KR20100003333A - Light emitting diode package - Google Patents

Abstract

PURPOSE: An LED package is provided to reduce a defect and facilitate the combination with a substrate and a reflector by fitting a protrusion on the substrate to a groove on the reflector. CONSTITUTION: An LED chip(16) is mounted on a substrate(11) with a mounting surface. A protrusion(12) is formed on the substrate and surrounds the LED chip. A reflector(13) is positioned on the substrate and a groove combined with the protrusion is formed on the reflector. The reflector includes a ceramic injection material or plastic injection material with an opening to expose a first lead terminal(14) and a second lead terminal(15). A via hole connecting the upper side and the lower side of the substrate is formed on the substrate. The first lead terminal and the second lead terminal are formed on the via hole.

Description

LED package {LIGHT EMITTING DIODE PACKAGE}

The present invention relates to an LED package, and more particularly, by bonding a groove formed in an injection-type reflector to a protrusion formed in a substrate, the substrate and the reflector can be easily bonded, and defects generated during bonding can be reduced. The present invention relates to an LED package that can improve yield in manufacturing.

Long life ceramic LED packages for display and lighting applications today include low-temperature-fired (LTCC) and high-temperature fired (HTCC) ceramics, laminated or single-plate ceramic structures, or injection cups made of PPA or ceramic on injection-molded ceramic or ceramic substrates. It is manufactured by adhering a structure, that is, a reflector.

In particular, the multilayer ceramic LED package is resistant to deterioration and excellent in reliability, but it is difficult to form the reflector, the reflector cannot be designed freely, and the surface roughness and the reflectance are low, resulting in the loss of light generated from the LED chip.

Although the injection-type ceramic LED package is excellent in reflector and package shape design, a reflective metal layer is formed on the reflector having a cavity to increase the reflection of light generated from the LED chip, and the adhesion force between the metal formed on the reflector and the encapsulant filled in the cavity is increased. This weak, deterioration in reliability due to delamination and corrosion from the externally exposed metal electrodes can have a fatal effect on reliability.

In addition, the ceramic LED package that manufactures and bonds the PPA injection or ceramic injection reflector separately on the ceramic plate-shaped substrate has a problem of arrangement due to bonding and incomplete bonding interface during transparent resin molding after LED chip mounting. Can be generated.

The technical problem to be achieved by the present invention is to bond the substrate and the injection-type reflector, but the bonding between the substrate and the reflector is easy and misaligned by joining the groove formed in the reflector to the protrusion formed on the substrate. ) And LED package to reduce the defect of the product by preventing the leakage of resin when forming the encapsulant.

In order to achieve the above technical problem, the LED package according to an embodiment of the present invention is an LED chip; A substrate having a mounting surface on which the LED chip is mounted; A protrusion formed on the substrate to surround the LED chip; And a reflector disposed on the substrate and having a groove coupled to the protrusion.

In the present embodiment, the reflector includes a ceramic injection molding or a plastic injection molding formed on the substrate, the ceramic injection molding having an opening for exposing the first and second lead terminals, one of which is the mounting surface. The LED package may be manufactured by bonding the injection type reflector and the substrate.

 The substrate further includes via holes connecting upper and lower portions of the substrate, and the via holes are provided with first and second lead terminals, one of which is the mounting surface.

The substrate and the reflector are bonded with a bonding material with the groove inserted in the protrusion, and the height of the protrusion is determined by the height of an encapsulant covering the LED chip.

The substrate may be a ceramic substrate, and further, the substrate and the protrusion may be integrated.

According to an embodiment of the present invention, the substrate and the injection-type reflector are bonded, but the bonding between the substrate and the reflector is easy by bonding the grooves formed in the reflector to the protrusions formed on the substrate, and reduce the defects generated during the bonding. It can improve the yield during package production. In addition, it is easy to design the light pattern avoiding the shape constraints generated during the LED package.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a cross-sectional view illustrating an LED package according to an embodiment of the present invention, FIG. 2 is a cross-sectional view illustrating an LED package according to another embodiment of the present invention, and FIG. 3 is an LED package shown in FIG. 2. 4 is an exploded perspective view of the LED package according to another embodiment of the present invention.

Referring to FIG. 1, the LED package 1 according to the present invention includes a substrate 11. The substrate 11 may be a ceramic substrate. The reflector 13 having an opening (not shown) exposing the first and second lead terminals 14 and 15 is positioned on the substrate 11. The reflector 13 is an injection molding mainly composed of ceramic or plastic. In the injection-type reflector 13, a groove 131 is formed to be engaged with the protrusion 12 formed on the substrate 11. The protrusions 12 are annular, hereinafter referred to as annular protrusions. Accordingly, when the substrate 11 and the reflector 13 are bonded to each other, the annular protrusion 12 is inserted into the groove 131 and bonded with a bonding material, for example, a ceramic bonding material. Can be prevented. In addition, since the injection-type reflector 13 is coupled to the substrate 11, the reflector 13 can be designed freely.

The substrate 11 is provided with a recess (not shown) for accommodating the annular protrusion 12. The substrate 11 is joined by a bonding material, for example, a ceramic bonding material, with the annular protrusion 12 fitted therein. The substrate 11 and the annular protrusion 12 are integrally manufactured. The substrate 11 and the annular protrusion 12 are both ceramic materials.

The substrate 11 has a mounting surface on which the LED chip 16 is mounted, and the mounting surface may be the first lead terminal 14. That is, the LED chip 16 is mounted on the first lead terminal 14 exposed through the opening. The LED chip 16 may be an LED chip emitting light in the ultraviolet or visible light region.

As shown in the figure, the LED chip 16 may be electrically connected to one surface of the first lead terminal 14. To this end, the LED chip 16 may be bonded to the first lead terminal 14 using silver epoxy. At this time, the bonding wire W electrically connects the LED chip 16 and the second lead terminal 15.

The first and second lead terminals 14 and 15 may be formed in various shapes. The first and second lead terminals 14 and 15 may be formed on the substrate 11 using an electroplating method in a single or stacked state of various metal layers such as gold, silver, or copper. However, the first and second lead terminals 14 and 15 are disposed to face each other in close proximity, and the other end extends in opposite directions to each other through the annular protrusion 12 to the outside of the substrate 11. To protrude. In this case, the groove 131 formed in the reflector 13 is bonded to the first and second lead terminals 14 and 15 formed on the annular protrusion 12 by a ceramic bonding material.

On the contrary, as shown in FIG. 2, the first and second lead terminals 14 and 15 are electrically connected to external terminals (not shown), respectively, through via holes 111 connecting upper and lower portions of the substrate 11. Can be connected. The first and second lead terminals 14 and 15 are installed in the via hole 111. When the via hole 111 is formed on the substrate 11 as described above, the groove 131 of the reflector 13 has an outer surface of the annular protrusion 12 formed on the substrate 11 shown in FIG. 3. And by a ceramic bonding material. At this time, the groove 131 of the reflector 13 is an asymmetrical shape.

In addition, as illustrated in FIG. 4, thermal via holes 113 may be formed in a portion or a side in which the LED chip 16 is mounted in addition to the via hole 111. . The thermal via holes 113 are formed to easily discharge heat generated from the LED chip 16 to the outside.

Meanwhile, an encapsulant 17 is formed to cover the LED chip 16 and the bonding wire W. The encapsulant 17 fills the opening. The encapsulant 17 may include at least one phosphor to convert ultraviolet light or visible light into, for example, white light. In addition, the upper surface of the encapsulant 17 may be a flat surface or may have a constant curvature. In addition, the height of the encapsulant 17 is higher than the height of the annular protrusion 12, but the height of the encapsulant 17 is preferably determined by the height of the annular protrusion 12. More preferably, the height of the annular protrusion 12 may be equal to or higher than the height of the encapsulant 17. As a result, the resin forming the encapsulant 17 can be prevented from leaking outside the annular protrusion 12 to the outside, thereby greatly reducing product defects.

1 is a cross-sectional view for explaining an LED package according to an embodiment of the present invention.

Figure 2 is a cross-sectional view for explaining an LED package according to another embodiment of the present invention.

3 is an exploded perspective view of the LED package shown in FIG.

Figure 4 is a cross-sectional view for explaining an LED package according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

1: LED Package 11: Substrate

12: protrusion 13: reflector

14: first lead terminal 15: second lead terminal

16 LED chip 17 encapsulation material

111: via hole 113: thermal via hole

131: home

Claims (7)

LED chip; A substrate having a mounting surface on which the LED chip is mounted; A protrusion formed on the substrate to surround the LED chip; And The LED package including a reflector is formed on the substrate, the groove is coupled to the protrusion. The method according to claim 1, The reflector is formed on the substrate, LED package, characterized in that it comprises a ceramic injection or plastic injection molding having an opening for exposing the first and second lead terminals. The method according to claim 1, The substrate further includes via holes connecting the upper and lower portions of the substrate, The via hole is an LED package, characterized in that the first and second lead terminals are installed. The method according to any one of claims 1 to 3, And the substrate and the reflector are bonded with a bonding material with the groove inserted in the protrusion. The method according to any one of claims 1 to 3, The height of the protrusion is determined by the height of the encapsulant covering the LED chip LED package. The method according to any one of claims 1 to 3, The substrate is an LED package, characterized in that the ceramic substrate. The method according to any one of claims 1 to 3, LED substrate, characterized in that the substrate and the protrusion is integral.

Images