WO2023158040A1 - Image sensor package using cover glass having groove formed therein, and method for manufacturing image sensor package - Google Patents

Image sensor package using cover glass having groove formed therein, and method for manufacturing image sensor package Download PDF

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Publication number
WO2023158040A1
WO2023158040A1 PCT/KR2022/012229 KR2022012229W WO2023158040A1 WO 2023158040 A1 WO2023158040 A1 WO 2023158040A1 KR 2022012229 W KR2022012229 W KR 2022012229W WO 2023158040 A1 WO2023158040 A1 WO 2023158040A1
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Prior art keywords
image sensor
cover glass
sensor chip
groove
sensor package
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PCT/KR2022/012229
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French (fr)
Korean (ko)
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하민기
김환
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(주)에이지피
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Publication of WO2023158040A1 publication Critical patent/WO2023158040A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration

Definitions

  • the present invention relates to an image sensor package, and more particularly, to an image sensor package, which is adhesively fixed to an upper portion of an image sensor chip rather than to a substrate, and uses a cover glass having a groove forming a space of a certain volume on top of an element region implemented in the image sensor chip. It relates to an image sensor package and a manufacturing method thereof.
  • the image sensor chip is a semiconductor device that converts an image applied from the outside into an electrical signal.
  • a transparent cover glass is attached to the top of the image sensor chip to receive external images and at the same time protect the surface of the chip from external shocks and impurities. protect from
  • FIG. 1 shows a cross section of a conventional image sensor package.
  • a conventional image sensor package 100 includes a substrate 110, an image sensor chip 130 seated on top of the substrate 110, and an image sensor chip 130 on top of the substrate 110. It includes a glass support member 160 installed on the edge, and a cover glass 180 seated on top of the glass support member 160 .
  • the image sensor chip 130 is attached to the substrate 110 using the first adhesive 120, and the cover glass 180 is attached to the top of the glass support member 160 using the second adhesive 170. .
  • the pad 141 of the image sensor chip 130 and the wire 150 of the substrate 110 are connected using a wire 140. While electrical connection is possible, an image can be sufficiently applied to the surface of the image sensor chip 130 through the cover glass 180 from the outside.
  • a space between the top of the image sensor chip 130 and the cover glass 180 is created by the glass support member 160 .
  • the glass support member 160 having a size surrounding the edge of the image sensor chip 130 must be manufactured in advance, and the glass support member 160 ) to the top of the substrate 110 should be performed.
  • the packaging yield decreases as the number of steps in the process of packaging the image sensor chip 130 increases. Accordingly, reducing the number of steps in the existing package process or reducing the number of structures used is desirable from an economic point of view as well as a yield.
  • a technical problem to be solved by the present invention is to form a groove on a surface of a cover glass facing an upper portion of an image sensor chip and directly adhere the cover glass to the upper portion of an image sensor chip, thereby providing a groove without using a glass support member. It is to provide an image sensor package using the formed cover glass.
  • Another technical problem to be solved by the present invention is to form a groove on the surface of the cover glass facing the top of the image sensor chip, and directly adhere the cover glass to the top of the image sensor chip, thereby eliminating the use of a glass support member.
  • An object of the present invention is to provide a method of manufacturing an image sensor package using a grooved cover glass.
  • An image sensor package using a grooved cover glass according to the present invention for achieving the above technical problem is a substrate, an image sensor chip adhesively fixed to an upper portion of the substrate and having a microlens seated thereon, and a constant formed along the edge surface.
  • a method of manufacturing an image sensor package using a cover glass having a groove has a depth at which the inner surface does not contact the microlens installed on the top of the image sensor chip, and the image sensor preparing a cover glass having a groove including a device region in which a light receiving unit and a signal processing unit of the chip are implemented; adhesively fixing an image sensor chip on which a microlens is seated on an upper portion of a substrate using a first adhesive; Adhering and fixing the cover glass to the cover glass fixing area of the image sensor chip using a second adhesive, connecting the pad of the image sensor chip and the wire of the substrate with wires, and an edge of the cover glass, and applying a side fill covering the wire and the conductive wire of the substrate.
  • the image sensor package according to the present invention is configured in such a way that the cover glass is adhered to and fixed to the image sensor chip rather than to the substrate, the support member used to support the cover glass to the substrate in the conventional image sensor package is unnecessary, thereby reducing cost. reduction and process simplification,
  • the wire is located in the internal space formed by the cover glass and the substrate and is wide, it is necessary to follow the procedure of attaching and fixing the cover glass after connecting the pad of the image sensor chip with the wire of the substrate. If internal moisture or residual foreign matter generated during the wire connection process moves to the upper space between the cover glass and the image sensor chip, there is a concern that the performance of the image sensor may be affected.
  • the image sensor package according to the present invention Since the conductors and interconnecting wires of the pad and substrate are all located outside the space formed between the cover glass and the top of the image sensor chip, the above concerns are resolved when the wire is connected after bonding and fixing the cover glass, and
  • the process of connecting the pad of the image sensor chip and the wire of the substrate with a wire can be subsequently processed.
  • the effect of reducing cost and increasing efficiency can be expected.
  • FIG. 1 shows a cross section of a conventional image sensor package.
  • FIG. 2 shows the structure of an image sensor package using a cover glass having a groove according to the present invention.
  • FIG. 3 is an example of an image sensor chip used in an image sensor package using a cover glass having a groove according to the present invention.
  • FIG. 4 is an exemplary embodiment of a cover glass having a groove used in an image sensor package using the cover glass having a groove according to the present invention.
  • FIG. 5 is a signal showing a method of manufacturing an image sensor package using a cover glass having grooves by attaching and fixing a cover glass to an image sensor chip after attaching and fixing an image sensor chip to a substrate according to an embodiment of the present invention
  • FIG. 6 illustrates an embodiment of a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to the image sensor chip after attaching and fixing the image sensor chip to a substrate according to the present invention.
  • FIG. 7 illustrates a method of manufacturing an image sensor package using a cover glass having grooves formed by attaching and fixing the image sensor chip to a substrate after attaching and fixing the cover glass to the image sensor package according to an embodiment of the present invention. It is a signal flow diagram.
  • FIG. 8 illustrates a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to an image sensor chip and then attaching and fixing the image sensor chip to a substrate according to an embodiment of the present invention.
  • ...unit ...unit
  • ...module a unit that processes at least one function or operation, which is hardware, software, or hardware and It can be implemented as a combination of software.
  • the image sensor chip includes a light receiving unit implemented with a photodiode array generating electric charge corresponding to an image applied from the outside through a micro lens and a plurality of image sensor circuits converting electric charge generated from each photodiode into a voltage value.
  • the description will be applied to a semiconductor device in which is integrated.
  • FIG. 2 shows the structure of an image sensor package using a cover glass having a groove according to the present invention.
  • an image sensor package 200 using a cover glass with grooves includes a substrate 210, an image sensor chip 230, and a cover glass 280 with grooves (hereinafter referred to as cover glass). Including is the same as the conventional image sensor package 100 shown in FIG.
  • the image sensor chip 230 is attached to the substrate 210 using a first adhesive 220, and the cover glass 280 is attached to the top of the image sensor chip 230 using a second adhesive 270. .
  • the pads 141 and 241 installed at the edges of the image sensor chips 130 and 230 actually protrude from the surface of the image sensor chips 130 and 230 to a degree that can be visually confirmed as shown in FIGS. 1 and 2 . Although it is not, it is shown as protruding for better understanding.
  • the image sensor package 200 does not use the glass support member 160 used in the conventional image sensor package 100 and forms a groove (not shown) inside the cover glass 280 There is a difference in that the cover glass 280 is attached and fixed to the image sensor chip 230 instead of the substrate 210.
  • the wire 140 connecting the pad 141 of the image sensor chip 130 and the conductive wire 150 of the substrate 110 is connected to the cover glass 180 and the substrate 110. While located in the inner space formed by the image sensor package 200 according to the present invention, not in the space formed with the top of the cover glass 280 and the image sensor chip 230, but outside the cover glass 280 The difference lies in the location of the wire 240.
  • the image sensor package 200 has a side fill for protecting the side of the cover glass 280, the wire 240, and the side of the image sensor chip 230. (260) is applied.
  • This difference is due to structures of the image sensor chip 230 and the cover glass 280 to be described later.
  • FIG. 3 is an example of an image sensor chip used in an image sensor package using a cover glass having a groove according to the present invention.
  • the image sensor chip 230 includes a device area 310 , a pad 241 and a cover glass fixing area 330 .
  • the device region 310 includes a light receiving unit (not shown) and a signal processing unit (not shown).
  • the light receiving unit is implemented with a plurality of photodiode arrays (not shown) that generate electric charge corresponding to an externally applied image.
  • the signal processing unit is a part implemented with a charge conversion circuit that converts charge generated from each photodiode constituting the photodiode array (not shown) into a voltage value.
  • a photodiode and a charge conversion circuit that converts charge generated from the photodiode into a voltage corresponding thereto may be collectively called a unit image sensor circuit.
  • an image sensor chip means a semiconductor device in which a plurality of image sensor circuits are integrated.
  • a microlens 231 is installed above the element region 310 so that the image sensor chip 230 can detect the color of an image of a received signal.
  • the pad 241 serves as a window for transmitting the converted voltage generated in the device region 310 to the outside or receiving a voltage source or signal applied from the outside.
  • the pad 241 Assume that it is formed at the edge of the image sensor chip 230 in a form surrounding the element region 310 .
  • the cover glass fixing area 330 is implemented in the form of a band having a constant thickness between the device area 310 and the area where the pad 241 is installed, and the adhesive surface 420 of the cover glass 280 to be described later is an adhesive ( (not shown) becomes an area that is adhesively fixed.
  • FIG. 4 is an exemplary embodiment of a cover glass having a groove used in an image sensor package using the cover glass having a groove according to the present invention.
  • FIG. 4A is a perspective view of the cover glass 280 in which grooves are formed
  • FIG. 4B is a plan view
  • FIG. 4C is a side view.
  • the grooved cover glass 280 includes a groove 410 formed inside the center of a panel-shaped cover glass body and a band-shaped adhesive surface 420 having a constant thickness at the edge of the groove. do.
  • the depth of the groove 410 should be longer than that of the micro lens 231 by about 1 to 2 ⁇ m, and the deeper the depth of the groove 410, the more effectively the incoming image can be received. possible.
  • the groove 410 of the cover glass 280 may be formed inside the center of the planar cover glass 280 by using an etchant.
  • the groove 410 forms a space between the micro lens 231 of the image sensor chip 230 and the cover glass 280 when the cover glass 280 is used for packaging the image sensor chip 230 .
  • the groove 410 has a two-dimensional area including at least the device region 310 and a depth at least to the extent that the top of the micro lens 231 and the inner surface of the groove 410 do not come into contact.
  • FIG. 5 is a signal showing a method of manufacturing an image sensor package using a cover glass having grooves by attaching and fixing a cover glass to an image sensor chip after attaching and fixing an image sensor chip to a substrate according to an embodiment of the present invention
  • the method 500 of manufacturing an image sensor package using a cover glass having a groove according to the present invention has a depth at which the inner surface does not contact the microlens installed on the top of the image sensor chip 230, Step 510 of preparing a cover glass 280 having a groove including a device area 310 in which the light receiving unit and the signal processing unit of the image sensor chip 230 are implemented (510), on the top using a first adhesive 220 Step 520 of adhesively fixing the image sensor chip on which the microlenses are seated on the substrate, using the second adhesive 270 to cover the cover glass 280 to the cover glass fixing area 330 of the image sensor chip 230 Step 530 of adhesively fixing, step 540 of connecting the pad 241 of the image sensor chip 230 and the lead wire 250 of the substrate 230 with wires 240 (wire bonding), and cover glass ( and applying (550) a side fill (260) covering the edge of (280), the wire (240) and the lead wire (250) of the substrate (210).
  • FIG. 6 illustrates an embodiment of a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to the image sensor chip after attaching and fixing the image sensor chip to a substrate according to the present invention.
  • a substrate 210 is prepared (6a), and a first adhesive 220 is applied on the prepared substrate 210.
  • Applying (FIG. 6B), attaching the image sensor chip 230 to the substrate 210 using the first adhesive 220 (FIG. 6C), and attaching the cover glass 280 to the image sensor using the second adhesive 270
  • Adhering to the top of the chip 230 (FIG. 6D, E), connecting the pad 241 of the image sensor chip 230 and the conductive wire 250 of the substrate with a bonding wire 240 (FIG. 6F), cover glass 280 ), a process of applying a side fill 260 covering the edge of the wire 240 and the conductive wire 250 of the substrate 210 (FIG. 6G).
  • FIG. 7 illustrates a method of manufacturing an image sensor package using a cover glass having grooves formed by attaching and fixing the image sensor chip to a substrate after attaching and fixing the cover glass to the image sensor package according to an embodiment of the present invention. It is a signal flow diagram.
  • the method 600 of manufacturing an image sensor package using a cover glass having a groove according to the present invention has a depth at which the inner surface does not contact the microlens installed on the top of the image sensor chip 230, Step 610 of preparing a cover glass 280 having a groove including a device region 310 in which the light receiving unit and the signal processing unit of the image sensor chip 230 are implemented (610), the cover glass using the second adhesive 270 Step 620 of adhesively fixing the cover glass 280 to the cover glass fixing area 330 of the image sensor chip 230 on which the microlens is seated, using the first adhesive 220 to secure the image sensor chip 230 Step 630 of adhesively fixing the image sensor chip 230 adhesively fixed to the cover glass fixing area 330 on the upper part of the substrate, the pad 241 of the image sensor chip 230 and the conductive wire of the substrate 230 Step 640 of connecting 250 with wire 240 (wire bonding) and side fill 260 covering the edge of cover glass 280, wire 240, and wire
  • FIG. 8 illustrates a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to an image sensor chip and then attaching and fixing the image sensor chip to a substrate according to an embodiment of the present invention.
  • a cover glass 280 is prepared ( FIG. 8A ), and a cover glass 280 is formed using a second adhesive 270. ) to the top of the image sensor chip 230 (FIGS. 8b, c), applying the first adhesive 220 to the top of the prepared substrate 210 (FIG. 8d), using the first adhesive 220 to the substrate Attaching the image sensor chip 230 to 210 (FIG. 8E), connecting the pad 241 of the image sensor chip 230 and the conductive wire 250 of the substrate with a bonding wire 240 (FIG. 8F), cover glass A process of applying a side fill 260 covering the edge of 280, the wire 240, and the conductive wire 250 of the substrate 210 (FIG. 8G) is included.
  • the above-described present invention can be implemented as computer readable code on a medium on which a program is recorded.
  • the computer-readable medium includes all types of recording devices in which data that can be read by a computer system is stored. Examples of computer-readable media include Hard Disk Drive (HDD), Solid State Disk (SSD), Silicon Disk Drive (SDD), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc. there is

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Abstract

The present invention proposes an image sensor package using a cover glass having a groove formed therein, wherein a groove is formed in a surface of a cover glass facing the top of an image sensor chip, and the cover glass is directly adhered to the top of the image sensor chip, such that a glass support member is not used. The image sensor package using the cover glass having a groove formed therein comprises: a substrate; an image sensor chip which is adhesively fixed to the top of the substrate and on the top of which a micro lens is seated; and a cover glass which forms a predetermined space above the image sensor chip by using a groove formed to the inside of an adhesive surface having a predetermined thickness along an edge surface thereof, and wherein the adhesive surface is adhesively fixed to a cover glass fixing area formed on the image sensor chip.

Description

홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지 및 이미지 센서 패키지의 제조방법Image sensor package using grooved cover glass and method for manufacturing image sensor package
본 발명은 이미지 센서 패키지에 관한 것으로, 특히 기판이 아니라 이미지 센서 칩의 상부에 접착 고정되며, 상기 이미지 센서 칩에 구현된 소자 영역의 상부에 일정 부피의 공간을 형성하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지 및 이의 제조 방법에 관한 것이다.The present invention relates to an image sensor package, and more particularly, to an image sensor package, which is adhesively fixed to an upper portion of an image sensor chip rather than to a substrate, and uses a cover glass having a groove forming a space of a certain volume on top of an element region implemented in the image sensor chip. It relates to an image sensor package and a manufacturing method thereof.
이미지 센서 칩은 외부에서 인가되는 영상을 전기신호로 변환하는 반도체 장치로, 이미지 센서 칩의 상부에 투명한 커버 글라스(Cover Glass)를 붙여 외부의 영상은 수신하면서 동시에 칩의 표면을 외부의 충격이나 불순물로부터 보호한다.The image sensor chip is a semiconductor device that converts an image applied from the outside into an electrical signal. A transparent cover glass is attached to the top of the image sensor chip to receive external images and at the same time protect the surface of the chip from external shocks and impurities. protect from
도 1은 종래의 이미지 센서 패키지의 단면을 나타낸다.1 shows a cross section of a conventional image sensor package.
도 1을 참조하면, 종래의 이미지 센서 패키지(100)는, 기판(110), 기판(110)의 상부에 안착한 이미지 센서 칩(130), 기판(110)의 상부에서 이미지 센서 칩(130)의 가장자리에 설치되는 글라스 지지부재(160), 및 글라스 지지부재(160)의 상부에 안착하는 커버 글라스(180)를 포함한다.Referring to FIG. 1 , a conventional image sensor package 100 includes a substrate 110, an image sensor chip 130 seated on top of the substrate 110, and an image sensor chip 130 on top of the substrate 110. It includes a glass support member 160 installed on the edge, and a cover glass 180 seated on top of the glass support member 160 .
이미지 센서 칩(130)은 제1 접착제(120)를 이용하여 기판(110)에 접착되고, 커버 글라스(180)는 제2 접착제(170)를 이용하여 글라스 지지부재(160)의 상부에 접착된다.The image sensor chip 130 is attached to the substrate 110 using the first adhesive 120, and the cover glass 180 is attached to the top of the glass support member 160 using the second adhesive 170. .
이미지 센서 칩(130)의 상부와 커버 글라스(180) 사이에는 일정한 공간을 형성함으로써, 이미지 센서 칩(130)의 패드(141)와 기판(110)의 도선(150)을 와이어(140)를 이용하여 전기적으로 연결할 수 있도록 하는 한편, 외부에서 커버 글라스(180)를 통과하여 이미지 센서 칩(130)의 표면으로 영상이 충분히 인가될 수 있도록 한다. By forming a certain space between the top of the image sensor chip 130 and the cover glass 180, the pad 141 of the image sensor chip 130 and the wire 150 of the substrate 110 are connected using a wire 140. While electrical connection is possible, an image can be sufficiently applied to the surface of the image sensor chip 130 through the cover glass 180 from the outside.
이미지 센서 칩(130)의 상부와 커버 글라스(180) 사이의 공간은 글라스 지지부재(160)에 의해 생성된다. 이미지 센서 패키지를 제조하는 공정의 관점에서 볼 때, 이미지 센서 칩(130)의 가장자리를 감싸는 크기의 글라스 지지부재(160)를 사전에 제작해 놓아야 하고, 패키지 공정이 진행되는 도중 글라스 지지부재(160)를 기판(110)의 상부에 접착해야 하는 공정을 수행해야 한다.A space between the top of the image sensor chip 130 and the cover glass 180 is created by the glass support member 160 . From the point of view of the process of manufacturing the image sensor package, the glass support member 160 having a size surrounding the edge of the image sensor chip 130 must be manufactured in advance, and the glass support member 160 ) to the top of the substrate 110 should be performed.
이미지 센서 칩(130)을 패키징하는 공정을 진행하는 단계가 많으면 많을수록 패키징 수율이 낮아지게 되는 것은 당연하다. 따라서, 기존의 패키지 공정의 단계를 줄이거나 사용되는 구조물의 개수를 줄이는 것은 수율은 물론 경제적인 측면에서도 바람직하다.It is natural that the packaging yield decreases as the number of steps in the process of packaging the image sensor chip 130 increases. Accordingly, reducing the number of steps in the existing package process or reducing the number of structures used is desirable from an economic point of view as well as a yield.
본 발명이 해결하고자 하는 기술적 과제는, 이미지 센서 칩의 상부와 대면하는 커버 글라스의 면에 홈을 형성하고, 상기 커버 글라스를 이미지 센서 칩의 상부에 직접 접착함으로써, 글라스 지지부재를 사용하지 않는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지를 제공하는 것에 있다.A technical problem to be solved by the present invention is to form a groove on a surface of a cover glass facing an upper portion of an image sensor chip and directly adhere the cover glass to the upper portion of an image sensor chip, thereby providing a groove without using a glass support member. It is to provide an image sensor package using the formed cover glass.
본 발명이 해결하고자 하는 다른 기술적 과제는, 이미지 센서 칩의 상부와 대면하는 커버 글라스의 면에 홈을 형성하고, 상기 커버 글라스를 이미지 센서 칩의 상부에 직접 접착함으로써, 글라스 지지부재를 사용하지 않는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법을 제공하는 것에 있다.Another technical problem to be solved by the present invention is to form a groove on the surface of the cover glass facing the top of the image sensor chip, and directly adhere the cover glass to the top of the image sensor chip, thereby eliminating the use of a glass support member. An object of the present invention is to provide a method of manufacturing an image sensor package using a grooved cover glass.
본 발명에서 이루고자 하는 기술적 과제들은 이상에서 언급한 기술적 과제들로 제한되지 않으며, 언급하지 않은 또 다른 기술적 과제들은 아래의 기재로부터 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.The technical problems to be achieved in the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below. You will be able to.
상기 기술적 과제를 달성하기 위한 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지는, 기판, 상기 기판의 상부에 접착 고정되며 상부에 마이크로 렌즈가 안착한 이미지 센서 칩 및 가장자리 면을 따라 형성되는 일정한 두께를 가지는 접착 면 안쪽으로 형성되는 홈을 이용하여 상기 이미지 센서 칩의 상부에 일정한 공간을 형성하며, 상기 접착 면이 상기 이미지 센서 칩에 형성된 커버 글라스 고정영역에 접착 고정되는 커버 글라스를 포함한다.An image sensor package using a grooved cover glass according to the present invention for achieving the above technical problem is a substrate, an image sensor chip adhesively fixed to an upper portion of the substrate and having a microlens seated thereon, and a constant formed along the edge surface. A cover glass having a predetermined space formed on an upper portion of the image sensor chip by using a groove formed inside an adhesive surface having a thickness, and the adhesive surface is adhesively fixed to a cover glass fixing area formed on the image sensor chip.
상기 다른 기술적 과제를 달성하기 위한 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법은, 이미지 센서 칩의 상부에 설치한 마이크로 렌즈와 내면이 접촉하지 않는 깊이를 가지고, 상기 이미지 센서 칩의 광 수신부와 신호 처리부가 구현된 소자 영역을 포함하는 홈을 가지는 커버 글라스를 준비하는 단계, 제1 접착제를 이용하여 상부에 마이크로 렌즈가 안착한 이미지 센서 칩을 기판의 상부에 접착 고정하는 단계, 제2 접착제를 이용하여 상기 커버 글라스를 상기 이미지 센서 칩의 커버 글라스 고정영역에 접착 고정하는 단계, 상기 이미지 센서 칩의 패드와 상기 기판의 도선을 와이어로 각각 연결하는 단계 및 상기 커버 글라스의 가장자리, 상기 와이어 및 상기 기판의 도선을 덮는 사이드 필을 도포하는 단계를 포함한다.In order to achieve the above other technical problem, a method of manufacturing an image sensor package using a cover glass having a groove according to the present invention has a depth at which the inner surface does not contact the microlens installed on the top of the image sensor chip, and the image sensor preparing a cover glass having a groove including a device region in which a light receiving unit and a signal processing unit of the chip are implemented; adhesively fixing an image sensor chip on which a microlens is seated on an upper portion of a substrate using a first adhesive; Adhering and fixing the cover glass to the cover glass fixing area of the image sensor chip using a second adhesive, connecting the pad of the image sensor chip and the wire of the substrate with wires, and an edge of the cover glass, and applying a side fill covering the wire and the conductive wire of the substrate.
본 발명에서 이루고자 하는 기술적 과제들은 이상에서 언급한 기술적 과제들로 제한되지 않으며, 언급하지 않은 또 다른 기술적 과제들은 아래의 기재로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.The technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below. You will be able to.
본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지 및 패키지의 제조방법은,An image sensor package and a method of manufacturing the package using a cover glass having a groove according to the present invention,
첫째, 발명에 따른 이미지 센서 패키지는 커버 글라스가 기판이 아니라 이미지 센서 칩에 접착되어 고정되는 방식으로 구성되므로 종래의 이미지 센서 패키지에서 기판에 커버 글라스를 지지하기 위해 사용하는 지지부재가 불필요하므로 비용의 절감 및 공정의 간소화 효과,First, since the image sensor package according to the present invention is configured in such a way that the cover glass is adhered to and fixed to the image sensor chip rather than to the substrate, the support member used to support the cover glass to the substrate in the conventional image sensor package is unnecessary, thereby reducing cost. reduction and process simplification,
둘째, 종래의 이미지 센서 패키지에서는 이미지 센서 칩의 패드와 기판의 도선을 와이어로 연결한 후 커버 글라스를 접착 및 고정하는 절차에 따라야 하므로 와이어가 커버 글라스와 기판이 형성하는 내부 공간에 위치하고 넓어서 패키징 후에 내부 습기의 발생 또는 와이어 연결 과정에서 발생한 잔존 이물질이 커버 글라스와 이미지 센서 칩 상부 공간으로 이동하는 경우 이미지 센서 성능에 영향을 미칠 우려가 있는 반면에, 본 발명에 따른 이미지 센서 패키지는 이미지 센서 칩의 패드와 기판의 도선 및 상호 연결하는 와이어가 모두 커버 글라스와 이미지 센서 칩의 상부 간에 형성되는 공간의 외부에 위치하므로 커브 글라스 접착 및 고정 후에 와이어 연결하는 경우 상기와 같은 우려가 해소되는 효과, 및Second, in the conventional image sensor package, since the wire is located in the internal space formed by the cover glass and the substrate and is wide, it is necessary to follow the procedure of attaching and fixing the cover glass after connecting the pad of the image sensor chip with the wire of the substrate. If internal moisture or residual foreign matter generated during the wire connection process moves to the upper space between the cover glass and the image sensor chip, there is a concern that the performance of the image sensor may be affected. On the other hand, the image sensor package according to the present invention Since the conductors and interconnecting wires of the pad and substrate are all located outside the space formed between the cover glass and the top of the image sensor chip, the above concerns are resolved when the wire is connected after bonding and fixing the cover glass, and
셋째, 본 발명에 따른 이미지 센서 패키지에서는 커버 글라스를 이미지 센서 칩에 접착 및 고정하는 동일한 공정을 우선 처리한 이후에 이미지 센서 칩의 패드와 기판의 도선을 와이어로 연결하는 공정을 이어서 처리할 수 있으므로, 커버 글라스가 접착 및 고정된 동일한 이미지 센서 패키지를 활용하여 사로 다른 다양한 종류의 기능을 갖는 다양한 기판을 제작하는 경우 비용이 절감되고 효율이 증대되는 효과를 기대할 수 있다.Third, in the image sensor package according to the present invention, after the same process of attaching and fixing the cover glass to the image sensor chip is first processed, the process of connecting the pad of the image sensor chip and the wire of the substrate with a wire can be subsequently processed. In the case of manufacturing various substrates having various types of different functions by utilizing the same image sensor package to which the cover glass is bonded and fixed, the effect of reducing cost and increasing efficiency can be expected.
본 발명에서 얻을 수 있는 효과는 이상에서 언급한 효과들로 제한되지 않으며, 언급하지 않은 또 다른 효과들은 아래의 기재로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.The effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.
도 1은 종래의 이미지 센서 패키지의 단면을 나타낸다.1 shows a cross section of a conventional image sensor package.
도 2는 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 구조를 나타낸다.2 shows the structure of an image sensor package using a cover glass having a groove according to the present invention.
도 3은 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지에 사용되는 이미지 센서 칩의 일 실시 예이다.3 is an example of an image sensor chip used in an image sensor package using a cover glass having a groove according to the present invention.
도 4는 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지에 사용되는 홈이 형성된 커버 글라스의 일 실시 예이다.4 is an exemplary embodiment of a cover glass having a groove used in an image sensor package using the cover glass having a groove according to the present invention.
도 5는 본 발명의 일 실시 예에 따라 이미지 센서 칩을 기판에 접착 및 고정한 후에 커버 글라스를 이미지 센서 칩에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법을 나타내는 신호 흐름도이다.5 is a signal showing a method of manufacturing an image sensor package using a cover glass having grooves by attaching and fixing a cover glass to an image sensor chip after attaching and fixing an image sensor chip to a substrate according to an embodiment of the present invention; It is a flow chart.
도 6은 본 발명에 따른 이미지 센서 칩을 기판에 접착 및 고정한 후에 커버 글라스를 상기 이미지 센서 칩에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법의 일 실시 예이다.6 illustrates an embodiment of a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to the image sensor chip after attaching and fixing the image sensor chip to a substrate according to the present invention.
도 7은 본 발명의 일 실시 예에 따라 커버 글라스를 이미지 센서 패키지에 접착 및 고정한 후에 상기 이미지 센서 칩을 기판에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법을 나타내는 신호 흐름도이다.FIG. 7 illustrates a method of manufacturing an image sensor package using a cover glass having grooves formed by attaching and fixing the image sensor chip to a substrate after attaching and fixing the cover glass to the image sensor package according to an embodiment of the present invention. It is a signal flow diagram.
도 8은 본 발명에 따른 커버 글라스를 이미지 센서 칩에 접착 및 고정한 후에 상기 이미지 센서 칩을 기판에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법의 일 실시 예이다.8 illustrates a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to an image sensor chip and then attaching and fixing the image sensor chip to a substrate according to an embodiment of the present invention.
본 발명의 추가적인 목적들, 특징들 및 장점들은 다음의 상세한 설명 및 첨부도면으로부터 보다 명료하게 이해될 수 있다.Additional objects, features and advantages of the present invention may be more clearly understood from the following detailed description and accompanying drawings.
본 발명의 상세한 설명에 앞서, 본 발명은 다양한 변경을 도모할 수 있고, 여러 가지 실시 예를 가질 수 있는바, 아래에서 설명되고 도면에 도시된 예시들은 본 발명을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다.Prior to the detailed description of the present invention, the present invention may make various changes and may have various embodiments, and the examples described below and shown in the drawings are not intended to limit the present invention to specific embodiments. No, it should be understood to include all changes, equivalents or substitutes included in the spirit and scope of the present invention.
어떤 구성요소가 다른 구성요소에 "연결되어" 있다거나 "접속되어" 있다고 언급된 때에는, 그 다른 구성요소에 직접적으로 연결되어 있거나 또는 접속되어 있을 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에, 어떤 구성요소가 다른 구성요소에 "직접 연결되어" 있다거나 "직접 접속되어" 있다고 언급된 때에는, 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다.It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.
본 명세서에서 사용한 용어는 단지 특정한 실시 예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도는 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.
또한, 명세서에 기재된 "...부", "...유닛", "...모듈" 등의 용어는 적어도 하나의 기능이나 동작을 처리하는 단위를 의미하며, 이는 하드웨어나 소프트웨어 또는 하드웨어 및 소프트웨어의 결합으로 구현될 수 있다.In addition, terms such as "...unit", "...unit", and "...module" described in the specification mean a unit that processes at least one function or operation, which is hardware, software, or hardware and It can be implemented as a combination of software.
또한, 첨부 도면을 참조하여 설명함에 있어, 도면 부호에 관계없이 동일한 구성 요소는 동일한 참조부호를 부여하고 이에 대하여 중복되는 설명은 생략하기로 한다. 본 발명을 설명함에 있어서 관련된 공지 기술에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.In addition, in the description with reference to the accompanying drawings, the same reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted. In describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.
또한, 본원 명세서 전체에서, 어떤 단계가 다른 단계와 "상에" 또는 "전에" 위치하고 있다고 할 때, 이는 어떤 단계가 다른 단계와 직접적 시계열적인 관계에 있는 경우뿐만 아니라, 각 단계 후의 혼합하는 단계와 같이 두 단계의 순서에 시계열적 순서가 바뀔 수 있는 간접적 시계열적 관계에 있는 경우와 동일한 권리를 포함한다.In addition, throughout the present specification, when a step is said to be located "on" or "before" another step, this means that a step is in a direct time-series relationship with another step, as well as the mixing step after each step. As in the case of an indirect time-series relationship in which the time-series order may change in the sequence of two steps, the same rights are included.
이하 본 발명의 바람직한 실시 예에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지 및 이미지 센서 패키지의 제조방법에 대하여 첨부 도면을 참조하여 상세히 설명한다.Hereinafter, an image sensor package using a cover glass having a groove and a method of manufacturing the image sensor package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
이하에서는 이미지 센서 칩은 외부에서 마이크로 렌즈를 통해 인가되는 영상에 대응하는 전하를 생성하는 포토다이오드 어레이가 구현된 광 수신부와 각각의 포토다이오드로부터 생성되는 전하를 전압값으로 변환하는 복수의 이미지 센서회로가 집적된 반도체 장치에 적용하여 설명하기로 한다.Hereinafter, the image sensor chip includes a light receiving unit implemented with a photodiode array generating electric charge corresponding to an image applied from the outside through a micro lens and a plurality of image sensor circuits converting electric charge generated from each photodiode into a voltage value. The description will be applied to a semiconductor device in which is integrated.
도 2는 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 구조를 나타낸다.2 shows the structure of an image sensor package using a cover glass having a groove according to the present invention.
도 2를 참조하면, 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지(200)는, 기판(210), 이미지 센서 칩(230), 및 홈이 형성된 커버 글라스(280, 이하 커버 글라스)를 포함하는 것은 도 1에 도시된 종래의 이미지 센서 패키지(100)와 동일하다.Referring to FIG. 2 , an image sensor package 200 using a cover glass with grooves according to the present invention includes a substrate 210, an image sensor chip 230, and a cover glass 280 with grooves (hereinafter referred to as cover glass). Including is the same as the conventional image sensor package 100 shown in FIG.
이미지 센서 칩(230)은 제1 접착제(220)를 이용하여 기판(210)에 접착되고, 커버 글라스(280)는 제2 접착제(270)를 이용하여 이미지 센서 칩(230)의 상부에 접착된다.The image sensor chip 230 is attached to the substrate 210 using a first adhesive 220, and the cover glass 280 is attached to the top of the image sensor chip 230 using a second adhesive 270. .
이미지 센서 칩(130, 230)의 가장자리에서 설치되는 패드(141, 241)는 실제로는 도 1 및 도 2에 도시된 것과 같이 육안으로 확인할 수 있을 정도로 이미지 센서 칩(130, 230)의 표면으로부터 돌출되지는 않지만 이해를 돕기 위해 돌출된 것으로 도시하였다.The pads 141 and 241 installed at the edges of the image sensor chips 130 and 230 actually protrude from the surface of the image sensor chips 130 and 230 to a degree that can be visually confirmed as shown in FIGS. 1 and 2 . Although it is not, it is shown as protruding for better understanding.
다만, 아래에 설명하는 것과 같이 3가지의 특징에서 차이가 있다.However, there are differences in three characteristics as described below.
첫째, 본 발명에 따른 이미지 센서 패키지(200)는 종래의 이미지 센서 패키지(100)에서 사용하는 글라스 지지부재(160)를 사용하지 않는다는 점과 커버 글라스(280)의 내부에 홈(미도시) 형성되어 있다는 점 및 커버 글라스(280)가 기판(210)이 아니라 이미지 센서 칩(230)에 접착 & 고정된다는 점에서 차이가 있다.First, the image sensor package 200 according to the present invention does not use the glass support member 160 used in the conventional image sensor package 100 and forms a groove (not shown) inside the cover glass 280 There is a difference in that the cover glass 280 is attached and fixed to the image sensor chip 230 instead of the substrate 210.
둘째, 종래의 이미지 센서 패키지(100)에서는 이미지 센서 칩(130)의 패드(141)와 기판(110)의 도선(150)을 연결하는 와이어(140)가 커버 글라스(180)와 기판(110)이 형성하는 내부 공간에서 위치하는 반면에, 본 발명에 따른 이미지 센서 패키지(200)는 커버 글라스(280)와 이미지 센서 칩(230)의 상부와 형성하는 공간이 아니라 커버 글라스(280)의 외부에 와이어(240)가 위치한다는 점에서 차이가 있다.Second, in the conventional image sensor package 100, the wire 140 connecting the pad 141 of the image sensor chip 130 and the conductive wire 150 of the substrate 110 is connected to the cover glass 180 and the substrate 110. While located in the inner space formed by the image sensor package 200 according to the present invention, not in the space formed with the top of the cover glass 280 and the image sensor chip 230, but outside the cover glass 280 The difference lies in the location of the wire 240.
셋째, 종래의 이미지 센서 패키지(100)는 기판(110), 글라스 지지부재(160) 및 커버 글라스(180)가 형성하는 공간이 이미지 센서 칩(130)을 커버(cover)하기 때문에 와이어(140)를 보호하기 위한 별도의 수단이 필요 없었지만, 본 발명에 따른 이미지 센서 패키지(200)는 커버 글라스(280)의 측면, 와이어(240), 및 이미지 센서 칩(230)의 측면을 보호하기 위한 사이드 필(260)이 도포된다는 점이다.Third, in the conventional image sensor package 100, since the space formed by the substrate 110, the glass support member 160, and the cover glass 180 covers the image sensor chip 130, the wire 140 However, the image sensor package 200 according to the present invention has a side fill for protecting the side of the cover glass 280, the wire 240, and the side of the image sensor chip 230. (260) is applied.
이러한 차이는 후술하는 이미지 센서 칩(230)과 커버 글라스(280)의 구조에 따른 것이다.This difference is due to structures of the image sensor chip 230 and the cover glass 280 to be described later.
도 3은 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지에 사용되는 이미지 센서 칩의 일 실시 예이다.3 is an example of an image sensor chip used in an image sensor package using a cover glass having a groove according to the present invention.
도 3을 참조하면, 이미지 센서 칩(230)은, 소자 영역(310), 패드(241) 및 커버 글라스 고정영역(330)을 포함한다.Referring to FIG. 3 , the image sensor chip 230 includes a device area 310 , a pad 241 and a cover glass fixing area 330 .
소자 영역(310)은 광 수신부(미도시) 및 신호 처리부(미도시)를 포함하는데, 광 수신부는 외부에서 인가되는 영상에 대응하는 전하를 생성하는 복수의 포토다이오드 어레이(미도시)가 구현된 부분이며, 신호 처리부는 포토다이오드 어레이(미도시)를 구성하는 각각의 포토다이오드로부터 생성되는 전하를 전압 값으로 변환하는 전하변환회로가 구현된 부분이다. 일반적으로 하나의 포토다이오드 및 해당 포토다이오드로부터 생성되는 전하를 이에 대응하는 전압으로 변환하는 전하변환회로를 하나로 묶어 단위 이미지 센서회로라고 할 수 있다. 본 발명에서 이미지 센서 칩은 복수의 이미지 센서회로가 집적된 반도체 장치를 의미한다.The device region 310 includes a light receiving unit (not shown) and a signal processing unit (not shown). The light receiving unit is implemented with a plurality of photodiode arrays (not shown) that generate electric charge corresponding to an externally applied image. part, and the signal processing unit is a part implemented with a charge conversion circuit that converts charge generated from each photodiode constituting the photodiode array (not shown) into a voltage value. In general, a photodiode and a charge conversion circuit that converts charge generated from the photodiode into a voltage corresponding thereto may be collectively called a unit image sensor circuit. In the present invention, an image sensor chip means a semiconductor device in which a plurality of image sensor circuits are integrated.
소자 영역(310)의 상부에는 마이크로 렌즈(231)가 설치되어, 이미지 센서 칩(230)이 수신하는 신호의 영상의 색을 감지할 수 있도록 한다.A microlens 231 is installed above the element region 310 so that the image sensor chip 230 can detect the color of an image of a received signal.
패드(241)는 소자 영역(310)에서 생성된 변환전압을 외부로 전송하거나 외부에서 인가되는 전압소스(voltage source) 또는 신호(signal)를 수신하는 창구가 되며, 본 발명에서는 패드(241)가 소자 영역(310)을 둘러싸는 형태로 이미지 센서 칩(230)의 가장자리에 형성되는 것으로 가정한다.The pad 241 serves as a window for transmitting the converted voltage generated in the device region 310 to the outside or receiving a voltage source or signal applied from the outside. In the present invention, the pad 241 Assume that it is formed at the edge of the image sensor chip 230 in a form surrounding the element region 310 .
커버 글라스 고정영역(330)은 소자 영역(310)과 패드(241)가 설치된 영역의 사이에 일정한 두께로 가지는 띠 형태로 구현되며, 후술하는 커버 글라스(280)의 접착 면(420)이 접착제(미도시)에 의해 접착 고정되는 영역이 된다.The cover glass fixing area 330 is implemented in the form of a band having a constant thickness between the device area 310 and the area where the pad 241 is installed, and the adhesive surface 420 of the cover glass 280 to be described later is an adhesive ( (not shown) becomes an area that is adhesively fixed.
도 4는 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지에 사용되는 홈이 형성된 커버 글라스의 일 실시 예이다.4 is an exemplary embodiment of a cover glass having a groove used in an image sensor package using the cover glass having a groove according to the present invention.
도 4a는 홈이 형성된 커버 글라스(280)의 사시도, 도 4b는 평면도, 도 4c는 측면도이다.FIG. 4A is a perspective view of the cover glass 280 in which grooves are formed, FIG. 4B is a plan view, and FIG. 4C is a side view.
도 4를 참조하면, 홈이 형성된 커버 글라스(280)는 패널 형태의 커버 글라스 바디의 중앙 내부에 형성되는 홈(410) 및 홈의 가장자리에 일정한 두께를 가지는 띠 형태의 접착 면(420)을 포함한다. 홈(410)의 깊이는 1~2㎛ 정도로 마이크로 렌즈(231)보다 길어야 하며, 홈(410)의 깊이가 깊으면 깊을수록 입사하는 영상을 효과적으로 수신할 수 있으므로, 0.05~0.5mm 정도로 하는 실시예도 가능하다.Referring to FIG. 4 , the grooved cover glass 280 includes a groove 410 formed inside the center of a panel-shaped cover glass body and a band-shaped adhesive surface 420 having a constant thickness at the edge of the groove. do. The depth of the groove 410 should be longer than that of the micro lens 231 by about 1 to 2 μm, and the deeper the depth of the groove 410, the more effectively the incoming image can be received. possible.
커버 글라스(280)의 홈(410)은 평면 형태의 커버 글라스(280)의 중앙 내부를 에칭 용액(etchant)을 이용하여 생성할 수 있다. 홈(410)은 커버 글라스(280)가 이미지 센서 칩(230)의 패키징에 사용될 때 이미지 센서 칩(230)의 마이크로 렌즈(231)와 커버 글라스(280) 사이의 공간을 형성한다.The groove 410 of the cover glass 280 may be formed inside the center of the planar cover glass 280 by using an etchant. The groove 410 forms a space between the micro lens 231 of the image sensor chip 230 and the cover glass 280 when the cover glass 280 is used for packaging the image sensor chip 230 .
커버 글라스(280)의 홈(410)을 생성하는데 사용하는 에칭 용액의 종류, 에칭 시간 및 방법은 이 분야의 통상의 기술자는 쉽게 구현할 수 있으므로, 여기서는 설명하지 않는다. 다만, 홈(410)은 최소한 마이크로 렌즈(231)의 상부와 홈(410)의 내면이 접촉하지 않는 정도의 깊이와 적어도 소자 영역(310)을 포함하는 2차원 면적을 가지는 것이 바람직하다.Since the type of etching solution used to create the groove 410 of the cover glass 280, the etching time and method can be easily implemented by a person skilled in the art, they will not be described herein. However, it is preferable that the groove 410 has a two-dimensional area including at least the device region 310 and a depth at least to the extent that the top of the micro lens 231 and the inner surface of the groove 410 do not come into contact.
도 5는 본 발명의 일 실시 예에 따라 이미지 센서 칩을 기판에 접착 및 고정한 후에 커버 글라스를 이미지 센서 칩에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법을 나타내는 신호 흐름도이다.5 is a signal showing a method of manufacturing an image sensor package using a cover glass having grooves by attaching and fixing a cover glass to an image sensor chip after attaching and fixing an image sensor chip to a substrate according to an embodiment of the present invention; It is a flow chart.
도 5를 참조하면, 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법(500)은 이미지 센서 칩(230)의 상부에 설치한 마이크로 렌즈와 내면이 접촉하지 않는 깊이를 가지고, 이미지 센서 칩(230)의 광 수신부와 신호 처리부가 구현된 소자 영역(310)을 포함하는 홈을 가지는 커버 글라스(280)를 준비하는 단계(510), 제1 접착제(220)를 이용하여 상부에 마이크로 렌즈가 안착한 이미지 센서 칩을 기판의 상부에 접착 고정하는 단계(520), 제2 접착제(270)를 이용하여 커버 글라스(280)를 이미지 센서 칩(230)의 커버 글라스 고정영역(330)에 접착 고정하는 단계(530), 이미지 센서 칩(230)의 패드(241)와 기판(230)의 도선(250)을 와이어(240)로 각각 연결(와이어 본딩)하는 단계(540) 및 커버 글라스(280)의 가장자리, 와이어(240) 및 기판(210)의 도선(250)을 덮는 사이드 필(260)을 도포하는 단계(550)를 포함한다.Referring to FIG. 5 , the method 500 of manufacturing an image sensor package using a cover glass having a groove according to the present invention has a depth at which the inner surface does not contact the microlens installed on the top of the image sensor chip 230, Step 510 of preparing a cover glass 280 having a groove including a device area 310 in which the light receiving unit and the signal processing unit of the image sensor chip 230 are implemented (510), on the top using a first adhesive 220 Step 520 of adhesively fixing the image sensor chip on which the microlenses are seated on the substrate, using the second adhesive 270 to cover the cover glass 280 to the cover glass fixing area 330 of the image sensor chip 230 Step 530 of adhesively fixing, step 540 of connecting the pad 241 of the image sensor chip 230 and the lead wire 250 of the substrate 230 with wires 240 (wire bonding), and cover glass ( and applying (550) a side fill (260) covering the edge of (280), the wire (240) and the lead wire (250) of the substrate (210).
도 6은 본 발명에 따른 이미지 센서 칩을 기판에 접착 및 고정한 후에 커버 글라스를 상기 이미지 센서 칩에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법의 일 실시 예이다.6 illustrates an embodiment of a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to the image sensor chip after attaching and fixing the image sensor chip to a substrate according to the present invention.
도 6을 참조하면, 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법은, 기판(210)의 준비(6a), 준비된 기판(210)의 상부에 제1 접착제(220)의 도포(도 6b), 제1 접착제(220)를 이용하여 기판(210)에 이미지 센서 칩(230)의 접착(도 6c), 제2 접착제(270)를 이용하여 커버 글라스(280)를 이미지 센서 칩(230)의 상부에 접착(도 6d, e), 이미지 센서 칩(230)의 패드(241)와 기판의 도선(250)을 본딩 와이어(240)로 연결(도 6f), 커버 글라스(280)의 가장자리, 와이어(240) 및 기판(210)의 도선(250)을 덮는 사이드 필(260)을 도포(도 6g)하는 과정을 포함한다.Referring to FIG. 6 , in the method of manufacturing an image sensor package using a cover glass having a groove according to the present invention, a substrate 210 is prepared (6a), and a first adhesive 220 is applied on the prepared substrate 210. Applying (FIG. 6B), attaching the image sensor chip 230 to the substrate 210 using the first adhesive 220 (FIG. 6C), and attaching the cover glass 280 to the image sensor using the second adhesive 270 Adhering to the top of the chip 230 (FIG. 6D, E), connecting the pad 241 of the image sensor chip 230 and the conductive wire 250 of the substrate with a bonding wire 240 (FIG. 6F), cover glass 280 ), a process of applying a side fill 260 covering the edge of the wire 240 and the conductive wire 250 of the substrate 210 (FIG. 6G).
도 7은 본 발명의 일 실시 예에 따라 커버 글라스를 이미지 센서 패키지에 접착 및 고정한 후에 상기 이미지 센서 칩을 기판에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법을 나타내는 신호 흐름도이다.FIG. 7 illustrates a method of manufacturing an image sensor package using a cover glass having grooves formed by attaching and fixing the image sensor chip to a substrate after attaching and fixing the cover glass to the image sensor package according to an embodiment of the present invention. It is a signal flow diagram.
도 7을 참조하면, 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법(600)은 이미지 센서 칩(230)의 상부에 설치한 마이크로 렌즈와 내면이 접촉하지 않는 깊이를 가지고, 이미지 센서 칩(230)의 광 수신부와 신호 처리부가 구현된 소자 영역(310)을 포함하는 홈을 가지는 커버 글라스(280)를 준비하는 단계(610), 제2 접착제(270)를 이용하여 커버 글라스(280)를 상부에 마이크로 렌즈가 안착한 이미지 센서 칩(230)의 커버 글라스 고정영역(330)에 접착 고정하는 단계(620), 제1 접착제(220)를 이용하여 커브 글라스가 이미지 센서 칩(230)의 커버 글라스 고정 영역(330)에 접착 고정된 이미지 센서 칩(230)을 기판의 상부에 접착 고정하는 단계(630), 이미지 센서 칩(230)의 패드(241)와 기판(230)의 도선(250)을 와이어(240)로 각각 연결(와이어 본딩)하는 단계(640) 및 커버 글라스(280)의 가장자리, 와이어(240) 및 기판(210)의 도선(250)을 덮는 사이드 필(260)을 도포하는 단계(650)를 포함한다.Referring to FIG. 7 , the method 600 of manufacturing an image sensor package using a cover glass having a groove according to the present invention has a depth at which the inner surface does not contact the microlens installed on the top of the image sensor chip 230, Step 610 of preparing a cover glass 280 having a groove including a device region 310 in which the light receiving unit and the signal processing unit of the image sensor chip 230 are implemented (610), the cover glass using the second adhesive 270 Step 620 of adhesively fixing the cover glass 280 to the cover glass fixing area 330 of the image sensor chip 230 on which the microlens is seated, using the first adhesive 220 to secure the image sensor chip 230 Step 630 of adhesively fixing the image sensor chip 230 adhesively fixed to the cover glass fixing area 330 on the upper part of the substrate, the pad 241 of the image sensor chip 230 and the conductive wire of the substrate 230 Step 640 of connecting 250 with wire 240 (wire bonding) and side fill 260 covering the edge of cover glass 280, wire 240, and wire 250 of substrate 210 and applying step 650.
도 8은 본 발명에 따른 커버 글라스를 이미지 센서 칩에 접착 및 고정한 후에 상기 이미지 센서 칩을 기판에 접착 및 고정하는 방식으로 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법의 일 실시 예이다.8 illustrates a method of manufacturing an image sensor package using a cover glass in which a groove is formed by attaching and fixing a cover glass to an image sensor chip and then attaching and fixing the image sensor chip to a substrate according to an embodiment of the present invention.
도 8을 참조하면, 본 발명에 따른 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법은, 커버 글라스(280)의 준비(도 8a), 제2 접착제(270)를 이용하여 커버 글라스(280)를 이미지 센서 칩(230)의 상부에 접착(도 8b, c), 준비된 기판(210)의 상부에 제1 접착제(220)의 도포(도 8d), 제1 접착제(220)를 이용하여 기판(210)에 이미지 센서 칩(230)의 접착(도 8e), 이미지 센서 칩(230)의 패드(241)와 기판의 도선(250)을 본딩 와이어(240)로 연결(도 8f), 커버 글라스(280)의 가장자리, 와이어(240) 및 기판(210)의 도선(250)을 덮는 사이드 필(260)을 도포(도 8g)하는 과정을 포함한다.Referring to FIG. 8 , in the method of manufacturing an image sensor package using a cover glass having a groove according to the present invention, a cover glass 280 is prepared ( FIG. 8A ), and a cover glass 280 is formed using a second adhesive 270. ) to the top of the image sensor chip 230 (FIGS. 8b, c), applying the first adhesive 220 to the top of the prepared substrate 210 (FIG. 8d), using the first adhesive 220 to the substrate Attaching the image sensor chip 230 to 210 (FIG. 8E), connecting the pad 241 of the image sensor chip 230 and the conductive wire 250 of the substrate with a bonding wire 240 (FIG. 8F), cover glass A process of applying a side fill 260 covering the edge of 280, the wire 240, and the conductive wire 250 of the substrate 210 (FIG. 8G) is included.
전술한 본 발명은, 프로그램이 기록된 매체에 컴퓨터가 읽을 수 있는 코드로서 구현하는 것이 가능하다. 컴퓨터가 읽을 수 있는 매체는, 컴퓨터 시스템에 의하여 읽혀질 수 있는 데이터가 저장되는 모든 종류의 기록장치를 포함한다. 컴퓨터가 읽을 수 있는 매체의 예로는, HDD(Hard Disk Drive), SSD(Solid State Disk), SDD(Silicon Disk Drive), ROM, RAM, CD-ROM, 자기 테이프, 플로피 디스크, 광 데이터 저장 장치 등이 있다.The above-described present invention can be implemented as computer readable code on a medium on which a program is recorded. The computer-readable medium includes all types of recording devices in which data that can be read by a computer system is stored. Examples of computer-readable media include Hard Disk Drive (HDD), Solid State Disk (SSD), Silicon Disk Drive (SDD), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc. there is
이상에서는 본 발명에 대한 기술사상을 첨부 도면과 함께 서술하였지만 이는 본 발명의 바람직한 실시 예를 예시적으로 설명한 것이지 본 발명을 한정하는 것은 아니다. 또한, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 기술자라면 누구나 본 발명의 기술적 사상의 범주를 이탈하지 않는 범위 내에서 다양한 변형 및 모방 가능함은 명백한 사실이다.In the above, the technical idea of the present invention has been described together with the accompanying drawings, but this is an illustrative example of a preferred embodiment of the present invention, but does not limit the present invention. In addition, it is obvious that anyone skilled in the art can make various modifications and imitations without departing from the scope of the technical idea of the present invention.

Claims (11)

  1. 상부에 마이크로 렌즈가 안착한 이미지 센서 칩; 및 An image sensor chip on which a micro lens is seated; and
    가장자리 면을 따라 형성되는 일정한 두께를 가지는 접착 면 안쪽으로 형성되는 홈을 이용하여 상기 이미지 센서 칩의 상부에 일정한 공간을 형성하며, 상기 접착 면이 상기 이미지 센서 칩에 형성된 커버 글라스 고정영역에 접착 고정되는 커버 글라스; 를 A certain space is formed on the upper part of the image sensor chip using a groove formed inside the adhesive surface having a constant thickness along the edge surface, and the adhesive surface is adhesively fixed to the cover glass fixing area formed on the image sensor chip. a cover glass; cast
    포함하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지. An image sensor package using a cover glass having a groove formed thereon.
  2. 제1항에서, 상기 커버 글라스의 홈은, In claim 1, the groove of the cover glass,
    내부에 상기 이미지 센서 칩의 광 수신부 및 신호 처리부가 구현된 소자 영역을 포함할 수 있으며, It may include an element region in which a light receiving unit and a signal processing unit of the image sensor chip are implemented,
    상기 이미지 센서 칩의 상부에 설치한 마이크로 렌즈와 상기 홈의 내면이 접촉하지 않는 깊이를 가지는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지. An image sensor package using a cover glass in which a micro lens installed on an upper portion of the image sensor chip is formed with a groove having a depth such that an inner surface of the groove does not contact.
  3. 제2항에서, 상기 커버 글라스 고정영역은, The method of claim 2, wherein the cover glass fixing area,
    상기 소자 영역과 상기 소자 영역의 외부에 형성되는 복수의 패드 사이에 형성되는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지. An image sensor package using a cover glass having grooves formed between the device region and a plurality of pads formed outside the device region.
  4. 제1항 내지 제3항 중 어느 하나의 항에서, In any one of claims 1 to 3,
    상기 이미지 센서 패키지는 상기 이미지 센서 칩이 접착 고정되는 기판: 을The image sensor package includes a substrate to which the image sensor chip is adhesively fixed:
    더 포함하는 것을 특징으로 하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지. An image sensor package using a cover glass in which a groove is formed, characterized in that it further comprises.
  5. 제4항에서, In paragraph 4,
    상기 이미지 센서 칩의 복수의 패드는 상기 기판에 형성된 도선과 와이어로 각각 연결되는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지. The plurality of pads of the image sensor chip use a cover glass having grooves connected to each other by wires and wires formed on the substrate.
  6. 제5항에서, In paragraph 5,
    상기 커버 글라스의 가장자리, 상기 와이어 및 상기 기판의 도선을 덮는 사이드 필(Side Fill)을 더 포함하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지. An image sensor package using a cover glass having a groove further comprising a side fill covering an edge of the cover glass, the wire, and the conductive wire of the substrate.
  7. 이미지 센서 칩의 상부에 설치한 마이크로 렌즈와 내면이 접촉하지 않는 깊이를 가지고, 상기 이미지 센서 칩의 광 수신부와 신호 처리부가 구현된 소자 영역을 포함하는 홈을 가지는 커버 글라스를 준비하는 단계; 및 preparing a cover glass having a depth at which an inner surface does not contact a microlens installed on an upper portion of an image sensor chip and a groove including a device region in which a light receiving unit and a signal processing unit of the image sensor chip are implemented; and
    제2 접착제를 이용하여 상기 커버 글라스를 상기 이미지 센서 칩의 커버 글라스 고정영역에 접착 고정하는 단계; 를 adhesively fixing the cover glass to a cover glass fixing area of the image sensor chip using a second adhesive; cast
    포함하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법. A method of manufacturing an image sensor package using a cover glass having a groove formed thereon.
  8. 제7항에서, 상기 커버 글라스 고정영역은,The method of claim 7, wherein the cover glass fixing area,
    상기 소자 영역과 상기 소자 영역의 외부에 형성되는 복수의 패드 사이에 형성되는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법.A method of manufacturing an image sensor package using a cover glass having a groove formed between the device region and a plurality of pads formed outside the device region.
  9. 제7항 내지 제8항 중 어느 하나의 항에서,In any one of claims 7 to 8,
    제1 접착제를 이용하여 상기 이미지 센서 칩을 기판의 상부에 접착 고정하는 단계; 를 더 포함하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법.adhesively fixing the image sensor chip to an upper portion of a substrate using a first adhesive; A method of manufacturing an image sensor package using a cover glass having a groove further comprising a.
  10. 제9항에서, In paragraph 9,
    상기 이미지 센서 칩의 패드와 상기 기판의 도선을 와이어로 각각 연결하는 단계;를 더 포함하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법.The method of manufacturing an image sensor package using a cover glass in which a groove is formed, further comprising connecting a pad of the image sensor chip and a wire of the substrate with a wire, respectively.
  11. 제10항에서,In paragraph 10,
    상기 커버 글라스의 가장자리, 상기 와이어 및 상기 기판의 도선을 덮는 사이드 필을 도포하는 단계;를 Applying a side fill covering the edge of the cover glass, the wire, and the conductive wire of the substrate;
    더 포함하는 홈이 형성된 커버 글라스를 이용하는 이미지 센서 패키지의 제조 방법.A method of manufacturing an image sensor package using a cover glass having a groove formed thereon, further comprising:
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