KR20090126084A - Cold chamber of semiconductor inspection device - Google Patents

Abstract

PURPOSE: A cold chamber of a semiconductor test device is provided to secure an inserting space for inserting a signal delivering part by arranging an insulating plate and an insulating material to a space inside an opening hole of a chamber. CONSTITUTION: A receiving space is formed inside a chamber(10). An opening hole is formed to one surface of the chamber, and is communicated with the receiving space. An end part of a signal delivering part(20) is exposed to the receiving space of the chamber. A rear end part of the signal delivering part is exposed to an outer part of the chamber. The signal delivering part is installed to the opening hole of the chamber. A connector(30) is fixed to the end part of the signal delivering part inside the receiving space of the chamber. A semiconductor device is connected to the connector. An insulating plate(40) includes an outer wall, an inner wall, and a vertical wall arranged between the outer wall and the inner wall. A heating part(50) heats the signal delivering part at an inserting hole of the insulating plate. A cover(60) finishes an inner side and an outer side of the opening hole of the chamber.

Description

COLD CHAMBER OF SEMICONDUCTOR INSPECTION DEVICE}

The present invention relates to a cold chamber of a semiconductor inspection apparatus, and more particularly, to a cold chamber of a semiconductor inspection apparatus capable of preventing cold inside the cold chamber from leaking to the outside through a signal transmission unit to prevent condensation from occurring outside the chamber. It is about.

A general semiconductor inspection apparatus puts a completed semiconductor device through a predetermined manufacturing process into a chamber for creating an environment of high temperature and low temperature, and tests whether the semiconductor device can perform a normal function even under extreme temperature conditions. Device for classifying by grade.

Such a semiconductor inspection apparatus is to provide a high or low temperature environment to a semiconductor device to be inspected, and includes a chamber in which a semiconductor device is mounted in a test tray, a connector to which a semiconductor device is electrically connected in the chamber, and the chamber. Signal transmission unit penetrated from the outside of the chamber to provide an electrical signal to the internal connector, heating and cooling means for heating or cooling the inside of the chamber, blower means for circulating air in the chamber, during the inspection of the semiconductor device Temperature control means for maintaining the inside of the chamber at an appropriate temperature for inspection.

Such a semiconductor inspection apparatus is configured to apply a test signal of a predetermined pattern to a semiconductor device in a state in which the internal temperature of the chamber is set to a high temperature or a low temperature, and the semiconductor device is accommodated in the chamber, and the electrical characteristics thereof are measured so that the device is subjected to a high or low temperature environment. Is to check whether it works properly.

However, in the conventional semiconductor inspection apparatus, when a low temperature environment is formed in the chamber, cold air inside is conducted to the outside through an installation space of a signal transmission unit and a chamber through which the signal transmission unit is inserted, so that the outer end and the chamber of the signal transmission unit Condensation occurs on the outside, and condensation water (結 露水) formed by the condensation is introduced into the electrical connection portion, causing problems such as a short circuit of the electrical wiring.

Accordingly, an object of the present invention is to solve such a conventional problem, to provide a cold chamber of the semiconductor inspection apparatus that can prevent the cold air inside the cold chamber leaks to the outside to prevent condensation from occurring outside the chamber. have.

The present invention also provides a cold chamber of a semiconductor inspection apparatus, which prevents the outflow of cold air through the opening hole of the chamber, and is firmly supported by an insulating plate inserted into the opening hole, with a cover closing both sides of the opening hole. There is this.

In addition, to provide a cold chamber of the semiconductor inspection device that prevents the cold air is conducted through the contact between the components by preventing the components directly exposed to the low temperature environment in the receiving space inside the chamber. There is a purpose.

According to the present invention, in the cold chamber of the semiconductor inspection apparatus for testing the semiconductor device by applying an electrical signal to the semiconductor device accommodated in the accommodation space while maintaining the interior space in a low temperature environment, the accommodation space is A chamber formed therein and having an opening formed in one surface thereof so as to communicate with the accommodation space; A connector fixed to the distal end of the signal transmission unit in the receiving space of the chamber to electrically connect the semiconductor device; an outer wall and an inner wall disposed inside and outside the opening hole in the opening hole; An insulating plate having a horizontal wall disposed between the inner wall and the outer wall to form a ball; and the insulation Heating unit is disposed in the insertion hole to heat parts of the signal transmission; And a cover closing the inside and the outside of the opening hole of the chamber, respectively.

The cold chamber of the semiconductor inspection device of the present invention preferably further includes a heat insulating material inserted into an inner space partitioned by the outer wall, the inner wall and the horizontal wall of the insulating plate.

The heat generating portion of the cold chamber of the semiconductor inspection device of the present invention is preferably provided on the inner surface of the insulating plate insertion hole.

It is also preferable that the heat generating portion of the cold chamber of the semiconductor inspection device of the present invention is provided on the outer surface of the signal transmission portion.

According to the present invention, there is provided a cold chamber of a semiconductor inspection apparatus that can prevent the cold air inside the cold chamber leaks to the outside to prevent condensation from occurring outside the chamber.

In addition, by arranging the insulating plate together with the heat insulating material in the space of the opening of the chamber, the insertion space into which the signal transmission unit is inserted is secured, and the gap between the covers closing both sides of the opening is supported to support the gap between the cold air inside the chamber. Of course, there is also the effect of assembling firmly structurally.

In addition, there is an effect of preventing the conduction of cold air through each component by interposing the silicon pad inside the connector and the inner cover exposed to the low-temperature environment in the interior of the chamber.

Prior to the description, in the various embodiments, components having the same configuration will be representatively described in the first embodiment using the same reference numerals, and in other embodiments, different configurations from the first embodiment will be described. do.

Hereinafter, a cold chamber of a semiconductor inspection apparatus according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing the configuration of a cold chamber of the semiconductor inspection device of the present invention, and FIG. 2 is an enlarged view of portion "A" of FIG.

As shown in the drawings, the cold chamber of the semiconductor inspection apparatus of the present invention includes a chamber 10, a signal transmission unit 20, a connector 30, an insulating plate 40, a heat generating unit 50, and a cover 61 and 62. It is configured to include a heat insulating material 70 and the silicon pad (80).

The chamber 10 is to seal the accommodating space 11 formed therein so as to create an internal pressure or temperature in a desired state, and the wall 12 partitioning the accommodating space 11; An opening hole 13 is formed through one surface of the wall 12, and there is provided a temperature control means and a blower (not shown) for maintaining the internal temperature of the accommodation space 11 at a high or low temperature. Can be. Here, the wall 12 has an inner box 12a having an inner side corresponding to the receiving space 11, an outer box 12b surrounding the outer side of the inner box 12a, and the inner box 12a and the outer box 12b. It consists of a heat insulating material 12c interposed between and preventing heat conduction.

The signal transmission unit 20 is installed in the opening hole 13 so that the front end is exposed to the receiving space 11 of the chamber 10 and the rear end is exposed to the outside of the chamber 10, the electrical Printed circuit boards or cables for transmitting signals are applied.

The connector 30 is a signal transmission unit 20 exposed to the receiving space 11 of the chamber 10 so that the semiconductor device for the test is electrically connected in the chamber 10 to receive a signal for the test. It is fixedly installed at the front end of the), the rear end side is provided with a support 31 is bent at both ends in order to hold the semiconductor device or a board on which the semiconductor device is mounted.

The insulating plate 40 has an outer wall 41, an inner wall 42, and an insertion hole 44 into which the signal transmission unit 20 is inserted, which are disposed outside and inside the opening hole 13 in the opening hole 13. ) Is formed of a transverse wall 43 disposed between the outer wall 41 and the inner wall 42. The insulating plate 40 is made of a material having a low thermal conductivity and a rigidity enough to serve as a structure between the cover 60 closing both sides of the opening hole 13.

The heat generating unit 50 generates heat by receiving a predetermined power, and is applied to a heat generating semiconductor element such as a positive temperature thermistor (positive thermistor) or a plate heater such as a silicon rubber heater. do. The heat generating unit 50 is installed on the outer surface of the signal transmitting unit 20 to generate heat, and the cold air on the receiving space 11 side of the chamber 10 through the front end of the signal transmitting unit 20. In order to prevent the condensation from occurring at the rear end of the signal transmission unit 20 by conducting to the rear end of the signal transmission unit 20, the signal transmission unit 20 is heated to maintain a temperature above the dew point.

The cover 60 is composed of an inner cover 61 closing the inside of the opening hole 13 of the chamber 10 and an outer cover 62 closing the outside of the opening hole 13. The (61, 62) plate surface is formed with a through hole through which the signal transmission unit 20 passes.

The heat insulating material 70 is inserted into an inner space partitioned by the outer wall 41, the inner wall 42, and the transverse wall 43 of the insulating plate 40 to prevent the cool air inside the chamber 10 from escaping out of the chamber. do.

The silicon pad 80 prevents cool air inside the chamber 10 from being conducted to the outside of the chamber 10 through the connector 30 and the inner cover 61 exposed to the accommodation space 11 of the chamber 10. In order to do this, the inner cover 61 is interposed between the wall 12 of the chamber 10 and between the connector 30 and the inner cover 61.

The operation of the first embodiment of the cold chamber of the semiconductor inspection apparatus described above will now be described.

The cold chamber of the semiconductor inspection apparatus of the present invention having the above configuration connects the semiconductor device introduced into the accommodation space 11 inside the chamber 10 to the connector 30, and then the accommodation space 11 of the chamber 10. ) A test signal of a predetermined pattern is applied to the semiconductor device through the signal transmission unit 20 while the inside thereof is maintained at a set temperature within a range of minus 10 degrees to minus 60 degrees and the electrical characteristics thereof are measured so that the semiconductor device has a low temperature environment. Will check whether it works properly. Here, both ends installed at the rear of the connector 30 can be firmly supported on the semiconductor device or the board on which the semiconductor device is inserted into the connector 30 through the support 31 bent forward.

In this case, the connector 30 exposed inside the chamber 10 is provided with a silicon pad 80 behind the support 31 so that the connector 30 is not in direct contact with the inner cover 61 of the chamber 10. The inner cover 61 that closes the inside of the opening hole 13 also has a silicon pad 80 at the rear thereof, so that the connector 13 and the inside are not directly contacted with the inner box 12a of the wall 12 of the chamber 10. The cover 61 prevents cold air in the chamber from conducting through the respective components.

In addition, since the heat insulating material 70 is inserted into the opening hole 13 of the chamber 10, the cool air inside the chamber 10 is formed by the air present in the opening hole 13. Is prevented from falling into the enclosure 11c and outer cover 62.

In addition, an outer wall 41 and an inner wall 42 are disposed outside and inside the opening hole 13, and an insertion hole 44 into which the signal transmission unit 20 is inserted is formed by a horizontal wall 43. Since the lateral wall 43 serves as a structure, the inner cover 61 and the outer cover 62 closing both sides of the opening hole 13 of the chamber 10 are firmly supported. On the other hand, since the insulating plate 40 is made of a material having a low thermal conductivity, heat is prevented from being conducted to the outside of the chamber 10 through the insulating plate 40.

In particular, the signal transmission unit 20 connected to the rear of the connector 30 and the rear end is exposed to the outside of the chamber 10 is provided with a heat generating unit 50 for generating heat by applying power to the upper side and the lower side, respectively. Since the signal transmission unit 20 is heated to a temperature higher than the dew point, it is possible that the cool air inside the chamber 10 is conducted to the rear end side of the signal transmission unit 20 through the signal transmission unit 20 connected to the rear end of the connector 30. Is prevented.

In addition, since the heat generating unit 50 is installed in the signal transmitting unit 20 and generates heat, when the signal transmitting unit 20 is withdrawn from the chamber 10 when necessary, the heat generating unit 50 is exposed to the outside and generates heat. The installation and maintenance of the part 50 will provide an advantage.

3 is a partially enlarged cross-sectional view of a cold chamber of a semiconductor inspection apparatus according to a second embodiment of the present invention. In the second embodiment of the present invention, unlike the above-described embodiment, the heating unit 50 has an insulating plate. It is characterized in that it is provided in the insertion hole 44 of the 40.

That is, the heat generating unit 50 is installed on the surface of the insulating plate 40 that faces the signal transmitting unit 20, and receives power from the chamber 10 to generate heat to heat the signal transmitting unit 20. In order to prevent the conduction of cold air to the rear end side of the chamber 20, since the heat generating unit 50 is installed on the chamber 10 side, the signal transmitting unit 20 should be replaced according to the type of semiconductor device to be inspected. In this case, the replacement of the signal transmission unit 20 provides an advantage.

The scope of the present invention is not limited to the above-described embodiment, but may be embodied in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the present invention as claimed in the claims, any person having ordinary knowledge in the art to which the present invention pertains is considered to be within the scope of the claims described in the present invention to various extents which can be modified.

1 is a cross-sectional view showing the configuration of a cold chamber of the semiconductor inspection device of the present invention;

2 is an enlarged view of a portion “A” of FIG. 1;

3 is a partially enlarged view showing a second embodiment of a cold chamber of the semiconductor inspection apparatus of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: chamber, 11: accommodation space, 12: wall,

12a: enclosure, 12b: enclosure, 12c: insulation,

13: opening, 20: signal transmission, 30: connector,

31: support, 40: insulation plate, 41: outer wall,

42: inner wall, 43: transverse wall, 44: insertion hole,

50: heat generating part, 60: cover, 61: inner cover,

62: outer cover, 70: insulation, 80: silicon pad

Claims (4)

A cold chamber of a semiconductor inspection apparatus for testing a semiconductor device by applying an electrical signal to a semiconductor device accommodated in the accommodation space while maintaining the interior space in a low temperature environment, A chamber having an opening formed therein and having an opening formed therein so as to communicate with the accommodation space on one surface thereof; A signal transmission unit installed in an opening hole of the chamber so that the front end portion is exposed to the accommodation space of the chamber and the rear end is exposed to the outside of the chamber; A connector which is fixed to a distal end of the signal transmission part in the accommodation space of the chamber and electrically connected to the semiconductor device; An insulating plate having an outer wall and an inner wall disposed inside and outside the opening hole, and a transverse wall disposed between the inner wall and the outer wall to form an insertion hole into which the signal transmission unit is inserted; A heating unit disposed in the insertion hole of the insulating plate to heat the signal transmission unit; And, Cold cover of a semiconductor inspection device comprising a; cover each of the inner and outer openings of the chamber. The method of claim 1, And a heat insulator inserted into an inner space partitioned by an outer wall, an inner wall and a horizontal wall of the insulating plate. The method according to claim 1 or 2, The heat generating unit is a cold chamber of the semiconductor inspection device, characterized in that installed on the inner surface of the insertion hole of the insulating plate. The method according to claim 1 or 2, Cold chamber of the semiconductor inspection apparatus, characterized in that the heat generating portion is provided on the outer surface of the signal transmission portion.

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