing group 3-5 nitride semiconductor substrate |
-
2008
- 2008-12-31 KR KR1020080137965A patent/KR101108244B1/en not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101220433B1 (en) * | 2009-06-10 | 2013-02-04 | 서울옵토디바이스주식회사 | Semiconductor substarte, method of fabricating the same, semiconductor device and method of fabricating the same |
KR101106136B1 (en) * | 2009-08-26 | 2012-01-20 | 서울옵토디바이스주식회사 | Method of fabricating semiconductor substarte and method of fabricating lighe emitting device |
KR101229832B1 (en) * | 2009-08-26 | 2013-02-04 | 서울옵토디바이스주식회사 | Method of fabricating semiconductor substarte and method of fabricating lighe emitting device |
KR101155773B1 (en) * | 2010-06-09 | 2012-06-12 | 삼성엘이디 주식회사 | Method for manufacturing vertical light emitting diode and vertical light emitting diode prepared by using the method |
KR101237969B1 (en) * | 2011-07-13 | 2013-02-28 | 주식회사 판크리스탈 | Semi-polar or Non-polar Nitride Semiconductor Substrate, Device, and Method for Manufacturing the Same |
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