KR20070057453A - Semiconductor module mounting tester - Google Patents

Abstract

A semiconductor module mounting tester is provided to locally heat or cool a semiconductor module by installing a temperature module for enclosing the semiconductor module mounted on a mother board. A semiconductor module(112) mounted on a mother board(110) is enclosed by a temperature module(130). A power supply unit(140) supplies a power to the temperature block to set the temperature block as a temperature suitable to conduct a test process. A temperature sensor(150) detects and transmits the temperature of the temperature block. A controller(160) controls the power supply unit based on the temperature transmitted from the temperature sensor to maintain the temperature of the temperature block to the proper temperature.

Description

Semiconductor module mounting tester

1 is a view schematically showing a semiconductor module mounting test apparatus according to the prior art.

2 is a schematic block diagram illustrating a semiconductor module mounting test apparatus according to an exemplary embodiment of the present invention.

3 is a perspective view illustrating a state in which a temperature block of a semiconductor module mounting test apparatus according to an embodiment of the present invention is installed on a mother substrate.

4 is a cross-sectional view taken along line AA ′ of FIG. 3, showing a state in which a heating block is installed as a temperature block.

5 is a cross-sectional view taken along line AA ′ of FIG. 3, showing a state in which a cooling block is installed as a temperature block.

6A and 6B are perspective views showing another form of the temperature block.

Description of the main parts of the drawing

110: mother substrate 112: module

114: socket 120: bracket

130, 230, 330: temperature block 130a: heating block

130b: cooling block 131, 136: heat conduction plate

132: heating element 133: insulating cover

134: interior space 135, 139: insulation

137: thermoelectric element 138: heat sink

140: power supply unit 150: temperature sensor

160 control unit 200 semiconductor module mounting test apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test apparatus, and more particularly, to a semiconductor module mounting test apparatus for testing a defect of a semiconductor module in a semiconductor module mounting environment.

After the manufacturing process is completed, the semiconductor module is actually mounted on a mother board of the computer and performs a semiconductor module mounting test process for checking for abnormalities. The semiconductor module mounting test checks whether the semiconductor module operates normally in a low temperature (about 0 ° C), room temperature (about 25 ° C), and high temperature (about 85 ° C) mother substrate environment.

As shown in FIG. 1, the semiconductor module mounting test is performed in a state in which the mother substrates 10 on which the semiconductor modules 12 are mounted are loaded into the chamber 20. The semiconductor module mounting test apparatus 100 according to the related art includes a chamber 20 in which a test process is performed, a heating unit 30 for heating the chamber 20, and a cooling unit 40 for cooling the chamber 10. And a controller 70 for controlling the operation of each component. At this time, the heating unit 30 is composed of a heater and a fan to provide a warmer (32) to the chamber (20). The cooling unit 40 is a cooler using a conventional refrigerant, and is composed of a compressor 41, a condenser 42, and an evaporator 43 to provide the cold air 34 to the chamber 20.

Therefore, when the high temperature test process is performed in the conventional semiconductor module mounting test apparatus 100, the heating unit 30 supplies the warmer 32 to the chamber 20 to increase the temperature of the chamber 20, and performs the low temperature test process. When proceeding, the cooling unit 40 supplies the cold air 34 to the chamber 20 to lower the temperature of the chamber 20 and then proceeds with the test process.

At this time, the temperature in the chamber 20 is detected by the temperature sensor 80 and transmitted to the control unit 70, the control unit 70 is based on the temperature provided by the temperature sensor 80, the heating unit 30 and the cooling unit ( 40 is selectively operated to set the temperature inside the chamber 20 according to the temperature of the test process to be carried out.

However, since the space occupied by the heating unit 30 and the cooling unit 40 is large, the conventional semiconductor module mounting test apparatus 100 requires a large installation space.

Since the mother substrate 10 together with the semiconductor module 12 is exposed to a high temperature environment in a high temperature process, a problem may occur due to deterioration of the mother substrate 10. For example, the life of the mother substrate 10 may be shortened, and although not shown, a substrate constituting the mother substrate 10, a hard disk, a chip set, a power supply, and the like may be used. Abnormal operation of the test process may not proceed normally. This can cause problems with the reliability of the test results themselves.

Since the test process is performed in a state in which the plurality of mother substrates 10 are loaded in the chamber 20, a problem in which the temperature of the chamber 20 is changed from high temperature to low temperature or from low temperature to high temperature takes a lot of time. Is holding. That is, since the test process proceeds in the chamber 20 in which the entire mother substrate 10 is exposed in addition to the portion of the semiconductor module 12 where the warm air 32 and the cold air 34 will act, the temperature inside the chamber 20 is increased. It takes a lot of time to convert.

The heating unit 30 and the cooling unit 40 require periodic maintenance, which is expensive.

In addition, since the chamber 10 has a large space and the plurality of mother substrates 10 are located in the chamber 10, testing the semiconductor modules 12 mounted on the mother substrates 10 under the same temperature condition is recommended. In other words, since the uniformity and reproducibility of the test temperature are inferior, the reliability of the test result may be deteriorated.

In addition, the Freon gas mainly used as the refrigerant of the cooling unit 40 is limited in use according to environmental regulations, and the cost burden due to the use of new refrigerant suitable for environmental regulations is also increasing. In addition, since the noise is severely generated in the compressor 41 when the cooling unit 40 is operated, a problem due to the noise may occur.

Therefore, the first object of the present invention is to minimize the size of the cooling unit and the heating unit to reduce the size of the device.

It is a second object of the present invention to solve a problem caused by deterioration of a mother substrate in a high temperature process.

It is a third object of the present invention to shorten the cold / hot conversion time.

A fourth object of the present invention is to make it possible to reduce maintenance costs of equipment.

A fifth object of the present invention is to be able to improve the uniformity and reproducibility of the test temperature.

In addition, a sixth object of the present invention is to provide a cool air without noise and using a refrigerant.

In order to achieve the above object, the present invention provides a semiconductor module mounting test apparatus for performing a test process by locally heating or cooling only a semiconductor module mounted on a mother substrate with a temperature block. That is, the present invention is a semiconductor module mounting test apparatus for testing a semiconductor module mounted on a mother substrate, the power supply for supplying power to the temperature block surrounding the semiconductor module and the temperature block to set the temperature block to an appropriate temperature for the test process And a supply unit, a temperature sensor for checking and transmitting the temperature of the temperature block, and a control unit for controlling the power supply unit based on the temperature transmitted from the temperature sensor to maintain the temperature of the temperature block at an appropriate temperature for the test process.

In the semiconductor module mounting test apparatus according to the present invention, the temperature block may be separately installed in the semiconductor modules. The temperature block may be in the form of any one of plate, square tube or box form.

In the semiconductor module mounting test apparatus according to the present invention, the temperature block may be composed of a heat conduction plate, a heating element, an insulating cover, and a heat insulator as a heating block. The heat conduction plate is disposed on a surface facing the semiconductor module, and the temperature sensor is installed on the first surface facing the semiconductor module. The heating element is installed in close contact with the second surface opposite to the first surface of the heat conduction plate, and generates heat by the power supplied from the power supply, thereby heating the heat conduction plate. The insulating cover surrounds the second surface of the heat conduction plate to which the heating element is attached, and has an inner space in which the heating element can be built. And the heat insulating agent fills the inner space between the insulating cover and the heating element, and suppresses heat generated in the heating element from being lost to the outside through the insulating cover.

In the semiconductor module mounting test apparatus according to the present invention, the temperature block may include a heat conduction plate, a thermoelectric element, a heat sink, and a heat insulator as a cooling block. The heat conduction plate is disposed on a surface facing the semiconductor module, and a temperature sensor is installed on the first surface facing the semiconductor module. The thermoelectric element is installed in close contact with the second surface opposite to the first surface of the thermal conductive plate, and cools the thermal conductive plate by the power supplied from the power supply. The heat sink is attached to the thermoelectric element to release the heat absorbed by the thermoelectric element to the outside. And the insulation surrounds the outer element of the thermoelectric element between the heat conduction plate and the heat sink. In this case, a Peltier device may be used as the thermoelectric device.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

2 is a schematic block diagram showing a semiconductor module mounting test apparatus 200 according to an embodiment of the present invention. 3 is a perspective view illustrating a state in which the temperature block 130 of the semiconductor module mounting test apparatus according to the embodiment of the present invention is installed on the mother substrate 110.

2 and 3, the semiconductor module mounting test apparatus 200 according to an embodiment of the present invention includes a temperature block 130, a power supply unit 140, a temperature sensor 150, and a controller 160. .

The temperature block 130 surrounds the region in which the semiconductor module 112 is mounted in the mother substrate 110, that is, the semiconductor module 112. In this case, the temperature block 130 may have a form that may surround each of the semiconductor modules 112 and is installed on the bracket 120.

The bracket 120 has an opening 121 through which the socket 114 of the mother substrate 110 is exposed, and is installed at a predetermined interval on the mother substrate 110.

The power supply unit 140 supplies power to the temperature block 130 to set the temperature block 130 to a temperature at which the test process is to be performed.

The temperature sensor 150 checks the temperature of the temperature block 130 and transmits the temperature to the controller 160.

The controller 160 controls the power supply unit 140 based on the temperature transmitted from the temperature sensor 150 to maintain the temperature of the temperature block 130 at an appropriate temperature for the test process.

Therefore, the semiconductor module mounting test apparatus 200 according to an exemplary embodiment of the present invention sets only the semiconductor module 112 mounted on the mother substrate 110 to a temperature at which the test process is to be performed locally.

In this case, as the temperature block, as shown in FIG. 4, the heating block 130a may be installed. The heating block 130a may be installed in a plate shape on both sides of the semiconductor module 112. The heating block 130a is sized to include the semiconductor module 112 so as to uniformly transfer heat to the semiconductor module 112.

The heating block 130a may include a heat conduction plate 131, a heating element 132, an insulating cover 133, and a heat insulating agent 135 on which the temperature sensor 150 is installed. The thermal conductive plate 131 is disposed on the side facing the semiconductor module 112, and the temperature sensor 150 is installed on the first surface 131a facing the semiconductor module 112. At this time, the heat conduction plate 131 is used as a heating plate.

The heating element 132 is installed in close contact with the second surface 131b opposite to the first surface 131a of the heat conductive plate 131, and generates heat by the power supplied from the power supply unit 140 (FIG. 2). Heat 131. In this case, a coil heater may be used as the heating element 132.

The insulating cover 133 surrounds the second surface 131b of the heat conducting plate 131 to which the heat generating element 132 is attached, and an inner space 134 in which the heat generating element 132 may be formed is formed.

The inner space 134 between the insulating cover 133 and the heating element 132 prevents the heat generated from the heating element 132 from being charged to the outside through the insulating cover 133. . Therefore, most of the heat generated from the heating element 132 is supplied to the semiconductor module 112 through the heat conducting plate 131.

In addition, as the temperature block, as shown in FIG. 5, a cooling block 130b may be installed. The cooling block 130b may be installed in a plate shape on both sides of the semiconductor module 112. The cooling block 130b may also have a size that may include the semiconductor module 112 to uniformly transfer cold air to the semiconductor module 112.

The cooling block 130b may include a heat conduction plate 136, a thermoelectric element 137, a heat sink 138, and a heat insulator 139 on which the temperature sensor 150 is installed. The thermal conductive plate 136 is disposed on the side facing the semiconductor module 112, and the temperature sensor 150 is installed on the first surface 136a facing the semiconductor module 112. At this time, the heat conduction plate 136 is used as a cooling plate.

The thermoelectric element 137 is installed in close contact with the second surface 136b of the thermal conductive plate 136, and cools the thermal conductive plate 136 by the power supplied from the power supply unit 140 of FIG. 2. In this case, a Peltier element may be used as the thermoelectric element 137. The Peltier device is a device using the Peltier Effect, a phenomenon in which heat is absorbed or dissipated according to current. When a Peltier device applies a direct current to the NP type thermoelectric semiconductor, electrons absorbing thermal energy from the surroundings move into the thermoelectric semiconductor at the negatively charged metal / semiconductor contact, and a cooling phenomenon occurs. It is a device using the Peltier effect that generates heat by emission. Therefore, the metal / semiconductor contact charged with the cathode of the thermoelectric element 137 is in close contact with the heat conduction plate 136, and the contact charged with the anode of the thermoelectric element 137 is in close contact with the heat sink 138.

As described above, the heat sink 138 is attached to the thermoelectric element 137 and releases heat absorbed by the thermoelectric element 137 to the outside.

And a heat insulator 139 surrounding the outer portion of the thermoelectric element 137 between the heat conduction plate 136 and the heat sink 138. The heat insulator 139 separates the heat conduction plate 136 and the heat dissipation plate 138 so that the cold air is mostly supplied to the semiconductor module 112 through the heat conduction plate 136.

In the present embodiment, although the temperature block in which the Peltier element is incorporated as the thermoelectric element 137 is disclosed as the cooling block 130a, it can be used as a heating block. In this case, by changing in the direction of the direct current, the temperature block in which the Peltier element is incorporated can be used as a heating block. That is, the temperature block in which the Peltier element is embedded can be used as a cooling block or a heating block according to the direction of the direct current.

In the exemplary embodiment of the present invention, the plate shape is illustrated as a temperature block. However, as shown in FIG. 6A, the temperature block 230 may be implemented in a square tube shape, or as shown in FIG. 6B, one surface of the temperature block 330 may be formed. It can be implemented in the form of an open box. Of course, the through hole 231 of the square tube and the inner space 331 of the box has at least a size to which the semiconductor module can be inserted.

On the other hand, the embodiments of the present invention disclosed in the specification and drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. In addition to the embodiments disclosed herein, it is apparent to those skilled in the art that other modifications based on the technical idea of the present invention may be implemented.

Therefore, according to the structure of the present invention, since the temperature block is installed to include a region in which the semiconductor module is mounted on the mother substrate, the temperature block occupies a smaller installation space than the heating and cooling units installed in the conventional semiconductor module mounting test apparatus. do. This can reduce the installation space, including the size of the installation compared to the conventional.

Since the temperature block can locally heat or cool only the region in which the semiconductor module is mounted, the test process can be performed, thereby solving the problem caused by deterioration of the mother substrate. Since the cold / hot transition time can be shortened, the semiconductor module mounting test time can be shortened. In addition, since the uniformity and reproducibility of the test temperature can be improved, the reliability of the test results can be ensured.

The temperature blocks installed in the brackets are easy to maintain, reducing the cost of maintenance of the installation.

In addition, since only electricity is used without any refrigerant or chemicals, there is an advantage in that an environment-friendly semiconductor module mounting test apparatus can be implemented.

Claims (6)

A semiconductor module mounting test apparatus for testing a semiconductor module mounted on a mother substrate, A temperature block surrounding the semiconductor module; A power supply unit supplying power to the temperature block to set the temperature block to an appropriate temperature for a test process; A temperature sensor for checking and transmitting the temperature of the temperature block; And a controller for controlling the power supply based on the temperature transmitted from the temperature sensor to maintain the temperature of the temperature block at an appropriate temperature for the test process. The apparatus of claim 1, wherein the temperature block heats the semiconductor modules independently. The semiconductor module mounting test apparatus of claim 2, wherein the temperature block is one of a plate, a square tube, and a box. The method according to any one of claims 1 to 3, wherein the temperature block is a heating block, A heat conduction plate disposed on a surface facing the semiconductor module and having the temperature sensor installed on a first surface facing the semiconductor module; A heating element installed in close contact with a second surface opposite to the first surface of the heat conductive plate, and generating heat by power supplied from the power supply unit to heat the heat conductive plate; An insulating cover surrounding a second surface of the heat conducting plate to which the heat generating element is attached and having an internal space in which the heat generating element may be embedded; And an inner space between the insulating cover and the heating element to prevent heat generated from the heating element from being lost to the outside through the insulating cover. The method according to any one of claims 1 to 3, wherein the temperature block is a cooling block, A heat conduction plate disposed on a surface facing the semiconductor module and having the temperature sensor installed on a first surface facing the semiconductor module; A thermoelectric element installed in close contact with a second surface opposite to the first surface of the heat conductive plate and generating heat by power supplied from the power supply unit to cool the heat conductive plate; A heat sink attached to the thermoelectric element for dissipating heat absorbed by the thermoelectric element to the outside; And a heat insulating agent surrounding an outer portion of the thermoelectric element between the heat conduction plate and the heat dissipation plate. 6. The semiconductor module mounting test apparatus according to claim 5, wherein the thermoelectric element is a Peltier element.

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