KR20100055184A - Heat-dissipating substrate and fabricating method of the same - Google Patents

Abstract

PURPOSE: The radiation substrate and manufacturing method thereof use the heat dissipation insulating layer and metal sheet without the use of the metal core. The protection against heat performance is improved. CONSTITUTION: The first circuit layer(114a) is formed in the single-side of the heat dissipation insulating layer(106). The first circuit layer comprises the first metal sheet and the first plating layer(112a). The second circuit layer(114b) is formed in the other side of the heat dissipation insulating layer. The second circuit layer comprises the second metal sheet(102b) and the second plating layer(112b).

Description

Heat dissipation substrate and its manufacturing method {HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD OF THE SAME}

The present invention relates to a heat dissipation substrate and a method of manufacturing the same, and more particularly, to provide a heat dissipation substrate and a method of manufacturing the same, which can improve heat dissipation performance without using a metal core.

With the miniaturization, high density, and thinning of electronic components, research on thinning and high functionalization of semiconductor package substrates is being actively conducted.

In particular, in order to implement a technology for stacking several semiconductor chips on a single substrate (MCP: Multi Chip Package) or for stacking several substrates on which a chip is mounted (PoP: Package on Package), There is a need to develop a substrate having thermal expansion behavior and excellent bending characteristics after mounting. In addition, the problem of heat generation also needs to be improved due to an increase in operating speed due to the higher performance of the chip.

In order to cope with such a demand, a technique of manufacturing a metal core substrate by inserting a metal into a core is used. This is because the metal has excellent thermal expansion and thermal conductivity properties, which can suppress the thermal expansion behavior of the substrate and at the same time play a role of heat dissipation.

1 to 5 are cross-sectional views illustrating a process for manufacturing the conventional metal core heat dissipation substrate. Referring to this, a conventional method for manufacturing a metal core heat radiation board will be described.

First, as shown in FIG. 1, a metal core 11 having high thermal conductivity is prepared.

Next, as shown in FIG. 2, the through hole 2 is processed in the metal core 11 by a drilling operation or an etching operation using a CNC drill, a CO 2 / YAG laser.

Next, as shown in FIG. 3, the insulating layer 13 is formed on both surfaces of the metal core 11 including the through holes 12.

Next, as shown in FIG. 4, via holes 14 are formed in the through-holes 12 of the metal core 11 through mechanical processing for interlayer connection. Here, the via hole 14 should be processed to a size smaller than the through hole 12 of the metal core 11 to insulate the copper plating layer formed on the inner wall thereof.

Finally, as shown in FIG. 5, a copper plating layer is formed on the surface of the insulating layer 13 and the inner wall of the via hole 5 by an electroless copper plating process and an electrolytic copper plating process, and the circuit layer 15 is subjected to exposure and development etching processes. ) To form a metal core heat dissipation substrate (10).

However, the conventional method of manufacturing the metal core heat dissipation substrate 10 has the following problems.

First, in order to prevent electrical failure due to the shorting of the plating layer formed on the inner walls of the metal core 11 and the via hole 14, the through hole 12 must be processed to a sufficient size, and in this case, the substrate area of the metal core. There was a problem that the thermal conductivity is halved because the residual ratio is only about 50%. Furthermore, in order to drill the via hole 14 to a smaller size than the through hole 12, a problem of processing accuracy has arisen, which causes a problem in that manufacturing cost and manufacturing time increase.

In addition, the thickness of the entire substrate is increased by inserting the metal core 11 in order to increase the heat dissipation efficiency, and as a result, the wear rate of the drill bit is inevitably increased during drilling, compared to other substrates having the same layer structure, and the machining accuracy is also increased. There was a problem falling.

In addition, there is a problem of blocking the heat conduction effect of the metal core by using an insulating layer 13 such as prepreg having a very low thermal conductivity.

The present invention was created to solve the problems of the prior art as described above, and an object of the present invention is to provide a heat dissipation substrate and a method for manufacturing the same, which can increase heat dissipation efficiency without using a metal core.

Another object of the present invention is to provide a heat dissipation substrate and a method of manufacturing the same, which can reduce the thickness of the entire substrate and thereby increase the hole machining accuracy by not using a metal core.

Still another object of the present invention is to provide a heat dissipation substrate capable of increasing heat dissipation efficiency by not using an insulating layer that blocks the heat conduction effect, and a method of manufacturing the same.

It is still another object of the present invention to provide a heat dissipation substrate and a method of manufacturing the same, which can prevent problems such as warpage acting on the heat dissipation substrate due to a difference in thermal expansion coefficient of the semiconductor chip and the heat dissipation substrate mounted on the heat dissipation substrate. .

According to a preferred embodiment of the present invention, a heat dissipation substrate may include a heat dissipation insulation layer, a first circuit layer including a first metal sheet and a first plating layer formed on one surface of the heat dissipation insulation layer, and a second metal formed on the other surface of the heat dissipation insulation layer. A second circuit layer comprising a sheet and a second plating layer, and a bump for electrically connecting the first circuit layer and the second circuit layer.

Here, the first metal sheet and the second metal sheet is characterized in that formed in the invar (Invar) or Invar formed with a copper plating layer on the outer surface.

In addition, the heat dissipation insulating layer is characterized in that the heat dissipation inorganic filler such as alumina (Al 2 O 3), aluminum nitrite (AlN), boron nitride (BN) excellent in thermal conductivity is dispersed in the polymer resin.

In addition, the bump is characterized in that consisting of the first bump and the second bump disposed to face.

In addition, a soldering resist layer having an opening for exposing the pad portion is formed on both surfaces of the heat dissipation insulating layer on which the first circuit layer and the second circuit layer are formed.

In the method of manufacturing the heat dissipation substrate according to the first embodiment of the present invention, (A) printing a bump on one surface of the first metal sheet, (B) heat dissipation insulation on the first metal sheet to expose the upper portion of the bump Forming a layer to form a base substrate, (C) laminating a second metal sheet on the heat dissipation insulating layer, and (D) forming a plating layer on the first metal sheet and the second metal sheet, and Patterning the metal sheet and the plating layer to form a first circuit layer and a second circuit layer.

At this time, the first metal sheet and the second metal sheet is characterized in that formed in the invar (Invar) or Invar formed with a copper plating layer on the outer surface.

In addition, the heat dissipation insulating layer is characterized in that the heat dissipation inorganic filler such as alumina (Al 2 O 3), aluminum nitrite (AlN), boron nitride (BN) excellent in thermal conductivity is dispersed in the polymer resin.

In addition, a process of reducing the thickness of the first metal sheet and the second metal sheet is performed between the steps (C) and (D).

Further, after the step (D), (E) the step of forming a solder resist layer having an opening for exposing the pad portion on both sides of the heat radiation insulating layer formed with the first circuit layer and the second circuit layer is performed. It is done.

In a method of manufacturing a heat dissipation substrate according to a second preferred embodiment of the present invention, (A) printing a first bump on one surface of a first metal sheet, (B) an upper portion of the first bump on the first metal sheet Manufacturing a first base substrate by forming a first heat dissipation insulating layer to expose the substrate, (C) preparing a second base substrate having the same structure as the first base substrate, and preparing the first bump and the second base. Stacking the first base substrate and the second base substrate so that the second bumps of the substrate are connected to each other, and (D) a plating layer is formed on the first metal sheet and the second metal sheet of the second base substrate. And forming the first circuit layer and the second circuit layer by patterning the metal sheet and the plating layer.

At this time, the first metal sheet and the second metal sheet is characterized in that formed in the invar (Invar) or Invar formed with a copper plating layer on the outer surface.

In addition, the first heat dissipation insulating layer and the second heat dissipating insulating layer may be formed of a polymer resin in which heat dissipating inorganic fillers having excellent thermal conductivity such as alumina (Al 2 O 3), aluminum nitrite (AlN), and boron nitride (BN) are dispersed. It features.

In addition, a process of reducing the thickness of the first metal sheet and the second metal sheet is performed between the steps (C) and (D).

In addition, after the step (D), (E) a solder resist layer having openings exposing pad portions on both surfaces of the first heat dissipation insulating layer and the second heat dissipation insulating layer on which the first circuit layer and the second circuit layer are formed. This forming step is characterized in that it is performed.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may appropriately define the concept of a term in order to best describe its invention The present invention should be construed in accordance with the spirit and scope of the present invention.

The present invention has the effect of improving the heat dissipation performance by using a heat dissipation insulating layer and a metal sheet without using a metal core.

In addition, the present invention has the effect of reducing the thickness of the entire substrate by using a metal core, thereby increasing the hole processing accuracy and enabling a thinning.

In addition, the present invention has the effect of improving the heat dissipation performance without shielding the heat conduction effect by using a heat dissipation insulating layer excellent in thermal conductivity.

In addition, the present invention improves the heat dissipation performance by using a metal sheet having excellent thermal conductivity but having a low thermal expansion coefficient as the seed layer, and at the same time, the warpage acting on the heat dissipation substrate by the difference in the thermal expansion coefficient with the semiconductor chip mounted on the heat dissipation substrate. There is an effect that can prevent problems such as.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. In this specification, the terms "first", "second", and the like are not used to indicate any quantity, order, or importance, but are used to distinguish the components from each other. However, it should be noted that the same components are provided with the same number as much as possible even though they are shown in different drawings. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

 Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Metal Core Substrate-First Embodiment

6 is a cross-sectional view of a metal core substrate according to a first embodiment of the present invention. Hereinafter, the metal core substrate 100a according to the present embodiment will be described with reference to the following.

As shown in FIG. 6, the heat dissipation substrate 100a according to the present embodiment includes circuit layers 114a and 114b made of metal sheets 102a and 102b and plating layers 112a and 112b on both sides of the heat dissipation insulating layer 106. Is formed, and the circuit layers 114a and 114b have a structure in which they are connected through the bumps 104.

Here, the metal sheets 102a and 102b are formed of the first metal sheet 102a formed on one surface of the heat dissipation insulating layer 106 and the second metal sheet 102b formed on the other surface of the heat dissipating insulating layer 106. . At this time, the metal sheets 102a and 102b function as seed layers, have excellent thermal conductivity to increase heat dissipation efficiency, and are warped due to mismatch in thermal expansion coefficient with semiconductor chips connected to the circuit layers 114a and 114b. In order to prevent such problems, it is preferable that the thermal expansion coefficient is formed of a material having a small coefficient of thermal expansion. For example, the metal sheets 102a and 102b may be formed of an invar having a low thermal expansion coefficient as an iron and nickel alloy or an invar having a copper plating layer formed on an outer surface thereof.

In addition, since the metal sheets 102a and 102b constitute the circuit layers 114a and 114b, for example, the metal sheets 102a and 102b may have a thickness of 10 μm or less.

The heat dissipation insulating layer 106 is a heat dissipation weapon having excellent thermal conductivity such as alumina (Al 2 O 3), aluminum nitrite (AlN), boron nitride (BN), and the like in order to achieve a heat dissipation function in addition to the interlayer insulation function. It is desirable to have a structure in which the filler 108 is dispersed.

The circuit layers 114a and 114b include a first circuit layer 114a formed on one surface of the heat dissipation insulating layer 106 and a second circuit layer 114b formed on the other surface of the heat dissipation insulating layer 106. In this case, the first circuit layer 114a is formed of the patterned first metal sheet 102a and the first plating layer 112a, and the second circuit layer 114b is the patterned second metal sheet 102b and the second. It is formed of the plating layer 112b.

On the other hand, the heat dissipation substrate 100a according to the present embodiment protects the circuit layers 114a and 114b, and pad portions 116a and 116b attached to the connection terminals 122 such as solder balls among the circuit layers 114a and 114b. It is preferable that the solder resist layers 118a and 118b having the open portions 120 exposing the portions are formed.

At this time, it is preferable that the pad portions 116a and 116b have an OSP treatment and / or an electroless nickel immersion gold (ENIG) layer formed on the surface thereof. Here, the OSP treatment is to prevent contact between air and copper (Cu) surface by applying an organic substance to the surfaces of the pad portions 116a and 116b to prevent oxidation of copper, and the organic substance applied to the surface is flux (Flux). It is also called Pre-Flux because it is very similar to). In the OSP treatment, when the organic material is applied to the pad portions 116a and 116b and the air and the copper surface are not evenly applied, the copper foil may be oxidized, which may cause a problem. Therefore, it is preferable to use it as soon as possible after opening the vacuum package.

Metal Core Substrate-Second Embodiment

7 is a cross-sectional view of a metal core substrate according to a second preferred embodiment of the present invention. Hereinafter, the metal core substrate 100b according to the present embodiment will be described with reference to the following.

As illustrated in FIG. 7, the heat dissipation substrate 100b according to the present exemplary embodiment may include a first bump 104a and a second bump connected to the first circuit layer 114a formed on the first heat dissipation insulating layer 106a. The second bump 104b is connected to the second circuit layer 114b formed on the heat dissipation insulating layer 106b, and is disposed to face each other. Except for this, other configurations are the same as the heat radiation substrate 100a according to the first embodiment, and thus redundant descriptions thereof will be omitted.

That is, the heat dissipation substrate 100b according to the present embodiment adopts a structure for connecting two bumps 104a and 104b to achieve a desired heat dissipation characteristic and thickness. For example, in the case where the thickness of the heat dissipation insulating layer needs to be increased to improve the heat dissipation performance, when the thickness of the heat dissipation insulating layer 106 is increased as in the first embodiment, the bumps 104 for the interlayer connection are formed. Inevitably, the size increases, and thus, fine patterns are difficult to implement. However, the heat dissipation substrate 100b according to the present exemplary embodiment can improve heat dissipation performance without having to increase the size of the bumps 104a and 104b by adopting a structure connecting the two bumps 104a and 104b.

Manufacturing Method of Metal Core Substrate-First Embodiment

8 to 17 are cross-sectional views illustrating a method of manufacturing a metal core substrate according to a first embodiment of the present invention. Hereinafter, a method of manufacturing the metal core substrate 100a according to the present embodiment will be described with reference to the following.

First, as shown in FIG. 8, the first metal sheet 102a is prepared.

In this case, the first metal sheet 102a may be formed of, for example, an invar having excellent thermal conductivity and a small thermal expansion coefficient, or an invar having a copper plating layer formed on an outer surface thereof.

Here, it is preferable that the first metal sheet 102a has a predetermined thickness or more so as to have a strength sufficient to print the bump 104 on the upper portion thereof, and improves adhesion to the bump 104 and the heat dissipation insulating layer 106. For this purpose, the surface roughness is preferably formed by buff polishing, plasma or ion beam processing, or the like. In addition, the surface roughness can also be formed by a method using a chemical such as Oxide treatment (black or brown), or Cz treatment.

Next, as shown in FIG. 9, the bump 104 is printed on the first metal sheet 102a.

In this case, the bump 104 may be printed by a screen print method. Screen printing is a method of printing a bump through a conductive paste transfer process through a mask having an opening. That is, the position of the opening part of a mask is aligned, and an electrically conductive paste is apply | coated to the upper surface of a mask. Then, when the conductive paste is pushed using a squeegee or the like, the conductive paste is extruded through the opening and transferred onto the first metal sheet 102a, thereby printing the desired shape and height. Of course, printing bumps 104 in other known ways would also fall within the scope of the present invention.

On the other hand, the conductive paste for forming the bump 104 can be used as long as it is a conductive material, for example, one of Ag, Pd, Pt, Ni, Ag / Pd may be used.

Next, as shown in FIG. 10, the base substrate 110 is manufactured by forming a heat dissipation insulating layer 106 on the first metal sheet 102a on which the bumps 104 are printed.

Here, the heat radiation insulating layer 106 is preferably formed to have a thickness smaller than the height of the printed bump 104, for example, the bump 104 is about 10 ~ 50㎛ over the heat radiation insulating layer 106 It is preferable to form the heat radiation insulating layer 106 so that it can be exposed.

At this time, the heat dissipation insulating layer 106 is a heat dissipation inorganic filler (108) having excellent thermal conductivity, such as, for example, alumina (Al 2 O 3), aluminum nitrite (AlN), boron nitride (BN), in order to increase heat dissipation efficiency in the polymer resin. ) Is dispersed.

On the other hand, the heat radiation insulating layer 106 may be formed by a contact or a contactless method.

Here, the contact method is to piercing the heat dissipation insulating layer 106 to the bump 104 printed on the first metal sheet 102a, and the non-contact method is to coat the insulating resin powder by an inkjet printing method. In this case, the non-contact method is a change in the shape of the bump 104 or the bump 104 and the heat radiation insulating layer 106 that may occur due to the force applied as the bump 104 penetrates the heat radiation insulating layer 106 in the contact method. This is useful in that problems such as the occurrence of minute gaps between the lines are minimized.

Next, as shown in FIG. 11, the second metal sheet 102b is disposed on the heat dissipation insulating layer 106 where the bumps 104 are exposed. At this time, the second metal sheet 102b has the same configuration as the first metal sheet 102a.

Next, as shown in FIG. 12, the second metal sheet 102b is laminated on the heat dissipation insulating layer 106.

At this time, the second metal sheet 102b uses, for example, a press plate such as a stainless plate having a flat surface while heating the heat-dissipating insulation layer 106 and the bump 104 at a softening temperature or higher in a vacuum state. And pressurized to form a laminate on the heat dissipation insulating layer 106.

Next, as shown in FIG. 13, the thicknesses of the first metal sheet 102a and the second metal sheet 102b are reduced. This is because the metal sheets 102a and 102b constitute a circuit layer, so that the thickness of the metal sheets 102a and 102b enables the micro circuit pattern to be realized.

In this case, the thickness of the first metal sheet 102a and the second metal sheet 102b may be reduced by etching, and for example, the first metal sheet 102a and the second metal sheet 102b may be etched to have a thickness of about 10 μm or less.

Next, as shown in FIG. 14, after forming a plating layer on the first metal sheet 102a and the second metal sheet 102b, the metal sheets 102a and 102b and the plating layer are patterned to form the first metal sheet 102a. ) And a first circuit layer 114a including the first plating layer 112a and a second circuit layer 114b including the second metal sheet 102b and the second plating layer 112b.

Finally, as shown in FIG. 15, the opening 120 exposing the pad portions 116a and 116b on both surfaces of the heat dissipation insulating layer 106 on which the first circuit layer 114a and the second circuit layer 114b are formed. Solder resist layers 118a and 118b are formed.

At this time, it is preferable that the pad portions 116a and 116b form an OSP treatment and / or an electroless nickel immersion gold (ENIG) layer. In addition, connection terminals 122 such as solder balls may be attached to the pad parts 116a and 116b.

Meanwhile, although the heat radiation board of the two-layer structure is shown in FIG. 15, it is also possible to manufacture the heat radiation board of the multi-layer structure by using the same. For example, a method of manufacturing a four-layer heat dissipation substrate will be described below with reference to FIGS. 16 and 17.

First, as shown in FIG. 16, the circuit layers 114a and 114b are connected to both surfaces of the heat dissipation insulating layer 106, and both surfaces of the heat dissipation substrate shown in FIG. The first base substrate 110a and the second base substrate 110b shown in the drawings are disposed.

Next, as shown in FIG. 17, the heat dissipation substrate and the base substrates 110a and 110b are stacked, and the plating layer is formed on the first metal sheet 102a and the second metal sheet 102b formed on the base substrates 110a and 110b. After forming, the metal sheets 102a and 102b and the plating layer are patterned to form a circuit layer (see FIG. 14 process). Thereafter, solder resist layers 118a and 118b having openings exposing the pad portions 116a and 116b are formed on both surfaces of the heat radiation insulating layers 106a and 106b in which the circuit layers are formed (see FIG. 15 process). ).

It will be apparent to those skilled in the art that the manufacturing process may be applied to manufacture a heat dissipation substrate having a multilayer structure of four or more layers, which will also be included within the scope of the present invention.

Manufacturing Method of Metal Core Substrate-Second Embodiment

18 to 22 are cross-sectional views illustrating a method of manufacturing a metal core substrate according to a second exemplary embodiment of the present invention. Hereinafter, referring to this, a method of manufacturing the metal core substrate 100b according to the present embodiment will be described. Here, the same or corresponding components as in the previous embodiment are given the same reference numerals, and detailed descriptions of the same or corresponding components and processes will be omitted.

First, as shown in FIG. 18, the first base substrate 110a and the second bump on which the first heat dissipation insulating layer 106a is formed on the first metal sheet 102a on which the first bumps 104a are printed. A second base substrate 110b having a second heat dissipation insulating layer 106b formed on the second metal sheet 102b printed with 104b is prepared, and the first bump 104a and the second bump 104b face each other. Place it if possible.

Next, as illustrated in FIG. 19, the first base substrate 110a and the second base substrate 110b are stacked to connect the first bump 104a and the second bump 104b.

Next, as shown in FIG. 20, the thicknesses of the first metal sheet 102a and the second metal sheet 102b are reduced.

Next, as shown in FIG. 21, after forming a plating layer on the first metal sheet 102a and the second metal sheet 102b, the metal sheets 102a and 102b and the plating layer are patterned to form the first metal sheet 102a. ) And a first circuit layer 114a including the first plating layer 112a and a second circuit layer 114b including the second metal sheet 102b and the second plating layer 112b.

Finally, as shown in FIG. 22, an opening 120 exposing the pad portions 116a and 116b on both surfaces of the heat dissipation insulating layer 106 on which the first circuit layer 114a and the second circuit layer 114b are formed. Solder resist layers 118a and 118b are formed. By this manufacturing process, the heat radiation substrate 110b according to the present embodiment is manufactured.

Meanwhile, although the heat radiation board having a two-layer structure is shown in FIG. 25, it is also possible to manufacture a heat radiation board having a multilayer structure by applying the processes illustrated in FIGS. 16 and 17. Detailed description thereof will be omitted.

Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and the heat dissipation substrate and its manufacturing method according to the present invention are not limited thereto, and the technical features of the present invention It will be apparent that modifications and improvements are possible by those skilled in the art.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

1 to 5 are process cross-sectional views for explaining a method of manufacturing a conventional metal core substrate.

6 is a cross-sectional view of a metal core substrate according to a first embodiment of the present invention.

7 is a cross-sectional view of a metal core substrate according to a second preferred embodiment of the present invention.

8 to 17 are process cross-sectional views illustrating a method of manufacturing a metal core substrate according to a first embodiment of the present invention.

18 to 22 are cross-sectional views illustrating a method of manufacturing a metal core substrate according to a second exemplary embodiment of the present invention.

<Description of main parts of drawing>

102, 102a, 102b: metal sheet 104, 104a, 104b: bump

106, 106a, 106b: Heat dissipation insulation layer 108: Heat dissipation inorganic filler

110, 110a, 110b: base substrate 112a, 112b: plating layer

114a and 114b: circuit layers 116a and 116b: pad portion

118a and 118b solder layer 120 openings

122: connection terminal

Claims (15)

Heat dissipation insulation layer; A first circuit layer comprising a first metal sheet and a first plating layer formed on one surface of the heat dissipation insulating layer; A second circuit layer comprising a second metal sheet and a second plating layer formed on the other surface of the heat dissipation insulating layer; And Bumps electrically connecting the first circuit layer and the second circuit layer Heat dissipation substrate comprising a. The method according to claim 1, The first metal sheet and the second metal sheet is a heat dissipation substrate, characterized in that formed in the invar (Invar) or the Invar in which the copper plating layer is formed on the outer surface. The method according to claim 1, The heat dissipation insulating layer is a heat dissipation substrate, characterized in that the heat dissipation inorganic filler having excellent thermal conductivity such as alumina (Al 2 O 3), aluminum nitrite (AlN), boron nitride (BN) is dispersed in the polymer resin. The method according to claim 1, The bump is a heat dissipation substrate, characterized in that consisting of the first bump and the second bump disposed to face. The method according to claim 1, And a solder resist layer having an opening for exposing the pad portion on both surfaces of the heat dissipation insulating layer on which the first circuit layer and the second circuit layer are formed. (A) printing a bump on one surface of the first metal sheet; (B) manufacturing a base substrate by forming a heat radiation insulating layer on the first metal sheet to expose the upper portion of the bump; (C) stacking a second metal sheet on the heat dissipation insulating layer; And (D) forming a plating layer on the first metal sheet and the second metal sheet, and patterning the metal sheet and the plating layer to form a first circuit layer and a second circuit layer. Method of manufacturing a heat dissipation printed circuit board comprising a. The method according to claim 6, The first metal sheet and the second metal sheet is a method of manufacturing a heat sink substrate, characterized in that formed in the invar (Invar) or the copper plated layer formed on the outer surface. The method according to claim 6, The heat dissipation insulating layer is a method of manufacturing a heat dissipation substrate, characterized in that the heat dissipation inorganic filler having excellent thermal conductivity such as alumina (Al 2 O 3), aluminum nitrite (AlN), boron nitride (BN) is dispersed in the polymer resin. The method according to claim 6, Between the steps (C) and (D), The method of manufacturing a heat sink is characterized in that the step of reducing the thickness of the first metal sheet and the second metal sheet is performed. The method according to claim 6, After the step (D), (E) forming a solder resist layer having openings exposing pad portions on both sides of the heat dissipation insulating layer on which the first circuit layer and the second circuit layer are formed; Method for producing a heat radiation board, characterized in that carried out. (A) printing a first bump on one surface of the first metal sheet; (B) manufacturing a first base substrate by forming a first heat dissipation insulating layer on the first metal sheet to expose an upper portion of the first bump; (C) preparing a second base substrate having the same structure as that of the first base substrate, and connecting the first and second bumps in a state where the first bump and the second bump of the second base substrate face each other. Stacking a base substrate; And (D) forming a plating layer on the first metal sheet and the second metal sheet of the second base substrate, and patterning the metal sheet and the plating layer to form a first circuit layer and a second circuit layer. Method of manufacturing a heat dissipation printed circuit board comprising a. The method of claim 11, The first metal sheet and the second metal sheet is a method of manufacturing a heat sink substrate, characterized in that formed in the invar (Invar) or the copper plated layer formed on the outer surface. The method of claim 11, The first heat dissipation insulation layer and the second heat dissipation insulation layer are characterized in that the heat dissipation inorganic filler such as alumina (Al 2 O 3), aluminum nitrite (AlN) and boron nitride (BN) is dispersed in the polymer resin. Method of manufacturing a heat dissipation substrate. The method of claim 11, Between the steps (C) and (D), The method of manufacturing a heat sink is characterized in that the step of reducing the thickness of the first metal sheet and the second metal sheet is performed. The method of claim 11, After the step (D), (E) forming a solder resist layer having openings exposing pad portions on both surfaces of the first heat dissipation insulating layer and the second heat dissipation insulating layer on which the first circuit layer and the second circuit layer are formed; Method for producing a heat radiation board, characterized in that carried out.

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