KR20100067558A - Photocuring composition for pressure sensitive adhesive and dicing die bonding film comprising the same - Google Patents

Abstract

PURPOSE: A photo-curable adhesive composition is provided to reduce delamination force of adhesive layers after UV hardening by including a UV-curable acrylate having a hydroxyl group and a vinyl group at the same time. CONSTITUTION: A photo-curable adhesive composition comprises UV-curable acrylate including a hydroxyl group and vinyl group 3-50 parts by weight, thermosetting material 0.5-5 parts by weight, and photopolymerization initiator 0.1-3 parts by weight based on 100.0 parts by weight of an acrylic adhesive binder including the vinyl group. The acrylic adhesive binder includes an acrylic monomer, a hydroxyl monomer, and an epoxy monomer. A dicing film includes a base film(100) and an adhesive layer which is formed on the base film.

Description

Photocurable adhesive composition and dicing die-bonding film comprising the same {PHOTOCURING COMPOSITION FOR PRESSURE SENSITIVE ADHESIVE AND DICING DIE BONDING FILM COMPRISING THE SAME}

The present invention relates to a photocurable pressure-sensitive adhesive composition and a dicing die-bonding film comprising the same, by adding a UV-curable acrylate including a hydroxyl group and a vinyl group to an acrylic pressure-sensitive adhesive binder containing a vinyl group, the adhesive layer and the adhesive layer after photocuring The present invention relates to a technique capable of effectively reducing the peel force therebetween.

In the semiconductor manufacturing process, wafers designed for circuits are divided into small chips through dicing in a size having a large diameter, and each separated chip is die-bonded by bonding to a supporting member such as a PCB substrate or a lead frame substrate. Go through

Conventionally, a dicing film is attached to the back surface of a wafer in a dicing process to prevent chips from scattering or moving during dicing. Without the dicing film, the chip is scattered or moved by the blades rotating at high speed, causing cracks and damage to the chip. Thus, a dicing film with appropriate adhesion was used to facilitate the individualization process of the chip.

When the dicing film is an ultraviolet curable composition, after dicing is completed, ultraviolet rays are irradiated on the rear surface to cure the composition, thereby lowering the interfacial peeling force with the wafer, thereby facilitating the pick-up process of the individualized chip wafer. .

However, if the chip size is small or the wafer thickness is large, the pick-up range can be adjusted by adjusting the parameters of the pick-up machine. However, in the case of a wafer thickness of 80 µm or less or a chip size of 10 mm x 10 mm or more, the adhesion layer is appropriate. The adhesion between the adhesive layer and the adhesive layer is not reduced, which causes a problem in die pickup.

In particular, the pick-up process is essential for bonding wafers smaller than 50 μm onto PCBs and other chips, but the reduction of the peel force between the adhesive layer and the adhesive layer after UV curing is low when the conventional dicing die-bonding film is applied. There is a problem that defects occur and process yield is reduced.

The present invention is to solve the above problems, in order to reduce the sufficient adhesive strength after ultraviolet curing, by introducing a UV-curable acrylate containing a hydroxyl group and a vinyl group at the same time the peeling force between the adhesive layer-adhesive layer after UV curing It is an object to provide a photocurable adhesive composition that can be reduced.

In addition, the present invention includes the above photocurable adhesive composition to prevent the chip from scattering or moving during dicing during the semiconductor process and to easily peel off the chip with the adhesive from the adhesive layer when picking up It is possible to provide a dicing film or a dicing die-bonding film having sufficient adhesiveness during die bonding operations on a PCB substrate or a lead frame substrate.

The photocurable pressure-sensitive adhesive composition according to the present invention is 3 to 50 parts by weight of UV-curable acrylates containing hydroxyl and vinyl groups, 0.5 to 5 parts by weight of a thermosetting agent, and 0.1 photopolymerization initiator, based on 100 parts by weight of the acrylic adhesive binder including a vinyl group. To 3 parts by weight.

Here, the acrylic pressure-sensitive adhesive binder containing a vinyl group is characterized in that it comprises an acrylic monomer, a hydroxy monomer and an epoxy monomer, the acrylic pressure-sensitive adhesive binder containing a vinyl group includes a hydroxyl value of 15 to 30, the acid value is 1 or less. The weight average molecular weight of the acrylic pressure-sensitive adhesive binder containing a vinyl group is 150,000 to 400,000, the glass transition temperature is -80 to -40 ℃, the acrylic containing a hydroxyl group and a vinyl group The rate is 5 to 20 parts by weight based on 100 parts by weight of the UV-curable acrylic pressure-sensitive adhesive binder containing a vinyl group, the UV-curable acrylate containing a hydroxyl group and a vinyl group is 2-hydroxyethyl methacrylate, 2- hydroxyethyl acrylate, 3-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, Hydroxyp ropyl Acrylate, Hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 4-hydroxybutyl acrylate, N- (hydroxymethyl) acrylate, N- (hydroxymethyl) methacrylate, 3-chloro-2-hydroxyl propyl methacrylate, 3-chloro-2-hydroxyl propyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, Glycerin dimethacrylate, Glycerin diacrylate, 2-hydroxy 3-acryloxy propyl methacrylate, 2-hydroxy 3-methacryloxy propyl acrylate, Pentaerythritol triacrylate, Pentaerythritol trimethacrylate, N- It is characterized in that it comprises one or more selected from the group consisting of (4-hydroxyphenyl) methacrylamide and N- (4-hydroxyphenyl) acrylamide.

In addition, the dicing film and the dicing die bonding film according to the present invention is characterized in that it comprises an adhesive layer formed of the photocurable pressure-sensitive adhesive composition described above.

The photocurable adhesive composition and the dicing die bonding film including the same according to the present invention include a UV-curable acrylate including a hydroxyl group and a vinyl group simultaneously in an acrylic adhesive binder containing a vinyl group, thereby peeling between the adhesive layer and the adhesive layer. Can reduce the force. Thus, when dicing, the chip is prevented from scattering or moving, and the diced chip is easily peeled from the adhesive layer.

Therefore, it is possible to maintain sufficient adhesiveness when die-bonding the PCB substrate or the lead frame substrate, and to improve the pick-up property during the dicing process or the die bonding process, so that it can be performed in one step to increase the manufacturing yield. To provide.

The present invention provides a photocurable pressure-sensitive adhesive composition for forming an adhesive layer by adding a UV-curable acrylate including a hydroxyl group and a vinyl group to an acrylic adhesive binder including a vinyl group.

Here, the photocurable pressure-sensitive adhesive composition 3 to 50 parts by weight of the acrylate including a hydroxyl group and a vinyl group, 0.5 to 5 parts by weight of the thermosetting agent and 0.1 to 3 parts by weight of the photopolymerization initiator, relative to 100 parts by weight of the acrylic adhesive binder containing a vinyl group Include it.

Hereinafter, each composition of the present invention will be described in more detail.

(A) Acrylic adhesive binder containing a vinyl group

The acrylic adhesive binder including the vinyl group is synthesized through a two step process. First of all, an acrylic monomer capable of imparting adhesive strength is selected as a main monomer, and a functional acrylic monomer is added thereto, and the acrylic adhesive binder is polymerized, and then a vinyl group-introducing monomer is applied thereto to perform urethane addition reaction at low temperature. A photocurable acrylic adhesive binder having a group can be synthesized.

Preferably, a first polymerization reaction in which an acrylic monomer, a functional acrylic monomer, and a polymerization initiator are polymerized to produce an acrylic polyol adhesive binder resin, and a monomer having an acrylic polyol adhesive binder resin, an isocyanate and vinyl group obtained in the first polymerization reaction, By the second polymerization reaction in which the urethane addition reaction is carried out, an acrylic adhesive binder (A) including a vinyl group may be prepared.

The functional monomer in the first polymerization reaction includes a hydroxy monomer, an epoxy group monomer or a reactive monomer, of which a hydroxy monomer and an epoxy group monomer are preferably used.

Here, the acrylic monomer functions to impart adhesion to the film, but there is no particular limitation as the acrylic monomer, 2-ethylhexyl methacrylate, iso-oxyl acrylate, 2-ethylhexyl acrylate, ethyl acrylate, n- Preference is given to using at least one member selected from the group consisting of butyl acrylate, iso-butyl acrylate and octadecyl methacrylate. At this time, it is preferable that the glass transition temperature of an acryl monomer is -50 degreeC or less.

The content of the acrylic monomer may be 50 to 85% by weight, preferably 60 to 80% by weight of the total monomers.

Next, there is no particular limitation as the hydroxy monomer, but with 2-hydroxy ethyl methacrylate, hydroxy ethyl acrylate, 4-hydroxy butyl acrylate, hydroxy propyl (meth) acrylate and vinyl caprolactam It is preferable to use one or more selected from the group consisting of.

The content of the hydroxy monomer may be 10 to 35% by weight, preferably 15 to 25% by weight of the monomer used in the first polymerization reaction. If the content is less than 10% by weight, the content of hydroxyl groups reacted with the isocyanate, which is a thermosetting agent after introduction of the monomer having a vinyl group, becomes small, so that the adhesion with the base film is very weak. It is desirable to maintain the addition ratio according to the invention as the adhesion with the layer can be increased after lamination.

Next, glycidyl methacrylate or glycidyl acrylate may be used as the epoxy group monomer. At this time, the content of the epoxy group monomer may be used 2 to 15% by weight, preferably 2 to 8% by weight of the monomer used in the first polymerization reaction. In the above range, in particular, the surface energy during UV curing is greatly reduced, and the greater the difference in surface energy before and after UV curing, the better the pickup performance. If the content is less than 2%, the adhesion to the ring frame is lowered, if the content is greater than 15%, the photocuring rate due to the epoxy group during photocuring may be deteriorated to increase the peeling force with the material.

The epoxy group monomer remains at the end of the acrylic adhesive binder (A) containing a vinyl group after polymerization and does not participate in the reaction after photocuring and affects surface properties. That is, it is related to surface energy and plays a role of reducing surface energy after photocuring.

Next, as the reactive monomer which can be used as the functional monomer, lauryl acrylate, lauryl methacrylate, stearyl methacrylate, cetyl acrylate, octadecyl acrylate, octadecyl methacrylate, and the like are preferable. More preferably, single or mixed use of monomers having 12 or more carbon atoms is more preferable. In this case, the content of the reactive monomer may be suitably used in the range of 1 to 10% by weight of the monomer used in the first polymerization reaction.

Next, as the vinyl group introduction monomer, a monomer or oligomer having an isocyanate group at one end and a vinyl group at the other end can be used, for introducing the vinyl group into the acrylic adhesive binder.

The vinyl group-introducing monomer is not necessarily limited, but α, α-dimethyl-m-isopropenylbenzyl isocyanate (α, α-dimethyl-m-isopropenylbenzyl isocyanate) and 2-isocyanatoethyl methacrylate (2-Isocyanatoethyl Methacrylate), 2-Isocyanatoethyl 2-propenoate, 1,1-bis (acryloyloxymethylethylisocyanate) (1,1-bis (acryloyloxy methyl ethyl isocyanate)) may be used alone or in combination. At this time, the vinyl group-introduced monomer is preferably used in a ratio of 0.4 to 0.9 compared to the hydroxyl equivalent of the acrylic polyol adhesive binder resin.

When the ratio is less than 0.4, the number of double bonds that can be reacted during photocuring is not so large that the loss of adhesive strength is not large, and thus the peeling force with the adhesive film for bonding the wafer or die is increased. This is because the number of sites that can react is reduced so that the adhesion with the base film is reduced.

Here, the content of the vinyl group-introducing monomer is 10 to 25 parts by weight, preferably 15 to 20 parts by weight, relative to 100 parts by weight of the solid content of the polyol adhesive binder resin prepared in the first polymerization reaction. If the content is less than 10 parts by weight, the loss of adhesion after photocuring is not large, the peeling force with the adhesive film for wafer or die adhesion is increased, and if more than 25 parts by weight, the fluidity of the adhesive film layer is worsened Adhesion may increase rather than increase peel force.

As described above, the acrylic pressure-sensitive adhesive (A) containing a vinyl group has a hydroxyl group as a result of applying a hydroxy monomer, the hydroxyl value is preferably 15 to 30. When the hydroxyl value of the acrylic adhesive binder (A) including the vinyl group is less than 15, the content of isocyanate, which is a thermosetting agent, is reduced, so that the adhesion force with the base film is very weak, and when the hydroxyl value is more than 30, the adhesive for wafer or die adhesion This is because adhesion with the film layer increases after lamination.

In addition, it is preferable to make the acid value of the acrylic adhesive binder (A) containing a vinyl group into one or less. If the acid value is greater than 1, it is very likely that a gel is generated during synthesis when the monomers having acrylic acid and an epoxy group are simultaneously introduced, and the change over time after lamination with an adhesive film layer for wafer or die bonding is very large.

The acrylic adhesive binder (A) containing the vinyl group has a glass transition temperature of -80 to -40 ° C, preferably -70 to -50 ° C, in order to obtain an appropriate initial adhesive strength after thermosetting. If the transition temperature exceeds about -40 ℃, the initial adhesion is low, when dicing, the adhesion to the ring frame is low, falling off from the ring frame, or the adhesion to the wafer may be low, chip scattering may occur, -80 ℃ If less than, the tack remains after the photocuring due to the high adhesive force before the photocuring may increase the peeling force with the wafer or adhesive film.

The weight average molecular weight of the acrylic adhesive binder (A) containing the said vinyl group is 150,000-400,000. Conventional acrylic resins composed of only acrylic polyols could exhibit low peeling strength after UV curing only when the acrylic resins contained an acrylic polyol having a molecular weight of 500,000 or more.However, the photocurable acrylic adhesive binder according to the present invention introduces an epoxy group to the ring frame. It is possible to improve the adhesion to the, it is possible to retain the excellent peeling force even in the molecular weight of about 150,000 ~ 400,000.

When the molecular weight of the binder is less than 150,000, a problem occurs in the coating film forming ability during coating, and even after the photocuring, even when the adhesive force is reduced, a certain physical property does not come out.

In the synthesis | combination of the acrylic adhesive binder (A) containing the said vinyl group, as an organic solvent in the case of performing copolymerization by solution polymerization, the thing of ketone type, ester type, alcohol type, and aromatic can be used, Preferably toluene, Ethyl acetate, acetone, methyl ethyl ketone and the like are preferably used, and a solvent having a boiling point of 60 to 120 ° C is particularly preferable.

As a polymerization initiator, radical generators, such as azobis type | system | groups, such as (alpha), (alpha) '-azobisisobutyl nitrile, and organic peroxides, such as benzoyl peroxide, are used normally. At this time, if necessary, a catalyst and a polymerization inhibitor may be used in combination, and the content thereof is preferably 0.1 to 0.5 parts by weight based on 100 parts by weight of the input monomer.

The polymerization reaction may control the molecular weight in the range of polymerization temperature 80 to 120 ℃ and polymerization time 1 to 75hr, preferably 5 to 15hr.

The acrylic polyol adhesive binder resin obtained in the first step of the polymerization reaction, a monomer having an isocyanate group and a vinyl group, and a catalyst are put in a urethane addition reaction at 30 to 55 ° C. for 7 to 15 hours to synthesize an acrylic copolymer.

(B) UV curable acrylates containing hydroxyl and vinyl groups

Available acrylates are 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, 3-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, Hydroxypropyl Acrylate, Hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 4-hydroxybutyl acrylate, N- (hydroxymethyl) acrylate, N- (hydroxymethyl) methacrylate, 3-chloro-2-hydroxyl propyl methacrylate, 3-chloro-2-hydroxyl propyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, Glycerin dimethacrylate, Glycerin diacrylate, 2 -hydroxy 3-acryloxy propyl methacrylate, 2-hydroxy 3-methacryloxy propyl acrylate, Pentaerythritol triacrylate, Pentaerythritol trimethacrylate, N- (4-hydroxyphenyl) methacrylamide, N- (4-hydroxyphenyl) acrylamide, including, but not limited to, hydroxyl groups And a UV curable acrylate surface having a vinyl group at the same time.

Of the above, 2-hydroxyethyl methacrylate follows the following [Formula 1], Pentaerythritol triacrylate follows the following [Formula 2], Glycerin dimethacrylate follows the following [Formula 3].

[Formula 1]

2-hydroxyethyl methacrylate

[Formula 2]

Pentaerythritol triacrylate

(3)

Glycerin dimethacrylate

As can be seen in [Formula 1] to [Formula 3] having a vinyl group (CH2 = CH-) and a hydroxyl group (-OH) at the same time, the vinyl group first reacts with an isocyanate curing agent and other reaction of isocyaneti The site will react with the hydroxyl groups of the binder.

In addition, although it was difficult to introduce a large number of double bonds during the conventional polymerization of a binder having only vinyl groups, in the present invention, a polyfunctional isocyanate curing agent and a monomer having a hydroxyl group (-OH) are introduced as shown in the following [Formula 4]. As a result, the double bond can be easily increased, and the pickup can be improved as the degree of curing due to the double bond is increased.

[Formula 4]

As described above, the UV curable acrylate (B) containing a hydroxyl group and a vinyl group is preferably applied to 3 to 50 parts by weight based on 100 parts by weight of the acrylic adhesive binder (A) containing a vinyl group. It is more preferable to use 20 weight part. This is because less than 3 parts by weight of the absolute amount of curing by ultraviolet light is relatively small, the adhesive force is relatively small, if more than 50 parts by weight of the coating film before UV irradiation is insufficient to form a film properly.

(C) thermosetting agent

Thermosetting agents that can be used to make photocurable adhesive films include 2,4-trilene diisocyanate, 2,6-triene diisocyanate, hydrogenated triylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene di Isocyanate, diphenyl methane-4,4-diisocyanate, 1,3-bisisocyanatomethyl cyclohexane, tetra methyl xylene diisocyanate, 1,5-naphthalene diisocyanate, 2,2,4-trimethyl hexamethylene diisocyanate, Consisting of 2,4,4-trimethyl hexamethylene diisocyanate, triylene diisocyanate adduct of trimetholpropane, xylene diisocyanate adduct of trimetholpropane, toriphenylmethanetoriisocyanate, methylene bistri isocyanate, etc. One or more selected from the group can be used, but is not limited thereto. The thermosetting agent (C) reacts with the functional group of the adhesive binder to act as a crosslinking agent and has a three-dimensional network structure as a result of the crosslinking reaction.

It is preferable to apply 0.5-5 weight part of thermosetting agents (C) with respect to 100 weight part of acrylic adhesive binders (A) containing a vinyl group. If it is less than 0.5, the degree of crosslinking reaction is low, resulting in poor adhesion to the base film, resulting in detachment of the coating layer after coating, or low adhesion after photocuring between the base film and the adhesive layer. The problem that can be transferred occurs, and if it is more than 5, the peeling force with the die-bonding adhesive film becomes relatively heavy due to unreacted isocyanate or the UV irradiation tack is lost due to excessive crosslinking reaction. This is because deterioration of the dicing die-bonding film and the wafer occurs in the ring frame during the expansion.

(D) photoinitiator

The adhesive composition of this invention contains a photoinitiator (D). The photoinitiator (D) contained in the said photocurable composition has a special limitation, and can use what is known conventionally. Specifically, benzophenones such as benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 4,4'dichlorobenzophenone, acetone such as acetophenone and diethoxyacetophenone Anthraquinones, such as phenone, 2-ethyl anthraquinone, and t-butyl anthraquinone, etc. can be used individually or in mixture of 2 or more types.

As for content of a photoinitiator (D), 0.1-3 weight part is preferable with respect to 100 weight part of acrylic adhesive binders (A) containing a vinyl group. If the content of the photopolymerization initiator (D) is less than 0.1 part by weight, the radical generation efficiency is lowered by ultraviolet irradiation, and thus, sufficient adhesive force may not be reduced between the adhesive layer and the interface between the adhesive layer after ultraviolet irradiation. Thus, regardless of chip size, the desired pickup performance is not achieved. On the contrary, if the content is more than 3 parts by weight, the resulting radical concentration is excessive and the molecular weight of the UV-curable acrylate reacted by the UV becomes small, resulting in odor problems of the unreacted initiator and the unreacted initiator to the adhesive layer without forming a sufficient network structure. Transitions occur that degrade the reliability in the packaging of the adhesive layer.

The composition of (A), (B), (C) and (D) can be dissolved in a solvent such as methyl ethyl ketone to prepare the photocurable pressure-sensitive adhesive composition of the present invention, and hot air drying and other methods for the prepared composition. The remaining amount of solvent may be volatilized to form a photocurable pressure-sensitive adhesive film. Moreover, the photocurable adhesive film obtained in this way can be usefully applied to the dicing die-bonding film which has a dicing film or an adhesive film layer for adhesion | attachment.

First, an acrylic adhesive binder, an esterified quinonediazide compound, a thermosetting agent, and a photopolymerization initiator are dissolved in a solvent such as methyl ethyl ketone in the above-described composition to prepare a photocurable adhesive composition of the present invention.

Next, the remaining amount of solvent is volatilized by hot air drying and other methods with respect to the prepared pressure-sensitive adhesive composition to form a photocurable pressure-sensitive adhesive layer.

Next, a photocurable adhesive layer is applied to a dicing film or a dicing die bonding film.

Here, the dicing film is a form in which an adhesive layer is applied on a base film, the dicing die bonding film is a form in which an adhesive layer is coated on a base film, and an epoxy adhesive layer is laminated on each other. At this time, the release film for protecting the adhesive layer may have a structure laminated on the adhesive layer.

However, dicing films or dicing diebonding films according to the present invention are not limited thereto.

In addition, the pressure-sensitive adhesive layer included in the dicing die-bonding film according to the present invention has a thickness of 3 to 40 microns, but in the pressure-sensitive adhesive layer of less than 3 microns, the coating film cohesion strength is weak after UV curing, and is preferable between the interfaces with the adhesive layer on the upper side. It does not bring about the effect of reducing the adhesive force, in the case of more than 40 microns, there is a problem that the cutting chips in the form of a beard during the dicing process occurs.

Hereinafter, the dicing die-bonding film according to the present invention will be described in detail with reference to the drawings.

1A to 1E are schematic cross-sectional views illustrating a dicing die-bonding film and a wafer chip pick-up process using the same according to an embodiment of the present invention.

Referring to FIG. 1A, the adhesive layer 120 is coated on the expandable base film 100 such as a polyolefin film, and the adhesive layer 130 may adhere between the chip and the chip on the adhesive layer 120. Is formed. At this time, the adhesive layer 120 is formed of the adhesive compositions of (A), (B), (C) and (D) described above, so that the thermosetting agent (C) and the vinyl group are included in a subsequent aging process. UV-curable acrylate (B) comprising an acrylic adhesive binder (A) and a hydroxyl group and a vinyl group to form a network by a urethane reaction, to prevent the transition, the adhesive layer 120 after UV curing It is possible to reduce the peel force of the adhesive layer 130.

Here, as described above, when only up to the structure of the base film 100 and the adhesive layer 120 is used as a dicing film, when used up to the structure of the adhesive layer 130 is a dicing die bonding film. At this time, the release film 140 to protect the adhesive layer 130 is formed on the adhesive layer 130, it will be described below with reference to the example of the dicing die bonding film.

Referring to FIG. 1B, after the release film 140 is peeled off, the wafer 150 is laminated on the adhesive layer 130.

Referring to FIG. 1C, after the lamination of the adhesive layer 130 and the wafer 150, a dicing process of cutting a chip to a size of a designed circuit is performed.

The dicing process is performed to the depth of the base film 100 under the adhesive layer 120 including the adhesive layer 130. As a result, the individualized chip 155, the adhesion pattern 135, and the adhesion pattern 125 are formed.

Subsequently, the adhesive pattern 125 is photocured by irradiating ultraviolet (UV) under the base film 100 for pickup, thereby reducing the interfacial peeling force with the adhesive pattern 135. At this time, since the UV-curable acrylate (B) comprising a hydroxyl group and a vinyl group included in the adhesive pattern 125 forms a network by a urethane reaction, between the adhesive pattern 125 and the adhesive pattern 135 The adhesion of is significantly reduced.

Referring to FIG. 1D, the individualized chip 155 to which the adhesive pattern 135 is attached is picked up with a constant force by using a pickup called a collet. In this case, an expansion process of expanding the base film 100 is performed to facilitate pickup, and as described above with reference to FIG. 1C, since the adhesive force between the adhesive pattern 125 and the adhesive pattern 135 is significantly reduced, Separation of the pattern 125 and the adhesive pattern 135 may be easily performed.

Referring to FIG. 1E, the picked-up chip 155 is attached to a supporting member 200 such as a PCB substrate or a lead frame.

Here, the base film 100 supports the adhesive layer 120, which serves to hold the wafer so as not to be shaken during dicing, and also facilitates pickup of individualized chips when dicing is completed. It is preferable to use a film that can be stretched at room temperature so as to enable an expansion process, which is a process of increasing the interval of.

Various polymer films may be used as the base film 100 constituting the dicing die-bonding film according to the present invention. Among them, thermoplastic plastic films are generally used. This is because the thermoplastic film must be used to expand the pickup after the dicing process, and the chips remaining after the expansion can be picked up again over time. Because.

The base film 100 should not only be expandable but also preferably UV-permeable, and in particular, when the pressure-sensitive adhesive is an ultraviolet curable pressure-sensitive adhesive composition, it is preferable that the base film 100 is a film excellent in transmittance to ultraviolet rays of a wavelength at which the pressure-sensitive adhesive composition can be cured. Therefore, the base film 100 should not contain an ultraviolet absorber or the like.

Examples of the polymer film for the base film 100 which can be used as such a substrate include polyethylene, polypropylene, ethylene / propylene copolymer, polybutene-1, ethylene / vinyl acetate copolymer, a mixture of polyethylene / styrenebutadiene rubber, poly Polyolefin type films, such as a vinyl chloride film, etc. can be mainly used. In addition, polymers such as polyethylene terephthalate, polycarbonate, poly (methyl methacrylate), thermoplastic elastomers such as polyurethane and polyamide-polyol copolymers, and mixtures thereof can be used, and these base films 100 are die In order to improve the cutting property and expandability at the time of cutting, it may have a multilayer structure. Such a film may be mainly melted by blending polyolefin chips to form a film by extrusion, or may be formed by blowing. The heat resistance and mechanical properties of the film to be formed are determined according to the type of chips to be blended, and the film to be manufactured should have a value of HAZE 85 or more. Emboss effect to give haze by scattering of light.

If the haze is less than 85, the film may fail to recognize the position of the film when laminating to the mirror surface of the wafer in the pre-cut state during the semiconductor process, and continuous operation may be impossible. Therefore, the back surface of the base film 100 must exhibit a value of haze 85 or more, which is a recognizable level by embossing the surface.

The embossing process of the base film 100 not only recognizes, but also prevents blocking during manufacturing of the base film 100, and thus serves to enable winding. Since the adhesive layer 120 is formed on the embossed back surface of the base film 100, the surface opposite to the embossed surface is preferably modified to increase the adhesive strength with the adhesive layer 120 formed thereon.

Surface modification can be performed by both physical and chemical methods, the physical method can be corona treatment or plasma treatment, the chemical method can be used such as in-line coating treatment or primer treatment, adhesion by corona discharge treatment Forming layer 120 is preferred in terms of manufacturing processability.

The thickness of the base film 100 is preferably 30 to 300 µm, more preferably 50 to 200 µm in view of strong elongation, workability, UV transmittance and the like. When the thickness of the base film 100 is less than 30 μm, workability is poor in a pre-cut state, and deformation of the film is easily caused by heat generated during ultraviolet irradiation. In addition, when the thickness of the base film 100 exceeds 300㎛, the force for expanding on the installation is excessively required, which is not preferable in terms of cost.

Next, the adhesive layer 120 should maintain a strong adhesive force with the adhesive layer 130 or the ring frame before the ultraviolet irradiation, when dicing if the adhesive strength of the interface between the adhesive layer 120 and the adhesive layer 130 is not large before ultraviolet irradiation Peeling easily occurs between the chip with the adhesive and the adhesive layer 120, so that partial lifting occurs, and the chip is shaken during dicing, causing chip damage such as chip cracks.

In addition, if the adhesion between the adhesive layer 120 and the ring frame is not large, the ring frame is fixed at the time of expansion and expands by applying a constant tension to the film, so that desorption occurs at the adhesive portion between the adhesive layer 120 and the ring frame and thus the entire wafer. May cause a defect.

Therefore, after the ultraviolet ray irradiation, the coating layer in the adhesive layer 120 is hardened by ultraviolet ray hardening crosslinking, and the cohesive force becomes large, and the adhesive layer 120 is interfaced with the adhesive layer 130 formed on the adhesive layer 120. The force should be significantly lower, and the greater the peel force reduction width, the easier the pick-up of the chip attached to the adhesive layer 130. That is, the adhesive layer 120 should have a great adhesive force enough to hold the chip strongly from the dicing step to the drying step, while the adhesive force is significantly reduced in the pick-up step so that the chip can be safely moved to the die bonding step. Both opposing properties, which must have low adhesion, should be before and after UV irradiation.

The pressure-sensitive adhesive layer 120 used for the dicing die-bonding film 160 according to the present invention is formed using the photocurable pressure-sensitive adhesive composition, and the method of forming the photocurable pressure-sensitive adhesive composition is mainly performed by coating.

The method of forming the adhesive layer 120 on the base film 100 may be directly coated, or may be transferred by a transfer method after completion of drying after coating on a release film or the like. The former or the latter is not limited as long as the coating method for forming the adhesive layer 120 can form a uniform coating layer, but mainly bar coating, gravure coating, comma coating, reverse roll coating, applicator coating, spray coating And lip coating are used.

After coating, the drying method for forming the coating layer is mainly a thermosetting method, the coating method may form a coating layer directly on the surface of the polyolefin film, the adhesive layer 120 is formed on a film such as the release film 140 After this, the coating layer may be transferred to a polyolefin film or the like to form a coating layer.

The thickness of the adhesion layer 120 is 3-40 micrometers, More preferably, it is 5-30 micrometers in thickness. If the thickness is less than 3 μm, the cohesive strength of the coating film is weak after UV curing, which does not bring about a desirable effect of reducing the adhesive force between the interface with the adhesive layer 130 on the upper side. Because there is.

The resulting pressure-sensitive adhesive layer 120 may be aged at a constant temperature for a certain time. Generally, since the pressure-sensitive adhesive proceeds to harden the coating layer even after thermal curing, the pressure-sensitive adhesive layer 120 may be aged within a range of minimizing stability and change over time. It is preferable to make it.

The adhesive layer 120 used in the dicing die-bonding film 160 according to the present invention is formed using the photocurable pressure-sensitive adhesive composition described above. Maintaining strong adhesive force, and also has a strong adhesive strength with the ring frame, after the ultraviolet irradiation, the adhesive layer 120 increases the coating cohesion force by the crosslinking reaction and shrinks, thereby significantly reducing the adhesive force at the interface with the adhesive layer 130 If the chip 155 having the adhesive layer 130 attached thereto is easily picked up and die-bonded to the support member 200, any one may be used.

In particular, any composition may be used as long as it is a composition which is cured by ultraviolet irradiation, and the adhesive force is significantly reduced between the interface with the adhesive layer 130 before and after the energy is added by heat curing or other external energy rather than ultraviolet irradiation.

Since the base film 100 used in the present invention is a non-polar material such as a polyolefin film, in order for the adhesive layer 120 to have adhesion to the film, the adhesive film 120 may be modified to improve the affinity for the adhesive layer 120, although the adhesion may be increased. Adhesion may be enhanced by introducing a polar group into the layer 120 component itself and crosslinking with the curing agent.

As described above, since the acrylic adhesive binder containing a vinyl group and the curing agent are mixed to form a coating film in the adhesive binder during the aging process when applied on the base film 100, the adhesive layer 130 even before UV irradiation. There is no transition to, resulting in a sufficient adhesive force reduction effect after ultraviolet irradiation.

By adding a thermosetting agent, the acrylic pressure-sensitive adhesive binder and the ultraviolet curing acrylate containing a vinyl group form a hard coating film on the surface of the base film 100, and coating film desorption does not occur by dicing or ultraviolet irradiation. As mentioned above, since the polyolefin film, which is the base film 100 used in the present invention, contains no polar group in the molecule, it is difficult to attach an external material having no polarity to the surface. Therefore, in order to increase the polarity of the film surface to increase the surface tension by corona treatment or primer treatment, etc. This is limited, so it is common to control the polarity of the basic resin to form a coating film.

Next, the adhesive layer 130 is made of a thermosetting composition in the form of a film and should have excellent adhesion to the mirror surface of the wafer, and the outermost release film 140 protects the adhesive layer 130 from foreign matter and rolls. It is used to facilitate winding up.

The dicing die bonding film 160 according to the present invention has a structure in which the adhesive layer 130 is coated on the base film 100 as described above, and the adhesive layer 130 is laminated on the upper side. The adhesive layer 130 is attached to the surface of the support member 200 in a state where the semiconductor chip is attached to the small size and then individualized to a small size and easily peeled off from the lower adhesive layer 130 when attached to the chip back surface. do.

The adhesive layer 130 is attached to the mirror surface (glass surface) of the wafer on which the circuit is designed at a temperature near 60 ° C. and then diced into a support member 200 such as a lead frame or a PCB substrate at a temperature of about 100 ° C. Bonding In addition, since the adhesive layer 130 is attached to the chip and enters the packaging and remains inside the packaging even after epoxy molding, reliability such as ionic or foreign matter and process stability over time is important.

The adhesive layer 130 of the dicing die bonding film 160 according to the present invention comprises a high molecular weight acrylic copolymer having a film forming ability and a thermosetting resin such as an epoxy resin. Examples of the acrylic copolymer include acrylic rubber which is a copolymer such as acrylic acid ester, methacrylic acid ester, and acrylonitrile. The epoxy resin is not particularly limited as long as the epoxy resin is cured to exhibit adhesive strength. However, in order to perform the curing reaction, the functional group must have two or more functional groups. Therefore, bisphenol A type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, etc. are used. It is desirable to.

In addition, a curing accelerator for curing the epoxy resin may be used for the adhesive layer 130, and as the curing accelerator, an imidazole series, an amine series, or the like may be used. In addition, in the adhesive layer 130, various silane coupling agents may be used in one kind or a mixture of two or more kinds to increase adhesion to the wafer, and inorganic particles such as silica may be added to improve the dimensional stability and heat resistance of the adhesive layer. can do.

The coating thickness of the adhesive layer 130 is preferably 5 to 100㎛, more preferably 10 to 80㎛. This is less than 5㎛ does not show the proper adhesion on the back of the wafer, if it exceeds 100㎛ contrary to the recent trend of thin and short semiconductor packaging, the larger the thickness, the adhesive layer when bonding between the chip and the chip, the chip and the substrate This is because the fillet phenomenon, such as when using a liquid adhesive, occurs due to the fluidity of the, causing problems in reliability during packaging.

In addition, as the component of the adhesive layer, it is possible to mix an organic filler, an inorganic filler, a tackifier, a surfactant, an antistatic agent and the like as necessary, and the coating method of the adhesive layer may also form a uniform coating film thickness as in the adhesive layer. There is no special limitation as long as it can.

The dicing die-bonding film according to the present invention is made of one film by laminating the adhesive layer 120 and the adhesive layer 130 prepared as described above, but both pre-cut and roll forms are possible. In case of manufacturing in roll form, it is necessary to separately process the film part other than wafer during the semiconductor process, and in case of manufacturing in pre-cut form, it is suitable for wafer size. No removal process is necessary. However, since the dicing die-bonding film according to the present invention is formed by cutting the adhesive layer 120 and the adhesive layer 130 to a certain size, the dicing die-bonding film according to the present invention is very important for controlling roll pressure, temperature dimension, and precision during lamination. Becomes

The invention can be better understood by the following examples, which are intended to illustrate the invention and are not intended to limit the scope of protection defined by the appended claims.

[Production of Adhesive Layer]

Acrylic resin KLS-1046DR (hydroxyl value 13 mgKOH / g, acid value 63 mgKOH / g, Tg 38 ° C, average molecular weight 690,000, manufacturer: Fujikura Corporation) 400 g, WS-023 (hydroxyl value or acid value 20 mgKOH / g, Tg -5 ° C) , Average molecular weight 500,000, hydroxyl or carboxyl group content 20, manufacturer: Nagase Chemtech) 60 g, cresol novolac-based epoxy resin YDCN-500-4P (manufactured by Kukdo Chemical, molecular weight 10,000 or less) 60 g, cresol novolac-based curing agent MEH-7800SS (Manufacturer: Meiwa Plastic Industries) 40g, imidazole series curing catalyst 2P4MZ (manufacturer: Shukuk Chemical) 0.1g, mercuryto silane coupling agent KBM-803 (manufacturer: Shin-Etsu Co., Ltd.) 0.5g, epoxy silane coupling agent KBM- 0.5 g of 303 (manufactured by Shin-Etsu Co., Ltd.) and 20 g of amorphous silica filler (OX-50, manufactured by Daegu Co., Ltd.) were mixed, followed by primary dispersion at 500 rpm for about 2 hours.

Milling was performed after the first dispersion. Milling mainly used bead milling method using inorganic particles. After the milling was completed, the coating was applied to one side of the polyethylene terephthalate release film having a thickness of 38 μm and then to a thickness of 20 μm.

In order to protect the coated surface, an adhesive layer was prepared by laminating a polyethylene terephthalate film on the upper surface of the coating layer.

[Preparation of acrylic adhesive binder containing vinyl group]

The reagent was added to a 2 L four-necked flask under the mixing conditions of the following Preparation Example, and the reaction process was as follows. 300 g of ethyl acetate, 240 g of toluene, which was an organic solvent, were added first, a reflux cooling tube was installed on one side, and a thermometer was installed on the other side, and a dropping panel was installed on the other side.

After raising the flask solution temperature to 80 to 90 ℃, 2-ethylhexyl acrylate (JUNSEI, 7A2150), hydroxyethyl methacrylate (SAMCHUN, 03120), hydroxy as in Preparation Example 1 of [Table 1] Ethyl acrylate (JUNSEI, 10132-0480), glycidyl methacrylate (SAMCHUN, E10780), iso-oxyl acrylate monomer (SARTOMER, 437425, etc.), lauryl methacrylate monomer (Aldrich, 291811) 0.12 g of benzoyl peroxide and a mixed solution were prepared, and the mixed solution was added dropwise at 80 to 100 ° C. using a dropping panel for 3 hours. At this time, the stirring speed of the dropwise addition was 250rpm, after the completion of dropping to mature the reaction at the same temperature for 4 hours, and then 30g of ethyl acetate, 1.2g of azobisisobutylonitrile was added and maintained for 4 hours The viscosity and solids were measured and the reaction was stopped to prepare an acrylic adhesive polyol binder resin, which is an acrylic copolymer. The viscosity after polymerization was 300 to 500 cps, and the content of solids was corrected to 40%.

7 parts by weight of 2-Isocyanatoethyl Methacrylate (trade name: Karenz MOI, Japan) to 100 parts by weight of the acrylic adhesive polyol binder resin synthesized above in a 2 L four-necked flask and dibutyl tin dilaurate , DBTDL, Aldrich Co., Ltd., 291234) 20ppm was added and reacted for 8 hours at a temperature of 60 ° C. The ethyl acetate was used as the end point of the reaction, where the isocyanate group of the 2-Isocyanatoethyl Methacrylate monomer disappeared on the FT-IR by reacting with the hydroxyl group of the binder. Was added and cooled, and the acrylic adhesive binder of 40% of solid content was synthesize | combined.

TABLE 1

[Production of Photocurable Adhesive Composition and Dicing Die Bonding Film]

TABLE 2 Adhesive composition

Example 1 Preparation of Photocurable Composition for Adhesive Film Formation

Into a 1 L beaker, 250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content synthesized in Preparation Example 1 and 10 g of a solid content of 100% 702A (Synnakamura, 2-Hydroxy-3-phenoxypropyl acrylate) containing hydroxyl groups were mixed. Thereafter, 0.3 g of photoinitiator solid content (Irgacure 184, Ciba-chemical) and 2.5 g of isocyanate curing agent 75% solid content (AK-75, Aekyung Chemical) were added to prepare a photocurable composition.

After mixing the photocurable composition for pressure-sensitive adhesive layer prepared in the above practice and coating it on one side of the 150㎛ polyolefin film, after drying the adhesive film (4-a) having a thickness of 10㎛ prepared by laminating with an adhesive film and dicing die-bonding film Prepared.

<Example 2: Preparation of photocurable composition for adhesive film formation>

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content synthesized in Preparation Example 1 and 15% of a solid content of hydroxyl group 100% 701 (Shin-Nakamura, Glycerin dimethacrylate) were added to a 1L beaker, followed by mixing. Photocurable composition was prepared by adding 0.3 g (Irgacure 184, Ciba-chemical), 2.5 g of isocyanate curing agent solids 75% (AK-75, Aekyung Chemical).

After mixing the photocurable composition for pressure-sensitive adhesive layer prepared in the above practice and coating on one side of the 150㎛ polyolefin film, after drying the adhesive film (4-b) having a thickness of 10 ㎛ and laminated with an adhesive film to dicing die-bonding film Prepared.

<Example 3: Preparation of photocurable composition for adhesive film formation>

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content synthesized in Preparation Example 1 and 20% of a solid content of 100% 4-Hydroxybutyl Methacrylate (Aldrich.Co.) In a 1L beaker were mixed, and then the photoinitiator solids were mixed. A photocurable composition was prepared by adding 100 g 0.3 g (Irgacure 184, Ciba-chemical) and 2.5 g 2.5 g of an isocyanate curing agent (AK-75, Aekyung Chemical).

After mixing the photocurable composition for pressure-sensitive adhesive layer prepared in the above practice and coating on one side of the 150㎛ polyolefin film, after drying the adhesive film (4-c) having a thickness of 10㎛ and laminated with an adhesive film after dicing as shown in FIG. A diebonding film was prepared.

Comparative Example 1

250g of acrylic adhesive binder containing 40% of the solid group synthesized in the production example in a 1L beaker and 100% of the photoinitiator solids 0.3g (Irgacure 184, Ciba-chemical), 75% of the isocyanate curing agent 2.5g (AK-75, Aekyung Chemical) ) Was added to prepare a photocurable composition.

After mixing the photocurable composition for pressure-sensitive adhesive layer prepared in the above practice and coating on one side of the 150㎛ polyolefin film, after drying the adhesive film (4-d) having a thickness of 10 ㎛ and laminated with an adhesive film to produce a dicing die-bonding film Prepared.

Comparative Example 2

Into a 1 L beaker, 250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content synthesized in the manufacturing example and 60 g of a solid content of 100% 702A (2-Hydroxy-3-phenoxypropyl acrylate) having a hydroxyl group were mixed and mixed. Thereafter, 0.3 g of photoinitiator solid content (Irgacure 184, Ciba-chemical) and 2.5 g of isocyanate curing agent 75% solid content (AK-75, Aekyung Chemical) were added to prepare a photocurable composition.

After mixing the photocurable composition for pressure-sensitive adhesive layer prepared in the above practice and coating on one side of the 150㎛ polyolefin film, after drying the adhesive film (4-e) having a thickness of 10㎛ prepared by laminating with the adhesive film and dicing die-bonding film Prepared.

Comparative Example 3

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content synthesized in the preparation example and 15% of a solid content of 100% Miramer M200 without a hydroxyl group were added to a 1L beaker, followed by mixing. Photoinitiator solid content 100% 0.3g (Irgacure 184, Ciba-chemical), isocyanate curing agent solids 75% 2.5g (AK-75, Aekyung Chemical) was added to prepare a photocurable composition.

After mixing the photocurable composition for the pressure-sensitive adhesive layer prepared in the above practice and coating on one side of the 150㎛ polyolefin film, after drying the adhesive film (4-f) having a thickness of 10㎛ prepared by laminating with the adhesive film and dicing die-bonding film Prepared.

<Comparative Example 4>

250 g of an acrylic adhesive binder containing a vinyl group of 40% of the solid content synthesized in the preparation example and 15% of a solid content without hydroxyl group EM-160A (Dipentaerythritol hexaacrylate) were added to a 1L beaker, followed by mixing. Photocurable composition was prepared by adding 0.3 g (Irgacure 184, Ciba-chemical), 2.5 g of isocyanate curing agent solids 75% (AK-75, Aekyung Chemical).

After mixing the photocurable composition for the pressure-sensitive adhesive layer prepared in the above practice and coating on one side of the 150㎛ polyolefin film, after drying the adhesive film (4-g) having a thickness of 10 ㎛ and laminated with an adhesive film to produce a dicing die-bonding film Prepared.

[Property evaluation method]

Test Example 1 Adhesive Layer-Adhesion Layer Interfacial Peeling Force

Adhesion measurement was tested in accordance with Clause 8 of Korean Industrial Standard KS-A-01107 (Test Method of Adhesive Tape and Adhesive Sheet). A sample having a width of 25 mm and a length of 250 mm was attached to the die bonding adhesive layer, and then an adhesive tape was attached to the die bonding adhesive layer, and then reciprocated once at a speed of 300 mm / min using a 2 kg load roller for compression. After 30 minutes after crimping, turn the folded part of the test piece to 180 ° and peel off about 25mm. Then, in 10N Load Cell, fix the test piece to the upper clip of tensile strength device and fix the die-bonding adhesive layer to the lower test clip of 300mm / min. The load when peeled off at the tensile speed was measured.

 Tensile tester used "Instron Series 1X / s Automated materials Tester-3343", UV irradiation was carried out for 3 seconds in a high-pressure mercury lamp of 70mW / ㎠ illuminance at 200mJ / ㎠, each sample before and after UV irradiation The average value was measured by measuring each 10 pieces.

Test Example 2: Measurement of the tackiness of the adhesive layer

Only the adhesive layer of the dicing die-bonding film prepared by the above Examples and Comparative Examples was measured using the "probe tack tester (Chemilab Tack Tester)" before / after UV curing. This method uses ASTM D2979-71 to determine the maximum force required when a clean probe tip is brought into contact with the adhesive surface for 1.0 + 0.01 sec at a rate of 10 + 0.1 mm / sec and a contact load of 9.79 + 1.01 kPa and then released. The average value of one result is shown.

At this time, the ultraviolet irradiation was irradiated with an exposure dose of 200mJ / ㎠ for 3 seconds in a high-pressure mercury lamp having an illuminance of 70mW / ㎠, each sample was measured before and after the ultraviolet irradiation each measured 5 average values.

Test Example 3: Measurement of the base film adhesion of the adhesive layer

In the dicing die-bonding film prepared in Examples and Comparative Examples above, the adhesive layer was cross cut tested, and 11 lines were drawn at intervals of 1 mm horizontally and vertically with a sharp knife to coat the coating board in total. After making the adhesive board, the adhesive tape was attached and pulled out instantaneously to measure the adhesive force.

Here, 100/100 indicates a test result that all the 100 check boards are attached well.

Test Example 4: Measurement of success rate of dicing die-bonding film pick-up

After the silicon wafer having a thickness of 50 μm was thermally compressed at 60 ° C. for 10 seconds to the dicing die bonding film 160 prepared according to Examples 1 to 3 and Comparative Example 1, DFD-650 (DISCO) was used. Dicing was carried out to the size of 16mm x 9mm.

Thereafter, the film was irradiated with a high-pressure mercury lamp having an illuminance of 70 mW / cm 2 for 3 seconds to irradiate with an exposure dose of 200 mJ / cm 2. After the irradiation was completed, the pick-up test was carried out using a die bonder (SDB-10M, Mechatronics) for 200 chips in the center of the silicon wafer, and the success rate (%) was measured. .

[Table 3] Results of Dicing Die Bonding Film Properties

As shown in [Table 2] and [Table 3], UV-curable acrylic containing a hydroxyl group and a vinyl group in the acrylic adhesive binder (A) containing a vinyl group as in Examples 1, 2 and 3 The dicing die-bonding film using the photocurable composition for pressure-sensitive adhesive layers using rate (B) achieved 100% pick-up success rate even with a 50 μm wafer 16 mm × 9 mm chip size.

On the other hand, Comparative Example 1 did not include a UV curable acrylate (B) containing a hydroxyl group and a vinyl group, Comparative Example 2 included a UV curable acrylate (B) including a hydroxyl group and a vinyl group, but The content was added 60 parts by weight relative to the binder, the film was not formed properly, the substrate adhesion did not come out. Comparative Example 3 and Comparative Example 4 is not a UV-curable acrylate (B) containing a hydroxyl group and a vinyl group, but a UV-curable acrylate without a hydroxyl group is used, so that the adhesive layer-adhesive layer after UV curing by transition Peel force also increased and did not achieve 100% pickup success rate.

Although the above has been described with reference to one embodiment of the present invention, various changes and modifications can be made at the level of those skilled in the art. Such changes and modifications may belong to the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be judged by the claims described below.

1A to 1E are cross-sectional schematic diagrams illustrating a dicing die-bonding film and a wafer chip pick-up process using the same according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: base film 120: adhesive layer

125: adhesive pattern 130: adhesive layer

135: adhesive pattern 140: release film

150 wafer 200 support member

Claims (10)

Compared to 100 parts by weight of the acrylic adhesive binder including a vinyl group, 3 to 50 parts by weight of a UV-curable acrylate including a hydroxyl group and a vinyl group, 0.5 to 5 parts by weight of a thermosetting agent and 0.1 to 3 parts by weight of a photopolymerization initiator Photocurable adhesive composition. The method of claim 1, Acrylic adhesive binder containing the vinyl group is a photocurable pressure-sensitive adhesive composition comprising an acrylic monomer, a hydroxy monomer and an epoxy monomer. The method of claim 1, The acrylic adhesive binder including the vinyl group is a photocurable adhesive composition comprising a hydroxyl value of 15 to 30, an acid value of 1 or less. The method of claim 1, The weight average molecular weight of the acrylic adhesive binder containing the said vinyl group is 150,000-400,000, and glass transition temperature is -80-40 degreeC, The photocurable adhesive composition characterized by the above-mentioned. The method of claim 1, UV-curable acrylate comprising the hydroxyl group and the vinyl group is a photocurable pressure-sensitive adhesive composition comprising 5 to 20 parts by weight based on 100 parts by weight of the acrylic adhesive binder containing the vinyl group. The method of claim 1, UV-curable acrylates containing the hydroxyl and vinyl groups are 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, 3-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, Hydroxypropyl Acrylate, Hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 4-hydroxybutyl acrylate, N- (hydroxymethyl) acrylate, N- (hydroxymethyl) methacrylate, 3-chloro-2-hydroxyl propyl methacrylate, 3-chloro-2-hydroxyl propyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate, Glycerin dimethacrylate, Glycerin diacrylate, 2-hydroxy 3-acryloxy propyl methacrylate, 2-hydroxy 3-methacryloxy propyl acrylate, Pentaerythritol triacrylate, Pentaerythritol trimethacrylate, N- (4-hydroxyphenyl) methacrylamide and N- (4-hydroxyphenyl) acrylamide Photocurable pressure-sensitive adhesive composition comprising one or more selected from the group consisting of. The method of claim 1, The thermosetting agent is 2,4-triylene diisocyanate, 2,6-triene diisocyanate, hydrogenated triylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, diphenyl methane-4, 4-diisocyanate, 1,3-bisisocyanatomethyl cyclohexane, tetra methyl xylene diisocyanate, 1,5-naphthalene diisocyanate, 2,2,4-trimethyl hexamethylene diisocyanate, 2,4,4-trimethyl hexa Methylene diisocyanate, triylene diisocyanate adduct of trimetholpropane, xylene diisocyanate adduct of trimetholpropane, toriphenylmethane toisocyanato and methylene bistriisocyanate Photocurable adhesive composition, characterized in that. The method of claim 1, The photopolymerization initiator may be a benzophenone including benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, and 4,4'dichlorobenzophenone; Acetone phenones containing acetophenone and diethoxy acetophenone; And Photocurable pressure-sensitive adhesive composition comprising at least one member selected from the group consisting of anthraquinones containing 2-ethylanthraquinone and t-butylanthraquinone. Base film; And A dicing film formed on the base film and including an adhesion layer formed of the photocurable pressure-sensitive adhesive composition of claim 1. Base film; An adhesion layer formed on the base film and formed of the photocurable pressure-sensitive adhesive composition of claim 1; And Dicing die bonding film comprising an adhesive layer formed on the adhesive layer.

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