KR20100041171A - 일체형 롤-투-롤 스퍼터 챔버 - Google Patents
일체형 롤-투-롤 스퍼터 챔버 Download PDFInfo
- Publication number
- KR20100041171A KR20100041171A KR1020080100217A KR20080100217A KR20100041171A KR 20100041171 A KR20100041171 A KR 20100041171A KR 1020080100217 A KR1020080100217 A KR 1020080100217A KR 20080100217 A KR20080100217 A KR 20080100217A KR 20100041171 A KR20100041171 A KR 20100041171A
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- chamber
- roll
- roller
- film
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- 238000000034 method Methods 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000005192 partition Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims description 13
- 238000004544 sputter deposition Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 7
- 238000012546 transfer Methods 0.000 abstract description 6
- 238000002203 pretreatment Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 43
- 238000012423 maintenance Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000010924 continuous production Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/206—Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (10)
- 기판의 필름에 부착된 이물질을 제거하는 전처리 공정을 수행하는 제1 챔버; 및상기 필름 위에 물질을 증착하는 공정을 수행하는 제2 챔버;상기 제1 챔버는 롤러(roller)에 의해 상기 필름을 상기 제1 챔버의 작업영역으로 이송하는 제1 롤러 시스템(Roller system)을 구비하고, 상기 제2 챔버는 롤러(roller)에 의해 상기 필름을 상기 제2 챔버의 작업영역으로 이송하는 제2 롤러 시스템(Roller system)을 구비하며,상기 제1 챔버와 상기 제2 챔버는 서로 대향하여 마주보며 경계를 형성하는 격벽(partition)을 통해 서로 부착되어 있는 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 1항에 있어서, 상기 제1 챔버는상기 격벽(partition)을 사이에 두고 상기 제2 챔버와 상하로 적층하여 하부(bottom) 챔버를 형성하는 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 1항에 있어서, 상기 제1 롤러 시스템은제1 Unwinding Roller, 제1 Rewinding Roller 및 복수개의 roller를 구비하는 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 1항에 있어서, 상기 제2 롤러 시스템은제2 Unwinding Roller, 제2 Rewinding Roller, 복수개의 roller 및 쿨링 드럼(Cooling drum)을 구비하는 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 3항에 있어서, 상기 제1 Unwinding Roller 및 상기 제1 Rewinding Roller는상기 제1 챔버 좌, 우에 각각 탈부착 가능하도록 설치 된 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 3항에 있어서, 상기 제1 Unwinding Roller 및 상기 제1 Rewinding Roller는,지면(ground)으로부터 1m 높이로 설치되는 것을 특징으로 하는 일체형 롤-투-롤(Roll to Roll) 스퍼터 챔버.
- 제 4항에 있어서, 상기 제2 Unwinding Roller 및 상기 제2 Rewinding Roller는상기 제2 챔버 좌, 우에 각각 탈부착 가능하도록 설치 된 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 4항에 있어서, 상기 제2 Unwinding Roller 및 상기 제2 Rewinding Roller는지면(ground)으로부터 1.5m 높이로 설치되는 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 1항에 있어서, 상기 제2 챔버는상기 제2 챔버의 중앙에 위치한 원형의 쿨링 드럼(Cooling Drum)을 향해 동심원으로 일정한 거리를 두고 설치된 복수의 타겟(target) 및 상기 복수의 타겟(target)에 상응하여 일정한 거리를 두고 설치된 복수의 증착 건(gun)을 구비하는 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
- 제 9항에 있어서, 상기 증착 건(gun)은복수의 RF Cathode 및 복수의 DC Cathode를 구비하는 것을 특징으로 하는 일체형 롤-투-롤(Roll-to-Roll) 스퍼터 챔버.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080100217A KR100998057B1 (ko) | 2008-10-13 | 2008-10-13 | 일체형 롤-투-롤 스퍼터 챔버 |
PCT/KR2009/005031 WO2010044545A2 (ko) | 2008-10-13 | 2009-09-04 | 일체형 롤-투-롤 스퍼터 챔버 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080100217A KR100998057B1 (ko) | 2008-10-13 | 2008-10-13 | 일체형 롤-투-롤 스퍼터 챔버 |
Publications (2)
Publication Number | Publication Date |
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KR20100041171A true KR20100041171A (ko) | 2010-04-22 |
KR100998057B1 KR100998057B1 (ko) | 2010-12-03 |
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KR1020080100217A KR100998057B1 (ko) | 2008-10-13 | 2008-10-13 | 일체형 롤-투-롤 스퍼터 챔버 |
Country Status (2)
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KR (1) | KR100998057B1 (ko) |
WO (1) | WO2010044545A2 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101512132B1 (ko) * | 2010-10-27 | 2015-04-15 | 한국전자통신연구원 | 박막 증착 장치 |
CN111020522A (zh) * | 2019-12-09 | 2020-04-17 | 王殿儒 | 基于气体放电型大功率电子枪的复合型基材连续镀膜系统 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9115425B2 (en) | 2010-10-18 | 2015-08-25 | Electronics And Telecommunications Research Institute | Thin film depositing apparatus |
WO2017051935A1 (ko) * | 2015-09-21 | 2017-03-30 | (주)브이앤아이솔루션 | 웹기판처리시스템 |
CN108517509A (zh) * | 2018-04-24 | 2018-09-11 | 广州市邦图机电科技有限公司 | 一种高真空卷绕式电容镀膜机的使用方法 |
Family Cites Families (4)
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JPS6082660A (ja) | 1983-10-08 | 1985-05-10 | Konishiroku Photo Ind Co Ltd | 酸化物層の形成装置 |
JPH0610117A (ja) * | 1992-06-26 | 1994-01-18 | Sony Corp | 薄膜形成方法、薄膜形成装置、レーザー光照射装置及びボンバード装置 |
KR100307081B1 (ko) | 1999-10-29 | 2001-10-29 | 권용범 | 롤 플레이트 롤 및 롤 투 플레이트 진공증착 시스템 |
KR100757736B1 (ko) | 2005-12-02 | 2007-09-12 | 한국전기연구원 | 플라즈마 이온주입 및 증착법을 이용한 fccl 제조장치 |
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2008
- 2008-10-13 KR KR1020080100217A patent/KR100998057B1/ko active IP Right Grant
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- 2009-09-04 WO PCT/KR2009/005031 patent/WO2010044545A2/ko active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101512132B1 (ko) * | 2010-10-27 | 2015-04-15 | 한국전자통신연구원 | 박막 증착 장치 |
CN111020522A (zh) * | 2019-12-09 | 2020-04-17 | 王殿儒 | 基于气体放电型大功率电子枪的复合型基材连续镀膜系统 |
Also Published As
Publication number | Publication date |
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KR100998057B1 (ko) | 2010-12-03 |
WO2010044545A2 (ko) | 2010-04-22 |
WO2010044545A3 (ko) | 2010-06-24 |
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