KR20100051339A - Image sensor package - Google Patents

Image sensor package Download PDF

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Publication number
KR20100051339A
KR20100051339A KR1020080110457A KR20080110457A KR20100051339A KR 20100051339 A KR20100051339 A KR 20100051339A KR 1020080110457 A KR1020080110457 A KR 1020080110457A KR 20080110457 A KR20080110457 A KR 20080110457A KR 20100051339 A KR20100051339 A KR 20100051339A
Authority
KR
South Korea
Prior art keywords
image sensor
semiconductor chip
transparent substrate
sensor package
bonding pad
Prior art date
Application number
KR1020080110457A
Other languages
Korean (ko)
Inventor
조일환
Original Assignee
주식회사 하이닉스반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하이닉스반도체 filed Critical 주식회사 하이닉스반도체
Priority to KR1020080110457A priority Critical patent/KR20100051339A/en
Publication of KR20100051339A publication Critical patent/KR20100051339A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE: An image sensor package is provided to reduce the size of the entire image sensor package by directly arranging an external connection terminal on a semiconductor chip in order to connect a substrate and the semiconductor chip. CONSTITUTION: A photo diode is located on the upper side of an image sensor(104). A semiconductor chip(102) includes bonding pads(106) on the edge of the image sensor. A transparent substrate(108) is attached on the image sensor. An external connection terminal(112) is attached on the bonding pads. The image sensor includes a micro lens. A connection unit(110) is interposed between the image sensor and the transparent substrate.

Description

Image Sensor Package {IMAGE SENSOR PACKAGE}

The present invention relates to an image sensor package, and more particularly, to an image sensor package having a reduced overall size when forming a CMOS type image sensor package.

The image sensor can be largely classified into a charge coupled device image sensor (CCD) and a COMS image sensor (CMOS).

The CCD image sensor transfers the charge generated at the light receiving unit to the output terminal by the gate voltage and converts the electric signal at the final stage. On the other hand, the COMS image sensor converts an electric signal (voltage) into each pixel part and delivers it to the final stage.

In addition, the COMS image sensor can be driven at a voltage of 3.3V to 1.8V because it uses the conventional CMOS process, and can be driven at a lower voltage than the CCD, and it can integrate circuits other than the sensor function in the same sensor chip. The advantage is that high integration is possible.

The package structure of such an image sensor generally takes a form in which an image sensor chip is mounted inside a package formed of a substrate or an encapsulant. The encapsulant is one of the housing components of the image sensor package. In addition, a top plate or a window for allowing light to be incident is required. The top plate or the upper portion of the window may include a lens aligned with the light receiving portion, and a lens holder formed on a housing, in particular, an encapsulant to support the lens.

In particular, the top plate or window is formed on or attached to the encapsulant or substrate so as to be spaced a predetermined distance from the image sensor chip. As a result, a predetermined space is usually formed inside the package between the top plate or the window and the image sensor chip.

This space is used as a space for forming an accessory for connecting the image sensor chip and the housing of the image sensor package.However, a method of filling the internal cavity with a transparent epoxy resin to omit the space and the top plate or window is not proposed. However, it is difficult to improve the transparency of the epoxy, has a weak strength compared to the existing top plate or window, it is difficult to correct the surface unevenness after molding is not used a little.

Therefore, to date, most image sensor packages use top plates or windows made of transparent material such as glass, and the encapsulant is not supported by the encapsulant to maintain the gap between the top plate or window and the image sensor chip. It is manufactured as possible structure.

However, although not shown and described in detail, in the above-described prior art, a substrate having a top plate or a window disposed to be spaced apart on the image sensor chip and allowing external light to enter is an entire portion of the image sensor chip. Since it is arranged in such a way as to cover, unnecessary loss occurs in terms of the cost for forming the substrate having the top plate or window.

In addition, since the substrate including the top plate or the window covers the entire portion of the image sensor chip as described above, a connection member for forming an electrical connection between the substrate and the image sensor chip and a space for forming the same must be secured. Thus, the size and cost of the overall package is increased.

The present invention provides an image sensor package which prevents unnecessary cost loss in forming a COMS type image sensor package.

In addition, the present invention provides an image sensor package that prevents the increase in size and cost of the entire package by forming an external connection terminal when forming a CMOS image sensor package.

An image sensor package according to the present invention includes a semiconductor chip including an image sensor unit including a photodiode on an upper surface thereof and a bonding pad at an edge of the image sensor unit; A transparent substrate attached to the image sensor unit; And an external connection terminal attached to the bonding pad.

The image sensor unit further includes a micro lens.

The apparatus may further include an adhesive member interposed between the image sensor unit and the transparent substrate.

At least one or more of the adhesive members may be opened.

The transparent substrate is characterized in that made of a light transmitting material.

In addition, an image sensor package according to the present invention may include a semiconductor chip including an image sensor unit including a photodiode on an upper surface and a first bonding pad and a second bonding pad interconnected to the upper surface and a lower surface facing the upper surface; A transparent substrate attached to an upper portion of the semiconductor chip to cover the image sensor part; And an external connection terminal attached to the second bonding pad.

The semiconductor device may further include a through electrode disposed in the semiconductor chip and connecting the first bonding pad and the second bonding pad.

The image sensor unit further includes a micro lens.

Further comprising an adhesive member interposed between the semiconductor chip and the transparent substrate.

At least one or more of the adhesive members may be opened.

The transparent substrate is characterized in that made of a light transmitting material.

According to the present invention, when the CMOS image sensor package is formed, a transparent substrate is disposed on the semiconductor chip having the image sensor to cover only the image sensor, thereby forming an image sensor package, thereby forming an overall cost for forming the image sensor package. To avoid unnecessary costs.

In addition, according to the present invention, the external connection terminal is disposed directly on the semiconductor chip and electrically connected to the substrate, thereby reducing the size of the entire image sensor package.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

1 is a cross-sectional view illustrating an image sensor package according to an embodiment of the present invention. FIGS. 2 and 3 are plan views illustrating the image sensor package according to an embodiment of the present invention. As follows.

As illustrated in FIGS. 1 and 2, the image sensor package 100 according to an exemplary embodiment of the present invention includes a semiconductor chip 102, a transparent substrate 108, and an external connection terminal 112.

The semiconductor chip 102 includes a bonding pad 106 provided at an upper edge portion, and also includes an image sensor unit 104 provided at a central portion and having a photodiode (not shown). The image sensor unit 104 may further include, for example, a micro lens.

The transparent substrate 108 is disposed on the semiconductor chip 102. In this case, the transparent substrate 108 is disposed to cover only a portion where the image sensor unit 104 of the semiconductor chip 102 is disposed, for example, and is made of a light transmissive material so that external light is emitted from the image of the semiconductor chip 102. To reach the sensor unit 104.

In addition, the transparent substrate 108 is disposed through the adhesive member 110 disposed on the semiconductor chip 102. The adhesive member 110 is disposed between the image sensor unit 104 and the transparent substrate 108 of the semiconductor chip 102 to be spaced apart from each other, so that a predetermined space is formed between the image sensor unit 104 and the transparent substrate 108. It is arranged to have a constant height so that it can be.

On the other hand, such an adhesive member 110, at least one surface of the adhesive member 110, as shown in Figure 3 so that air can escape when the transparent substrate 108 is disposed on the semiconductor chip 102 It may be made of an open (A) shape.

The external connection terminal 112 is disposed on the bonding pad 106 provided at the upper edge of the semiconductor chip 102, and the external connection terminal 112 includes solder balls, for example.

4 is a cross-sectional view illustrating an image sensor package according to another embodiment of the present invention, and FIG. 5 is a plan view illustrating an image sensor package according to another embodiment of the present invention. Same as

As shown in FIGS. 4 and 5, the image sensor package 200 according to another exemplary embodiment includes a semiconductor chip 202, a transparent substrate 208, and an external connection terminal 212.

The semiconductor chip 202 includes a first bonding pad 206 and a second bonding pad 203 provided at an edge of a top surface and a bottom surface opposite to the top surface. In this case, the first bonding pad 206 and the second bonding pad 203 are electrically connected to each other by the through electrode 205 disposed inside the semiconductor chip 202.

In addition, the semiconductor chip 202 is provided in the center portion of the upper surface, and includes an image sensor unit 204 having a photodiode (not shown), which image sensor unit 204 further comprises a micro lens, for example. Include.

The transparent substrate 208 is disposed above the semiconductor chip 202. In this case, the transparent substrate 208 is disposed to cover only a portion where the image sensor unit 204 of the semiconductor chip 202 is disposed, for example, and is formed of a light transmissive material so that external light is emitted from the image of the semiconductor chip 202. To reach the sensor unit 204.

In addition, the transparent substrate 208 is disposed through the adhesive member 210 disposed on the semiconductor chip 202. The adhesive member 210 is disposed between the image sensor unit 204 and the transparent substrate 208 of the semiconductor chip 202 so that a predetermined space is formed between the image sensor unit 204 and the transparent substrate 208. It is arranged to have a constant height so that.

The external connection terminals 212 are disposed on the second bonding pads 203 provided on the bottom edge of the semiconductor chip 202, and the external connection terminals 212 include solder balls, for example.

As described above, the present invention is different from the conventional method in which a substrate having a window is disposed in such a manner as to cover an entire portion of the semiconductor chip. By being disposed to form an image sensor package, it is possible to prevent unnecessary cost loss in terms of the overall cost for forming the image sensor package.

In addition, since the external connection terminal is directly attached on the semiconductor chip and electrically connected to the substrate, the size of the entire image sensor package caused by the connecting member for electrically connecting the conventional substrate and the semiconductor chip and securing the space for forming the same. And the cost increase accordingly.

In the above-described embodiments of the present invention, the present invention has been described and described with reference to specific embodiments, but the present invention is not limited thereto, and the scope of the following claims is not limited to the scope of the present invention. It will be readily apparent to those skilled in the art that the present invention may be variously modified and modified.

1 is a cross-sectional view for explaining an image sensor package according to an embodiment of the present invention.

2 and 3 are plan views illustrating an image sensor package according to an exemplary embodiment of the present invention.

4 is a cross-sectional view illustrating an image sensor package according to another exemplary embodiment of the present invention.

5 is a plan view illustrating an image sensor package according to another exemplary embodiment of the present invention.

Claims (11)

A semiconductor chip including an image sensor unit including a photodiode on an upper surface thereof and a bonding pad at an edge of the image sensor unit; A transparent substrate attached to the image sensor unit; And An external connection terminal attached to the bonding pad; Image sensor package comprising a. The method of claim 1, The image sensor package further comprises a micro lens. The method of claim 1, And an adhesive member interposed between the image sensor unit and the transparent substrate. The method of claim 3, wherein And at least one open portion of the adhesive member. The method of claim 1, The transparent substrate is an image sensor package, characterized in that made of a light transmitting material. A semiconductor chip having an image sensor unit including a photodiode on an upper surface thereof, and a first bonding pad and a second bonding pad interconnected to the upper surface and a lower surface facing the upper surface; A transparent substrate attached to an upper portion of the semiconductor chip to cover the image sensor part; And An external connection terminal attached to the second bonding pad; Image sensor package comprising a. The method of claim 6, And a through electrode disposed in the semiconductor chip and connecting the first bonding pad and the second bonding pad. The method of claim 6, The image sensor package further comprises a micro lens. The method of claim 6, And an adhesive member interposed between the semiconductor chip and the transparent substrate. The method of claim 9, And at least one open portion of the adhesive member. The method of claim 6, The transparent substrate is an image sensor package, characterized in that made of a light transmitting material.
KR1020080110457A 2008-11-07 2008-11-07 Image sensor package KR20100051339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080110457A KR20100051339A (en) 2008-11-07 2008-11-07 Image sensor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080110457A KR20100051339A (en) 2008-11-07 2008-11-07 Image sensor package

Publications (1)

Publication Number Publication Date
KR20100051339A true KR20100051339A (en) 2010-05-17

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KR1020080110457A KR20100051339A (en) 2008-11-07 2008-11-07 Image sensor package

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023158040A1 (en) * 2022-02-16 2023-08-24 (주)에이지피 Image sensor package using cover glass having groove formed therein, and method for manufacturing image sensor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023158040A1 (en) * 2022-02-16 2023-08-24 (주)에이지피 Image sensor package using cover glass having groove formed therein, and method for manufacturing image sensor package

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