KR20100005462A

KR20100005462A - Glass scribing apparatus for panel dispaly and the method thereof

Info

Publication number: KR20100005462A
Application number: KR1020080065501A
Authority: KR
Inventors: 박웅기
Original assignee: 박웅기
Priority date: 2008-07-07
Filing date: 2008-07-07
Publication date: 2010-01-15

Abstract

PURPOSE: A glass scribing apparatus for panel display and a method thereof are provided to perform cutting operation by sending/arranging the substrate in the upright state. CONSTITUTION: An original substrate is loaded for the cutting operation in the upright state. The loaded original substrate as described above is quickly sent in the upright state. The substrate is arranged in the upright state. The arranged substrate as described above is cut in a predetermined direction by the scribing and breaking in the upright state. The substrate cutting as described above is unloaded. The damage on glass substrate is prevented by performing quick sending, alignment, and cutting in the upright state.

Description

Glass scribing apparatus for panel dispaly and the method

The present invention relates to a method and an apparatus for cutting a substrate for a flat panel display, and in particular, to provide rapid aligning and scribing and breaking in an upright state in which a large substrate is erected. It relates to a cutting method and apparatus.

In general, the conventional technology of cutting a substrate in the process of manufacturing a flat panel display such as a PDP, LCD, etc. while cutting and aligning the substrate while maintaining the substrate to be cut horizontally through the scribing process and breaking process For example, Korean Patent Publication No. 10-2006-0090905, Korean Patent Publication No. 10-0824253 and the like are known.

In the conventional horizontal feeding alignment and cutting method, the larger the size of the substrate to be cut, the larger the equipment corresponding thereto becomes. In particular, it takes up a lot of plane space for accommodating the substrate. As it needs to be large, it is very inefficient in terms of utilization of planar space and has a huge negative impact on the facility site as well as the facility investment.

In addition, since the physical properties of the substrate made of glass have high compressive strength but very weak vulnerability to tensile strength or impact strength, most of the substrates are made to be fed and aligned while keeping the substrate horizontal during the cutting process. Since the feed line or alignment line must be in contact with the feeding line or the alignment line over the entire area of either one of the upper and lower planes, which occupy the area of the two planes, the feeding line or the alignment line must also be operated while maintaining a horizontal state. It requires a lot of peripheral equipment to be able to feed and align while maintaining horizontality over the entire horizontal area, especially when there are enough facilities to meet these requirements, In case of occurrence, the glass substrate vulnerable to external shock is easily broken. Damaged and partial defects occur, which is not easy to control quality and is a major cause of high loss rate of the product.

Despite this situation, conventionally, a solution for solving this problem has not been presented separately. However, the reality is that it follows the horizontal feeding, alignment, and cutting methods as they are.

The present invention has been researched and developed in order to solve such a conventional problem.

The main purpose of the present invention is to maintain the upright state, which is established by breaking the horizontal feeding, alignment, and cutting method as a conventional substrate cutting method, and the feeding and alignment process of the substrate is made in such an upright state and cutting including scribing and breaking. It is intended to be able to efficiently perform cutting work while taking up very little horizontal space that occupies most of the factory site or equipment by allowing work to be done, and to utilize the horizontal space more efficiently than before.

Another object of the present invention is to allow the substrate to be fed, aligned, and cut continuously in an upright state so that the glass substrate is not easily damaged or broken during the operation, thereby achieving a more stable operation and lowering the loss rate of the substrate. An object of the present invention is to provide a cutting technique for phosphorus substrates.

The present invention, in order to achieve the above objects, the upright loading step of loading the original substrate for the cutting operation in an upright upright state, the original substrate loaded in the upright upright state is dispatched to the upright upright state, aligned in the upright upright state An upright alignment step, an upright cutting step of scribing and breaking a substrate aligned in the alignment step in a predetermined upright state, and an unloading step of unloading the substrate cut in the upright cutting step Provided is a method of cutting a substrate for a flat panel display, which includes the same.

Further, a second upright alignment step of feeding and aligning the substrate cut in the upright cutting step into a standing upright state between the upright cutting step and the unloading step, and a standing upright state of the substrate aligned in the second upright alignment step Provides a method of cutting a substrate for a flat panel display further comprising a second upright cutting step of scribing and breaking in a predetermined direction in the unit substrate form.

In addition, as a cutting device for a substrate embodying the above-described cutting method, a feeding mechanism for feeding in the upper portion in the upright state of the substrate, and a guide provided on both sides of the upper portion of the feeding mechanism, the inner space for the substrate is provided A mechanism, an alignment mechanism for aligning the substrate to a predetermined position to align the substrate in position, and a cutter tool installed at a position adjacent to the guide mechanism and scribing and breaking the substrate and cutting the substrate. Provided is a cutting device for a flat panel display substrate.

Furthermore, a second feeding device is provided with a separate guide mechanism in a position adjacent to the guide mechanism and the cutting tool, and is installed in a position adjacent to the feeding alignment mechanism, and secondly scribes and breaks the substrate again. Provided is a cutting device for a flat panel display substrate provided with a cutting tool.

The present invention maintains the upright state of the conventional substrate is upright, and in this upright state, the feeding and alignment of the substrate is made and the cutting operation including scribing and breaking is made to occupy most of the factory site or equipment It takes up very little space and can cut efficiently and utilize horizontal space more efficiently than before.

In addition, the present invention is the feeding, alignment, and cutting operation in the upright state of the substrate is continuously made so that the glass substrate is not easily damaged or broken during the operation can be made more stable work and lower the loss rate of the substrate economical economical of the substrate The cutting is made.

Hereinafter, with reference to the accompanying drawings to find out more specific content about the present invention.

First, the present invention is a cutting device for a substrate for a flat panel display as shown in Figures 3 to 8 can be made in a variety of configurations, all of which are to be fed in the upper portion in the upright state in which the substrate (1) is standing in common A feeding mechanism (2), a guide mechanism (3) provided on both sides of the feeding mechanism (2) and provided with an internal space (30) for the substrate (1), and the substrate (1) in position. Alignment mechanism 4 for positioning the substrate 1 to a predetermined position in order to align it, and a cutting mechanism installed at a position adjacent to the guide mechanism 3 and scribing and breaking the substrate 1 to cut it. (5) will be made.

In addition, a feed sorting mechanism 6 having a separate guide mechanism is provided at a position adjacent to the guide mechanism 3 and the cutting mechanism 5, and is installed at a position adjacent to the feed sorting mechanism 6 and the substrate. The second cutting tool 7 for scribing and breaking the secondary 10 again and breaking may be further installed.

At this time, the alignment mechanism 4 performs the alignment by positioning the substrate 1 located in the feeding mechanism 2 up or down as it is, so that accurate cutting operation can be performed by the cutting tool 5. It is installed in order to use, for example, by adopting a lifting mechanism, which is operated by a servomotor.

The cutting tools 5, 7 are preferably installed on both sides so that cutting can be simultaneously performed on both sides of the substrate 1, 10. The scribers 50, 70 and the breakers 52, 72 are simultaneously It has a shape that includes each, and a separate aspirator (54, 74) is installed in the position adjacent to the breakers (52, 72), glass fragments, chips generated from the substrate during cutting operations including scribing or breaking work It is desirable to be able to remove the dust immediately after generation.

The loader 8 is installed at an adjacent position as the front of the cutting device, and the loader 8 is used to load the substrate 1 for cutting at first, which is the feeding mechanism 80. And a guide mechanism 82 on both sides, and the unloader 9 is installed at an adjacent position as the rear portion of the cutting device described above, and the unloader 9 is a substrate (10, 12) in which a cutting operation is made. This is for unloading the feeding mechanism 90 and the guide mechanism 92 on each side.

In this case, the feeding mechanism (2, 80, 90) can be utilized by adopting a roller conveyor or an air conditioner as a feeding means for placing the substrate (1, 10, 12) to feed the, the guide mechanism (3) 82 and 92 serve to guide both sides of the substrate 1, 10, and 12 so that the substrates 1, 10, and 12 do not fall down during feeding or alignment, and operate while maintaining the upright state. Guides can be adopted and utilized.

Next will be described in more detail with reference to the contents shown in Figs. 1 to 6 by dividing the process of cutting the substrate of the present invention by each step with reference to the cutting device of the substrate made as described above.

Upright Loading Step

This step is an upright loading step of loading the original substrate 1 for cutting work in an upright upright state. The feeding mechanism is provided between the two guide mechanisms 82 in an upright state with the substrate 1 upright on the loader 8. (80) is pushed so as to be located at the top of the loading operation.

Upright alignment

The next step is an upright alignment step of feeding the original substrate 1 loaded in a standing upright state to a standing upright state and aligning it in a standing upright state, wherein the substrate 1 loaded in the above-mentioned upright loading step has a feeding mechanism 80 Position the substrate 1 on the upper side of the feeding mechanism 2 of the internal space 30 provided by the guide mechanism 3 as an upper position of the alignment mechanism 4 positioned at an adjacent position, or The step (4) is used to raise or lower the substrate 1 to position it in the proper position to perform the next upright cutting step.

Erect cutting stage

The next step is an upright cutting step of scribing and breaking the substrates aligned in the alignment step in a predetermined upright state and cutting them by the cutting tool 5, and the scriber 50 of the cutting tool 5. And the breaker 52 to cut the substrate 1 to a predetermined size, and immediately remove the glass fragments, chips, dust, etc. generated in the substrates 1 and 10 by the aspirator 54 immediately after the cutting. Do it.

Unloading Step

The next step is an unloading step of unloading the substrates 10 and 12 cut to a predetermined size in the cutting step, and may be unloaded in the state of the first cut substrate 10 as illustrated in FIG. 6. 3 and 5, the substrate 10, which is primarily cut, is cut again to have a second cut and the substrate having the guide mechanism 92 and the feeding mechanism 90 in the second cut substrate 12 state. The loader 9 can be used for unloading.

Next, a case of adopting a second alignment step and a second cutting step between the cutting step and the unloading step as described above will be described.

Second upright sorting step

This step is a secondary alignment step of feeding and aligning the substrate 10 cut in the cutting step in an upright position between the upright cutting step and the unloading step as described above, as illustrated in FIGS. 3 and 5. Based on the contents, it is a step of aligning the substrate 10 cut first by the feeding alignment mechanism 6 so that the second upright cutting operation described later by the second cutting mechanism 7 can be performed.

2nd upright cutting stage

This step is a secondary upright cutting step of scribing and breaking the substrates aligned in the second upright alignment step in a predetermined upright state in a predetermined direction to cut the unit substrate 12 into the shape of the second upright alignment step. In the second cutting mechanism 7, the scriber 70 and the breaker 72 are used to cut the substrate 10 to a predetermined size, and the glass fragments, chips, As soon as dust and the like are generated, it can be directly sucked off by the aspirator 74.

As such, the initial substrate 1 is cut into a state of the intermediate substrate 10 or the unit substrate 12 through the upright loading step, the upright alignment step, the upright cutting step, and the unloading step. The unloading can be made, and the intermediate substrate (2) is further subjected to the second upright alignment step and the second upright cutting step of the substrate 10 cut in the upright cutting step between the upright cutting step and the unloading step. The cutting operation from 10) to the unit substrate 12 can be made.

1 is a block process diagram showing an example of the present invention cutting method,

2 is a block process diagram showing a modification of the present invention cutting method,

3 is a partially omitted front view showing a preferred example of the present invention cutting device,

4 is a side view of main parts of FIG. 3;

5 is a schematic diagram showing an example in which a part of the apparatus illustrated in FIGS. 3 and 4 is changed;

6 is a schematic diagram illustrating a modification of the present invention.

1,10,12: substrate, 2: feeding mechanism,

3,82,92: guide mechanism, 4,6: alignment mechanism,

5, 7: cutter slot, 8: loader,

9: unloader, 30: internal space,

50,70: scriber, 52,72: breaker,

54,74: Aspirator

Claims

An upright loading step of loading the original substrate for cutting operation in a standing upright state,

An upright alignment step of feeding the original substrate loaded in the upright state upright and aligning the upright state upright,

An upright cutting step of cutting and scribing and breaking the substrate aligned in the alignment step in a predetermined upright state, and

And a unloading step of unloading the substrate cut in the upright cutting step.

The method of claim 1,

A second upright alignment step of feeding and aligning the substrate cut in the upright cutting step into an upright upright state between the upright cutting step and the unloading step, and in a standing upright state of the substrate aligned in the second upright alignment step And a second upright cutting step of scribing and breaking in a predetermined direction to cut the unit board into a unit board shape.

A feeding mechanism for feeding at the upper portion of the board in an upright state,

Guide mechanisms provided at both upper sides of the feeding mechanism and provided with an inner space for the substrate;

An alignment mechanism for positioning the substrate to a predetermined position in order to position the substrate in position; and

And a cutting tool tool installed at a position adjacent to the guide mechanism and cutting the substrate by scribing and breaking the substrate.

The method of claim 3,

Install a rapid alignment mechanism having a separate guide mechanism in a position adjacent to the guide mechanism and the cutting mechanism,

And a second cutting tool that is installed at a position adjacent to the feeding alignment mechanism and cuts by scribing and breaking the substrate again.

The method according to claim 3 or 4,

The cutting tool is installed on both sides at the same time, and has a form including a scriber and a breaker, respectively,

Cutting device for a flat panel display substrate, characterized in that provided in each of the adjoining the breaker with a separate aspirator.