KR20100077636A - Beam punching unit and beam punching method - Google Patents

Abstract

PURPOSE: A light punching unit and a light punching method thereof are provided to prevent the physical damage of a chip mounting film by punching a chip mounting film with laser light. CONSTITUTION: A light punching unit comprises a chip identification part(100) and a light punching part(200). A chip identification part recognizes a punching region including each semiconductor chip mounted on a chip mounting film. The light punching part comprises a light source(210), an optical path guidance module(220), and a control module(230). The light source irradiates laser light. The optical path guidance module guides the laser light irradiated from the light source to the circumference of the punching region. The control module controls the operation of the light source and the optical path guidance module according to the information about the punching region, which is received from the chip identification part.

Description

Optical punching unit and optical punching method using the same {BEAM PUNCHING UNIT AND BEAM PUNCHING METHOD}

The present invention relates to an optical punching unit, and more particularly, to an optical punching unit capable of punching punching regions corresponding to various sizes of semiconductor chips using laser light in a chip mounting film in which a plurality of semiconductor chips are housed. It relates to the optical punching method used.

In recent years, thanks to the rapid development of semiconductor integrated technology, ULSI (Ultra Large Scale Integration) semiconductor chips beyond LSI (Large Scale Integration) and VLSI (Very Large Scale Integrated Circuit) have been commercialized. Tape Carrier Package (TCP) technology is widely used as a wireless bonding method among assembly and mounting technologies.

In general, TCP refers to a package using a tape automated bonding (TAB) technology in which a semiconductor chip is connected to a film in a tape form and sealed with a resin, but a film-type flexible printed circuit (FPC) As it is developed, TAB technology is currently being used as a concept including a chip on film or chip on flexible printed circuit (COF), and is a representative packaging technology for connecting driver circuits of liquid crystal display devices according to the trend of thin and light communication devices. It is utilized as.

1 is a perspective view showing that electrodes of a flat panel display glass and electrodes of an FPCB are connected to each other by a conventional punched TAB IC. 2 is a perspective view showing that a conventional TAB IC is punched out.

Referring to FIG. 1, the TAB product 10 connects an active matrix liquid crystal panel 2 and gate and data driver circuits 4 and 6 that output signals necessary for image realization thereof. For reference, the name of the TAB product 10 was used as a concept including both TCP or COF, and the base film on which the semiconductor chip 14 is seated among the TAB products 10 is called a TCP film 12 for convenience. In the same context, a series of TCP films 12 which will be mentioned below in the same context is called a TCP reel.

On the other hand, such a TAB product is usually completed through an automated TAB manufacturing system, the accompanying Figure 2 is a side view showing a simplified portion of the general TAB manufacturing system a pair of to advance the TCP reel 20 in one direction Sprocket wheels 40 and 50 and a TAB punching device 60 to obtain a TAB product by punching the TCP reel 20 for each semiconductor chip therebetween.

More specifically, first, the pair of sprocket wheels 40 and 50 rotate in the same direction and take a method of moving the TCP reel 20 wound on one to another, and as a result, the TCP reel 20 is It continues in one direction.

At this time, in order to increase the accuracy of the transmission of the TCP reel (20), two rows of sprockets (42, 52) are surrounded along both edges of the outer width direction of each pair of sprocket wheels (40, 50), TCP reel ( 20) Two rows of sprocket holes 22 through which sprockets 42 and 52 of each row are inserted are also penetrated along both edges of the width direction perpendicular to the traveling direction.

In the course of the TCP reel 20 between the pair of sprocket wheels 40 and 50, a TAB punching device having a die 70 and a holder 70 facing up and down with the TCP reel 20 interposed therebetween. As the 60 is positioned, the double holder 70 can be lifted up and down, and the punch 72 protrudes downward from the back facing the die 90, and the die 90 has a punch ( The punch hole 92 into which the 72 can be inserted penetrates in the vertical direction.

The TCP reel 20 is periodically stopped in the process of being transferred in one direction by a pair of sprocket wheels (40, 50), the holder 70 of the TAB punching device 60 is lowered and By raising, punching operations are performed by the punch 72 and the punch hole 92 to obtain the TAB product 12 for each semiconductor chip 14. Therefore, the TAB product 12 including the semiconductor chip 14 exists in the TCP reel 20 of the previous stage based on the punch 72 with respect to the advancing direction of the TCP reel 20, but the TCP reel of the subsequent stage is present. The TAB product 12 is punched and removed by the star 14 of the semiconductor chip 14 so that only holes H of a predetermined interval remain, and the punched TAB product 12 is punched out of the die 90. Through 92).

On the other hand, for the accurate punching operation of the above-described TAB punching device 60, despite the frequent lifting of the holder 70, the correct alignment of the holder 70 and the die 90 should be ensured, for this purpose holder 70 On the back side, a plurality of posts 74 having a columnar shape protrude downward, and a pipe-shaped post guide 94 into which each post 74 can be inserted is upward on the upper surface of the die 90. It protrudes. Accordingly, the post 74 is inserted into each post guide 94 to maintain the correct alignment between the holder 70 and the die 90.

In addition, in order to increase the process reliability of the TAB punching device 60, at least the flexible TCP reel 20, which tends to bend at the time of punching operation, should be flattened and at the same time flow must be suppressed. From the back of the 70, a plurality of pilot pins 76 inserted into the at least one sprocket hole 22 for each row of the TCP reel 20 protrude downward with the same length, although not clearly shown The upper surface of the die 90 is provided with a pin hole into which each pilot pin 76 can be inserted. And these pilot pins 76 are located at their distal end between the punch 72 and the post 74, so that the TCP reel from before the punch 72 contacts the TCP reel 20 to a point after punching. At least one sprocket hole 22 for each row of 20 is inserted into the TCP reel 20 to flatten and simultaneously suppress flow.

However, in the TAB-IC in which the semiconductor chip 6 is bonded on the COF 5, when the various types of TAB products having different sizes of the semiconductor chip or the COF 5 are applied, the above-mentioned TAB- The punch hole 92 of the holder 70 constituting the IC punching device and the punch hole 92 of the die 90 should be changed.

Therefore, in the related art, whenever the type of the TAB-IC is changed, the holder 70 and the die 90 must be changed together.

In addition, the above problem is to remove the holder 70 and the die 90 of the punching device 60 each time the type of TAB product is changed, and after replacing them with a different type of holder and die for these Because of the fine tuning, testing and verification of the location, there is a problem of process loss due to replacement / preparation time.

In addition, since the signal line of the TAB-IC connecting the liquid crystal panel, the gate, and the source driver circuit to a signal necessary for realizing an image of a liquid crystal display requiring high resolution is increased, fine pitching between the signal lines is inevitable.

In this case, in the case where the conventional punch is lowered toward the punch hole 92 and mechanically separates the TAB-IC from the COF reel 20, the cutting marks Burr at the cut surface of the punch hole 90 ) Occurs, which has a problem of causing an electrical short between adjacent leads.

The present invention has been made to solve the above problems, an object of the present invention is to punch a punching area corresponding to various sizes of the semiconductor chips using light in the chip mounting film in which a plurality of semiconductor chips are accommodated. An optical punching unit and an optical punching method using the same are provided.

Another object of the present invention, when punching a predetermined region including a semiconductor chip from the chip mounting film, the optical punching unit and the optical punching method using the same that can prevent the physical cutting traces generated on the edge of the punched punching region In providing.

The present invention provides an optical punching unit for achieving the above object.

The optical punching unit may include a chip recognition unit recognizing a punching area including each of the semiconductor chips accommodated in a chip mounting film of a predetermined length, and receiving the information about the punching area from the chip recognition unit to form an edge of the punching area. And an optical punching unit for punching the chip mounting film by irradiating light.

Here, the optical punching unit, a light source for emitting a laser light, an optical path guide module for guiding the laser light emitted from the light source along the edge of the punching area, and information about the punching area from the chip recognition unit It is preferred to have a control module for receiving the light source and operating the light path guide module.

The optical path guide module may include a reflection mirror reflecting laser light emitted from the light source to the punching area, and the punched area receiving the reflected laser light connected to the reflection mirror and receiving an electrical signal from the control module. It is preferable to have a drive motor for rotating the reflection mirror to be irradiated along the edge of.

In addition, the chip mounting film is moved at a predetermined interval by a moving module driven by receiving an electrical signal from the control module, the moving module is a pair of drive wheels to surround both ends of the chip mounting film, It is preferable to include a rotary motor for receiving any electrical signal from the control module to rotate any one of the drive wheels at regular intervals.

In addition, pitch holes are formed at both ends of the chip mounting film at predetermined intervals, and pitch protrusions at which the pitch holes are fitted at predetermined intervals are formed at outer peripheries of both side ends of the driving wheels. Preferably, the control module is set at intervals of pitch holes or intervals of the pitch protrusions.

The chip recognition unit may be a vision camera electrically connected to the control module, and the vision camera acquires an image of a chip mounting film which is moved at a predetermined interval from an upper portion of the chip mounting film and transfers the image to the control module. And the control module determines whether the semiconductor chips are accommodated from the image, and punches a punching area of the chip mounting film positioned at a punching position preset to the control module when the semiconductor chips are accommodated. It is preferable to operate the light source and the optical path guide module.

The chip recognizing unit may be a vision camera electrically connected to the control module, and the punching area is an area in which position coordinates of alignment marks that are previously formed to include the semiconductor chip are connected to each other. It is preferable to recognize the position coordinates of the punching area and to recognize the area having a predetermined width and width as the punching area so as to include the recognized semiconductor chips.

The present invention provides an optical punching method using an optical punching unit for achieving the above object.

The optical punching method may include a chip recognition step of recognizing a punching area including each of the semiconductor chips accommodated in a chip mounting film having a predetermined length using a chip recognition unit, and an optical punching unit electrically connected to the chip recognition unit. And an optical punching step of receiving the information about the punching region from the chip recognition unit and irradiating light along an edge of the punching region to punch the chip mounting film.

In the optical punching step, the laser light is emitted through the light source by operating a light source using a control module, and transmitting information about the punching area from the chip recognition unit to the optical path guide module using the control module. By using the control module, the optical path guide module is operated to guide the laser light emitted from the light source to be irradiated along the edge of the punching area.

The optical path guide module reflects laser light emitted from the light source to the punching area using a reflection mirror, and is connected to the reflection mirror and receives a driving signal that is rotated by receiving electrical signals from the control module. Rotate the reflective mirror to irradiate the reflected laser light along an edge of the punching area.

In addition, the chip mounting film is moved at a predetermined interval by a moving module driven by receiving an electrical signal from the control module, the moving module is a pair of drive wheels to surround both ends of the chip mounting film, It is preferable to include a rotary motor for receiving any electrical signal from the control module to rotate any one of the drive wheels at regular intervals.

In addition, pitch holes are formed at both ends of the chip mounting film at predetermined intervals, and pitch protrusions at which the pitch holes are fitted at predetermined intervals are formed at outer peripheries of both side ends of the driving wheels. Preferably, the control module is set at intervals of pitch holes or intervals of the pitch protrusions.

The chip recognition unit may be a vision camera electrically connected to the control module, and the vision camera acquires an image of a chip mounting film which is moved at a predetermined interval from an upper portion of the chip mounting film and transfers the image to the control module. And the control module determines whether the semiconductor chips are accommodated from the image, and punches a punching area of the chip mounting film located at a punching position preset to the control module when the semiconductor chips are accommodated. It is preferable to operate the light source and the optical path guide module.

The chip recognizing unit may be a vision camera electrically connected to the control module, and the punching area is an area in which position coordinates of alignment marks that are previously formed to include the semiconductor chip are connected to each other. It is preferable to recognize the position coordinates of the punching area and to recognize the area having a predetermined width and width as the punching area so as to include the recognized semiconductor chips.

The present invention has the effect of punching the punching region corresponding to the various sizes of the semiconductor chips using a laser light in the chip mounting film that accommodates a plurality of semiconductor chips.

In addition, the present invention has the effect of preventing the physical cutting traces generated on the edge of the punched punched region when punching a predetermined region including the semiconductor chip from the chip mounting film.

In addition, the present invention improves the quality of the TAB IC manufactured by punching by punching by irradiating laser light without punching by conventional physical contact, thereby eliminating the mechanical damage problem caused by the conventional long-term physical contact. Has the effect.

Hereinafter, an optical punching unit and an optical punching method using the same will be described with reference to the accompanying drawings.

3 is a perspective view showing that the punching region of the semiconductor chip is punched using the optical punching unit of the present invention. 4 is a diagram illustrating the light path guide module of FIG. 3. FIG. 5 is a plan view illustrating a punching area in which the semiconductor chip of FIG. 3 is included and a portion of a chip mounting film having the same. 6 is a block diagram showing the electrical connection between the components of the optical punching unit of the present invention.

First, the configuration of the optical punching unit of the present invention will be described.

Referring to FIG. 2, the optical punching unit includes a chip recognition unit 100 and an optical punching unit 200 electrically connected to the chip recognition unit 100.

The chip recognition unit 200 may be a vision camera capable of recognizing a punching area PA including each of the semiconductor chips 600 accommodated in the chip mounting film 600 having a predetermined length. .

In addition, the chip recognition unit 100, which is a vision camera, recognizes position coordinates of the semiconductor chips 600 accommodated in the chip mounting film 500, and sets a predetermined width and width to include the recognized semiconductor chips 600. The area having the edge can be recognized as the punching area PA.

Here, referring to FIG. 5, alignment marks AMa, AMb, AMc, and AMd surrounding the semiconductor chip 600 may be formed on the chip mounting film 500 including the semiconductor chip 600. Each of the alignment marks AMa, AMb, AMc, and AMd has a position coordinate.

That is, the alignment mark AMa forms position coordinates Xa, Ya, the alignment mark AMb forms position coordinates Xb, Yb, the alignment mark AMc forms position coordinates Xc, Yc, and the alignment mark AMd forms position coordinates Xd, Forms Yd.

Therefore, when the above-mentioned position coordinates are connected to each other, a rectangular area is formed, and the semiconductor chip 600 is located inside the area. In the present invention, a region consisting of the position coordinates is called a punching region PA. In addition, the edge 610 of the punching area PA is a portion that is punched or cut by irradiation of laser light, which will be described later.

Accordingly, the punching area PA may be an area including the semiconductor chip 600 in which the position coordinates of the alignment marks AMa, AMb, AMc, and AMd are connected to each other.

The punching area PA is increased in proportion to the size of the semiconductor chips 600, and the alignment marks AMa, AMb, AMc, and AMd of the punching area PA that are increased or decreased in proportion to each other are chips. The mounting film 500 may be pre-formed.

Although not shown in the drawing, a plurality of lead wires, which are electrically connected signal lines extending radially from the semiconductor chip 600, are provided in the punching area PA.

Referring to FIGS. 3 and 4 again, the optical punching unit 200 receives information about the punching area PA from the chip recognition unit 100 and cuts the edge 610 of the punching area PA. Accordingly, the chip mounting film 500 may be punched by irradiating light.

Here, the chip mounting film 500 is formed to have a predetermined length and width, and a plurality of semiconductor chips 600 are received at regular intervals. Pitch holes 510 having a predetermined interval are formed at both ends of the chip mounting film 500. The formation intervals of the pitch holes 510 are determined according to the sizes of the semiconductor chips 600. That is, the interval of the pitch hole 510 may be formed in proportion to the size of the size of the semiconductor chip 600.

In addition, the chip mounting film 500 may be moved along the movement path (a) at a predetermined interval by the movement module 300. Here, the moving module 300 is electrically connected to the control module 230 of the optical punching unit 200, and operates by receiving an electrical signal from the control module 230.

The moving module 300 includes a pair of driving wheels 311 and 312 and a rotating motor 320 for rotating the driving wheel at a predetermined interval. Here, one end of the chip mounting film 500 is wound around the first driving wheel 311, and the other end of the chip mounting film 500 is wound around the second driving wheel 312. In this case, pitch protrusions 311a and 312a that are fitted to the pitch hole 510 are formed at outer peripheries of both side ends of the first and second driving wheels 311 and 312. In addition, the driving motor 320 may be connected to any one of the first and second driving wheels 311 and 312, and hereinafter, the rotary motor 320 is based on a configuration connected to the second driving wheel 312. Shall be. Of course, the rotary motor 320 may be connected to both the first and second driving wheels 311 and 312.

Here, the variable rotation position of the rotary motor 320 is set to the control module 230 on the basis of the interval of the pitch holes 510 or the interval of the pitch projections (312a).

On the other hand, the optical punching unit 200 is disposed on one side of the chip recognition unit 100.

The light puncher 200 may include a light source 210 that emits laser light, and an optical path that guides the laser light emitted from the light source 210 along the edge 610 of the punching area PA. The control module 230 for operating the light source 210 and the optical path guide module 220 by receiving the information about the punching area PA from the guide module 220 and the chip recognition unit 100. It is composed.

Referring to FIG. 4, the optical path guide module 220 may include reflection mirrors 221 and 222 reflecting the laser light emitted from the light source 210 to the punching area PA, and the reflection mirrors 221, 222 and a drive to rotate the reflection mirrors 221 and 222 to receive the electrical signal from the control module 230 and to irradiate the reflected laser light along the edge 610 of the punching area PA. And motors 223 and 224.

More specifically, the light source 210 is connected to the optical fiber 225 for guiding the laser light emitted. The optical fiber 225 is connected to a collimator 226 which makes the guided laser light into parallel light, and the collimator 226 is connected to a housing 228 having a predetermined space therein.

The reflection mirrors 221 and 222 are installed in the housing 228. The reflection mirrors 221 and 222 may be configured of first and second reflection mirrors 221 and 222.

The first reflection mirror 221 reflects the laser light passing through the collimator 226 in a different direction, and the second reflection mirror 222 reflects the laser light reflected from the first reflection mirror 221. May be reflected in another direction, ie, under the housing 228.

A lens 227 is disposed below the housing 228 to adjust the focus to the chip mounting film 500 by forming the laser light reflected from the second reflection mirror 222 into vertical light.

In addition, each of the first and second reflection mirrors 221 and 222 is connected to the first and second driving motors 223 and 224 that are rotationally driven by receiving an electrical signal from the control module 230.

Meanwhile, the chip recognition unit 100, which is a vision camera, acquires an image of the chip mounting film 500 which is moved along the movement path a at a predetermined interval from the top of the chip mounting film 500, and displays the image. Send to the control module 230.

The control module 230 determines whether the semiconductor chips 600 are stored from the image, and a punching area including the position coordinates of the alignment marks mentioned above when the semiconductor chips 600 are accommodated. The light source 210 and the optical path guide module 220 are operated to cut the punching area by irradiating laser light along the edge of the punching area.

In addition, the control module 230 punches the punching area PA of the chip mounting film 500 positioned at the punching position preset in the control module 230 when the semiconductor chips 600 are accommodated. The light source 210 and the optical path guide module 220 may be operated to operate. In this case, the punching area PA is preset in the control module 230.

Meanwhile, FIG. 8 shows another example of the optical punching unit of the present invention.

As shown in Fig. 8, the present invention may include a plurality of optical path guide modules 200, 200 ', and 200 "configured as described above. The optical path guide module 200, 200', 200" may be provided. Are connected to the light sources 210, 210 ', and 210 ", respectively.

In this case, the plurality of optical path guide modules 200, 200 ′, 200 ″ are disposed on the chip mounting film 500, and the plurality of punching areas PA formed in the chip mounting film 500. It may be disposed on top of each).

Accordingly, the punching regions PA including the plurality of semiconductor chips 600 may be simultaneously cut from the chip mounting film 500 by the plurality of optical path guide modules 200, 200 ′, and 200 ″. have.

In this case, a plurality of pickup modules 400 as shown in FIG. 3 may be disposed on the side of the chip mounting film 500 so as to pick up the punched plurality of punching areas PA.

In addition, the plurality of pickup modules 400 may include a shuttle 430 located at the bottom of the vacuum adsorbers 420, and the shuttle 430 may be moved along the guide rail 440. . Here, the shuttle 430 may be moved by a driving device (for example, a driving motor) not shown along the guide rail 440. In addition, in addition to the shuttle 430, a device such as a conveyor belt (not shown) driven by receiving power from the outside may be applied.

Next, the optical punching method will be described through the operation of the optical punching unit having the above configuration.

 7 is a flowchart showing an optical punching method using the optical punching unit of the present invention.

3 and 7, the chip mounting film 500 is moved at a predetermined pitch along the moving path a using the moving module 300 (S100).

Here, a plurality of semiconductor chips 600 are accommodated at predetermined intervals in the chip mounting film 500, and a region including each of the semiconductor chips 600 is provided in an area in which the semiconductor chips 600 are accommodated. The punching area PA to be punched is formed. Here, the punching area PA consists of a connection of the position coordinates X and Y of the alignment marks AM (see FIG. 5).

That is, the control module 230 transmits an operation signal to the rotary motor 320 connected to the second driving wheel 312. The rotary motor 320 rotates the second driving wheel 312 at a predetermined pitch interval. Therefore, the chip mounting film 500 having the pitch holes 510 fitted into the pitch protrusions 311a and 312a of the first and second driving wheels 311 and 312 may be moved at a predetermined pitch interval.

Here, the control module 230 may be preset the interval of the pitch holes 510 and the interval of the pitch protrusions (311a, 312a) of the driving wheels (311, 312), the control module 230 May control a rotation operation of the rotary motor 320 to move the chip mounting film 500 at the predetermined pitch interval.

Subsequently, the presence of the semiconductor chip 600 is determined using the chip recognition unit 100 and the control module 230 (S200).

The chip recognizing unit 100 may recognize whether the semiconductor chip 600 is in the chip mounting film 500 moved below. The chip recognition unit 100 may be a vision camera.

The chip recognition unit 100 acquires image information (including an alignment mark) of the punching area PA that is moved by the moving module 300. Subsequently, the chip recognition unit 100 transmits the acquired image information to the control module 230. Accordingly, the control module 230 determines whether the semiconductor chip 600 exists in the image information.

Next, the punching area PA is recognized (S300).

When the semiconductor chip 600 is present, the control module 230 may include a semiconductor chip 600 using the position coordinates X and Y of the alignment marks AM from the image information. A punching area PA having a size can be set.

In addition, when the semiconductor chip 600 is present, the control module 230 may calculate position information of the semiconductor chip 600 from the image information, and accordingly, the control module 230 may generate the image. The positional information of the semiconductor chip 600 may be calculated from the information. Here, the location information may be a coordinate value that determines the size of the semiconductor chip 600. Subsequently, the control module 230 may set a punching area PA having a predetermined size including the semiconductor chip 600 based on the position information.

Subsequently, the punching area PA is received by receiving information about the punching area PA from the chip recognition unit 100 using the optical punching unit 200 electrically connected to the chip recognition unit 100. Irradiating laser light along the edge 610 of the chip mounting film 500 is punched through an optical punching step (S400).

More specifically, referring to FIGS. 4 and 6 and 7, the semiconductor chip 600 in which the punching area PA is recognized may be located at a bottom of the housing 228. The predetermined position may be a position to be punched.

In addition, the control module 230 transmits an electrical signal to the light source 210, the light source 210 emits a laser light of a constant illuminance.

The emitted laser light is guided to the collimator 226 through the optical fiber 225. The collimator 226 forms the guided laser light as parallel light and guides it to the first reflection mirror 221 provided in the housing 228.

Subsequently, the laser light guided to the first reflection mirror 221 is reflected by the second reflection mirror 222, and the laser light reflected by the second reflection mirror 222 is focused while passing through the lens 227. In addition to this, it may be irradiated toward the edge 610 of the punching area PA including the semiconductor chip 600 located at the punching position.

In this case, the control module 230 may sequentially irradiate the irradiation path of the laser light irradiated through the lens 227 along the edge 610 of the punching area PA.

That is, the control module 230 controls the operations of the first and second drive motors 223 and 224 to rotate the first reflection mirror 221 and the second reflection mirror 222, respectively, A laser light irradiation path for forming vertical light through the mirror 222 may be along the edge 610 of the punching area PA.

Accordingly, as illustrated in FIG. 5, the punching area PA including the semiconductor chip 600 may be separated from the area of the chip mounting film 500 in which the pitch hole 510 is formed. That is, the punching area PA may be cut from the chip mounting film 500 by irradiation of the laser light.

The punching area PA punched as described above may be unloaded or discharged to the outside by the pickup module 400 (S500).

That is, the control module 230 extends the cylinder shaft 411 of the cylinder 410 to reach the punching position, and thus the vacuum adsorber disposed at the end of the cylinder shaft 411 is positioned above the punching position. Can be. Here, the cylinder 410 may be a pneumatic cylinder that is provided with air pressure from the outside to expand or contract the cylinder shaft 411. Thus, the control module 230 may control a device (not shown) that substantially provides pneumatic pressure.

Subsequently, the vacuum adsorber 420 sucks the upper surface of the punching area PA including the semiconductor chip 600 which is punched at the punching position by the lowering of the actuator 421 installed at the end of the cylinder shaft 411. And return to the original position.

In addition, the punched semiconductor chip punching area PA may be transported to an external predetermined position and loaded by an operation of the cylinder shaft 411.

Subsequently, the semiconductor chips 600 positioned at the rear end of the punched punching area PA are sequentially moved to the punching positions by an operation of the moving module 300, and are fixed by the optical punching part 200. The punching areas PA may be sequentially punched, and the punched punching areas PA may be sequentially discharged and stacked by the pickup module 400.

Meanwhile, when the semiconductor chip 600 is not recognized by the chip recognition unit 100 on the chip mounting film 500, the control module 230 may stop the punching process. That is, the control module 230 may stop the operation of the moving module 300, the optical punching unit 200, and the pickup module 400.

1 is a perspective view showing that electrodes of a flat panel display glass and electrodes of an FPCB are connected to each other by a conventional punched TAB IC.

2 is a perspective view showing that a conventional TAB IC is punched out.

3 is a perspective view showing that the punching region of the semiconductor chip is punched using the optical punching unit of the present invention.

4 is a diagram illustrating the light path guide module of FIG. 3.

FIG. 5 is a plan view illustrating a punching area in which the semiconductor chip of FIG. 3 is included and a portion of a chip mounting film having the same.

6 is a block diagram showing the electrical connection between the components of the optical punching unit of the present invention.

7 is a flowchart showing an optical punching method using the optical punching unit of the present invention.

8 is a perspective view showing another example of the optical punching unit of the present invention.

* Description of Signs of Main Parts of Drawings *

100: chip recognition unit

200: optical punching unit

210: light source

220: optical path guide module

230: control module

300: moving module

400: pickup module

Claims (14)

A chip recognition unit recognizing a punching area including each of the semiconductor chips accommodated in a chip mounting film of a predetermined length; And And an optical punching unit for receiving the information about the punching region from the chip recognition unit and irradiating light along an edge of the punching region to punch the chip mounting film. The method of claim 1, The optical punching unit, a light source for emitting laser light, an optical path guide module for guiding the laser light emitted from the light source along the edge of the punching area, and transmits information about the punching area from the chip recognition unit. And a control module for receiving the light source and operating the light path guide module. 3. The method of claim 2, The optical path guide module includes a reflection mirror that reflects the laser light emitted from the light source to the punching area, and an edge of the punching area that is connected to the reflection mirror and receives an electrical signal from the control module. And a driving motor for rotating the reflection mirror to be irradiated along the surface of the optical punching unit. 3. The method of claim 2, The chip mounting film is moved at a predetermined interval by a moving module driven by receiving an electrical signal from the control module, The moving module includes a pair of driving wheels that surround both ends of the chip mounting film, and a rotating motor that receives an electrical signal from the control module and rotates any one of the driving wheels at a predetermined interval. Optical punching unit. The method of claim 4, wherein Pitch holes are formed at both ends of the chip mounting film at regular intervals, Pitch protrusions in which the pitch holes are fitted at predetermined intervals are formed at outer peripheries of both ends of the driving wheels. And a rotation interval of the rotary motor is set in the control module at intervals of the pitch holes or intervals of the pitch protrusions. The method of claim 4, wherein The chip recognition unit is a vision camera electrically connected to the control module, The vision camera acquires an image of the chip mounting film that is moved at the predetermined interval from the top of the chip mounting film and transmits the image to the control module, The control module determines whether the semiconductor chips are received from the image, and when the semiconductor chips are accommodated, the light source and the light source to punch the punching region of the chip mounting film located at a punching position preset to the control module. Optical punching unit, characterized in that for operating the optical path guide module. 3. The method of claim 2, The chip recognition unit is a vision camera electrically connected to the control module, The punching area is an area in which position coordinates of alignment marks which are previously formed to include the semiconductor chip are connected to each other. And the vision camera recognizes the position coordinates of the punching region and recognizes the region having a predetermined width and width as the punching region to include the recognized semiconductor chips. A chip recognition step of recognizing a punching area including each of the semiconductor chips accommodated in a chip mounting film of a predetermined length by using a chip recognition unit; And An optical punching step of punching the chip mounting film by receiving information about the punching area from the chip recognition unit by using an optical punching unit electrically connected to the chip recognition unit to irradiate light along an edge of the punching area; Optical punching method using an optical punching unit comprising a. The method of claim 8, The optical punching step, Operating a light source using a control module to emit laser light through the light source, Transmits the information about the punching area from the chip recognition unit to the optical path guide module using the control module, And operating the optical path guide module using the control module to guide the laser light emitted from the light source to be irradiated along the edge of the punching area. The method of claim 9, The optical path guide module Reflecting laser light emitted from the light source into the punching region using a reflecting mirror, Light punching, characterized in that for rotating the reflection mirror so that the reflected laser light is irradiated along the edge of the punching area using a drive motor connected to the reflection mirror and receives the electrical signal from the control module to rotate the drive. Optical punching method using the unit. The method of claim 9, The chip mounting film is moved at a predetermined interval by a moving module driven by receiving an electrical signal from the control module, The moving module includes a pair of driving wheels that surround both ends of the chip mounting film, and a rotating motor that receives an electrical signal from the control module and rotates any one of the driving wheels at a predetermined interval. Optical punching method using an optical punching unit. The method of claim 11, Pitch holes are formed at both ends of the chip mounting film at regular intervals, Pitch protrusions in which the pitch holes are fitted at predetermined intervals are formed at outer peripheries of both ends of the driving wheels. And a rotation interval of the rotary motor is set in the control module at intervals of the pitch holes or intervals of the pitch protrusions. The method of claim 11, The chip recognition unit is a vision camera electrically connected to the control module, The vision camera acquires an image of the chip mounting film which is moved at the predetermined interval from the top of the chip mounting film and transmits the image to the control module, The control module determines whether the semiconductor chips are received from the image, and when the semiconductor chips are accommodated, the light source and the light source to punch the punching region of the chip mounting film located at a punching position preset to the control module. Optical punching method using an optical punching unit, characterized in that for operating the optical path guide module. The method of claim 9, The chip recognition unit is a vision camera electrically connected to the control module, The punching area is an area in which position coordinates of alignment marks which are previously formed to include the semiconductor chip are connected to each other. And the vision camera recognizes the position coordinates of the punching region and recognizes the region having a predetermined width and width as the punching region to include the recognized semiconductor chips as the punching region.

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