KR101504282B1 - Light emitting device package - Google Patents

Abstract

The present invention relates to a light emitting device package having a lead frame, a light emitting element arranged in the lead frame, and a light emitting element coupled to the lead frame, the light emitting element having a light emitting luminance uniform and a narrow directivity angle and excellent durability, A molding member having an opening for allowing light generated in the mold member to pass therethrough and having a support portion continuously or intermittently arranged along the opening periphery and an opening portion corresponding to the opening of the molding member And a reflective structure having a shape corresponding to the support portion of the molding material.

Description

A light emitting device package

The present invention relates to an apparatus for emitting light, and more particularly to a light emitting device package.

In general, a light emitting element is used as a light source of a backlight unit in an electronic device, for example, a display device, or as a light source of a stroboscope for a photographing apparatus and a camera. Such a light emitting device can be packaged in various forms before being coupled to each device, and the backlight unit or the strobe for a camera has the light emitting device package thus packaged.

However, in the conventional light emitting device package, significant heat is generated in the light emitting device, and the generated heat is not easily discharged to the outside. As a result, there has been a problem that the lifetime of the light emitting device is reduced, for example, the molding material is inflated or the reflective structure is detached. Further, there is a problem in that the luminance is lowered as the directional angle of the emitted light becomes wider and further away from the optical axis.

It is an object of the present invention to provide a light emitting device package which is excellent in heat radiation performance, uniform in light emission luminance, narrow in directing angle, structurally stable, and excellent in durability, in order to solve various problems including the above- . However, these problems are exemplary and do not limit the scope of the present invention.

According to one aspect of the present invention, there is provided a light emitting device including: a lead frame; a light emitting element disposed in the lead frame; an opening formed in the lead frame and passing light generated in the light emitting element, And a reflective structure having a shape corresponding to the support portion of the molding material, the molding material having an opening corresponding to the opening of the molding material and having a supporting portion arranged continuously or continuously, Is provided.

And an adhesive layer interposed between at least a part of the molding material and the reflective structure to fix the reflective structure to the molding material.

The adhesive layer may have a first thickness at a portion closer to the light emitting element than a second thickness at a portion far from the light emitting element.

The thickness of the adhesive layer may gradually decrease from the light emitting element.

The reflective structure may include a radiating surface spreading from the molding material in a direction in which light emitted from the light emitting device is emitted.

The radiation surface of the reflective structure may form a predetermined angle with respect to the main emission direction of the light generated in the light emitting device.

The predetermined angle may be greater than or equal to 10 degrees, and less than or equal to 25 degrees.

Wherein the emission surface of the reflective structure forms a first angle with a main emission direction of light generated from the light emitting device from a point of contact with the molding material to a first point of the molding material away from the molding material, Emitting direction of the light emitted from the light emitting element to a second point farther from the molding material than a point, and a second angle larger than the first angle.

The supporting portion may spread in a radial direction in a direction in which light generated from the light emitting device is emitted from the surface of the molding material facing the opening.

According to another aspect of the present invention, there is provided a light emitting device comprising: a lead frame; a light emitting element disposed on the lead frame; a molding member coupled to the lead frame and having an opening for emitting light emitted from the light emitting element; A reflecting structure which has an opening corresponding to the opening of the molding material and makes contact with the molding material; and at least a part of the reflecting structure is interposed between the molding material and the reflecting structure to fix the reflecting structure to the molding material, And a first thickness at a portion of the light emitting element is greater than a second thickness at a portion far from the light emitting element.

The support portion may be an L-shaped stepped portion disposed at an edge portion and protruding in the direction of the reflective structure.

The adhesive layer containing space is formed between the molding material and the reflective structure so that a first thickness of the adhesive layer in a portion close to the light emitting element is smaller than a thickness of the adhesive layer in a portion far from the light emitting element The space width of the portion closer to the light emitting element may be larger than the space width of the portion far from the light emitting element so as to be thicker than the second thickness of the light emitting element.

The reflective structure may be formed with at least one lead frame welding protrusion protruded in the lead frame direction to pass through the molding material and welded to the lead frame by a welding material.

The lead frame welding protrusion may be welded to the upper surface of the first lead so as to be electrically connected to the first lead of the lead frame and electrically insulated from the second lead.

The lead frame welding protrusion may be a cylindrical protrusion or a square column protrusion having a sloped surface formed on a side surface thereof.

The reflective structure may be formed with at least one substrate welding protrusion protruding toward the substrate so as to pass through the molding material and the lead frame and welded to the welding pad of the substrate by a welding material.

The substrate welding protrusion may be spaced apart from the lead frame so as to be electrically insulated from the lead frame.

The substrate welding protrusion may be a cylindrical protrusion or a square column protrusion having an inclined surface formed on a side surface thereof.

The welding material may include a solder.

The reflective structure may be formed to protrude in the direction of the molding material, and may have a fixed blade portion formed with a through hole through which the fixing member installed in the molding material may pass.

The fixing member may be a molding-type fixing member that is molded into a through hole formed in the molding material and a through-hole of the fixed blade.

The reflective structure may be formed to protrude in the direction of the molding material, and a welding wing portion to be welded to the metal frame may be formed.

And a hook member provided on the reflecting structure and hooking the reflecting structure to the molding material or the lead frame.

The hook member may include: a hook provided on a side surface of the reflective structure; And a hook groove portion formed on a side surface of the molding material or the lead frame and into which the hook can be inserted.

The hook member may include a hook provided on a side surface of the molding material or the lead frame, and a hook groove portion formed on a side surface of the reflective structure and into which the hook can be inserted.

According to one embodiment of the present invention, as described above, a light emitting device package having excellent heat dissipation performance, uniform luminance, low directivity angle, and high durability can be realized. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view schematically showing a light emitting device package according to an embodiment of the present invention.
2 is an exploded perspective view schematically showing the light emitting device package of FIG.
3 is a cross-sectional view schematically showing a cross section taken along line III-III in FIG.
4 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
FIG. 5 is a cross-sectional view schematically illustrating a light path and a light-emitting surface of a light emitting device package according to embodiments of the present invention.
6 is a graph schematically showing the directivity angle of light emitted from the light emitting device package according to the embodiments of the present invention.
7 is a perspective view schematically showing a part of a light emitting device package according to an embodiment of the present invention.
8 is a perspective view schematically showing a light emitting device package according to another embodiment of the present invention.
9 is an exploded perspective view schematically showing the light emitting device package of Fig.
10 is a plan view showing the reflective structure of FIG.
11 is a cross-sectional view in the forward direction of the reflective structure of Fig.
12 is a front view of the reflective structure of Fig.
13 is a side view of the reflective structure of FIG.
14 is a bottom view of the reflective structure of Fig.
15 is a plan view showing the molding material of Fig.
16 is a side sectional view of the molding material of Fig.
17 is a side view of the molding material of Fig.
18 is a bottom view of the molding material of Fig.
19 is a plan perspective view showing the light emitting device package of Fig.
20 is a side view showing the light emitting device package of Fig.
21 is a perspective view schematically showing a light emitting device package according to another embodiment of the present invention.
22 is an exploded perspective view showing the light emitting device package of Fig.
23 is a side view showing the light emitting device package of Fig.
24 is a bottom view showing the light emitting device package of Fig.
25 is a perspective view schematically showing a light emitting device package according to another embodiment of the present invention.
26 is an exploded perspective view showing the light emitting device package of Fig.
27 is a plan view showing the reflective structure of FIG. 26;
28 is a cross-sectional view showing an AA cut plane of the reflection structure of FIG. 27;
29 is a lateral cross-sectional view showing the reflective structure of Fig. 26;
Fig. 30 is a bottom view showing the reflecting structure of Fig. 26;
31 is a plan view showing the molding material of Fig. 26;
32 is a cross-sectional view showing the BB cutting face of the molding material of Fig. 31;
Fig. 33 is a cross-sectional view showing the CC cutting face of the molding material of Fig. 31;
Fig. 34 is a bottom view showing the molding material of Fig. 31;
35 is a lateral cross-sectional view of the light emitting device package of Fig.
36 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
37 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
38 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
39 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

In the following embodiments, the main emission direction of the light generated in the light emitting element refers to the + z direction.

FIG. 1 is a perspective view schematically showing a light emitting device package according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the light emitting device package of FIG. 1. And Fig. 3 is a cross-sectional view schematically showing a section taken along the line III-III in Fig.

The light emitting device package according to the present embodiment may include a lead frame, a light emitting device 20, a molding material 30, and a reflective structure 40 as shown in the figure.

The lead frame may include a first lead 11 and a second lead 12. Of course, you can include more leads. For example, the lead frame may include a die pad to which a light emitting device 20 to be described later is to be disposed, and first and second leads spaced apart from the die pad. In the drawings, it can be understood that the die pad and the first lead are integrated.

The light emitting element 20 is disposed on the lead frame, and may be disposed on the first lead 11, for example, as shown in the drawing. The light emitting device 20 is a device that emits light by receiving an electric signal and can be used as a light source of various electronic devices. For example, the light emitting device 20 may be composed of a diode of a compound semiconductor, and the light emitting device 20 may be called a light emitting diode (LED). Such a light emitting diode can emit light of various colors depending on the material of the compound semiconductor.

The light emitting device 20 may be electrically connected to the first lead 11 and / or the second lead 12, and may be electrically connected using a conductive adhesive member or electrically connected through wiring.

The molding material 30 may be bonded to the lead frame to form the overall shape of the light emitting device package. The molding material 30 may have an opening 31 through which the light generated from the light emitting device 20 passes. In the drawing, an opening (not shown) through which the light generated in the light emitting device 20 can travel in the + z direction 31 are provided in the molding material 30.

The molding material 30 may be formed of resin through a transfer molding method or the like. Of course, the molding material 30 may be formed by injection molding, injection molding or the like in addition to the transfer molding method. As the resin usable as the molding material 30, epoxy and the like can be mentioned.

The molding material 30 may include a support portion 33 that is continuous or intermittently arranged around the opening 31. Specifically, the support portion 33 may be provided adjacent to the outside of the opening 31 along the periphery of the opening 31. In the figure, the support portion 33 is shown enclosing and surrounding the opening 31 of the molding material 30. However, as shown above, the supporting portion 33 may continuously surround the opening 31 of the molding material 30 as long as it is limited to the illustrated one.

For example, if the molding material 30 has a substantially rectangular parallelepiped shape, a hollow opening 31 is formed at the center of the upper surface thereof, and the light emitting device 20 can be seated in the substantially center of the opening 31. The support portion 33 may extend along the periphery of the opening 31 of the molding material 30 and protrude in the + z direction from the edge of the molding material 30 as shown in FIG.

At this time, the support portion 33 may spread in the form of a radiation toward the opening 31 of the molding material 30 in a direction in which light emitted from the light emitting device 20 is emitted (for example, + z direction). Specifically, the support portion 33 may be an inclined surface that descends as the inner surface thereof is adjacent to the opening 31 of the molding material 30. This is because the support 33 supports the reflective structure 40 to be described later more stably. The support 33 can also guide or limit the coupling position of the reflective structure 40 to more precisely guide or confine the coupling position of the reflective structure 40.

In addition, the support portion 33 may include four L-shaped steps when viewed from above, which are disposed at four corner portions and protrude in the direction of the reflective structure 40. This is because the molding member 30 can more firmly align and support the reflective structure 40 in the front, rear, left, and right directions using the support portion 33.

The resin layer 60 may be disposed on the light emitting element 20 in the opening 31 of the molding material 30 so as to cover the light emitting element 20 in order to protect the light emitting element 20 from external moisture. The phosphor layer may be mixed with the resin layer 60 to fill the opening 31 of the molding material 30 in whole or in part. Of course, the resin layer 60 mixed with the phosphor may be partially filled, and the phosphor-free (transparent) filler may be separately filled. The resin layer 60 or the filler material may fill the opening 31 of the molding material 30 as well as the bottom or the top of the reflective structure 40 to be described later.

The reflective structure 40 has an opening corresponding to the opening 31 of the molding material 30 and can be assembled to the molding material 30. [ The reflective structure 40 may include a metal having excellent thermal conductivity. The reflective structure 40 may have a radiation surface 45 that radiates in a direction in which the light emitted from the light emitting device 20 is emitted.

Describing the role of the reflective structure 40, the reflective structure 40 can reflect the light emitted from the light emitting device 20 in the + z direction. More specifically, light emitted from the light emitting element 20 has light traveling in the + z direction but light traveling in the + z direction and the + y direction. By proceeding in the + z direction after being reflected by the slope 45, the luminance at the front of the light emitting device package can be remarkably increased, and the directivity angle of the light emitted from the light emitting device package can be narrowed. That is, the emission surface 45, which is a component of the reflective structure 40, can act as a reflective surface together with the inclined side surface of the opening 31 of the molding material 30. [

It is of course possible to consider forming the reflecting portion by only the inner surface of the opening 31 of the molding material 30 but it is also possible to form the reflecting portion between the + z direction and the + y direction without reaching the inner surface of the opening 31 of the molding material 30. [ There may be light to do. In the case of the light emitting device package according to the present embodiment, the light can be reflected by the emission surface 45 disposed outside the light casting member 30 and proceed in the + z direction.

The radiation surface 45 of the reflective structure 40 may have a flat or bent cross-section. For example, referring to FIG. 3, the emission surface 45 of the reflective structure 40 may have a flat cross-section. That is, the emission surface 45 of the reflective structure 40 may form a predetermined angle a with respect to the main emission direction of the light generated in the light emitting element 20. [ Here, the main emission direction of the light emitted from the light emitting element 20 refers to the + z direction. At this time, the predetermined angle a may be greater than or equal to 10 degrees, and less than or equal to 25 degrees.

4 is a cross-sectional view of a light emitting device package according to another embodiment of the present invention. FIG. 4 is a cross-sectional view of a light emitting device package according to this embodiment taken at a position similar to the line III-III of FIG.

4, the emission surface 45 of the reflective structure 40 is disposed in the + z direction from the point of contact with the molding material 30 to the first point 43 away from the molding material 30, and a second angle a2 from the first point 43 to the second point 44 farther from the molding material 30 than the first point 43 can be achieved. At this time, the second angle a2 may be larger than the first angle a1. Specifically, the first angle a1 may be approximately 10 degrees, and the second angle a2 may be approximately 25 degrees. In addition, the second angle a2 may be smaller than the first angle a1.

Here, the second point 44 may be, for example, the end of the reflective structure 40. That is, the first point 43 is located between the ends of the inner surface of the reflecting structure 40 disposed in the + z direction, that is, the ends of the molding material 30 (-z direction) and the light emitting direction (+ z direction) It can be a certain point. The first point 43 and the second point 44 may be continuously arranged around the opening 31 of the molding material 30 to form a line around each of them.

The light emitted from the light emitting element 20 can be emitted to the emission surface 45 by inclining the emission surface 45 at a predetermined angle a. Accordingly, the directivity angle of light emitted from the light emitting device package can be narrowed. Also, the emission surface 45 of the reflective structure 40 may be coated with a reflective material such as silver to improve reflectance. Of course, it may be coated to a portion other than the radiation surface 45 for convenience.

The reflective structure 40 has a shape corresponding to the support portion 33 and can contact the molding material 30. For example, when the support portions 33 are continuously disposed, the reflective structure 40 may be formed as a continuous portion corresponding to the shape of the support portion 33. [ As another example, if the support portion 33 is intermittently arranged as shown, the reflective structure 40 may also include an intermittent shape to be inserted between the supports 33.

5 is a cross-sectional view schematically showing a path of light emitted from a light emitting device package according to embodiments of the present invention. FIG. 5 schematically shows the light path of the light emitting device package according to the embodiment shown in FIG. 3, but may be applied to the same or similar light emitting device package according to the embodiment shown in FIG.

5, the light emitted from the light emitting device 20 can arrive at the A region of the light directing surface 70 directly along the first path 21 and along the second path 22 to the molding material 30 And may reach the B region of the dimming surface 70 and may be reflected by the reflective structure 40 along the third path 23 to arrive at the C region of the dimming surface 70. [

At this time, if the reflectance of the reflective structure 40 and the molding material 30 are the same, the luminance of the A region is the highest, the B region is the next highest, and the luminance of the C region is low. In other words, as the distance from the optical axis increases, the luminance decreases. In particular, the luminance gradually decreases from the B region to the C region.

However, according to embodiments of the present invention, the reflective structure 40 may have a higher reflectivity than the molding material 30. [ For example, as described above, the reflective structure 40 may include a metal and may have a higher reflectivity than the molding material 30 made of a resin material. Therefore, the luminance of the light irradiated to the C region along the third path 23 can be higher than that of the conventional art due to the high reflectance of the reflective structure 40. Accordingly, the brightness does not decrease sharply as it goes from region A to region C, and the luminance gradually decreases from region A to region C. In particular, the luminance may gradually change from region B to region C, Thus, the light having a substantially constant brightness can be effectively irradiated onto the light control surface 70 to which the light reaches.

6 is a graph illustrating the directivity angle of light emitted from the light emitting device package according to the embodiments of the present invention.

The conventional light emitting device package has a peak of light output in the direction of the optical axis and light is emitted so that the light output does not decrease sharply but gradually decreases as the angle from the optical axis increases. In addition, since the conventional light emitting device package has a wide directivity angle and a great distance from the optical axis, the reduction in light output is not large so that the total luminance of the light emitted from the light emitting device package gradually decreases in a wide range, .

However, according to embodiments of the present invention, the light emitted from the light emitting device 20 is reflected by the reflective structure 40 so that the light output does not decrease and becomes substantially constant even if it is moved away from the optical axis in the vicinity of the optical axis . Further, by narrowing the directivity angle, the luminance can be increased at the portion irradiated with the light. Therefore, the light emitted from the light emitting device package can be constant and high in luminance in the vicinity of the optical axis even if it is moved away from the optical axis. Accordingly, when used for a flash of a cellular phone or a camera, it is possible to effectively irradiate light of a high luminance and a constant brightness in all the regions to be photographed. That is, the above-mentioned optical lenses are effectively used as flash optical lenses so as to be combined with the light emitting device package so that light having a uniform and uniform intensity can be irradiated in the irradiation area.

7 is a perspective view schematically showing a location of the adhesive layer 50 among the light emitting device packages according to an embodiment of the present invention. Hereinafter, the adhesive layer 50 will be described with reference to Figs. 3, 4 and 7. Fig. An adhesive layer 50 may be provided on at least a part of the space between the molding material 30 and the reflective structure 40 to fix the reflective structure 40 to the molding material 30.

The adhesive layer 50 may be disposed between the support portion 33 of the molding material 30 and the reflective structure 40 as shown in Fig. That is, the adhesive layer 50 minimally exposes the portion exposed to the outside, and generally has a low light reflectance, so that the adhesive layer 50 is formed between the emission surface 45 of the reflective structure 40 and the opening 31 of the molding material 30 It is preferable not to be exposed. The adhesive layer 50 is interposed between the support 33 and the reflective structure 40 as shown and may not be interposed between the reflective structure 40 and the portion of the molding 30 adjacent the opening 31 have.

Referring to FIG. 3, the adhesive layer 50 may have a different thickness depending on its position in order to minimize the amount thereof and to maximize the adhesive force. The first thickness 51 at a portion closer to the light emitting element 20 may be thicker than the second thickness 52 at a portion far from the light emitting element 20. [ At this time, the thickness of the adhesive layer 50 may gradually decrease as the distance from the light emitting device 20 increases.

Generally, the place where heat is generated in the light emitting device package is the light emitting device 20, and the closer to the light emitting device 20, the more heat is affected by the heat generated in the light emitting device 20. The thickness of the adhesive layer 50 is sufficient at a portion close to the light emitting element 20 so that the bonding between the molding material 30 and the reflective structure 40 is ensured and the adhesive layer 50 50 can be reduced to reduce the manufacturing cost by reducing the amount of material used in manufacturing the light emitting device package.

For this purpose, an adhesive layer accommodating space in which the adhesive layer 50 can be accommodated may be formed between the molding material 30 and the reflective structure 40.

The adhesive layer accommodating space is formed such that the first thickness 51 of the adhesive layer 50 near the light emitting device 20 is smaller than the second thickness 52 of the adhesive layer 50 near the light emitting device 20 The space width of the portion closer to the light emitting element 20 may be larger than the space width of the portion far from the light emitting element 20 so that the light emitting element 20 may be thick.

According to another embodiment of the present invention, the light emitting device package may include a lead frame, a light emitting device 20, a molding material 30, a reflective structure 40, and an adhesive layer 50. The light emitting device package according to this embodiment is the same as or similar to the light emitting device package according to the above-described embodiment. Therefore, redundant description will be omitted.

The molding material 30 is combined with the lead frame and an opening 31 for emitting light generated in the light emitting device 20 may be formed. That is, in the present embodiment, the molding material 30 may be omitted from the molding material 30 of the light emitting device package according to the above-described embodiment.

The reflective structure 40 has an opening corresponding to the opening 31 of the molding material 30 and can contact the molding material 30. [ In this embodiment, the reflective structure 40 is the same as or similar to the reflective structure 40 of the light emitting device package according to the above-described embodiment, but may optionally have a shape corresponding to the supporting portion 33.

The adhesive layer 50 may be interposed at least partly between the molding material 30 and the reflective structure 40 to fix the reflective structure 40 to the molding material 30. [ The adhesive layer 50 may be thicker than the second thickness 52 at a portion closer to the light emitting element 20 than at the portion farther from the light emitting element 20. In this embodiment, the adhesive layer 50 is the same as or similar to the adhesive layer 50 of the light emitting device package according to the above-described embodiment, and a detailed description thereof will be omitted. This is to maintain the adhesive strength.

FIG. 8 is a perspective view schematically showing a light emitting device package according to another embodiment of the present invention, and FIG. 9 is an exploded perspective view schematically illustrating the light emitting device package of FIG. 9 is a front view of the reflective structure of Fig. 9, Fig. 13 is a side view of the reflective structure of Fig. 9, and Fig. 14 is a bottom view of the reflective structure of Fig. Fig. 15 is a plan view showing the molding material of Fig. 9, Fig. 16 is a side sectional view of the molding material of Fig. 9, Fig. 17 is a side view of the molding material of Fig. 9, and Fig. 18 is a bottom view of the molding material of Fig. FIG. 19 is a planar perspective view showing the light emitting device package of FIG. 8, and FIG. 20 is a side view showing the light emitting device package of FIG.

8 to 20, the reflective structure 40 of the light emitting device package according to another embodiment of the present invention protrudes in the direction of the lead frame to pass through the molding material 30, At least one lead frame welding protrusion 40-1 to be welded to the lead frame may be formed on the bottom surface thereof.

The welding material W may be a welding material made of a metal material including solder and may be welded at a temperature not lower than the melting point of the material of the reflective structure 40, the material of the lead frame, All kinds of welded materials developed for welding can be applied so that they are cured at a temperature below the melting point and are firmly fixed to each other either mechanically or electrically.

9, the lead frame welding protrusion 40-1 is electrically connected to only the first lead 11 of the lead frame and is electrically insulated from the second lead 12 Only two can be welded to the upper surface 11a of the first lead 11. [

Here, the number of the lead frame welding protrusions 40-1 may be various, and the reflective structure 40 shown in FIGS. 8 to 20 may include two lead frame welding And a projecting projection 40-1 may be provided.

The bottom surface of the lead frame welding protrusion 40-1 may be flat so as to correspond to the top surface of the first lead 11 so that welding of the welding material W is easily performed.

Since the lead frame welding protrusion 40-1 can be electrically connected to the first lead 11 but not to the second lead 12, It is possible to prevent a short circuit, a safety accident caused by a discharge or other leakage current, and the like.

In addition, though not shown, the lead frame welding protrusion 40-1 may have an insulating layer such as an oxide film formed on the surface thereof so as to be electrically insulated from the lead frame, or may be formed entirely or partially from an insulating material It is possible.

Also, the welding material W to be welded between the lead frame welding protrusion 40-1 and the lead frame may include a solder. Alternatively, the welding material W may be made of an insulating material, It is also possible to prevent electricity from flowing between the lead frame welding protrusion 40-1 and the lead frame.

Also, as shown in FIGS. 8 to 14, the lead frame welding protrusion 40-1 may be a square column-shaped protrusion having a sloped side surface so that the contact surface can be easily guided during assembly.

Although not shown, the lead frame welding protrusions 40-1 may be applied to various types of protrusions such as a cylindrical protrusion, an elliptical column protrusion, a triangular column protrusion, a polygonal protrusion, and a geometric protrusion .

11, the emission surface 45 of the reflective structure 40 is divided into a first inclined surface 45-1 having a first inclination angle with respect to the ground and a second inclined surface 45-1 having a second inclination angle (45-2). Here, the second inclination angle may be larger than the first inclination angle so that the first inclined surface 45-1 is inclined more slantingly than the second inclined surface 45-2.

8 to 20, the reflective structure 40 can be supported by the support portion 33 of the molding material 30, and is also firmly held by the adhesive layer 50 described above The protrusion 40-1 for welding the lead frame of the reflective structure 40 may be passed through the molding material 30 and the first lead 11 of the lead frame may be fixed to the welding material W ) So that it can be structurally very strong even if thermal expansion occurs between the parts or an external impact is generated, thereby greatly improving the electrical, mechanical and thermal durability.

FIG. 21 is a perspective view schematically showing a light emitting device package according to another embodiment of the present invention, and FIG. 22 is an exploded perspective view illustrating the light emitting device package of FIG. FIG. 23 is a side view showing the light emitting device package of FIG. 21, and FIG. 24 is a bottom view of the light emitting device package of FIG.

21 to 24, the reflective structure 40 of the light emitting device package according to another embodiment of the present invention protrudes toward the substrate 80 so as to pass through the molding material 30 and the lead frame And at least one substrate welding protrusion 40-2 welded to the welding pad 81 of the substrate 80 by the welding material W may be formed on the bottom surface thereof.

21 to 24, the substrate welding protrusions 40-2 are formed on the lead frame 11 so as to be electrically insulated from the first lead 11 or the second lead 12 of the lead frame, And the separation distance L1 in Figs. 23 and 24.

Therefore, since the substrate welding protrusion 40-2 is not electrically connected to the first lead 11 and the second lead 12, electricity does not flow through the reflective structure 40, It is possible to prevent safety accidents caused by discharging or other leakage currents.

In addition, though not shown, the substrate welding protrusion 40-2 may be formed with an insulating layer such as an oxide film on its surface or may be made of an insulating material wholly or partly so as to be electrically insulated from the lead frame Do.

The welding material W to be welded between the substrate welding protrusions 40-2 and the substrate 80 may also include a solder. Alternatively, the welding material W may be made of an electrically insulating material It is also possible to prevent electricity from flowing between the substrate welding protrusion 40-2 and the lead frame.

The welding material W may be a welding material made of a metal material including solder and may be welded at a temperature not lower than the melting point of the material of the reflective structure 40, the material of the lead frame, Any type of conductive or insulating weld material developed for welding may be applied so that it is hardened at a temperature below the melting point and firmly fixes the object to itself mechanically or electrically.

In addition, the number of the substrate welding protrusions 40-2 may vary widely. The reflective structure 40 shown in FIGS. 21 to 24 includes one substrate welding protrusion 40- 2) may be installed. In addition, the protruding portions 40-2 for welding a plurality of substrates such as two, three, or four can be provided.

The bottom surface of the substrate welding protrusion 40-2 may be formed flat so as to correspond to the upper surface of the welding pad 81 of the substrate 80 so that welding of the welding material W is facilitated.

As shown in FIGS. 21 to 24, the substrate welding protrusion 40-2 may be a rectangular column-shaped protrusion having a sloped side surface so as to easily guide the contact surface during assembly.

In addition, although not shown, the substrate welding protrusion 40-2 can be applied to various types of protrusions such as a cylindrical protrusion, an elliptical column protrusion, a triangular column protrusion, a polygonal column protrusion, and a geometric protrusion have.

21 to 24, the reflective structure 40 can be supported by the support portion 33 of the molding material 30 and can be firmly and firmly held by the adhesive layer 50 described above. The protrusion 40-2 for welding the substrate of the reflective structure 40 may be fixed to the welding pad 30 of the substrate 80 through the molding material 30 and the lead frame 81 can be firmly welded with the welding material W, so that even if thermal expansion occurs between parts or an external impact is generated, it is structurally very robust, and electrical, mechanical and thermal durability can be greatly improved.

FIG. 25 is a perspective view schematically illustrating a light emitting device package according to another embodiment of the present invention, and FIG. 26 is an exploded perspective view illustrating the light emitting device package of FIG. 25. 26 is a plan view of the reflective structure of Fig. 26, Fig. 28 is a forward sectional view of the reflective structure of Fig. 26, Fig. 29 is a lateral sectional view of the reflective structure of Fig. 26, 31 is a plan view showing the molding material of Fig. 26, Fig. 32 is a sectional view showing the BB cutting face of the molding material of Fig. 31, Fig. 33 is a cross sectional view showing the CC cutting face of the molding material of Fig. 31, Fig. 35 is a lateral cross-sectional view showing the light emitting device package of Fig. 25; Fig.

25 to 35, the reflective structure 40 of the light emitting device package according to another embodiment of the present invention protrudes toward the substrate 80 so as to pass through the molding material 30 and the lead frame And at least one substrate welding protrusion 40-3 welded to the welding pad 82 of the substrate 80 by the welding material W of Fig. 26 may be formed on the bottom surface thereof.

The substrate welding protrusion 40-3 may be a cylindrical protrusion having a sloped surface formed on a side surface thereof.

31 to 33, the supporting portion 33 of the molding material 30 may be formed in a wide variety of shapes to support the reflective structure 40, but as shown in FIGS. 26 to 35 The supporting portion 33 may be formed in the upper surface of the molding material 30 along the rim with a generally rectangular quadrilateral 33-1 and a circular shape formed in two corner portions of the quadrilateral 33-1. And may be a circular hole 33-3 formed in the groove 33-2 and the other two corner portions.

33, the substrate welding protrusion 40-3 having a relatively long length may be inserted into the circular hole 33-3, and the circular groove 33-2 may have a length A relatively short cylindrical protrusion 40-4 can be inserted.

34, the substrate welding protrusion 40-3 is inserted into the circular hole 3-3 of the molding material 30 to form the first lead 11 of the lead frame, 1 through the lead hole H1 and is not electrically connected to the second lead 12 even if it is electrically connected to the first lead 11, it is possible to prevent a safety accident caused by leakage, discharge, Can be prevented.

In addition, though not shown, the substrate welding protrusions 40-3 may be formed of an insulating layer such as an oxide film on the surface or may be made entirely or partly of an insulating material so as to be electrically insulated from the lead frame, It is also possible to install it away from the lead frame.

The welding material W may be a welding material made of a metal material including solder. The welding material W may be welded at a temperature higher than the melting point of the material of the reflective structure 40, the material of the lead frame, Any type of conductive or insulating weld material developed for welding may then be applied so that it is cured at a temperature below the melting point and can be mechanically or electrically fixed to each other firmly.

In addition, the number of the projection portions 40-3 for welding the substrate may be various. The reflection structure 40 shown in FIGS. 25 to 35 includes two substrate welding projections 40- 3) may be installed. In addition, a plurality of protruding portions 40-3 for welding a substrate may be provided, such as one, three, or four.

The bottom surface of the substrate welding protrusion 40-3 may be flat so as to correspond to the upper surface of the welding pad 82 of the substrate 80 so that welding of the welding material W is facilitated.

25 to 35, the reflective structure 40 is formed by joining the groove 33-1 of the support 33 of the molding material 30 with the circular groove 33-2, And can be supported by the circular holes 33-3 and can be firmly fixed by the adhesive layer 50 described above and also the substrate welding protrusions 40- 3 can be firmly welded to the welding pad (82) of the substrate (80) through the molding material (30) and the lead frame with the welding material (W), so that thermal expansion Even if an external impact is generated, it is structurally very robust and can greatly improve electrical, mechanical and thermal durability.

36 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.

36, the reflective structure 40 is formed on the bottom surface thereof to protrude in the direction of the molding material 30 and has a through hole through which the fixing member 90 installed in the molding material 30 can pass A fixed blade portion 100 in which a hole H2 is formed may be formed.

The fixing member 90 may be a molding type fixing member that is molded into the through hole H3 formed in the molding material 30 and the through hole H2 in the fixed blade unit 100. [

The worker inserts the fixed wing 100 into the molding material 30 and then inserts the through hole H3 formed in the molding material 30 and the through hole H2 in the fixed wing 100, The fixing member 90 may be formed by molding a molding material.

The fixing member 90 formed in this way is formed by injection molding of the molding material 30 and the through hole H3 formed in the molding material 30 and the through hole H3 formed in the molding material 30. [ Through hole (H2), it can be bonded very firmly. Therefore, even if thermal expansion occurs between parts or an external impact is generated, it is structurally very strong and greatly improves electrical, mechanical and thermal durability .

37 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.

37, the light emitting device package according to another exemplary embodiment of the present invention may further include a metal frame 110 mounted on the molding material 30, A welding blade 120 protruding toward the molding material 30 and welded to the metal frame 110 with a welding material W may be formed.

The operator inserts the metal frame 110 into the molding material 30 and inserts the welding wing 120 of the reflecting structure 40 into the metal frame 110 ).

Therefore, the welding wing 120 formed by this method is welded very firmly to the metal frame 110, which is insert-molded in the molding material 30, so that thermal expansion between the parts occurs or external impact Even if it occurs, it is structurally very strong and can greatly improve the electrical, mechanical and thermal durability.

38 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.

38, a light emitting device package according to another exemplary embodiment of the present invention includes a light emitting device package 300 mounted on a reflective structure 40 and hooked to hook the reflective structure 40 to the molding material 30 or the lead frame, Member 130 as shown in FIG.

38, the hook member 130 is formed on the side surface of the molding material 30 and includes a hook 131 provided on the side surface of the reflective structure 40, and the hook 131 And a hook groove portion 132 into which the hook portion 132 can be inserted.

38, the hook 131 may be made of the same metal material as the reflective structure 40, or may be made of other metal Or other materials such as resin.

In addition, the hook 131 may have a rounded tip with a rounded end. In addition, a tip of an arrowhead shape, a tip of a triangular shape, or other various shapes of tip portions can be applied so that one-way assembly is possible but reverse separation is difficult.

The hook groove 132 may be formed on the side surface of the lead frame instead of the side surface of the molding material 30. [

Therefore, when the operator assembles the reflective structure 40 into the molding material 30, the operator can easily grasp the hooks 131 of the reflective structure 40 by one-touch operation of pressing the reflective structure 40 against the molding material 30. [ May be coupled to the hook groove portion 132 of the molding material so as to be firmly fixed.

At this time, as the support portion 33, a step formed on the contact surface between the reflective structure 40 and the molding material 30 may be applied. In addition, various protrusions, grooves, various other shapes of engagement may be applied.

39 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.

Referring to FIG. 39, a hook member 130 of a light emitting device package according to another embodiment of the present invention includes a hook 133 provided on a side surface of the lead frame and a hook 133 formed on a side surface of the reflective structure 40 And a hook groove 134 into which the hook 133 can be inserted.

39, the hook 133 may be made of the same metal material as the lead frame, or may be made of other metal, resin, or the like that has appropriate elasticity to be deformed or returned by the pressing force during assembly, It can be made of other materials.

In addition, the hook 133 may have a rounded tip with a rounded end. In addition, a tip of an arrowhead shape, a tip of a triangular shape, or other various shapes of tip portions can be applied so that one-way assembly is possible but reverse separation is difficult.

Therefore, when the operator assembles the reflective structure 40 into the molding material 30, the hook 133 of the lead frame can be easily removed by the one-touch operation of pressing the reflective structure 40 against the molding material 30, And can be firmly fixed to the hook groove portion 132 of the reflecting structure 40 by being engaged.

At this time, as the support portion 33, a step formed on the contact surface between the reflective structure 40 and the molding material 30 may be applied. In addition, various protrusions, grooves, various other shapes of engagement may be applied.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

11: first lead
12: second lead
20: Light emitting element
30: Molding material
31: opening
33: Support
40: reflective structure
45:
50: Adhesive layer
51: first thickness
52: second thickness
W: Welding material
40-1: protrusion for welding lead frame
11a: upper surface
80: substrate
81: Welding pad
40-2, and 40-3: protrusions for welding a substrate
L1: separation distance
33-1: Shackle
33-2: Circular groove
33-3: Round hole
40-4: Cylindrical protrusion
H1: First lead hole
90: Fixing member
H2, H3: Through hole
100: fixed wing portion
110: metal frame
120: welding wing
130: hook member
131, 133: Hook
132, 134: a hook groove portion

Claims (27)

Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening;
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material; And
An adhesive layer interposed between at least a part of the molding material and the reflective structure to fix the reflective structure to the molding material;
/ RTI >
Wherein the adhesive layer has a first thickness at a portion close to the light emitting element and a second thickness at a portion far from the light emitting element. The method according to claim 1,
Wherein the reflective structure includes a radiating surface that radiates from the molding material in a direction in which light emitted from the light emitting element is emitted. 3. The method of claim 2,
Wherein the emission surface of the reflective structure has a predetermined angle with respect to a main emitting direction of light generated in the light emitting element. The method of claim 3,
Wherein the predetermined angle is greater than or equal to 10 degrees, and less than or equal to 25 degrees. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
Wherein the reflective structure has a radiating surface spreading from the molding material in a direction in which light emitted from the light emitting device is emitted,
The radiation surface of the reflective structure
And a first angle with a main emission direction of light generated from the light emitting device from a point coupled to the molding material to a first point away from the molding material,
And a second angle larger than the first angle with a main emission direction of light generated from the light emitting element from the first point to a second point farther from the molding material than the first point. 3. The method of claim 2,
The radiation surface of the reflective structure
And a first angle with a main emission direction of light generated from the light emitting device from a point coupled to the molding material to a first point away from the molding material,
And a second angle smaller than the first angle with a main emission direction of light generated in the light emitting element from the first point to a second point farther from the molding material than the first point. The method according to claim 1,
Wherein the reflective structure comprises a metal. The method according to claim 1,
Wherein the supporting portion is spread in a shape in which a surface of the molding material facing the opening is emitted in a direction in which light emitted from the light emitting device is emitted. delete delete The method according to claim 1,
Wherein the thickness of the adhesive layer gradually decreases from the light emitting element. Lead frame;
A light emitting element disposed on the lead frame;
A molding member coupled to the lead frame and having an opening for passing light generated from the light emitting device;
A reflective structure having an opening corresponding to the opening of the molding material; And
Wherein the reflective structure is interposed between the molding material and the reflective structure to fix the reflective structure to the molding material, and wherein a first thickness at a portion near the light emitting device is greater than a second thickness at a portion far from the light emitting device Adhesive layer;
Emitting device package. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
Wherein the support portion is an L-shaped stepped portion disposed at an edge portion and protruding in the direction of the reflective structure. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
An adhesive layer containing space is formed between the molding material and the reflective structure so that the adhesive layer can be received,
Wherein the adhesive layer accommodation space has a space width at a portion close to the light emitting element so that a first thickness at a portion of the adhesive layer close to the light emitting element is thicker than a second thickness at a portion far from the light emitting element, Wherein the light emitting element package is wider than the space width of the distant portion. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
Wherein the reflective structure is formed with at least one lead frame welding protrusion protruded in the lead frame direction to pass through the molding material and welded to the lead frame by a welding material. 16. The method of claim 15,
The lead frame welding protrusions may include:
Wherein the first lead is electrically connected to only the first lead of the lead frame and is welded to the upper surface of the first lead so as to be electrically insulated from the second lead. 16. The method of claim 15,
Wherein the protrusion for welding the lead frame is a cylindrical protrusion or a square column protrusion having an inclined surface formed on a side surface thereof. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
Wherein the reflective structure is formed with at least one substrate welding protrusion protruding toward the substrate so as to pass through the molding material and the lead frame and welded to the welding pad of the substrate by a welding material, . 19. The method of claim 18,
The substrate welding protrusions may be formed,
And is spaced apart from the leadframe so as to be electrically insulated from the leadframe. 19. The method of claim 18,
Wherein the protrusion for welding the substrate is a cylindrical protrusion or a square column protrusion having an inclined surface formed on a side surface thereof. 19. The method according to claim 15 or 18,
Wherein the welding material comprises a solder. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
The reflective structure may include:
And a fixed blade portion formed to protrude toward the molding material and having a through hole through which the fixing member installed in the molding material can be formed. 23. The method of claim 22,
Wherein the fixing member is a molding-type fixing member that is molded into a through-hole formed in the molding material and a through-hole in the fixed blade. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
And a metal frame installed on the molding material,
Wherein the reflective structure is formed so as to protrude toward the molding material, and a welding wing portion to be welded to the metal frame is formed. Lead frame;
A light emitting element disposed in the lead frame;
A molding member coupled to the lead frame and having an opening through which the light emitted from the light emitting device is allowed to pass and having a support portion continuously or intermittently arranged along the opening; And
A reflecting structure having an opening corresponding to the opening of the molding material and having a shape corresponding to the supporting portion of the molding material;
Lt; / RTI >
A hook member for hooking the reflective structure to the molding material or the lead frame;
Emitting device package. 26. The method of claim 25,
The hook member
A hook provided on a side surface of the reflective structure; And
A hook groove portion formed on a side surface of the molding material or the lead frame and into which the hook can be inserted;
Emitting device package. 26. The method of claim 25,
The hook member
A hook provided on a side surface of the molding material or the lead frame; And
A hook groove portion formed on a side surface of the reflective structure and into which the hook can be inserted;
Emitting device package.

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