KR20100073598A - Led package, method of manufacturing led package, back light unit and lighting device - Google Patents

Abstract

PURPOSE: A light emitting diode(LED) package, a method for manufacturing the same, a back light unit, and an illuminating device are provided to ensure wide directional angles by emitting light from a light emitting device through a fluorescent lens to the entire direction. CONSTITUTION: An LED package includes a substrate(10), a light emitting device(14), a transparent lens(16), and a fluorescent lens(18). A pattern electrode(12) is formed on the upper side of the substrate. The light emitting device is arranged on one side of the substrate. The transparent lens surrounds the light emitting device. The fluorescent lens covers the transparent lens.

Description

LED package, method of manufacturing LED package, back light unit and lighting device {LED package, method of manufacturing LED package, back light unit and lighting device}

The present invention relates to an LED package, a method for manufacturing the LED package, and a backlight unit and a lighting apparatus, and more particularly, a method for manufacturing an LED package and an LED package capable of emitting light upward and to the side, an LED package having such a structure, and The present invention relates to a backlight unit and a lighting device employing an LED package manufactured by a predetermined manufacturing method.

In general, a backlight unit employed in a flat panel display or the like is largely classified into an edge type and a direct type according to a position where a light source is disposed. The edge type is a structure in which light sources are installed on the side of the light guide plate in the backlight unit, and the direct type is a structure in which one or more light sources are arranged in a row on the lower surface of the diffuser plate in the backlight unit to irradiate light to the flat panel display in front. .

As a light source, it generates relatively little heat, produces white light that is close to natural light, and uses a long-life cold cathode ray tube lamp or LED which has good color reproduction and low power.

LED is mainly used in small and medium sized liquid crystal display devices such as mobile phones and PDPs because of its light weight and light weight, but LED is also used as a light source of a backlight unit in a large display device such as a TV employing a direct type.

In other words, the LED package packaged by the LED has been applied as a light source of a backlight unit such as an LCD TV through a flash lamp of a mobile phone from a simple indicator of the electronic device. Furthermore, it is also employed in lighting devices (e.g., lighting, street lamps, indoor lights, etc.).

By the way, the light emitted by the LED has a strong straightness, and tends to be concentrated and emitted in the front direction of the LED. Therefore, LED is mainly used as a point light source.

In order to widen the LED's directivity, which is characteristic of point light source, reflector is used in the case of existing LED package. Even with a reflector, it was not easy to achieve a direct angle of about 120 degrees. Accordingly, in order to further widen the angle of view, there is a task of adding a separate means to the LED package or modifying the LED package.

In particular, in flat panel displays using LEDs as a light source, a tendency to require a wide direct angle (eg, 160 degrees or more) in order to bring an LED having a characteristic of a point light source closer to a surface light source has become predominant. In addition, there is an increasing demand for LEDs having a wide orientation angle (for example, 160 degrees or more) in various lighting apparatuses using LEDs as light sources.

The present invention has been proposed in view of the above-described conventional circumstances, and an object thereof is to provide an LED package and a method of manufacturing the LED package to obtain a wide direct angle with a simple structure.

Another object of the present invention is to provide a backlight unit and a lighting device employing an LED package to obtain a wide direct angle with a simple structure.

Still another object of the present invention is to provide a backlight unit and a lighting apparatus employing an LED package manufactured by a method of manufacturing an LED package, which can obtain a wide direct angle with a simple structure.

In order to achieve the above object, the LED package according to a preferred embodiment of the present invention, the substrate; A light emitting device mounted on one surface of the substrate; A transparent lens mounted on one surface of the substrate and installed to surround the light emitting device and the periphery of the light emitting device; And a phosphor lens in which the inner side is in close contact with the outer side of the transparent lens and covers the transparent lens.

The transparent lens is made of transparent silicone.

The transparent lens is installed in a shape protruding from one surface of the substrate.

An LED package according to another embodiment of the present invention, a substrate; A light emitting device mounted on one surface of the substrate; And a transparent block mounted on one surface of the substrate to surround the light emitting device, wherein a concave cavity is formed at a portion of the substrate opposite to the surface of the substrate, and a phosphor layer is coated on the inner surface of the cavity.

The transparent block is composed of transparent silicon.

The transparent block has a rectangular plane.

The phosphor layer is spaced apart from the light emitting element to surround the light emitting element, and the space between the phosphor layer and the light emitting element is filled with air or transparent silicon.

Method for producing an LED package according to an embodiment of the present invention, the substrate preparation step of preparing a substrate; A light emitting device mounting step of mounting a light emitting device on one surface of the substrate; A transparent lens mounting step of mounting a light emitting device and a transparent lens prepared in advance to surround the light emitting device on one surface of the substrate; And forming a phosphor lens covering the transparent lens by bringing the inner surface of the phosphor lens prepared in advance into the outer surface of the transparent lens.

The transparent lens mounting step consists of transparent lens made of transparent silicone.

In the transparent lens mounting step, the transparent lens is mounted in a shape protruding from one surface of the substrate.

According to another aspect of the present invention, a method of manufacturing an LED package includes a substrate preparation step of preparing a substrate; A light emitting device mounting step of mounting a light emitting device on one surface of the substrate; And a transparent block mounting step of mounting a transparent block having a concave cavity formed at a portion opposite to one surface of the substrate and having a phosphor layer coated on the inner surface of the cavity so as to surround the light emitting device on one surface of the substrate.

The transparent block mounting step consists of transparent blocks made of transparent silicon.

In the transparent block mounting step, the transparent block has a rectangular plane.

The phosphor layer is spaced apart from the light emitting device to surround the light emitting device, and further comprises filling air or transparent silicon in the space between the phosphor layer and the light emitting device.

According to another aspect of the present invention, there is provided a method of manufacturing an LED package, in which an upper mold for supporting a substrate mounted so that the light emitting device faces downward and a first lower mold having a cavity are positioned below the upper mold. First step; A second step of inserting the transparent member into the cavity; A third step of clamping the upper mold with the first lower mold and performing primary curing; A fourth step of separating the upper mold from the first lower mold and placing the upper mold after the primary curing, wherein the light emitting device is wrapped by the transparent member; Placing a second lower mold having a cavity larger than a diameter of a cavity of the first lower mold at a lower portion of the upper mold according to the fourth step; A sixth step of introducing the phosphor into the cavity of the second lower mold; A seventh step of clamping the upper mold according to the fourth step with the second lower mold and performing secondary curing; An eighth step of separating the upper mold from the second lower mold and placing the upper mold after the secondary curing, wherein the transparent member is wrapped by the phosphor; And a ninth step of separating the substrate from the upper mold and separating the substrate by unit elements.

According to the present invention having such a configuration, since the light of the light emitting device is emitted in the entire direction through the phosphor lens, the directivity angle is very wider than the conventional side view LED package and direct LED package. In addition, since the LED package of the embodiment of the present invention does not use a reflecting plate, the structure is simpler than that of the conventional edge type LED package and the direct type LED package.

In particular, in the past, most of the light source (for example, LED chip) is in the form of the phosphor directly wraps the phosphor deteriorated easily by the light of the light source, but according to the present invention, the phosphor is separated from the light source (for example, LED chip) As a result, not only the incidence of degradation of the phosphor is lower than that of the related art, but also a decrease in luminance and a shift in color coordinates are minimized.

Since the LED package of the present invention can sufficiently serve as a light source for a flat panel display device and a lighting device, the LED package can be effectively used for a flat panel display device and a lighting device requiring a wide directing angle.

Hereinafter, an LED package and a backlight unit using the LED package according to an embodiment of the present invention will be described with reference to the accompanying drawings. Hereinafter, it is assumed that the LED package is any SMD type package, such as a ceramic package, a plastic package, a lead frame type package, and a plastic + lead frame type package.

The LED package of the present invention is characterized in that it does not have a reflecting plate but has a lens-shaped phosphor block which can be called a phosphor lens.

(First embodiment)

1 to 3 schematically show the configuration and manufacturing process of the LED package according to the first embodiment of the present invention.

The LED package of the first embodiment includes a substrate 10, an LED chip 14, a hemispherical lens-shaped silicon block (hereinafter referred to as a silicon lens) 16, and a hemispherical lens-shaped phosphor block (hereinafter referred to as a phosphor lens). 18).

First, the substrate 10 as in FIG. 1 is prepared. As long as the board | substrate 10 can mount the LED chip 14 (light emitting element) at high density, it can be any. For example, the material of the substrate 10 may be alumina, quartz, calcium zirconate, forsterite, SiC, graphite, fusedsilica, mullite. Cordierite, zirconia, beryllia, and aluminum nitride, low temperature co-fired ceramic (LTCC), metals, plastics, varistors, and the like. Preferably, it is best to manufacture using a ZnO series varistor material. This is because varistors of ZnO series have high thermal conductivity. The production of ZnO-based varistor material not only functions as a varistor, but also allows the LED package to be rapidly cooled due to the high thermal conductivity of the varistor itself. Although the planar shape of the board | substrate 10 was made into the rectangle in the figure, it may be square.

The pattern electrode 12 is formed on the upper surface of the substrate 10. The pattern electrode 12 may be formed of a cathode electrode and an anode electrode spaced apart from each other. For example, the pattern electrode 12 takes the form of a lead frame plated with on (Ag). The anode electrode is formed to be spaced apart from each other to electrically insulate the cathode electrode formed on the LED chip mounting region (that is, the center of the upper surface of the substrate 10) on the substrate 10. Anyone skilled in the art can easily know the reference numerals for the cathode electrode and the anode electrode without separately indicating them in the drawings.

After the LED chip 14 is mounted in the LED chip mounting region of the substrate 10, wire bonding is performed. Although the wire is not shown separately in the drawings, it is easily understood by those skilled in the art.

Next, the silicon lens 16 manufactured beforehand is installed. The silicon lens 16 is manufactured by a mold (not shown). The silicon lens 16 is made of transparent silicon. That is, the silicon lens 16 is provided to cover the LED chip 14 and the periphery thereof on the substrate 10. In addition, the bottom surface of the silicon lens 16 is in close contact with the surface of the substrate 10 (see FIG. 2). In the first embodiment, reference numeral 16 is referred to as a silicon lens, but if there is a material having excellent light transmittance other than transparent silicon, the lens may be used.

Then, the phosphor lens 18 prepared in advance is installed so as to surround the silicon lens 16. The phosphor lens 18 is manufactured by a mold (not shown). The fluorescent substance lens 18 is manufactured by mixing a fluorescent substance, silicone, an epoxy, etc. suitably. That is, the inner surface of the phosphor lens 18 is in close contact with the outer surface of the silicon lens 16 and the phosphor lens 18 is provided so as to completely surround the silicon lens 16. In addition, the bottom surface of the phosphor lens 18 is in close contact with the surface of the substrate 10 (see FIG. 3).

In the above-described first embodiment, the coupling between the substrate 10 and the silicon lens 16, the adhesion between the silicon lens 16 and the phosphor lens 18, and the coupling between the substrate 10 and the phosphor lens 18 are described. Although not described separately, it will be apparent to those skilled in the art that the present invention can be sufficiently carried out using well-known techniques.

In the LED package of this first embodiment, since the light from the LED chip 14 is emitted in all directions through the silicon lens 16 and the phosphor lens 18, the conventional side view LED package and the direct LED package Compared to this, the aiming angle is very wide.

In addition, since the LED package of the first embodiment does not use a reflecting plate, the structure is simpler than that of the conventional edge-type LED package and the direct-type LED package.

In particular, conventionally, since the phosphor is directly wrapped around the light source (for example, LED chip), deterioration of the phosphor due to the light of the light source easily occurs. However, in the above-described first embodiment, since the phosphor is distributed outside the silicon lens 16 in a double mold type, the deterioration rate is low, and the luminance decrease and the shift of the color coordinate are minimized.

Since the LED package of the first embodiment described above can serve as a light source sufficiently for a flat panel display and a lighting device, the LED package is effectively used for a flat panel display and a lighting device requiring a wide directing angle. In the specification of the present invention, the light source of the flat panel display device may be regarded as a light emitting device included in the backlight unit. The light source of the lighting device may be regarded as a light emitting device that is employed in lighting, street lamps, indoor lights, and other lights other than a flat panel display device.

(Second embodiment)

4 to 6 schematically illustrate the configuration and manufacturing process of the LED package according to a second embodiment of the present invention. The second embodiment is similar to the first embodiment described above, but the hemispherical lens-shaped cavity is formed in the center of the rectangular silicon block 20 and the phosphor layer 22 is coated on the inner side of the cavity. It is different. Other parts are the same as in the above-described first embodiment, and description thereof will be omitted.

First, the substrate 10 as in FIG. 4 is prepared. The pattern electrode 12 is formed on the upper surface of the substrate 10. After the LED chip 14 is mounted in the LED chip mounting region of the substrate 10, wire bonding is performed. Although the wire is not shown separately in the drawings, it is easily understood by those skilled in the art.

Thereafter, the silicon block 20 prepared in advance is bonded to the substrate 10 (see FIG. 6). The silicon block 20 has a planar shape of square or rectangle. The silicon block 20 is molded of transparent silicon. In the center portion of the bottom of the silicon block 20 is formed a cavity recessed in a hemispherical shape. The phosphor layer 22 having a predetermined thickness is coated on the inner surface of the cavity (see FIG. 5). The phosphor layer 22 is formed by a spray method or a separate mold. That is, the phosphor layer 22 is formed like a hemispherical lens. The phosphor layer 22 is prepared by mixing a phosphor, silicon, epoxy, or the like as appropriate. In the second embodiment, reference numeral 20 is referred to as a silicon block. However, if there is a material having excellent light transmittance other than transparent silicon, the block may be used. When the silicon block 20 is bonded to the substrate 10, the phosphor layer 22 surrounds the LED chip 14.

The size of the plane of the silicon block 20 is the same as the size of the plane of the substrate 10. Here, the same is to be understood as a concept including not only numerically identical but also some errors. If the size of the plane of the silicon block 20 and the substrate 10 are the same, the phosphor layer 22 having a lens shape can be easily assembled to the substrate 10. Of course, the size of the plane of the silicon block 20 and the substrate 10 may be slightly different.

In Fig. 6, the space between the LED chip 14 and the phosphor layer 2 wrapped by the hemispherical phosphor layer 22 is filled with air. If necessary, a transparent member such as transparent silicone may be filled.

In the above-described second embodiment, the coupling between the substrate 10 and the silicon block 20 has not been described separately, but it will be apparent to those skilled in the art that a sufficient technique can be performed using well-known techniques.

In the LED package of the second embodiment, since the light from the LED chip 14 is emitted in all directions through the hemispherical phosphor layer 22 and the silicon block 20, the LED package 14 and the direct side view of the LED package 14 are directly Compared to the type LED package, the orientation angle is very wide.

In addition, since the LED package of the second embodiment does not use a reflecting plate, the structure is simpler than that of the conventional edge type LED package and the direct type LED package.

In the past, since the phosphor is directly wrapped around the light source (for example, LED chip), deterioration of the phosphor due to light of the light source easily occurs. However, in the above-described second embodiment, since the hemispherical phosphor layer 22 is spaced apart from the LED chip 14, not only the deterioration rate is lower but also the luminance deterioration and the shift of color coordinates are minimized.

In particular, the second embodiment uses a rectangular silicon block 20, thereby easily assembling a portion (for example, a phosphor lens and a phosphor layer) serving as a lens to the substrate 10 as compared with the first embodiment. You can do it. That is, in the first embodiment, the silicon lens 16 and the phosphor lens 18 are somewhat difficult to hold, but in the second embodiment, the rectangular silicon block 20 can be easily held so that the assembly with the substrate 10 is easy. It's easy.

Since the LED package of the second embodiment described above can serve as a light source sufficiently for a flat panel display and a lighting device, the LED package is effectively used for a flat panel display device and a lighting device requiring a wide directing angle.

(Third Embodiment)

7 to 9 are diagrams schematically showing the configuration and manufacturing process of the LED package according to a third embodiment of the present invention. The third embodiment has a double mold structure like the first embodiment and there is no difference in the shape of the finally completed LED package. However, the third embodiment differs from the first embodiment in the manufacturing process.

First, as shown in FIG. 7, the substrate 10 on which the LED chip 14 is mounted is disposed upside down.

Subsequently, as shown in FIG. 8, the mold 35 filled with the transparent silicon 30 is brought into close contact with a predetermined position of the substrate 10 (that is, a position where the LED chip 14 can be wrapped) and then a predetermined temperature for a predetermined time. Carry out primary cure in.

When the primary curing is completed, the mold 35 is removed. Accordingly, the solidified hemispherical transparent silicon 30 takes the form of surrounding the LED chip 14 mounted on the substrate 10. Here, the hemispherical transparent silicon 30 may be referred to as a silicon lens.

Thereafter, as shown in FIG. 9, the mold 37 filled with the phosphor 32 is brought into close contact with a predetermined position of the substrate 10 (that is, a position where the solidified hemispherical transparent silicon 30 can be wrapped). Secondary curing is performed at a predetermined temperature for a time. The phosphor 32 filled in the mold 37 includes silicon or epoxy.

The mold 37 is removed when the secondary curing is completed. Accordingly, the solidified hemispherical phosphor 32 takes the form of surrounding the outer surface of the hemispherical transparent silicon 30. Here, the hemispherical phosphor 32 may be referred to as a phosphor lens.

In the LED package of the third embodiment, since the light from the LED chip 14 is emitted in all directions through the hemispherical transparent silicon 30 and the phosphor 32, a conventional side view LED package and a direct type are provided. Compared to the LED package, the orientation angle is very wide.

In addition, since the LED package of the third embodiment does not use a reflecting plate, the structure is simpler than that of the conventional edge type LED package and direct type LED package.

In particular, in the past, most of the light sources (for example, LED chips) are in the form of directly encapsulating the phosphor, so that deterioration of the phosphor by the light of the light source easily occurs. However, in the above-described third embodiment, since the fluorescent substance 32 is distributed outside the hemispherical transparent silicon 30 in the form of a double mold, not only the deterioration rate is reduced, but also the luminance decrease and the shift of color coordinates. This is minimized.

In addition, the LED package of the third embodiment described above can serve as a light source sufficiently for a flat panel display device and a lighting device, and thus is effectively used for a flat panel display device and a lighting device requiring a wide directing angle.

The above description based on FIG. 7 to FIG. 9 can be regarded as schematically illustrating a manufacturing process of the LED package of the third embodiment. Thus, a process of manufacturing the LED package according to the third embodiment of the present invention in a multi-array structure will be described in more detail with reference to FIGS. 10 to 15.

First, as shown in FIG. 10, the upper mold 50 and the lower mold 40 are provided.

The lower mold 40 is formed with a cavity 42 which is concave into a plurality of hemispherical shapes. The upper mold 50 supports the substrate 10, and a plurality of LED chips 14 are mounted on the bottom of the substrate 10. Here, each cavity 42 of the lower mold 40 is positioned to correspond to each LED chip 14 of the substrate 10 supported by the upper mold 40.

Transparent silicon 30 is introduced into each cavity 42 of the lower mold 40. Of course, a thin film (not shown) is placed in each cavity 42 before the transparent silicon 30 is introduced into the cavity 42. This is to allow the transparent silicone 30 to be separated while maintaining the formulation when the lower mold 40 and the upper mold 50 are separated from each other after the first curing described below.

Thereafter, the upper mold 50 is lowered vertically downward to clamp the lower mold 40. In this way, the lower mold 40 and the upper mold 50 are in close contact with each other, as shown in FIG. More specifically, the transparent silicon 30 and the LED chip 14 of each cavity 42 of the lower mold 40 are in close contact with each other. That is, each LED chip 14 is wrapped by each transparent silicon 30.

Then, primary curing is performed at a predetermined temperature for a predetermined time.

When the primary curing is finished, the upper mold 50 is lifted upward as shown in FIG. 12. Accordingly, the plurality of LED chips 14 mounted on the substrate 10 and the substrate 10 and the hemispherical transparent silicon 30 surrounding each of the LED chips 14 are separated from the lower mold 40 to form an image. Will rise together in the direction.

Thereafter, as shown in FIG. 13, another lower mold 60 is positioned below the upper mold 50 instead of the lower mold 40. The lower mold 60 has a cavity 62 which is concave into a plurality of hemispherical shapes. The diameter of the cavity 62 is slightly larger than the diameter of the cavity 42.

The phosphor 32 is injected into each cavity 62 of the lower mold 60. In fact, the phosphor 32 injected into the cavity 62 is mixed with silicon or epoxy. The phosphors 32 introduced into the respective cavities 62 are not added to completely fill the respective cavities 62, but only up to a predetermined height. The amount of the phosphor 32 injected is adjusted according to the diameter of the cavity 62, the thickness of the desired phosphor, and the like.

Then, the upper mold 50 is lowered vertically downward to clamp the lower mold 60. Due to the lowering of the upper mold 50, the lower mold 60 and the upper mold 50 are in close contact with each other as shown in FIG. 14. That is, hemispherical transparent silicon 30 arranged below the upper mold 50 is inserted into each cavity 62. The inserted transparent silicon 30 presses the phosphor 32 in the cavity 62 and spreads evenly in all directions. Accordingly, the result is as shown in FIG.

Then, secondary curing is performed at a predetermined temperature for a predetermined time.

When the secondary curing is finished, the upper mold 50 is lifted upward as shown in FIG. 15. Accordingly, the substrate 10, the plurality of LED chips 14 mounted on the substrate 10, the hemispherical transparent silicon 30 surrounding each of the LED chips 14, and the hemispheres surrounding the transparent silicon 30. The phosphor 32 in the shape is separated from the lower mold 60 and is raised together in the upward direction.

Thereafter, the substrate 10 is separated from the upper mold 50 and then separated by unit elements (ie, cut out) to form a desired LED package.

10 to 15, the manufacturing process of the LED package of the third embodiment can be easily understood. In addition, the manufacturing process of the LED package of the first embodiment and the second embodiment can also be easily understood by those skilled in the art without additional description.

16 is an orientation curve diagram for comparing the orientation angles of the LED package and the existing LED package of the present invention. The orientation angles of the LED packages of the first to third embodiments of the present invention described above and the existing LED packages (Product A, Product 2 of Company A) were compared.

The LED packages of the first to third embodiments of the present invention actually have a wide orientation angle of about 173.5 ° as in (a). On the contrary, (b) was a test of a conventional LED package (product A1) having a directing angle of about 160 ° on the specification, and actually was found to have a directing angle of about 110 °. (c) is a test of a conventional LED package (product A company 2) having a direction angle of about 170 ° in the specification, and actually measured as having a direction angle of about 163.7 °.

As described above, it can be seen that the LED packages of the first to third embodiments of the present invention provide a wider direct angle than the LED packages providing the conventional light directing angle.

17 is a view for comparing the uniformity of the LED package and the existing LED package of the present invention. The uniformity of the LED packages of the first to third embodiments of the present invention described above and the existing LED package (product of A Company) were compared.

In the LED packages of the first to third embodiments of the present invention, as shown in (a), the change in color temperature according to the change in angle is not so large. That is, in (a), the highest color temperature is about 5660K according to the change of angle, and the lowest color temperature is about 4460K according to the change of angle. Accordingly, the LED packages of the first to third embodiments of the present invention have a uniformity of about 78.79%.

By the way, in the existing LED package (Product A company 1), the change in the color temperature according to the change of the angle as in (b) is larger than the LED package of the first to third embodiments of the present invention. That is, in (b), the highest color temperature is about 8413K according to the change of angle, and the lowest color temperature is about 5122K according to the change of angle. Accordingly, the existing LED package (product A1) has a uniformity of about 60.88%.

In addition, in the conventional LED package (manufactured by A Company 2), as shown in (b), the change in color temperature according to the change in angle is larger than the LED packages of the first to third embodiments of the present invention. That is, in (b), the highest color temperature is about 10074K according to the change of angle, and the lowest color temperature is about 4872K according to the change of angle. Accordingly, the existing LED package (product A company 2) has a uniformity of about 48.36%. Existing LED package (product A company 2) tends to worsen uniformity as in the circled portion indicated by the dotted line of (c) when it exceeds approximately 85 °.

On the other hand, the present invention is not limited only to the above-described embodiments and can be carried out by modifications and variations within the scope not departing from the gist of the present invention, the technical idea that such modifications and variations are also within the scope of the claims Must see

1 to 3 schematically show the configuration and manufacturing process of the LED package according to the first embodiment of the present invention.

4 to 6 schematically illustrate the configuration and manufacturing process of the LED package according to a second embodiment of the present invention.

7 to 9 are diagrams schematically showing the configuration and manufacturing process of the LED package according to a third embodiment of the present invention.

10 to 15 are views illustrating a process of manufacturing the LED package according to the third embodiment of the present invention in a multi-array structure.

16 is an orientation curve diagram for comparing the orientation angles of the LED package and the existing LED package of the present invention.

17 is a view for comparing the uniformity of the LED package and the existing LED package of the present invention.

Description of the Related Art

10 substrate 12 pattern electrode

14 LED chip 16: silicon lens

18: phosphor lens 20: silicon block

22 phosphor layer 30 silicon

32: phosphor 40, 60: lower mold

50: upper mold

Claims (23)

Board; A light emitting device mounted on one surface of the substrate; A transparent lens mounted on one surface of the substrate and installed to surround the light emitting device and the periphery of the light emitting device; And LED package, characterized in that the inner surface is in close contact with the outer surface of the transparent lens, the phosphor lens covering the transparent lens. The method according to claim 1, LED package, characterized in that the transparent lens is made of transparent silicon. The method according to claim 1, LED package, characterized in that the transparent lens is installed in a shape protruding from one surface of the substrate. A backlight unit comprising the LED package according to any one of claims 1 to 3. An illumination device comprising the LED package according to any one of claims 1 to 3. Board; A light emitting device mounted on one surface of the substrate; And The LED package is mounted to surround the light emitting device on one surface of the substrate, and includes a transparent block having a concave cavity formed on a portion of the substrate facing the one surface of the substrate and having a phosphor layer coated on the inner surface of the cavity. . The method according to claim 6, LED package, characterized in that the transparent block is made of transparent silicon. The method according to claim 6, LED package, characterized in that the transparent block has a rectangular plane. The method according to claim 6, The phosphor layer is spaced apart from the light emitting device to surround the light emitting device, LED package, characterized in that the space between the phosphor layer and the light emitting element is filled with air or transparent silicon. A backlight unit comprising the LED package according to any one of claims 6 to 9. An LED lighting device comprising the LED package according to any one of claims 6 to 9. A substrate preparation step of preparing a substrate; A light emitting device mounting step of mounting a light emitting device on one surface of the substrate; A transparent lens mounting step of mounting the light emitting element and a transparent lens prepared in advance to surround the light emitting element on one surface of the substrate; And And a phosphor lens forming step of closely contacting the inner surface of the phosphor lens prepared in advance to the outer surface of the transparent lens to cover the transparent lens. The method according to claim 12, The transparent lens mounting step, the method of manufacturing an LED package, characterized in that the transparent lens composed of transparent silicon. The method according to claim 12, The transparent lens mounting step, the mounting method of the LED package, characterized in that for mounting the transparent lens in a shape protruding from one surface of the substrate. A backlight unit comprising the LED package manufactured by the manufacturing method of any one of Claims 12-14. An LED lighting apparatus comprising the LED package manufactured by the manufacturing method according to any one of claims 12 to 14. A substrate preparation step of preparing a substrate; A light emitting device mounting step of mounting a light emitting device on one surface of the substrate; And And a transparent block mounting step of mounting a transparent block having a concave cavity formed at a portion opposite to one surface of the substrate and having a phosphor layer coated on an inner surface of the cavity to surround the light emitting device on one surface of the substrate. Method for producing an LED package characterized in that. The method according to claim 17, The transparent block mounting step, the manufacturing method of the LED package, characterized in that the transparent block is composed of transparent silicon. The method according to claim 17, In the transparent block mounting step, the transparent block has a rectangular flat surface manufacturing method of the LED package. The method according to claim 17, The phosphor layer is spaced apart from the light emitting device to surround the light emitting device, And filling air or transparent silicon in a space between the phosphor layer and the light emitting device. A first step of arranging an upper mold for supporting the substrate mounted so that the light emitting device faces downward and a first lower mold having a cavity formed below the upper mold; A second step of inserting the transparent member into the cavity; A third step of clamping the upper mold with the first lower mold and performing primary curing; A fourth step of separating the upper mold from the first lower mold and positioning the upper mold after the primary curing, wherein the light emitting device is wrapped by the transparent member; Placing a second lower mold having a cavity larger than a diameter of a cavity of the first lower mold below the upper mold according to the fourth step; A sixth step of injecting a phosphor into the cavity of the second lower mold; A seventh step of clamping the upper mold according to the fourth step with the second lower mold and performing secondary curing; An eighth step of separating the upper mold from the second lower mold and positioning the upper mold after the second curing, wherein the transparent member is wrapped by the phosphor; And And a ninth step of separating the substrate from the upper mold and separating the substrate by unit elements. A backlight unit comprising the LED package manufactured by the manufacturing method of any one of Claims 17-21. An LED lighting apparatus comprising the LED package manufactured by the manufacturing method according to any one of claims 17 to 21.

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