KR20090125487A - Scribing apparatus and method - Google Patents

Abstract

PURPOSE: A scribing apparatus, and a scribing method are provided to reduce the tact time of the polishing process, thereby improving productivity. CONSTITUTION: A scribing apparatus comprises a first scribing part which forms a scribe line on the upper side of a mother substrate(1); a shift part which turns over the mother substrate having the scribe line formed at the upper side; a second scribing part which forms a scribe line on the lower side of the mother substrate; a shift polishing part which turns over the mother substrate having the scribe line formed at the lower side, and polishes the corner where the edges of the mother substrate cross; and an edge polishing part which polishes the edges of the mother substrate.

Description

Scribing device and method {SCRIBING APPARATUS AND METHOD}

The present invention relates to an apparatus and method for use in the manufacture of a flat panel display panel, and more particularly, to a scribing apparatus and method for forming a scribe line on a mother substrate having a plurality of unit substrates.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. Such information processing apparatus has a display for displaying the activated information. Conventionally, a cathode ray tube monitor is mainly used as a display, but recently, a light and space-saving thin film transistor-liquid crystal display panel or organic light emitting diodes display The use of such flat panel displays is greatly increasing.

In general, a panel used for a flat panel display or the like is usually manufactured using a brittle substrate, and the panel is roughly classified into a single plate substrate composed of one sheet or a bonded substrate bonded to two substrates.

Since the bonded substrate is processed into small and various sizes, such as a panel for a liquid crystal display of a mobile phone, to a large size such as a panel such as a TV or a display, the bonded substrate is cut into a unit substrate having a predetermined size from a large parent substrate, Used as a panel.

As a method of cutting a mother substrate, there are a method of cutting using a scribe wheel (Scribe Wheel) in which fine diamonds are embedded, and a method of cutting using a laser beam.

A method of cutting a mother substrate using a scribe wheel includes a scribing process of contacting a scribe wheel with a cutting target line of the mother substrate and forming a scribe line having a predetermined depth along the cutting target line, and a mother substrate. A cracking process propagates along a scribe line by applying a physical impact to the breaker to break the parent substrate into a unit substrate.

A method of cutting a mother substrate using a laser beam includes a scribing process of irradiating a scribe laser beam along a cutting line of the mother substrate to form a scribe line and quenching the heated scribe line, and a brake along the scribe line. It is made of a braking step of cutting the parent substrate into a unit substrate by irradiating a laser beam for.

It is an object of the present invention to provide a scribing apparatus and method capable of improving productivity through shortening of process time.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the scribing apparatus according to the present invention comprises a first scribing unit for forming a scribe line on the upper surface of the parent substrate; An inverting unit for inverting the mother substrate on which a scribe line is formed; A second scribing unit forming a scribe line on a lower surface of the mother substrate; An inverted-polishing unit for inverting the mother substrate having a scribe line formed on a lower surface thereof, and polishing a corner at which edges of the mother substrate cross each other; And an edge polishing part for polishing the edges of the mother substrate.

In the scribing apparatus according to the present invention having the configuration as described above, the inverted-polishing portion takes over the mother substrate transferred from the second scribing portion to the corner polishing portion, and at the corner polishing, A conveying unit for contact supporting; An inversion unit spaced above the transfer unit and inverting the mother substrate; And a polishing unit disposed at both sides of the rear end of the transfer unit and polishing a corner of the mother substrate.

The polishing unit includes: a polishing stone having a rotational center axis disposed side by side in the plane of the parent substrate; A rotary driver for rotating the abrasive stone; And a linear driver for linearly moving the rotary driver in a direction perpendicular to the moving direction of the parent substrate.

The apparatus may further include an alignment roller which contacts the edges of the mother substrate supported by the transfer unit to align the mother substrate.

In order to achieve the above object, the scribing method according to the present invention comprises the steps of forming a scribe line on the upper surface of the parent substrate; Inverting the parent substrate such that a lower surface thereof faces upward; Forming a scribe line on a bottom surface of the parent substrate; Grind the corners located on both sides of the corner of any one side of the parent substrate, invert the mother substrate so that the upper surface is facing upwards, and then located on both sides of the other side opposite the one corner of the mother substrate Polishing the corners; And polishing edges of the parent substrate.

In the scribing method according to the present invention having the configuration as described above, the method may further include an alignment step of correcting the inclination of the mother substrate before the polishing of the corners of the mother substrate.

According to the present invention, the process time (Tact Time) can be shortened by performing the corner polishing process of the substrate, which was performed in the edge polishing unit, in the inverting unit disposed at the front end of the edge polishing unit, thereby improving productivity.

Hereinafter, a scribing apparatus and a method according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals have the same reference numerals as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

(Example)

1 is a diagram illustrating an example of a mother substrate.

Referring to FIG. 1, the mother substrate 1 may be a panel for a thin film transistor-liquid crystal display (TFT-LCD). The mother substrate 1 is composed of a first mother substrate 2 and a second mother substrate 3 having a generally rectangular plate shape. The first mother substrate 2 and the second mother substrate 3 are stacked up and down. A plurality of unit substrates 2a and 3a are formed on the first and second mother substrates 2 and 3, and the unit substrates 2a and 3a are planes of the first and second mother substrates 2 and 3. It may be arranged in a grid shape on the phase. The first mother substrate 2 may be a substrate on which a color filter (CF) substrate is formed, and the second mother substrate 3 may be a substrate on which a thin film transistor (TFT) substrate is formed. The mother substrate 1 may be a panel for organic light emitting diodes (OLED) display, which is a kind of panel for a flat panel display.

2 is a view schematically showing the configuration of a scribing apparatus according to the present invention.

Referring to FIG. 2, the scribing apparatus is used to separate a parent substrate (reference numeral 1 of FIG. 1) into a plurality of unit substrates, and includes a loading unit 10, a first scribing unit 20, and a van. All 30, second scribing portion 40, buffer portion 50, inverted-polishing portion 60, corner polishing portion 70, cleaning portion 80, and unloading portion 90 do. Loading part 10, first scribing part 20, inverting part 30, second scribing part 40, buffer part 50, inverted-polishing part 60, edge grinding part 70 The cleaning unit 80 and the unloading unit 90 may be sequentially arranged in a row.

The mother substrate 1 is loaded into the scribing apparatus 1 through the loading unit 10, and sequentially the first scribing unit 20, the inverting unit 30, and the second scribing unit 40 are sequentially loaded. A scribe line for separating into a plurality of unit substrates is formed in the mother substrate 1 through the above. The first scribing unit 20 forms a scribe line on the first mother substrate 2, that is, the color filter CF substrate, and the second scribing unit 40 is the second mother substrate 3, that is, A scribe line is formed on a thin film transistor (TFT) substrate. In the inverting unit 30, after a scribe line is formed with respect to the first mother substrate 2 in the first scribing unit 20, the first mother substrate 2, that is, the color filter CF substrate, moves downward. The mother substrate 1 is inverted to face the mother substrate 1, and in this state, the mother substrate 1 is transferred to the second scribing unit 40.

After the scribe line is formed on the thin film transistor (TFT) substrate in the second scribing unit 40, the mother substrate 1 is transferred to the buffer unit 50 with the thin film transistor (TFT) substrate facing upward. . The buffer unit 50 temporarily stores the mother substrate 1 and transfers the mother substrate to the inverted-polishing unit 60. The inversion-polishing part 60 performs a process of polishing four corners at which the edges of the mother substrate cross each other, and inverts the mother substrate so that the color filter (CF) substrate faces upward in the middle of the corner polishing process. Let's do it. Detailed description thereof will be described later. The mother substrate subjected to the corner polishing process in the inverse-polishing unit 60 is transferred to the corner polishing unit 70, and the corner polishing unit 70 polishes four edges of the first and second mother substrates. After the corner polishing process is completed, the mother substrate is transferred to the cleaning unit 80 and cleaned, and then transported to the outside of the apparatus 1 through the unloading unit 90.

3 is a side view of the inversion-polishing portion 60 of FIG. 2, and FIG. 4 is a plan view of the inversion-polishing portion 60 of FIG. 2. 3 and 4, the reverse polishing unit 60 includes a transfer unit 100, a reverse unit 200, and a polishing unit 300.

The transfer unit 100 takes over the mother substrate transferred from the second scribing unit 40 through the buffer unit 50 to the corner polishing unit 70, and contacts and supports the mother substrate during the progress of the corner polishing process. The conveying unit 100 includes conveying shafts 110, conveying rollers 120, and a support member 130. The conveying axes 110 are arranged in a length direction in a direction perpendicular to the conveying direction of the substrate S, and are arranged side by side on both left and right sides along the conveying direction of the substrate S. FIG. The conveying shafts 110 may be rotatably coupled to the support member 130, and the conveying rollers 110 are inserted into and installed in the conveying shafts 110 to be in contact with the lower surface of the substrate S.

In addition, the substrate S supported by the transfer unit 100 should be aligned such that the long side S1 is perpendicular to the transfer axes 110 and the short side S2 is parallel to the transfer axes 110. Alignment rollers 140, 150 are provided for this purpose. The alignment rollers 140 are in contact with the short side S2 of the substrate S, and the alignment rollers 150 are in contact with the long side S1 of the substrate S so that the substrate S is not inclined. Align it. The alignment rollers 140, 150 may be linearly moved to / from the long side S1 or the short side S2 of the substrate S by a conveying means (not shown).

The inversion unit 200 is spaced apart from the upper side of the transfer unit 100 and inverts the substrate S supported by the transfer unit 100. The substrate transferred from the buffer unit 50 to the inverted-polishing unit 60 has a thin film transistor (TFT) substrate facing upwards, and in this state, a polishing process for one corner of the substrate S is performed. . In addition, the inversion unit 200 inverts the substrate S so that the color filter CF substrate is directed upward, and in this state, the polishing process for the corner of the other side of the substrate S is performed.

The polishing unit 300 polishes the corners of the substrate and is disposed at both sides of the rear end of the transfer unit 100, respectively. The polishing unit 300 includes an abrasive stone 310, a rotation driver 320, and a linear driver 330. The abrasive stone 310 may have a disc shape, and one side edge portion may have a chamfered shape for the corner polishing process of the substrate. The abrasive stone 310 is disposed so that the rotational center axis is parallel to the plane of the substrate S, and the abrasive stone 310 is connected to a rotary driver 320, that is, a motor, to provide a rotational driving force. In addition, the rotary driver 320 is connected to the linear driver 330 for linearly moving the rotary driver 320 in a direction perpendicular to the moving direction of the substrate, that is, in the longitudinal direction of the transfer axes 110. A cylinder may be used as the linear driver 330, and an assembly composed of a combination of a motor and a gear may be used.

Referring to the process of polishing the corner of the substrate using the inverted-polishing portion having the configuration as described above are as follows.

5A to 5D are views illustrating a process of polishing a corner of a parent substrate using an inverted-polishing unit according to the present invention.

First, the substrate subjected to the scribing process is transferred from the buffer unit 50, and the substrate S is supported by the transfer unit 100. At this time, the substrate S is a state in which the thin film transistor TFT substrate is directed upward (Fig. 4A).

Thereafter, the alignment roller 140 contacts the short side S2 of the substrate, and the alignment roller 150 contacts the long side S1 of the substrate to align the substrate S. In this state, the polishing unit 300 moves toward the corners C1 and C2 of the substrate S, and the abrasive stone 310 is rotated under the rotational force of the rotation driver 320 while rotating the corners of the substrate S. C1 and C2) are polished (FIG. 4B).

When the polishing process for the corners C1 and C2 of the substrate S is completed, the polishing unit 300 is retracted by the linear driver 330, and the substrate S is removed by the inversion unit 200. CF) The substrate is reversed to face upward. At this time, the substrate S is in a state where the corners C3 and C4 of the substrate S are located on the polishing unit 300 side by inversion. In this state, the alignment roller 140 contacts the short side S2 of the substrate, and the alignment roller 150 contacts the long side S1 of the substrate to align the substrate S (FIG. 4C).

In the state in which the substrates are aligned, the polishing unit 300 moves toward the corners C3 and C4 of the substrate S, and the abrasive stone 310 is rotated by receiving the rotational force of the rotation driver 320. The corners C3 and C4 are polished (FIG. 4D).

As such, when the polishing process for the corners C1, C2, C3, and C4 of the substrate is completed, the substrate S is transferred to the edge polishing portion (reference numeral 70 of FIG. 2), and the corner polishing portion 70 ), The polishing process is performed on the edges of the upper and lower surfaces of the substrate S.

As described above, in the present invention, the polishing process for the corners of the substrate is performed in the inversion-polishing unit 60 disposed at the front end of the corner polishing unit 70, and the polishing process for the corners of the substrate is inverted- The polishing unit 60 is characterized in that it proceeds in a separate process in the corner polishing unit 70 of the rear end. As described above, when the corner polishing process of the substrate and the corner polishing process of the substrate are separated, the process time is shortened as compared with the conventional case in which the polishing process for the corners and corners of the substrate is performed in one polishing unit. You can. This is because the inverted part and the polished part are conventionally arranged, but the process bottleneck occurs in the polished part because the process time in the polished part is longer than the process time in the inverted part. In order to reduce such a bottleneck, the present invention proceeds a part of the polishing process of the substrate, that is, the corner polishing process of the substrate in the inverted portion disposed at the front end of the polishing portion, thereby eliminating the bottleneck of the conventional process. have.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

The drawings described below are for illustrative purposes only and are not intended to limit the scope of the invention.

1 is a view showing an example of a mother substrate,

2 is a view schematically showing the configuration of a scribing apparatus according to the present invention;

3 is a side view of the inverted-polishing part of FIG. 2;

4 is a plan view of the inverted-polishing part of FIG. 2;

5A to 5D are views illustrating a process of polishing a corner of a parent substrate using an inverted-polishing unit according to the present invention.

<Description of Symbols for Main Parts of Drawings>

20, 40: scribing unit 60: inverted-polishing unit

70: corner grinding unit 100: transfer unit

200: reversal unit 300: polishing unit

Claims (6)

A first scribing unit forming a scribe line on an upper surface of the parent substrate; An inverting unit for inverting the mother substrate on which a scribe line is formed; A second scribing unit forming a scribe line on a lower surface of the mother substrate; An inverted-polishing unit for inverting the mother substrate having a scribe line formed on a lower surface thereof, and polishing a corner at which edges of the mother substrate cross each other; And And a corner polishing portion for polishing the corners of the parent substrate. The method of claim 1, The reverse-polishing part, A transfer unit which takes over the mother substrate transferred from the second scribing unit to the corner polishing unit and contacts and supports the mother substrate during corner polishing; An inversion unit spaced above the transfer unit and inverting the mother substrate; And And a polishing unit disposed at both sides of the rear end of the transfer unit, the polishing unit polishing the corner of the mother substrate. The method of claim 2, The polishing unit, An abrasive stone having a rotational center axis disposed side by side in the plane of the parent substrate; A rotary driver for rotating the abrasive stone; And a linear driver for linearly moving the rotary driver in a direction perpendicular to the moving direction of the parent substrate. The method of claim 2, And an alignment roller that contacts the edges of the parent substrate supported by the transfer unit to align the parent substrate. Forming a scribe line on the top surface of the parent substrate; Inverting the parent substrate such that a lower surface thereof faces upward; Forming a scribe line on a bottom surface of the parent substrate; Grind the corners located on both sides of the corner of any one side of the parent substrate, invert the mother substrate so that the upper surface is facing upwards, and then located on both sides of the other side opposite the one corner of the mother substrate Polishing the corners; And And grinding edges of the parent substrate. And an alignment step of correcting the inclination of the parent substrate before polishing the corners of the parent substrate.

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