KR20100035405A - Method for fabricating printed circuit board and printed circuit board using the same - Google Patents

Abstract

PURPOSE: By at the same time forming the single PCB of 2 field into both sides copper foil laminated film of the double core shape the manufacturing method of PCB and the printed circuit board which is manufactured by using this multiply the production yield to two times. CONSTITUTION: A first copper foil layer(130) is formed on the top of the first insulation layer(100). The second copper foil layer(140) is formed in the lower part of the second insulation layer. The release agent(120) is located between the first insulation layer and the second insulation layer. The CCL(Copper Clad Laminated) combination having the double core construction the first insulation layer and the second insulation layer are adhered each other is formed. It is formed into the polypropylene having the release agent is the glossiness of the surface roughness of 1~10μm and 5~40%.

Description

Printed circuit board manufacturing method and printed circuit board manufactured using the same {METHOD FOR FABRICATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME}

The present invention relates to a method for manufacturing a printed circuit board and a printed circuit board manufactured by using the same. In particular, in the manufacture of a single-sided printed circuit board, a technology for improving manufacturing efficiency while preventing warpage of the substrate during circuit pattern printing. It is about.

Printed Circuit Boards (PCBs), which are used as the core of many electronic products such as computers, televisions, audio, video, telephones, cameras, automotive instrument panels, etc., are based on conductor patterns based on the surface of or on the surface of the electrically insulating substrate. Is made of a conductive material and fixed.

The printed circuit board serves as a pedestal for mounting various components inside the final product and connects signals of the components to each other. Therefore, the printed circuit board is hole-processed where the circuit is formed to integrate with advanced electronic components such as transistors and high-density integrated circuits, thereby greatly contributing to automation, high reliability, and miniaturization of electronic products.

Such printed circuit boards are classified into various types according to their use and manufacturing method, and various kinds of insulators are also used. Kinds and properties of the resin used for the insulator (material of the substrate) are shown in Table 1 below.

[Table 1] Types of resins and their uses in printed circuit boards

division Characteristics Phenolic Resin It is the oldest among synthetic resins, and is used in large quantities as an electric insulation material such as molding materials, adhesives, and paints, compared to other printed circuit boards. Epoxy Resin It is used as a resin for printed circuit boards having excellent electrical properties, adhesion, heat resistance, moisture resistance, chemical resistance, and dimensional stability. Polyimide Resin Polyimide development was developed by the US Aeronautics and Space Administration as a highly heat resistant material. It is flame retardant to withstand continuous use at around 400 ℃ as well as at soldering temperature. B-T Resin It has a heat deflection temperature (300 ° C.) equivalent to that of polyimide, and has better copper foil adhesion than polyimide.

Types of printed circuit boards using the resins described above are classified into various types including manufacturing methods, but are generally classified by the material of the substrate and the number of layers laminated. That is, they are generally classified into single-sided, double-sided, multi-layered (more than 4 layers), and flexible printed circuit boards.

Here, the single-sided printed circuit board refers to a printed circuit board in which the circuit is formed only on one side, and is a low-cost product having a low mounting density and a simple manufacturing method. Mainly used for home appliances such as TV, VTR and audio.

1 is a cross-sectional view illustrating a copper clad laminated film (CCL) for manufacturing a single-sided printed circuit board.

Referring to FIG. 1, an insulator layer 10 such as phenol, epoxy, polyimide, and BT resin described above is provided, and upper copper foil 20 and lower copper foil 30 are provided on both surfaces thereof.

In this case, when only one surface of the upper or lower copper foils 20 and 30 is formed, warpage of the copper-clad laminated film occurs during the circuit pattern printing process, thereby lowering the reliability of the product and reducing the production yield. have.

As described above, according to the manufacturing method of the single-sided printed circuit board according to the prior art, it is necessary to use the copper foil laminated film (CCL) covered with copper foil on both sides because of the phenomenon that the copper foil laminated film is distorted during circuit pattern printing.

However, in the case of using a double-sided copper foil laminated film, all copper foils on one surface that do not require a circuit pattern after the circuit pattern formation have to be removed by etching, so the copper foil is unnecessarily wasted and there is still a risk of distortion problems during the etching process. There is.

The present invention forms a double-core copper foil laminated film in which a double core (CCL) is bonded using a release agent, and a printed circuit board is manufactured on a double-sided copper foil by a double-sided printed circuit board manufacturing technology. Printed circuit board manufacturing method and method of using the same by separating cores from a release agent so that two single-sided printed circuit boards are formed, thereby preventing manufacturing from warping during the circuit pattern printing process and doubling manufacturing efficiency It is an object of the present invention to provide a printed circuit board manufactured.

The method of manufacturing a printed circuit board according to the present invention comprises the steps of preparing two sheets of copper foil laminated films having a structure in which a copper foil layer is formed on one surface of an insulating layer, and forming an adhesive release agent on the surface of the insulating layer of the copper foil laminated film. Bonding each insulating layer of the sheet of copper foil laminated film to face each other to form a copper clad laminated (CCL) binder having a double core structure, and photolithography each of the copper foil layers formed on both sides of the CCL binder. Patterning a predetermined circuit pattern using a process and separating the two sheets of copper foil laminated films on which the circuit patterns are formed from each other by using a surface on which the release agent is formed as a separate surface, and remaining on the surface of the copper foil laminated film It includes the step of removing.

Here, the release agent is characterized in that the use of polypropylene, the release agent is characterized in that using a material having a surface roughness of 1 ~ 10㎛, the release agent is formed to a thickness of 50 ~ 100㎛ The release agent may be a material having a glossiness of 1 to 5%, and the release agent may be formed on both surfaces of the two insulation layers, or on only one selected surface of the two insulation layers. The circuit pattern formed on both sides of the CCL assembly is characterized in that it is formed in a symmetrical form.

In addition, the release agent is characterized in that using a polyester, characterized in that further forming an anti-adhesive between the release agent and the insulating layer, the anti-adhesive (Anti-adhesive) is Si It is characterized in that the main component to form a thickness of 25 ~ 28㎛.

The photolithography process may include forming a dry film on an upper surface of the copper foil layer of the CCL binder, performing an exposure process on the dry film, and developing the dry film. The copper foil layer is etched using the dry film pattern formed by development as a mask to form the circuit pattern, and the method further comprises peeling the dry film pattern.

After forming the circuit pattern, after forming a PSR (Photo Solder Resist) on the circuit pattern, the copper foil laminated film is separated from each other, and the copper foil laminated film is separated from each other after the circuit And forming a PSR (Photo Solder Resist) on the top of the pattern and the surface of the insulating layer, and further comprising coating Au on the exposed circuit pattern after forming the PSR. It features.

In addition, the printed circuit board according to the present invention is characterized in that it is formed using a method for manufacturing a printed circuit board using the release agent.

A printed circuit board manufacturing method and a printed circuit board manufactured using the same according to the present invention are two sheets using a double core double-sided copper foil laminated film in which two copper clad laminated films (CCL) are bonded using a release agent. Simultaneous formation of single-sided printed circuit boards doubles production yields and provides cost savings.

In addition, the present invention provides an effect of reducing waste elements in which copper foil is unnecessarily etched and completely preventing distortion of the substrate which may occur in a circuit pattern forming process.

Based on the above-described object of the present invention, a method for manufacturing a printed circuit board and a printed circuit board manufactured using the same will be described in detail.

Advantages and features of the present invention, and methods of accomplishing the same will be apparent with reference to the embodiments and drawings described below in detail. However, the present invention is not limited to the embodiments and drawings disclosed below, but will be implemented in various different forms, only these embodiments are intended to complete the disclosure of the present invention, and is usually in the art to which the present invention pertains. It is provided to fully inform the scope of the invention to those skilled in the art, the invention being defined only by the scope of the claims.

2 is a cross-sectional view of a printed circuit board according to the present invention, in which two copper foil laminated films having a structure in which a copper foil layer is formed on one surface of an insulating layer are bonded using a release agent.

Referring to FIG. 2, the first copper foil layer 130 is provided on the first insulating layer 100, and the second copper foil layer 140 is provided below the second insulating layer 110.

Next, the release agent 120 is disposed between the first insulating layer 100 and the second insulating layer 110, and the insulating layers are adhered to each other to form a CCL assembly having a double core structure.

Here, the release agent 120 preferably uses polypropylene having a surface roughness of 1 to 10 μm and glossiness of 5 to 40%, and is formed to a thickness of 50 to 100 μm.

When the release agent 120 is formed to a thickness of less than 50 μm, the first insulation layer 100 and the second insulation layer 110 do not stick well, and when the release agent 120 is formed to a thickness of more than 100 μm, the first insulation is performed in a subsequent process. Separation of the layer 100 and the second insulating layer 110 becomes difficult, and the release agent 120 is not properly performed. That is, the polypropylene used as the release agent 120 preferably has a surface roughness of 10 μm or less, a thickness of 100 μm or less, and a glossiness of 5% or more, which facilitates separation of the insulating layer when the release agent is peeled off. It is for. In order to facilitate the acquisition of the release agent, it is preferable that the surface roughness is 1 µm or more, the thickness is 50 µm or more, and the glossiness is 40% or less.

On the other hand, polyester can be used as a mold release agent. At this time, since the polyester is more adhesive, an anti-adhesive is further formed between the insulating layer and the release agent to prevent full adhesion. Here, the anti-sticking agent is not necessarily limited to the case of polyester, the main component is Si and preferably formed in a thickness of 25 ~ 28㎛.

In addition, the release agent 120 may be formed on both surfaces of the first and second insulating layers 100 and 110, or may be formed only on one surface selected from two insulating layers.

As described above, by forming a CCL assembly having a double core structure, the present invention can easily perform a single-sided printed circuit board manufacturing process. Hereinafter, a single-sided printed circuit board manufacturing process using the CCL assembly according to the present invention will be described.

3A to 3G are cross-sectional views illustrating a method of manufacturing a printed circuit board according to the first embodiment of the present invention.

Referring to FIG. 3A, a CCL having a structure of a second copper foil layer 240, a second insulation layer 210, a release agent 220, a first insulation layer 200, and a first copper foil layer 230 from a lower portion thereof. To form a conjugate.

Referring to FIG. 3B, a first dry film 250 and a second dry film 260 are formed on the surfaces of the first copper foil layer 230 and the second copper foil layer 240, respectively.

Referring to FIG. 3C, an exposure process is performed on the first dry film 250 and the second dry film 260, respectively. In this case, the exposure process follows a general photolithography process performed in a semiconductor manufacturing process, and is formed to print a circuit pattern. That is, the 1st and 2nd dry film pattern which defines a predetermined circuit pattern by an exposure process is formed. Here, the first and second dry film pattern forming process is preferably formed using a double-sided printed circuit board manufacturing technology so as to be symmetrical with each other.

Next, the exposed first and second dry films are developed, and the first and second copper foil layers 230 and 240 are etched using masks of the first and second dry film patterns formed by the development, respectively, to form a first And a DES process of forming the second circuit patterns 235 and 245 and peeling the first and second dry film patterns.

In the prior art, when the single-sided copper-clad laminate is used, the substrate is distorted while performing the DES process and the warpage of the solder-resist-coated process does not proceed to the post-curing process. In spite of using, since the insulating layers have a double core structure in which the insulating layers are adhered to each other, the problem of distortion does not occur.

Referring to FIG. 3D, a first photo solder resist (PSR) 255 and a second PSR 265 are formed on the first and second circuit patterns 235 and 245, respectively.

Referring to FIG. 3E, first and second soft Au coating layers 270 and 280 are formed in regions between the first and second PSRs 255 and 265 to complete a printed circuit pattern manufacturing process.

Referring to FIG. 3F, the first insulating layer 200 and the second insulating layer 210 are separated from each other, and the release agent 220 is removed.

Through the above process, the first single-sided printed circuit board 300 having the first circuit pattern 235 and the second single-sided printed circuit board 310 having the second circuit pattern 245 are manufactured. In this case, in the case of using a double-sided copper foil laminated film in the prior art, the process waste is caused by further performing a process of removing the copper foil on the back surface where the circuit pattern is not formed by an etching process. The efficiency can be improved.

Referring to FIG. 3G, a first punch hole is performed by performing a routing and punching process in a state in which the first single-sided printed circuit board 300 and the second single-sided printed circuit board 310 are aligned in a finishing process. 490 and a second punch hole 495 are formed, respectively. In this case, the guide punching and laser marking processes may be additionally performed before the routing and punching process.

Laser marking is for forming a recognition marker (Fiducial) that can be an indicator of the molding process during the packaging process. In addition to laser marking, ink marking may optionally be used.

4A to 4G are cross-sectional views illustrating a method of manufacturing a printed circuit board according to a second embodiment of the present invention.

The process of FIGS. 4A to 4C follows the processes of FIGS. 3A to 3C in the same manner.

The second copper foil layer 440, the second insulating layer 410, the release agent 420, the first insulating layer 400, and the first copper foil layer 430 may be formed on both surfaces of the CCL binder. The first dry film 450 and the second dry film 460 are formed, and the first circuit pattern 435 is formed on the first insulating layer 400 by performing an exposure and DES process, and the second The second circuit pattern 445 is formed on the insulating layer 410.

In this case, in the single-sided printed circuit board, the PSR may be formed only on the surface on which the circuit pattern is formed, and the PSR may be formed on the back surface on which the circuit pattern is not formed. The former case is the case of the first embodiment described with reference to Figs. 3A to 3G, and the latter case is the second embodiment described below.

Referring to FIG. 4D, immediately after the first and second circuit patterns 435 and 445 are formed, the first insulating layer 400 and the second insulating layer 410 are immediately separated and the release agent 420 is removed. Thus, the first single-sided printed circuit board 500 and the second single-sided printed circuit board 510 are formed. At this time, the first single-sided printed circuit board 500 and the second single-sided printed circuit board 510 are not finally completed.

Referring to FIG. 4E, a first PSR 455 is formed on a surface on which the first circuit pattern 435 of the first insulating layer 400 is formed and on a rear surface thereof, and a second circuit of the second insulating layer 410 is formed. A second PSR 465 is formed on the surface and the back surface on which the pattern 445 is formed. In this case, the PSR forming process is preferably performed in a state in which the first single-sided printed circuit board 500 and the second single-sided printed circuit board 510 are aligned.

Referring to FIG. 4F, the first soft Au coating layer 470 is formed in a region between the first PSRs 455 on the surface on which the first circuit pattern 435 is formed, and the surface on which the second circuit pattern 445 is formed. A second soft Au coating layer 480 is formed in the region between the second PSRs 465.

Referring to FIG. 4G, a first punch hole is performed by performing a routing and punching process in a state where the first single-sided printed circuit board 500 and the second single-sided printed circuit board 510 are aligned in a finishing process. 490 and a second punch hole 495 are formed, respectively. In this case, the guide punching and laser marking processes may be additionally performed before the routing and punching process.

Laser marking is for forming a recognition marker (Fiducial) that can be an indicator of the molding process during the packaging process. In addition to laser marking, ink marking may optionally be used.

As described above, the present invention can improve the reliability of the process because the DES process that can cause the most serious distortion of the printed circuit board is performed in a double-core copper foil laminated film state. In addition, since two single-sided printed circuit boards are formed at the same time, the production yield can be doubled and the cost can be reduced accordingly.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments and can be modified in various forms, and having ordinary skill in the art to which the present invention pertains. It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a cross-sectional view showing a copper clad laminated film (CCL) for manufacturing a single-sided printed circuit board.

2 is a cross-sectional view showing a printed circuit board according to the present invention.

3A to 3G are cross-sectional views illustrating a method of manufacturing a printed circuit board according to the first embodiment of the present invention.

4A to 4G are cross-sectional views illustrating a method of manufacturing a printed circuit board according to a second embodiment of the present invention.

Claims (17)

Providing two sheets of copper foil laminated films having a structure in which a copper foil layer is formed on one surface of the insulating layer; Forming an adhesive release agent on the surface of the insulating layer of the copper-clad laminated film, and sticking each of the insulating layers of the two copper-clad laminated film to face each other to form a CCL (Copper Clad Laminated) conjugate having a double core (Double Core) structure step; Patterning the copper foil layers formed on both surfaces of the CCL assembly into a predetermined circuit pattern using a photolithography process; And Separating the two sheets of copper foil laminated films on which the circuit pattern is formed from each other by using the surface on which the release agent is formed, and removing the release agents remaining on the surface of the copper foil laminated films. The method of claim 1, The release agent is a printed circuit board manufacturing method characterized in that using polypropylene. The method of claim 1, The release agent is a printed circuit board manufacturing method, characterized in that using a material having a surface roughness of 1 ~ 10㎛. The method of claim 1, The release agent is a printed circuit board manufacturing method, characterized in that formed in a thickness of 50 ~ 100㎛. The method of claim 1, The release agent is a printed circuit board manufacturing method, characterized in that using a material having a gloss of 5 to 40%. The method of claim 1, And the release agent is formed on both surfaces of the two insulating layers or on only one selected surface of the two insulating layers. The method of claim 1, The release agent is a printed circuit board manufacturing method, characterized in that using polyester. The method of claim 1, A method for manufacturing a printed circuit board, further comprising: forming an anti-adhesive agent between the release agent and the insulating layer. The method of claim 8, The anti-adhesive agent (Anti-adhesive) is a printed circuit board manufacturing method characterized in that the main component of Si to form a thickness of 25 ~ 28㎛. The method of claim 1, Printed circuit board manufacturing method characterized in that the circuit pattern formed on both sides of the CCL assembly is formed in a symmetrical form. The method of claim 1, The photolithography process may include forming a dry film on an upper surface of the copper foil layer on which the CCL binder is formed; Performing an exposure process on the dry film; And And developing the dry film, etching the copper foil layer using a dry film pattern formed by the development as a mask to form the circuit pattern, and peeling the dry film pattern. Substrate manufacturing method. The method of claim 1, After the step of forming the circuit pattern to form a PSR (Photo Solder Resist) on the circuit pattern after the printed circuit board manufacturing method characterized in that to separate the copper foil laminated film from each other. The method of claim 1, Separating the copper foil laminated film from each other and forming a PSR (Photo Solder Resist) on the circuit pattern and on the surface of the insulating layer. The method according to claim 12 or 13, And coating Au on the exposed circuit pattern after forming the PSR. The method of claim 14, After performing the step of coating the Au, performing a guide punching (Guide Punching) process on the surface of the copper-clad laminated film, and performing a laser marking or ink marking (Ink Marking) process Printed circuit board manufacturing method characterized in that. The method of claim 15, And performing a routing and punching process after performing the laser marking or ink marking process. A printed circuit board formed using the method of manufacturing a printed circuit board according to claim 1.

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