KR20100070840A - Apparatus for supplying epoxy molding compound - Google Patents
Apparatus for supplying epoxy molding compound Download PDFInfo
- Publication number
- KR20100070840A KR20100070840A KR1020080129570A KR20080129570A KR20100070840A KR 20100070840 A KR20100070840 A KR 20100070840A KR 1020080129570 A KR1020080129570 A KR 1020080129570A KR 20080129570 A KR20080129570 A KR 20080129570A KR 20100070840 A KR20100070840 A KR 20100070840A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy molding
- molding compound
- emc
- trench
- suction chamber
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
The present invention relates to an apparatus for supplying an epoxy molding compound (EMC). More particularly, the present invention relates to an apparatus for supplying a powdered epoxy molding compound into a mold by using a tray for packaging semiconductor chips mounted on a substrate in the manufacture of a semiconductor device.
In general, in the manufacture of a semiconductor device, a molding process may be performed to package semiconductor chips mounted on a substrate using an epoxy resin. The molding process may be performed by a molding apparatus including a mold that provides a space for molding the semiconductor chips.
The mold may include an upper mold and a lower mold, and a substrate in which the semiconductor chips are mounted and an epoxy molding compound in powder form may be supplied to the mold by a loader. have. At this time, the EMC powder may be carried by the tray.
The device for supplying the EMC feeds the EMC powder to the tray, which can be transported into the mold by the loader.
The EMC supply device includes a storage container for storing the EMC in a powder state, a storage container for storing the EMC powder supplied from the storage container, and an induction furnace for extending the EMC powder to the tray and extending from the storage container. It may include a trench member to perform a function and a vibration generator for vibrating the trench member to move the EMC powder through the trench member.
In the case of using the conventional EMC supply device as described above, disturbances from the outside, for example, shock or vibration, may be directly transmitted to the trench member through the vibration generator, and conversely, vibration by the vibration generator It can be delivered directly throughout this molding installation. As a result, the EMC powder falling from the trench member may not be uniformly supplied to the tray by the disturbance, and the vibration caused by the vibration generator may affect other elements in the molding facility. In addition, when the EMC powder falls irregularly due to the disturbance, a large amount of dust may be generated from the EMC powder, and thus the inside of the molding facility may be contaminated by the dust.
An object of the present invention for solving the above problems is to provide an EMC supply device that can reduce the dust generated during the supply of the EMC powder.
According to embodiments of the present invention for achieving the above object, the EMC supply device, the container for accommodating the EMC in the powder state, extending from the container in one direction and the tray for conveying the EMC A trench member that functions as a delivery passage for supplying the container, the trench member being connected to the vessel and moving the EMC from the vessel toward the end of the trench member and allowing the EMC to drop from the end of the trench member toward the tray. And a vibration generator for vibrating the trench member, and a gate member disposed in the trench member to adjust an amount of the EMC carried in the trench.
According to embodiments of the present invention, the gate member may have sides configured to be parallel to the inner surfaces of the trench member.
According to embodiments of the present invention, the trench member may have a width reduced downward.
According to embodiments of the present invention, the EMC supply device may further include a chute disposed between the end of the trench member and the tray to guide the EMC dropped from the end of the trench member to the tray.
According to embodiments of the present invention, the EMC supply device is disposed adjacent to the chute, to remove dust generated in the space adjacent the end of the chute while supplying the EMC through the chute to the tray. It may further include an EMC remover having a plurality of vacuum holes for.
According to the embodiments of the present invention, the EMC removal unit may include an intake chamber with upper and lower openings. Here, the lower end of the chute may be disposed in the suction chamber while the EMC is supplied, and the plurality of vacuum holes may be disposed on sidewalls of the suction chamber.
According to embodiments of the present invention, the EMC removal unit has sidewalls and a bottom panel connected to the suction chamber and forming an open top and a closed bottom, and the trench member for removing the EMC contained in the container. A second suction chamber having a plurality of second vacuum holes for suctioning the EMC dropped into the second suction chamber through the suction chamber and the suction chamber and the second suction chamber to adjust positions of the suction chamber and the second suction chamber; The apparatus may further include a driving unit for moving the chamber.
According to embodiments of the present invention, the EMC supply device may further include a disturbance blocker disposed under the vibration generator to reduce the direct transmission of external disturbances to the trench member.
According to embodiments of the present invention, the disturbance blocker is disposed between the upper plate supporting the vibration generator, the lower plate disposed below the upper plate, and the upper plate and the lower plate to absorb the disturbance. It may include an attenuation member.
According to embodiments of the present invention, the EMC supply device may further include a weight sensor disposed under the disturbance blocker for measuring the weight of the EMC contained in the container and the vibration frequency and amplitude by the vibration generator. have.
The EMC supply apparatus according to the embodiments of the present invention as described above can be used to mold the semiconductor chips mounted on the substrate. In particular, by placing the gate member in the trench member for supplying the EMC powder to the EMC tray for transporting the EMC powder, it is possible to prevent abnormally drop of a large amount of the EMC powder due to disturbance.
In addition, the EMC powder scattered in the space adjacent to the lower end of the chute while supplying the EMC powder to the tray may be vacuum sucked through the EMC removal. In addition, since the disturbance may be sufficiently blocked by the disturbance blocking unit while supplying the EMC powder to the EMC tray, the irregular powder drop may be prevented by the disturbance.
The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.
When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.
Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.
Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to other elements as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be fitted as being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of one or more other forms, regions, integrals, steps, actions, elements, components, and / or groups.
Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.
Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.
FIG. 1 is a schematic front view for explaining an EMC supply device according to an embodiment of the present invention, and FIG. 2 is a schematic side view for explaining the EMC supply device shown in FIG. 3 is a schematic view for explaining a method of loading an EMC powder in an EMC tray.
1 and 2, an
The
In particular, the
Although not shown in detail, the
As shown in FIG. 3, the
The operation of the
The
Specifically, the
The
The
According to other embodiments of the present invention, the
In addition, by reducing the lower width of the
4 and 5 are schematic diagrams for describing the EMC powder carried through the trench member and the gate member shown in FIGS. 1 and 2.
According to the exemplary embodiment of the present invention, as shown in FIGS. 4 and 5, the
As described above, since the transfer amount of the
In addition, as described above, the space between the
Although not shown, the
Referring again to FIGS. 1 and 2, the
The
The reinforcing
The EMC
According to one embodiment of the invention, the
According to another embodiment of the present invention, although not shown, a plurality of elastic blocks (not shown) may be disposed between the upper plate 122 and the
According to one embodiment of the present invention, the
Referring to FIG. 3, an
The lower end of the
6 and 7 are schematic diagrams for describing the EMC remover illustrated in FIG. 3, and FIG. 8 is a schematic cross-sectional view for describing the first and second suction chambers illustrated in FIG. 3.
3, 6 to 8, the upper part of the
Sidewalls constituting the
The first and second vacuum holes 154 and 158 may be connected to the
According to one embodiment of the present invention, the
The lower end of the
The
As described above, the EMC dust which may be generated during the supply of the
The controller may be connected to the
The volume information may be calculated using information of semiconductor chips transmitted from a vision inspection unit (not shown). The vision inspector may acquire a 3D image of the semiconductor chips while the substrate on which the semiconductor chips are mounted is loaded into a molding facility, and obtain information such as thickness and size of the semiconductor chips from the image. The information obtained as described above may be transmitted to the controller, and the controller may process the information to obtain volume information of the semiconductor chips. In addition, the controller may calculate the amount of the
In particular, the control unit of the
The EMC supply apparatus according to the embodiments of the present invention as described above can be used to mold the semiconductor chips mounted on the substrate. In particular, by placing the gate member in the trench member for supplying the EMC powder to the EMC tray for transporting the EMC powder, it is possible to prevent abnormally drop of a large amount of the EMC powder due to disturbance.
In addition, since the disturbance may be sufficiently blocked by the disturbance blocker while supplying the EMC powder to the EMC tray, the irregular powder drop may be prevented by the disturbance.
In addition, the EMC powder scattered in the space adjacent to the lower end of the chute while supplying the EMC powder to the tray may be vacuum sucked through the EMC removal.
As a result, the EMC supply device can load the EMC powder uniformly in the tray, and by sufficiently reducing the contamination of the molding equipment by the EMC powder, it is possible to greatly improve the molding quality for the semiconductor chips.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that
1 is a schematic front view illustrating an EMC supply apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic side view for explaining the EMC supply apparatus shown in FIG. 1.
3 is a schematic view for explaining a method of loading an EMC powder in an EMC tray.
4 and 5 are schematic diagrams for describing the EMC powder carried through the trench member and the gate member shown in FIGS. 1 and 2.
6 and 7 are schematic diagrams for describing the EMC remover illustrated in FIG. 3.
FIG. 8 is a schematic cross-sectional view for describing the first and second suction chambers shown in FIG. 3.
Explanation of symbols on the main parts of the drawings
10
20: storage container 22: screw
24: rotation drive unit 100: EMC supply device
102
106: gate member 110: vibration generator
112 Support Panel 114: Reinforcement Member
120: disturbance blocker 122: upper plate
124: lower plate 126: damping member
130: weight sensor 140: chute
150:
154 and 158: first and second vacuum holes 160: vacuum module
168
174: horizontal drive unit
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080129570A KR101038732B1 (en) | 2008-12-18 | 2008-12-18 | Apparatus for supplying epoxy molding compound |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080129570A KR101038732B1 (en) | 2008-12-18 | 2008-12-18 | Apparatus for supplying epoxy molding compound |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100070840A true KR20100070840A (en) | 2010-06-28 |
KR101038732B1 KR101038732B1 (en) | 2011-06-03 |
Family
ID=42368523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080129570A KR101038732B1 (en) | 2008-12-18 | 2008-12-18 | Apparatus for supplying epoxy molding compound |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101038732B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011158976A1 (en) * | 2010-06-15 | 2011-12-22 | 세크론 주식회사 | Device for supplying an epoxy moulding compound |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06191627A (en) * | 1992-12-25 | 1994-07-12 | Sharp Corp | Hopper for powder conveying |
KR19980033574U (en) * | 1996-12-09 | 1998-09-05 | 문정환 | Molding Compound Feeder |
US6209758B1 (en) * | 1999-06-07 | 2001-04-03 | Nylok Fastener Corp. | Powder feed system |
JP5156201B2 (en) | 2006-06-07 | 2013-03-06 | 高園産業株式会社 | Vibrating feeder |
-
2008
- 2008-12-18 KR KR1020080129570A patent/KR101038732B1/en active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011158976A1 (en) * | 2010-06-15 | 2011-12-22 | 세크론 주식회사 | Device for supplying an epoxy moulding compound |
Also Published As
Publication number | Publication date |
---|---|
KR101038732B1 (en) | 2011-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101031341B1 (en) | Apparatus for supplying epoxy molding compound | |
KR20080016518A (en) | Substrate carrying device | |
KR101038732B1 (en) | Apparatus for supplying epoxy molding compound | |
KR101403890B1 (en) | Tray Feeder | |
KR101216241B1 (en) | Apparatus for supplying resin | |
CN112706342B (en) | Resin supply mechanism, resin molding device, and method for manufacturing resin molded article | |
CN211469866U (en) | Automatic feeding device for vibrating disc | |
WO2011158976A1 (en) | Device for supplying an epoxy moulding compound | |
KR101042692B1 (en) | Method of supplying epoxy molding compound into tray | |
CN114160378A (en) | Dispensing equipment | |
KR100771480B1 (en) | Tray transfer system | |
CN208856299U (en) | A kind of belt bucket elevator vibration unloading device | |
CN216037195U (en) | Automatic tray filler | |
JP2017152582A (en) | Processing method | |
CN109896260A (en) | A kind of automatic material arranging and the supply all-in-one machine that sorts | |
CN217911660U (en) | Quality detection equipment for precise materials | |
US11350549B2 (en) | Component supply device and component mounting device | |
KR101209185B1 (en) | Apparatus for feeding materials of wafer | |
CN213294065U (en) | Bucket lifting type material distribution device and screening production line | |
TWI840092B (en) | Transportation mechanism of electronic component and processing machine | |
CN112776241B (en) | Resin material supply device, resin molding device, and method for manufacturing molded article | |
JP6866522B2 (en) | Pitching device for loose parts, picking method for loose parts | |
CN115043021B (en) | Automatic tray loading equipment for electronic seal labels | |
JP6854372B2 (en) | Loose parts picking device, loose parts picking method | |
CN210709622U (en) | Feeding conveyor and electricity meter production equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20140508 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20150430 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20160503 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20170426 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20180503 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20190503 Year of fee payment: 9 |