CN111710611A - Method for reducing fracture of central area of copper-clad ceramic substrate - Google Patents
Method for reducing fracture of central area of copper-clad ceramic substrate Download PDFInfo
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- CN111710611A CN111710611A CN202010517503.1A CN202010517503A CN111710611A CN 111710611 A CN111710611 A CN 111710611A CN 202010517503 A CN202010517503 A CN 202010517503A CN 111710611 A CN111710611 A CN 111710611A
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- copper foil
- edge
- reinforcing rib
- longitudinal
- substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 64
- 239000000919 ceramic Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 68
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000011889 copper foil Substances 0.000 claims abstract description 42
- 238000005516 engineering process Methods 0.000 claims description 12
- 238000005336 cracking Methods 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000003698 laser cutting Methods 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a method for reducing fracture of a central area of a copper-clad ceramic substrate, wherein the substrate is rectangular and comprises an upper short edge, a lower short edge, a left long edge and a right long edge; a plurality of substrate graphs can be arranged on the substrate, and when the substrate graphs are designed, longitudinal copper foil reinforcing ribs and transverse copper foil reinforcing ribs are additionally arranged at the center of the substrate graphs; the rigidity of the substrate is improved by adding the longitudinal and transverse copper foil reinforcing ribs at the center of the pattern of the DBC substrate, so that the substrate ceramic is prevented from being broken along the center of the substrate ceramic after being pressed in the production process, and the product yield is improved.
Description
Technical Field
The invention belongs to the field of DBC substrate manufacturing, relates to application of a DBC substrate, and particularly relates to a method for reducing fracture of a central area of a copper-clad ceramic substrate.
Background
In order to reduce the thermal resistance of a copper-clad ceramic substrate (DBC) and improve the heat dissipation performance of the copper-clad ceramic substrate, DBC manufacturers achieve the requirement by reducing the thickness of the ceramic sheet. However, after the thickness of the ceramic sheet is reduced, the corresponding mechanical strength is correspondingly reduced. In the actual production process, although the peripheral edges of the substrate are provided with the process edges for protecting the ceramic at the edges from being damaged and cracked, in the processing process of each procedure after etching, especially in the processes of solder resist printing, surface nickel gold plating, laser cutting and the like, because the thickness of the ceramic is too thin, the product is easy to break along the longitudinal or transverse area of the center of the plate surface after being pressed, and the product is scrapped. See fig. 1.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a method for reducing the fracture of the central area of a copper-clad ceramic substrate, which improves the rigidity of the substrate by adding longitudinal and transverse copper foil reinforcing ribs at the center of a DBC substrate graph, prevents the substrate ceramic from fracturing along the center after being pressed in the production process, and improves the yield of products.
The technical scheme of the invention is as follows: a method for reducing the fracture of the central area of a copper-clad ceramic substrate is disclosed, wherein the substrate is rectangular and comprises an upper short edge, a lower short edge, a left long edge and a right long edge; the base plate can be arranged with a plurality of base plate graphs, and when the base plate graphs are designed, a longitudinal copper foil reinforcing rib and a transverse copper foil reinforcing rib are added at the center of the base plate graphs.
Furthermore, the thickness of the ceramic sheet of the substrate is 0.25 mm-1.0 mm, the length of the long side of the substrate is 180 mm-200 mm, and the length of the short side of the substrate is 130 mm-150 mm.
Further, go up minor face edge and be provided with technology limit, minor face edge is provided with down technology limit down, long limit edge is provided with left technology limit on a left side, long limit edge is provided with right technology limit on a right side.
Furthermore, the longitudinal copper foil reinforcing ribs are positioned on the longitudinal central line of the substrate.
Further, the length of the longitudinal copper foil reinforcing rib extends from the upper technical edge to the lower technical edge of the substrate.
Furthermore, the distance between the longitudinal copper foil reinforcing rib and the upper process edge and the distance between the longitudinal copper foil reinforcing rib and the lower process edge are both 0.5 mm-1.5 mm, and the width of the longitudinal copper foil reinforcing rib is 3mm-8 mm.
Furthermore, the transverse copper foil reinforcing ribs are positioned on the transverse central line of the substrate and are divided into two blocks which are symmetrical left and right, one block is arranged on the left side of the longitudinal copper foil reinforcing ribs, and the other block is arranged on the right side of the longitudinal copper foil reinforcing ribs.
Furthermore, the distance between the transverse copper foil reinforcing rib on the left side and the left technical side and the distance between the transverse copper foil reinforcing rib on the left side and the longitudinal reinforcing rib are both 0.5 mm-1.5 mm, and the width is 3 mm-6 mm; the distance between the transverse copper foil reinforcing rib on the right side and the right technical side and the distance between the transverse copper foil reinforcing rib on the right side and the longitudinal reinforcing rib are both 0.5 mm-1.5 mm, and the width is 3 mm-6 mm.
Furthermore, the width of the upper technical edge and the width of the lower technical edge are 5 mm-15 mm.
Furthermore, the width of the left technical side and the right technical side is 5 mm-15 mm.
The invention has the beneficial effects that:
1. for a DBC substrate with a ceramic chip with the thickness of 0.25 mm-1.0 mm, when the pattern of the DBC substrate is designed, longitudinal and transverse copper foil reinforcing ribs are added in the center of the pattern, the rigidity of a mother board is improved by the copper foil reinforcing ribs, and the ceramic is prevented from being broken along the center after the mother board is pressed in the production process.
2. The longitudinal copper foil reinforcing ribs penetrate through the whole board surface from top to bottom, and the transverse reinforcing ribs are symmetrically divided into a left section and a right section by taking the longitudinal reinforcing ribs as the left section and the right section, so that after the laser cutting process is completed, the substrate is easily broken into small pieces from the longitudinal direction, and the product yield of the laser cutting process is improved.
Drawings
FIG. 1 shows that the ceramic is too thin, and the product is easy to break along the longitudinal or transverse area of the center of the plate surface after being pressed, so that the product is scrapped.
FIG. 2 shows a longitudinal copper foil reinforcing rib designed at the center of the substrate pattern, and a left section and a right section of transverse reinforcing ribs are designed by taking the longitudinal copper foil reinforcing rib as symmetry.
In the figure: 1 is a fracture area, 2 is a longitudinal reinforcing rib, and 3 is a transverse reinforcing rib.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
In the embodiment, the longitudinal and transverse copper foil reinforcing ribs are added at the center of the pattern of the DBC substrate to improve the rigidity of the substrate, so that the problem that the substrate ceramic is broken along the center of the substrate ceramic after being pressed in the production process is solved, and the product yield is improved.
The design steps of this example are as follows:
1. when designing the substrate pattern, longitudinal and transverse copper foil reinforcing ribs are added at the center of the pattern. The base plate is rectangular and comprises an upper short edge, a lower short edge, a left long edge and a right long edge. The ceramic plate thickness of the substrate is 0.38mm (the method is basically applicable to DBC with the ceramic plate thickness in the range of 0.25 mm-1.0 mm), the length of the long side of the substrate is 180 mm-200 mm, and the length of the short side of the substrate is 130 mm-150 mm. Go up minor face edge and be provided with the technology limit, minor face edge is provided with down the technology limit down, long limit edge is provided with left technology limit on a left side, long limit edge is provided with right technology limit on a right side. The width of the upper technical edge and the lower technical edge is 7mm (the width can be in the range of 5 mm-15 mm). The width of the left technical side and the right technical side is 7mm (the width can be in the range of 5 mm-15 mm).
2. Longitudinal copper foil reinforcing rib design
a) The width of the longitudinal copper foil reinforcing rib is 5mm (the width can be within the range of 3mm-8 mm).
b) The length extends from the upper process edge A1 to the lower process edge A2, both being 1mm (here, the width may range from 0.5mm to 1.5 mm) from A1, A2. The width is 5 mm.
3. Designing a transverse copper foil reinforcing rib:
a) the longitudinal reinforcing rib is used as a center and is symmetrically divided into a left section and a right section.
b) The left section of reinforcing rib extends rightwards from the left technical edge B1 of the edge of the substrate to the longitudinal reinforcing rib, the distance B between the left section of reinforcing rib and the B1 and the distance B between the left section of reinforcing rib and the longitudinal reinforcing rib are both 1mm (the width of the left section of reinforcing rib ranges from 0.5mm to 1.5 mm), and the width of the left section of reinforcing rib ranges from 5mm (the width of the left section of reinforcing rib ranges from 3mm to 8.
c) The right section of reinforcing rib extends leftwards from the right technical edge B2 of the edge of the substrate to the longitudinal reinforcing rib, the distance between the right section of reinforcing rib and the B2 and the distance between the right section of reinforcing rib and the longitudinal reinforcing rib are both 1mm (the width of the right section of reinforcing rib ranges from 0.5mm to 1.5 mm), and the width of the right section of reinforcing rib ranges from 5mm (the width of the right section of reinforcing rib ranges from 3mm to 8 mm). See fig. 2.
Through the longitudinal and transverse copper foil reinforcing ribs designed at the center of the substrate, the defect that the substrate ceramic is broken along the center of the substrate ceramic after being pressed in the production process due to the excessively thin thickness of the ceramic can be reduced, and the product yield is improved.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A method for reducing the fracture of the central area of a copper-clad ceramic substrate is characterized by comprising the following steps: the substrate is rectangular and comprises an upper short edge, a lower short edge, a left long edge and a right long edge; the base plate can be arranged with a plurality of base plate graphs, and when the base plate graphs are designed, a longitudinal copper foil reinforcing rib and a transverse copper foil reinforcing rib are added at the center of the base plate graphs.
2. The method for reducing the breakage of the central area of the copper-clad ceramic substrate according to claim 1, wherein the method comprises the following steps: the thickness of the ceramic sheet of the substrate is 0.25 mm-1.0 mm, the length of the long side of the substrate is 180 mm-200 mm, and the length of the short side of the substrate is 130 mm-150 mm.
3. The method for reducing the breakage of the central area of the copper-clad ceramic substrate according to claim 1 or 2, wherein: go up minor face edge and be provided with the technology limit, minor face edge is provided with down the technology limit down, long limit edge is provided with left technology limit on a left side, long limit edge is provided with right technology limit on a right side.
4. The method for reducing the cracking of the central area of the copper-clad ceramic substrate according to claim 3, wherein: the longitudinal copper foil reinforcing ribs are positioned on the longitudinal central line of the substrate.
5. The method for reducing the cracking of the central area of the copper-clad ceramic substrate according to claim 4, wherein: the length of the longitudinal copper foil reinforcing rib extends from the upper technical edge to the lower technical edge of the substrate.
6. The method for reducing the cracking of the central area of the copper-clad ceramic substrate according to claim 5, wherein: the distance between the longitudinal copper foil reinforcing rib and the upper process edge and the distance between the longitudinal copper foil reinforcing rib and the lower process edge are both 0.5 mm-1.5 mm, and the width is 3mm-8 mm.
7. The method for reducing the cracking of the central area of the copper-clad ceramic substrate according to claim 4, wherein: the transverse copper foil reinforcing ribs are positioned on the transverse central line of the substrate and are divided into two blocks which are symmetrical left and right, one block is arranged on the left side of the longitudinal copper foil reinforcing ribs, and the other block is arranged on the right side of the longitudinal copper foil reinforcing ribs.
8. The method for reducing the cracking of the central area of the copper-clad ceramic substrate according to claim 7, wherein: the distance between the transverse copper foil reinforcing rib on the left side and the left technical side and the distance between the transverse copper foil reinforcing rib on the left side and the longitudinal reinforcing rib are both 0.5-1.5 mm, and the width is 3-6 mm; the distance between the transverse copper foil reinforcing rib on the right side and the right technical side and the distance between the transverse copper foil reinforcing rib on the right side and the longitudinal reinforcing rib are both 0.5 mm-1.5 mm, and the width is 3 mm-6 mm.
9. The method for reducing the cracking of the central area of the copper-clad ceramic substrate according to claim 3, wherein: the width of the upper technical edge and the lower technical edge is 5 mm-15 mm.
10. The method for reducing the cracking of the central area of the copper-clad ceramic substrate according to claim 3, wherein: the width of the left technical side and the right technical side is 5 mm-15 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010517503.1A CN111710611A (en) | 2020-06-09 | 2020-06-09 | Method for reducing fracture of central area of copper-clad ceramic substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010517503.1A CN111710611A (en) | 2020-06-09 | 2020-06-09 | Method for reducing fracture of central area of copper-clad ceramic substrate |
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| Publication Number | Publication Date |
|---|---|
| CN111710611A true CN111710611A (en) | 2020-09-25 |
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|---|---|---|---|
| CN202010517503.1A Pending CN111710611A (en) | 2020-06-09 | 2020-06-09 | Method for reducing fracture of central area of copper-clad ceramic substrate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025048A (en) * | 2011-09-22 | 2013-04-03 | 常州紫寅电子电路有限公司 | Ultra-thin anti-fracture printed circuit board |
| CN104411100A (en) * | 2014-12-16 | 2015-03-11 | 南通富士通微电子股份有限公司 | Making method of substrate with support |
| CN206422972U (en) * | 2017-01-24 | 2017-08-18 | 昆山市鸿运通多层电路板有限公司 | A kind of hydrocarbon circuit board of high-strength ceramic using the formula design of paving copper |
| CN110379793A (en) * | 2019-07-08 | 2019-10-25 | 上海申和热磁电子有限公司 | One kind covering copper ceramic substrate motherboard structure |
-
2020
- 2020-06-09 CN CN202010517503.1A patent/CN111710611A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025048A (en) * | 2011-09-22 | 2013-04-03 | 常州紫寅电子电路有限公司 | Ultra-thin anti-fracture printed circuit board |
| CN104411100A (en) * | 2014-12-16 | 2015-03-11 | 南通富士通微电子股份有限公司 | Making method of substrate with support |
| CN206422972U (en) * | 2017-01-24 | 2017-08-18 | 昆山市鸿运通多层电路板有限公司 | A kind of hydrocarbon circuit board of high-strength ceramic using the formula design of paving copper |
| CN110379793A (en) * | 2019-07-08 | 2019-10-25 | 上海申和热磁电子有限公司 | One kind covering copper ceramic substrate motherboard structure |
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Effective date of registration: 20201112 Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Applicant after: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Applicant before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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Application publication date: 20200925 |