KR20100002778A - Method for making ceramic package - Google Patents

Abstract

PURPOSE: A method for making ceramic package is provided to manufacture a ceramic package without a broken of thin part between cavities since a transfer load is not transferred to the cavity. CONSTITUTION: In a method for making ceramic package, a non-plastic ceramic substrate(100) in which cavities are formed into a column and row is prepared. The cutting pattern including a partial cutting pattern and cutting pattern is formed on the ceramic substrate. The ceramic substrate in which the cutting pattern is formed is plasticized. The ceramic substrate is plasticized according to the cutting pattern.

Description

Ceramic Package Manufacturing Method {METHOD FOR MAKING CERAMIC PACKAGE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a ceramic package, and more particularly, to a ceramic package for mounting a light emitting diode through a step of forming a cutting pattern, firing, and cutting from an unbaked ceramic substrate having a cavity. It relates to a manufacturing method.

As a package in which the light emitting diodes are mounted, ceramic packages are frequently used. Ceramic material has excellent thermal characteristics, and has the advantage of excellent light, heat, and moisture reliability.

Some ceramic packages have a cavity that is deep enough to accommodate a light emitting diode. Such a ceramic package is manufactured from an unbaked ceramic substrate having a laminated structure of ceramic sheets. Prior to lamination of the ceramic sheet, a punching process and / or a screen printing process for forming a cavity and the like are performed. The punching process is to form holes defining a plurality of cavities arranged in rows and columns.

Breaking methods and dicing methods are known for making ceramic packages.

The braking method is to partially cut (or free) between the rows and columns of the cavities and the outline surrounding the entire cavity with a cut line of 1/2 to 2/3 of the substrate thickness before firing the ceramic substrate at high temperature. After cutting, and after firing is completed, the ceramic substrate is cut in the unit of cavity along the cutting line. In addition, the dicing method is a method of completely cutting the ceramic substrate on which baking was completed with a sharp blade instead of omitting a partial cutting process before a predetermined time.

The conventional braking method has a problem in that a thin portion between the cavity and the cavity is easily broken in the braking process after firing, and the cut surface by the braking is not clean. Moreover, although the conventional dicing method cut | disconnects using a sharp blade, many foreign substances generate | occur | produce in a cut surface, and there exists a problem which is difficult to apply to cutting of a thick ceramic substrate.

Furthermore, the side view type light emitting diode package requires an elongated slot type cavity. For this purpose, when cutting a ceramic substrate on which a slot type cavity is formed in a unit of cavity, cutting between two long sides of a neighboring cavity is very difficult. it's difficult.

Therefore, the technical problem of the present invention is to improve the cutting pattern forming step in manufacturing a ceramic package for mounting a light emitting diode through a step of forming a cutting pattern, firing and cutting from an unbaked ceramic substrate. Through this, the phenomenon of thinning between the cavities is reduced.

Another technical problem of the present invention is to improve the cutting pattern forming step in manufacturing a ceramic package for mounting a light emitting diode through a step of forming a cutting pattern, firing and cutting from an unbaked ceramic substrate. To obtain a ceramic package having a clean cut surface.

According to an aspect of the present invention, there is provided a method of preparing a non-ceramic ceramic substrate having cavities formed in rows and columns, forming a cutting pattern including a partial cutting pattern and a complete cutting pattern on the ceramic substrate; A method of manufacturing a ceramic package is provided, comprising: firing a ceramic substrate having the cut pattern formed thereon, and cutting the fired ceramic substrate along the cut pattern.

Preferably, the forming of the cutting pattern may include forming a partial cutting pattern between the columns and the columns of the cavities and forming a complete cutting pattern between the rows and the rows of the cavities.

Preferably, the forming of the cutting pattern further includes forming an outer line surrounding the cavities as the partial cutting pattern.

According to one embodiment of the present invention, the complete cutting pattern may be an elongated hole formed by the punching process.

According to one embodiment of the invention, the complete cutting pattern may be a single cutting line formed by the blade processing.

According to one embodiment of the invention, the complete cutting pattern may be a double cutting line formed by the blade processing.

According to another aspect of the invention, preparing a unbaked ceramic substrate formed of rows and columns of cavities, forming a cut pattern on the ceramic substrate, firing the ceramic substrate formed with the cut pattern, and Cutting the fired ceramic substrate along a cutting pattern, wherein forming the cutting pattern includes forming a single cutting line between the columns and the columns of the cavities, and double cutting between the rows and the rows of cavities. Provided is a method of manufacturing a ceramic package that forms a line. In this case, the double cutting line is preferably a partial cutting pattern formed to a depth smaller than the thickness of the ceramic substrate.

According to the present invention, in the manufacture of a ceramic package for mounting a light emitting diode through a step of forming a cutting pattern, firing and cutting from a fired ceramic substrate, a phenomenon in which thin portions between cavities are broken is greatly increased. The ceramic package can be reduced and a clean surface can be obtained.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Therefore, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a flowchart illustrating a method of manufacturing a ceramic package according to the present invention.

Referring to FIG. 1, the method of manufacturing a ceramic package according to the present invention includes preparing a unbaked ceramic substrate (S1), forming a cut pattern on the ceramic substrate (S2), and forming the cut pattern ceramic. Firing the substrate (S3) and cutting the ceramic substrate along the cutting pattern (S4).

In step S1, an unbaked ceramic substrate having a laminated structure of ceramic sheets and having a cavity arranged in rows and columns is prepared. The ceramic sheets and the laminated structure thereof are in a soft state before firing. Prior to lamination of the ceramic sheets, at least one of the ceramic sheets is subjected to a punching process and / or a screen printing process for forming a cavity and the like. The unbaked ceramic substrate includes a structure in which cavities are arranged in rows and columns. In addition, in the prepared unbaked ceramic substrate, in addition to the above-mentioned cavities, the positions for forming the plating pattern and / or the via for the electrode may be previously formed in the form of holes and / or grooves.

In step S2, cutting patterns including a partial cutting pattern and a complete cutting pattern are formed on the unbaked ceramic substrate. The partial cut pattern is a pattern formed using a sharp blade at a depth smaller than the thickness of the ceramic substrate (eg, 1/2 to 2/3 of the substrate thickness). The complete cut pattern is a cut pattern formed by using a punch or a blade and the like at the same depth as the thickness of the ceramic substrate.

The partial cut pattern allows the unbaked ceramic substrate to be maintained without being cut completely until the firing step, despite the presence of the complete cut pattern. In addition, the complete cut pattern is preformed before firing with respect to a weak part and / or a part where a smooth surface is required, and thus, during the post-firing cutting process, the thin part between the cavity and the cavity, in particular, breaks up. It can reduce drift and provide a smooth, clean surface to the finished ceramic package.

Step S3 is a baking step of baking the ceramic substrate on which the cutting pattern is formed at a high temperature. Korean Patent Publication No. 2006-0003491 discloses a technique for firing ceramic at a temperature of 800 ~ 1000 ℃. However, the firing temperature for the ceramic substrate can be appropriately selected by the operator. In addition, the firing step may be performed according to various techniques known in the art.

In step S4, a cutting pattern is formed and cutting is performed on the ceramic substrate on which the firing step is completed. The cutting can produce a ceramic package including one cavity. Plating patterns and / or vias for electrodes are formed in the ceramic package in subsequent processes, after which the light emitting diodes are housed in a cavity, for example in the form of a chip, and connected with the plating pattern.

In step 4 according to the present invention, cutting of the ceramic substrate is made along the cutting pattern formed in step S2. For the part in which the partial cut pattern is formed, additional cutting work by braking or dicing is required, but the part in which the complete cut pattern is formed is already cut and no additional cutting work is required. And a clean cut surface is obtained by a complete cut pattern, and there is substantially no cracking in the vicinity of the cut surface.

When the above cutting step (S4) is completed, a plurality of ceramic packages having one cavity are manufactured, and the ceramic packages thus manufactured are, for example, forming a plating pattern and vias (or electrode connections). The light emitting diode package may be manufactured and sold through a subsequent process such as mounting of the light emitting diode, wire bonding, and forming a sealing support in the cavity.

Forming a cut pattern on the ceramic substrate (S2) is an important feature of the present invention, hereinafter, the step of forming such a cut pattern will be described in more detail with reference to various embodiments.

<Example 1>

2 is a plan view illustrating a cutting pattern process according to a first exemplary embodiment of the present invention.

Referring to FIG. 2, an unbaked ceramic substrate 100 is formed in which a plurality of cavities 102 are arranged in rows and columns. For convenience, although the rows and columns of the cavities 102 are shown as being two rows and two columns, the cavities may actually be arranged in more rows and columns. In this embodiment, the cavities 102 have a slot shape having a long side, which is suitable for a side view type light emitting diode package. Between two opposing long sides of neighboring cavities is particularly vulnerable when cutting ceramic substrates.

For ease of understanding, the partial cut patterns 110 and 112 in FIG. 2 are indicated by dashed lines. In the present exemplary embodiment, the partial cutting pattern may include a first partial cutting pattern 110 that is a rectangular outline line surrounding the cavity 102 as a whole, and a second partial cutting pattern formed between the rows and the rows of the cavities 102. Pattern 112. The first and second partial cutting patterns 110 and 112 are formed to have a depth smaller than the thickness of the ceramic substrate 100 using sharp blades.

For ease of understanding, the complete cut pattern 120 in FIG. 2 is shown as a hatch. The complete cut pattern 120 is formed long between the rows of cavities. In addition, the complete cut pattern 120 is an elongated hole having a predetermined width formed through a punching process.

The complete cutting pattern, ie, the long hole 120, is formed in parallel between the long sides of each of the cavities 102 between two rows of cavities 102 adjacent to each other. Therefore, as the width of the long hole 120 is wider, the gap between the long side and the cut surface of the cavity 102 may be thinner. Even if the gap between the long side of the cavity and the cut surface becomes thin, since the cut surface is a face that has been completely cut before firing, even after the firing step and subsequent cut steps, no cracking or damage in the portion substantially occurs. In addition, since the cut surface becomes the outer surface of the ceramic package, a beautiful ceramic package can be obtained by using the above-described cutting pattern forming step.

<Example 2>

3 is a plan view illustrating a cutting pattern process according to a second exemplary embodiment of the present invention.

Referring to FIG. 3, the first and second partial cut patterns 110 and 112 may have an outer line surrounding the cavities 102 to a depth smaller than the thickness of the ceramic substrate 100, and between the rows of the cavities 102. Is formed in the same manner as in the first embodiment.

In contrast, the complete cut pattern 122 of the present embodiment is a single cut line formed to a depth equal to the thickness of the ceramic substrate 100 between the rows of the cavities 102. For convenience, the single cut line 122 is indicated by a solid line. The single cutting line 122 is formed by blade processing, unlike the long hole of the first embodiment, which was formed by punching. Since the single cutting line 122 is formed at the pre-firing stage of the ceramic substrate, it is possible to thin the cutting surface formed by the single cutting line 122 and the long side of the cavity 102. In addition, the cut surface is a surface cut in advance before the actual cutting step of the fired ceramic substrate. Thus, the cut surface does not require an additional braking process and can be a clean surface.

<Example 3>

4 is a plan view illustrating a cutting pattern process according to a third exemplary embodiment of the present invention.

Referring to Fig. 4, the present embodiment is the same as in the second embodiment, except that the cutting patterns formed between the rows and the rows of the cavities are double cut lines 124a and 124b. The process of this embodiment employing double cut lines 124a and 124b as a cut pattern may be more suitable than the previous embodiment to produce a ceramic package with a thin product thickness. This is because, in the cutting step of the ceramic substrate made after firing, the elongated rectangular portions between the double cutting lines 124a and 124b easily come off without being subjected to a large impact.

<Example 4>

When the double cut line is used as the cut pattern, the double cut line is not formed as a complete cut pattern, and the cut lines 125a and 125b, which are indicated by the dotted lines of FIG. 5, are formed to have a depth smaller than the thickness of the ceramic substrate. It can be a double cutting line. 5 is a plan view of the unbaked ceramic substrate in which the double cut lines 125a and 125b are formed in a partial cut pattern. When the double cut line is a partial cut pattern, even if a shear load is applied to an area between rows and rows during the process of cutting the fired ceramic substrate, the shear load is blocked by the double cut lines 125a and 125b. It is not properly delivered to the cavity. Therefore, it is possible to manufacture the ceramic package without breaking while thinning between the long side and the cut surface of the cavity 102.

2 to 5 show a ceramic substrate comprising an elongated slot shaped cavity, the shape of the cavity is not limiting of the invention and the cavity may be circular, elliptical or other geometrical shape.

1 is a flow chart illustrating a method of manufacturing a ceramic package according to the present invention.

2 is a plan view for explaining a cutting pattern process according to a first embodiment of the present invention.

3 is a plan view for explaining a cutting pattern process according to a second embodiment of the present invention.

4 is a plan view for explaining a cutting pattern process according to a third embodiment of the present invention.

5 is a plan view for explaining a cutting pattern process according to a fourth embodiment of the present invention.

Claims (8)

Preparing an unbaked ceramic substrate having cavities formed in rows and columns; Forming a cut pattern on the ceramic substrate, the cut pattern including a partial cut pattern and a complete cut pattern; Firing the ceramic substrate on which the cutting pattern is formed; And And cutting the fired ceramic substrate along the cutting pattern. The method of claim 1, wherein the forming of the cutting pattern comprises forming a partial cutting pattern between the columns and the columns of the cavities, and forming a complete cutting pattern between the rows and the rows of the cavities. Way. 3. The method of claim 2, wherein the forming of the cut pattern further comprises forming an outer line surrounding the cavities as the partial cut pattern. 4. The method of claim 2, wherein the complete cut pattern is an elongated long hole formed by a punching process. The method of claim 2, wherein the complete cutting pattern is a single cutting line formed by blade processing. The method of claim 2, wherein the complete cut pattern is a double cut line formed by a blade process. Preparing an unbaked ceramic substrate having cavities formed in rows and columns; Forming a cutting pattern on the ceramic substrate; Firing the ceramic substrate on which the cutting pattern is formed; And Cutting the fired ceramic substrate along the cutting pattern; The forming of the cutting pattern may include forming a single cutting line between the columns and the columns of the cavities, and forming a double cutting line between the rows and the rows of the cavities. The method of claim 7, wherein the double cutting line is a partial cutting pattern formed to a depth smaller than the thickness of the ceramic substrate.

Images