KR20090123706A - Routing methods of the printed circuit board where slot in semicircle is formed - Google Patents

Routing methods of the printed circuit board where slot in semicircle is formed Download PDF

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KR20090123706A
KR20090123706A KR1020080049909A KR20080049909A KR20090123706A KR 20090123706 A KR20090123706 A KR 20090123706A KR 1020080049909 A KR1020080049909 A KR 1020080049909A KR 20080049909 A KR20080049909 A KR 20080049909A KR 20090123706 A KR20090123706 A KR 20090123706A
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South Korea
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routing
printed circuit
circuit board
router
bitter
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KR1020080049909A
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Korean (ko)
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KR100997195B1 (en
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남장록
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(주)삼일전자
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE: A routing method of a printed circuit board is provided to prevent disconnection of a circuit by suppressing generation of a burr at both ends of a semicircular slot. CONSTITUTION: A plurality of through holes is formed in a printed circuit board in a row. A first routing processing part is formed by routing the printed circuit board with a first router bit in order to be adjacent to an outer circumference of the through holes(200). A second routing processing part is formed by routing a center front part of each through hole with a second router(300). A semicircular slot is formed by routing each through hole with a first router bit(400). A size of the first router bit is Φ1.5. A size of the second router bit is Φ1.0. A size of the through hole is Φ0.6.

Description

반원형의 슬롯이 형성되는 인쇄회로기판의 라우팅방법.{Routing methods of the printed circuit board where slot in semicircle is formed.}Routing methods of the printed circuit board where slot in semicircle is formed.

본 발명은 인쇄회로기판의 다수개로 일렬로 형성된 복수개의 관통홀부를 라우터비트로 라우팅하여 반원형의 슬롯으로 형성되게 제1라우팅가공부가 형성되는 제1라우팅공정과, 제2라우팅가공부가 형성되는 제2라우팅공정과, 제2라우팅가공부를 일직선으로 라우트하는 제3라우팅공정으로 인쇄회로기판의 다수개의 관통홀부들을 반원형의 슬롯형태로 형성시 상기 슬롯의 반원형 양단에 버의 발생을 억제하여 인쇄회로기판 반원형의 슬롯 불량률을 획기적으로 줄이도록 한 반원형의 슬롯이 형성되는 캐슬형 인쇄회로기판의 외곽 라우팅방법에 관한 것이다.The present invention provides a first routing process in which a first routing processing part is formed to form a semi-circular slot by routing a plurality of through-holes formed in a row in a plurality of printed circuit boards to a router bit, and a second routing in which a second routing processing part is formed. Process and the third routing process of routing the second routing processing part in a straight line, when forming a plurality of through-hole portions of the printed circuit board in the form of a semi-circular slot, suppressing the occurrence of burrs at both ends of the semi-circular slot of the slot, An outer routing method of a castle-type printed circuit board in which a semi-circular slot is formed so as to significantly reduce the slot defect rate of a.

일반적으로, 전자제품이 소형화됨에 따라 반도체 소자의 크기를 축소시키고 회로동작시 발생되는 열을 외부로 방출시키기 위한 다양한 구조의 인쇄회로기판이 개발되고 있다. In general, as electronic products become smaller, printed circuit boards having various structures for reducing the size of semiconductor devices and dissipating heat generated during a circuit operation to the outside have been developed.

이러한 상기 인쇄회로기판으로서 캐슬형 인쇄회로기판을 예를 들수가 있다.A castle type printed circuit board can be cited as the printed circuit board.

상기 캐슬형 인쇄회로기판은 도 1a, b에 도시하는 바와 같이 기판의 외곽에 관통홀부(10, 10')를 갖는 구조로서 외곽에 반원형의 슬롯(10a, 10a')으로 형성함 으로써, 회로동작시 발생하는 열을 방출시키고 인쇄회로기판(100)의 내부 및 외곽부분을 슬롯부분만큼 제거하여 면적을 축소시킨것이다.The castle printed circuit board has a through-hole portion 10, 10 'at the outer side of the substrate as shown in Figs. 1A and 1B, and is formed by the semicircular slots 10a and 10a' at the outer side. When heat is emitted, the area is reduced by removing the inner and outer parts of the printed circuit board 100 by the slot part.

그러나, 인쇄회로기판(100) 반원형의 슬롯(10a, 10a')을 형성하기 위해서는 인쇄회로기판(100)의 일렬로 다수개로 형성된 복수개의 관통홀부(10, 10')를 라우팅비트(20)로 라우팅 또는 절단하여 반원형의 슬롯(10a, 10a')을 형성하였다.However, in order to form the semicircular slots 10a and 10a 'of the printed circuit board 100, the plurality of through-holes 10 and 10' formed in a row of the printed circuit board 100 are routed to the routing bit 20. Routing or cutting to form semicircular slots 10a and 10a '.

이러한 반원형의 슬롯(10a, 10a')을 형성하기 위해서 라우팅되는 다수개의 관통홀부(10, 10')의 중앙을 라우팅비트(20)로 절단하여 반원형의 슬롯(10a, 10a')으로 형성시 상기 슬롯의 시작점은 깨끗하게 절단되나, 상기 슬롯의 종료점에서는 버(50)가 발생되어 왔다.When the centers of the plurality of through-holes 10 and 10 'that are routed to form the semi-circular slots 10a and 10a' are cut into the routing bits 20 to form the semi-circular slots 10a and 10a '. The start point of the slot is cut cleanly, but the burr 50 has been generated at the end point of the slot.

이러한 버(50)의 발생원인은 관통홀부(10, 10')이 형성된 상태에서 라우터비터(20)가 상기 관통홀부(10, 10')를 따라 회전하면서 반원형의 슬롯(10a, 10a')을 형성할때, 어떠한 지지면적이 없기 때문에 관통홀부(10, 10') 내벽에 도금된 동박이 라우터비터(20)의 회전과 함께 관통홀부(10, 10')의 가장자리로 밀려 발생하여 인쇄회로기판의 반원형의 슬롯(10a, 10a')의 양단부분의 불량이 많이 발생하였다.The cause of the burr 50 is the router bitter 20 rotates along the through-holes 10 and 10 'in the state where the through-holes 10 and 10' are formed, thereby opening the semi-circular slots 10a and 10a '. When forming, since there is no supporting area, the copper foil plated on the inner wall of the through-holes 10 and 10 'is pushed to the edge of the through-holes 10 and 10' with the rotation of the router bitter 20 so that the printed circuit board The defects at both ends of the semi-circular slots 10a and 10a 'of Hb have occurred.

이러한 버(50)는 관통홀부(10, 10')주변에 형성되는 회로에 접촉하여 회로의 단락을 일으키기 때문에 반도체의 소자의 불량률을 증가시키는 문제점이 발생되어 왔다.Since the burr 50 contacts a circuit formed around the through hole portions 10 and 10 'and causes a short circuit, a problem of increasing the defective rate of the device of the semiconductor has been generated.

상기와 같은 문제점을 발생하기 위해서, 본 발명은 인쇄회로기판의 다수개로 일렬로 형성된 복수개의 관통홀부를 라우터비트로 라우팅하여 반원형의 슬롯으로 형성되게 제1라우팅가공부가 형성되는 제1라우팅공정과, 제2라우팅가공부가 형성되는 제2라우팅공정과, 제2라우팅가공부를 일직선으로 라우트하는 제3라우팅공정으로 인쇄회로기판의 다수개의 관통홀부들을 반원형의 슬롯형태로 형성시 상기 슬롯의 반원형 양단에 버의 발생을 억제하여 인쇄회로기판 반원형의 슬롯부분 불량률을 획기적으로 줄이도록 한 새로운 반원형의 슬롯이 형성되는 캐슬형 인쇄회로기판의 외곽 라우팅방법을 제공하는데 그 목적이 있다.In order to generate the above problems, the present invention provides a first routing process in which a first routing processing unit is formed to form a semi-circular slot by routing a plurality of through holes formed in a row in a plurality of printed circuit boards to a router bit, A second routing process in which a routing processing part is formed, and a third routing process in which the second routing processing part is routed in a straight line. When a plurality of through-hole parts of a printed circuit board are formed in a semicircular slot shape, burrs are formed at both ends of the semicircular shape of the slot. It is an object of the present invention to provide an outer routing method of a castle printed circuit board in which a new semi-circular slot is formed to suppress the occurrence of the circuit board and reduce the defective rate of the slot portion of the semicircular printed circuit board.

이와 같은 목적을 달성하기 위해서, 본 발명은 인쇄회로기판 내부 및 외곽에 동박을 입힌 복수 관통홀부가 일렬로 다수개로 형성되고, 상기 관통홀부를 라우터비트로 라우팅하여 반원형의 슬롯이 형성되는 인쇄회로기판의 라우팅방법에 있어서,In order to achieve the above object, the present invention provides a plurality of through-holes coated with copper foil in and out of a printed circuit board, and a plurality of through-holes are routed through router bits to form semi-circular slots. In the routing method,

상기 인쇄회로기판을 전면부에서 후면부로 뒤집고, 상기 인쇄회로기판에 일렬로 다수개로 형성된 양 상기 관통홀부들의 외주연에 인접되도록 제1라우터비터로 라우팅하여 제1라우팅가공부를 갖는 제1라우팅공정과; The first routing process having the first routing processing part by inverting the printed circuit board from the front part to the rear part, and routing the printed circuit board to the first router bitter so as to be adjacent to the outer circumference of the through holes formed in plural in a row. and;

상기 제1라우팅공정 후, 다수개의 상기 관통홀부의 중앙 전방부를 제2라우터비터로 각각 라우팅되는 제2라우팅가공부가 형성되는 제2라우팅공정과;A second routing process, after the first routing process, a second routing processing unit for routing a plurality of central front portions of the plurality of through-holes to a second router beater;

상기 제2라우팅공정 후, 상기 인쇄회로기판을 후면부에서 전면부로 뒤집고, 다수개의 상기 제2라우팅가공부가 형성된 상기 관통홀부들에 상기 제1라우터비터로 전방에서 후방으로 일직선 라우팅되어 반원형의 슬롯으로 형성되는 제3라우팅공정 으로 구성하는 것을 특징으로 한다.After the second routing process, the printed circuit board is turned over from the rear side to the front side, and the through-routers formed with a plurality of the second routing processing portions are linearly routed from the front to the rear with the first router bitter to form a semi-circular slot. Characterized in that consisting of a third routing process.

또한, 상기 제1라우터비터의 크기는 Ø1.5이고, 상기 제2라우터비터의 크기는 Ø1.0인 것을 특징으로 한다.In addition, the size of the first router bitter is Ø1.5, the size of the second router bitter is characterized in that Ø1.0.

본 발명은 인쇄회로기판의 다수개로 일렬로 형성된 복수개의 관통홀부를 제1라우팅공정과, 제2라우팅공정과, 제3라우팅공정으로 인쇄회로기판의 다수개반원형의 슬롯형태로 형성하게 하여 기존의 인쇄회로기판 반원형 슬롯의 양단에 버가 발생되는 라우팅방법을 탈피하여 인쇄회로기판의 반원형의 슬롯을 형성시 상기 반원형의 슬롯의 양단에서 버의 발생을 억제하여 인쇄회로기판 반원형의 슬롯부분 불량률을 획기적으로 줄여주어 양호한 인쇄회로기판의 반원형의 슬롯을 양산하는 효과가 있다.According to the present invention, a plurality of through holes formed in a row in a plurality of printed circuit boards may be formed in a slot shape of a plurality of semicircular shapes of a printed circuit board by a first routing process, a second routing process, and a third routing process. Breaking out the routing method where burrs are generated at both ends of the semicircular slots of the printed circuit board, and forming the semicircular slots of the printed circuit board, suppressing the occurrence of burrs at both ends of the semicircular slots, thereby dramatically reducing the defective rate of the slot part of the semicircular slots of the printed circuit board. In this way, the semicircular slot of a good printed circuit board can be produced.

이하, 본 발명을 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 블럭도이고, 도 3은 본 발명에 따른 제 1라우팅공정을 나타낸 개략도이고, 도 4a는 본 발명에 따른 제 2라우팅공정을 나타낸 개략도이고, 도 4b는 본 발명에 따른 제 2라우팅공정의 라우팅방향을 나타낸 개략도이고, 도 5는 본 발명에 따른 제 3라우팅공정을 나타낸 개략도이다.Figure 2 is a block diagram according to the present invention, Figure 3 is a schematic diagram showing a first routing process according to the present invention, Figure 4a is a schematic diagram showing a second routing process according to the present invention, Figure 4b according to the present invention 5 is a schematic diagram showing a routing direction of a second routing process, and FIG. 5 is a schematic diagram showing a third routing process according to the present invention.

본 발명에 따른 반원형의 슬롯이 형성되는 인쇄회로기판의 라우팅방법을 도 2 내지 도 5에 도시된 것을 참조하여 상세하게 설명하면;A method of routing a printed circuit board on which a semicircular slot is formed according to the present invention will be described in detail with reference to FIGS. 2 to 5;

인쇄회로기판(100) 내부 및 외곽에 동박을 입힌 복수 관통홀부(10, 10')가 일렬로 다수개로 형성되고, 상기 관통홀부(10, 10')를 라우터비트(20)로 라우팅하여 반원형의 슬롯(10a, 10a')이 형성되는 인쇄회로기판의 라우팅방법을 사용하여왔다.A plurality of through holes 10 and 10 'coated with copper foil on the inside and the outside of the printed circuit board 100 are formed in a row, and the through holes 10 and 10' are routed to the router bit 20 to form a semicircular shape. The routing method of the printed circuit board in which the slots 10a and 10a 'are formed has been used.

그러나 본 발명에 따른 반원형의 슬롯이 형성되는 인쇄회로기판의 라우팅방법은 제1라우팅공정(200)과, 제2라우팅공정(300)과, 제3라우팅공정(400)으로 구성한다.However, the routing method of a printed circuit board having a semicircular slot according to the present invention includes a first routing step 200, a second routing step 300, and a third routing step 400.

<실시예><Example>

<제1라우팅공정(200)><First Routing Process 200>

상기 인쇄회로기판(100)을 전면부(101a)에서 후면부(101)로 뒤집고, 상기 인쇄회로기판(100)에 일렬로 다수개로 형성된 양 상기 관통홀부(10, 10')들의 외주연에 인접되도록 제1라우터비터(20a)로 라우팅하여 제1라우팅가공부(30)를 형성하여 구성한다.The printed circuit board 100 is inverted from the front portion 101a to the rear portion 101 and adjacent to the outer circumferences of the through-hole portions 10 and 10 'formed in plural in a row on the printed circuit board 100. Routing to the first router bitter (20a) to form a first routing processing unit 30 is configured.

상기 관통홀부(10, 10')의 크기는 Ø0.6인 것이 바람직하나, 그 크기는 ±Ø0.6의 크기로 형성할 수 있다.Preferably, the through-holes 10 and 10 'have a size of Ø0.6, but the size of the through-holes 10 and 10' may be ± 0.6.

상기 제1라우터비터(20a)의 크기는 Ø1.5로 하는 것이 바람직하나, 그 크기는 ±Ø1.5의 크기로 형성할 수 있다.Preferably, the size of the first router bitter 20a is Ø1.5, but the size of the first router bitter 20a may be Ø1.5.

<제2라우팅공정(300)><Second routing process 300>

상기 제1라우팅공정(200) 후, 다수개의 상기 관통홀부(10,10')의 중앙 전방부(102)를 제2라우터비터(20a)로 각각 라우팅되는 제2라우팅가공부(40)를 각각 형 성한다.After the first routing process 200, each of the second routing processing part 40, each of which is routed to the second router bitter 20a, the central front part 102 of the plurality of through-hole parts 10 and 10 ', respectively, is formed. Sung.

상기 인쇄회로기판(100)의 후면부(101)에 상기 제2라우팅가공부(40)를 상기 관통홀부(10, 10')들의 중앙 전방부(102)에 미리 형성하는 것은 상기 인쇄회로기판(100)을 전면부(100a)로 뒤집어서 상기 제2라우팅가공부(40)와 상기 관통홀부(10, 10')의 중앙을 라우터비터로 라우팅하여 반원형의 슬롯(10a, 10a')을 형성시 상기 반원형의 슬롯(10a, 10a')의 양단이 일직선으로 양호하게 절단되게 하여 상기 반원형의 슬롯(10a, 10a')의 양단에 버(50)가 발생되는 것을 막아 상기 인쇄회로기판(100)의 라우팅가공공정에서 발생하는 상기 인쇄회로기판(100)의 불량품을 없애고 라우팅가공공정작업의 능률을 향상하기 위함이다.Forming the second routing processing portion 40 on the rear portion 101 of the printed circuit board 100 at the central front portion 102 of the through hole portions 10 and 10 'is preformed on the printed circuit board 100. To the front portion 100a to route the center of the second routing processing portion 40 and the through hole portions 10 and 10 'to a router beater to form the semicircular slots 10a and 10a' when forming the semicircular slots. Both ends of (10a, 10a ') are cut in a straight line to prevent burrs 50 from occurring at both ends of the semicircular slots (10a, 10a') in the routing process of the printed circuit board (100). This is to eliminate the defective products of the printed circuit board 100 to occur and to improve the efficiency of the routing process operation.

상기 제2라우터비터(20b)의 크기는 Ø1.0로 하는 것이 바람직하나, 그 크기는 ±Ø1.0의 크기로 형성할 수 있다.The size of the second router bitter 20b is preferably set to Ø 1.0, but the size of the second router bitter 20b may be formed to a size of Ø 1.0.

<제3라우팅공정(400)><3rd routing process (400)>

상기 제2라우팅공정(300) 후, 상기 인쇄회로기판(100)을 후면부(101)에서 전면부(101a)로 뒤집어준다.After the second routing process 300, the printed circuit board 100 is turned over from the rear portion 101 to the front portion 101a.

전면부(101a)가 위로 향한 상기 인쇄회로기판(100)상의 다수개로 상기 제2라우팅가공부(40)가 형성된 상기 관통홀부(10, 10')들에 상기 제1라우터비터(20a)로 상기 관통홀부(10, 10')의 중앙(A)의 전방에서 후방으로 일직선 라우팅하여준다.The first router bitter 20a penetrates the through-hole portions 10 and 10 'on which the second routing processing portion 40 is formed on the printed circuit board 100 with the front portion 101a facing upward. Routing in a straight line from the front of the center (A) of the hole (10, 10 ') to the rear.

이러하게 라우터비터로 라우팅하여주면 상기 제2라우팅가공부(40)가 제거되고 상기 관통홀부(10, 10')은 반원형의 슬롯(10a, 10a')으로 형성되게 된다.When routed to the router bitter in this way, the second routing processing portion 40 is removed and the through hole portions 10 and 10 'are formed as semi-circular slots 10a and 10a'.

상기 제1라우터비터(20a)의 크기는 Ø1.5로 하는 것이 바람직하나, 그 크기는 ±Ø1.5의 크기로 형성할 수 있다.Preferably, the size of the first router bitter 20a is Ø1.5, but the size of the first router bitter 20a may be Ø1.5.

이상 설명한 내용을 통해 당업자라면 본 발명의 기술 사상을 일탈하지 아니하는 범위에서 다양한 변경 및 수정이 가능함을 알 수 있을 것이다.Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

따라서, 본 발명의 기술적 범위는 실시 예에 기재된 내용으로 한정되는 것이 아니라 특허 청구의 범위 및 그와 균등한 것들에 의하여 정해져야 한다.Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims and their equivalents.

도 1a, b는 종래의 인쇄회로기판의 반원형의 슬롯을 가공을 나타낸 개략도.1A and 1B are schematic views showing processing of semi-circular slots of a conventional printed circuit board.

도 2는 본 발명에 따른 블럭도.2 is a block diagram according to the present invention;

도 3은 본 발명에 따른 제 1라우팅공정을 나타낸 개략도.Figure 3 is a schematic diagram showing a first routing process according to the present invention.

도 4는 본 발명에 따른 제 2라우팅공정을 나타낸 개략도.Figure 4 is a schematic diagram showing a second routing process according to the present invention.

도 4b는 본 발명에 따른 제 2라우팅공정의 라우팅방향을 나타낸 개략도.Figure 4b is a schematic diagram showing the routing direction of the second routing process according to the present invention.

도 5는 본 발명에 따른 제 3라우팅공정을 나타낸 개략도.Figure 5 is a schematic diagram showing a third routing process according to the present invention.

**** 도면의 주요부분에 대한 부호의 설명 ******** Explanation of symbols for the main parts of the drawing ****

10, 10': 관통홀부 10a, 10a': 반원형의 슬롯10, 10 ': through hole 10a, 10a': semicircular slot

20: 라우터비터 20a: 제1라우터비터20: router bitter 20a: first router bitter

20b: 제2라우터비터 30: 제1라우팅가공부20b: second router bitter 30: first routing processing

40: 제2라우팅가공부 100: 인쇄회로기판40: second routing processing unit 100: a printed circuit board

101: 후면부 101a: 전면부101: rear 101a: front

102: 중앙전방부 200: 제1라우팅공정102: front center 200: first routing process

300: 제2라우팅공정 400: 제3라우팅공정300: second routing process 400: third routing process

Claims (2)

인쇄회로기판(100) 내부 및 외곽에 동박을 입힌 복수 관통홀부(10, 10')가 일렬로 다수개로 형성되고, 상기 관통홀부(10, 10')를 라우터비트(20)로 라우팅하여 반원형의 슬롯(10a, 10a')이 형성되는 인쇄회로기판의 라우팅방법에 있어서,A plurality of through holes 10 and 10 'coated with copper foil on the inside and the outside of the printed circuit board 100 are formed in a row, and the through holes 10 and 10' are routed to the router bit 20 to form a semicircular shape. In the routing method of a printed circuit board in which slots (10a, 10a ') are formed, 상기 인쇄회로기판(100)을 전면부(101a)에서 후면부(101)로 뒤집고, 상기 인쇄회로기판(100)에 일렬로 다수개로 형성된 양 상기 관통홀부(10, 10')들의 외주연에 인접되도록 제1라우터비터(20a)로 라우팅하여 제1라우팅가공부(30)를 갖는 제1라우팅공정(200)과; The printed circuit board 100 is inverted from the front portion 101a to the rear portion 101 and adjacent to the outer circumferences of the through-hole portions 10 and 10 'formed in plural in a row on the printed circuit board 100. A first routing process (200) having a first routing processing portion (30) by routing to the first router bitter (20a); 상기 제1라우팅공정(200) 후, 다수개의 상기 관통홀부(10,10')의 중앙 전방부(102)를 제2라우터비터(20a)로 각각 라우팅되는 제2라우팅가공부(40)가 형성되는 제2라우팅공정(300)과;After the first routing process 200, the second routing processing portion 40 is formed to route the central front portion 102 of the plurality of through holes 10, 10 'to the second router bitter 20a, respectively. A second routing process 300; 상기 제2라우팅공정(300) 후, 상기 인쇄회로기판(100)을 후면부(101)에서 전면부(101a)로 뒤집고, 다수개의 상기 제2라우팅가공부(40)가 형성된 상기 관통홀부(10, 10')들에 상기 제1라우터비터(20a)로 전방에서 후방으로 일직선 라우팅되어 반원형의 슬롯(10a, 10a')으로 형성되는 제3라우팅공정(400)으로 구성하는 것을 특징으로 하는 반원형의 슬롯이 형성되는 인쇄회로기판의 라우팅방법.After the second routing process 300, the printed circuit board 100 is turned over from the rear portion 101 to the front portion 101a, and the through hole portions 10 and 10 in which the plurality of second routing processing portions 40 are formed. Semi-circular slots, characterized in that consisting of a third routing process (400) formed of semi-circular slots (10a, 10a ') are routed in a straight line from the front to the first router bitter (20a) to Routing method of the printed circuit board formed. 제 1항에 있어서, The method of claim 1, 상기 제1라우터비터(20a)의 크기는 Ø1.5이고, 상기 제2라우터비터(20b)의 크기는 Ø1.0인 것을 특징으로 하는 반원형의 슬롯이 형성되는 인쇄회로기판의 라우팅방법.The size of the first router bitter (20a) is Ø1.5, the size of the second router bitter (20b) is Ø1.0 is a routing method of a printed circuit board is formed a semi-circular slot.
KR1020080049909A 2008-05-28 2008-05-28 Routing methods of the printed circuit board where slot in semicircle is formed. KR100997195B1 (en)

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KR20160121291A (en) * 2015-04-10 2016-10-19 (주)영진프로텍 Half hole of pcb machining method and the pcb manufactured from the same
CN107414152A (en) * 2017-09-05 2017-12-01 梅州市志浩电子科技有限公司 A kind of processing method of the strip gong groove of PCB
CN112969312A (en) * 2021-01-27 2021-06-15 红板（江西）有限公司 PCB metallized half-hole processing technology
CN115958226A (en) * 2023-01-10 2023-04-14 湖北全成信精密电路有限公司 Improved process for burr by using forming auxiliary groove

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KR100361682B1 (en) * 2000-04-24 2002-11-22 봉문근 Cutting Method of Print Circuit Board
JP2005223266A (en) 2004-02-09 2005-08-18 Sharp Corp Manufacturing method of through-hole in end face of board
JP2007067224A (en) 2005-08-31 2007-03-15 Sharp Corp Board cutting method and board
KR100687791B1 (en) 2005-11-29 2007-03-02 주식회사 코리아써키트 Manufacturing method of printed circuit board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160121291A (en) * 2015-04-10 2016-10-19 (주)영진프로텍 Half hole of pcb machining method and the pcb manufactured from the same
CN107414152A (en) * 2017-09-05 2017-12-01 梅州市志浩电子科技有限公司 A kind of processing method of the strip gong groove of PCB
CN112969312A (en) * 2021-01-27 2021-06-15 红板（江西）有限公司 PCB metallized half-hole processing technology
CN115958226A (en) * 2023-01-10 2023-04-14 湖北全成信精密电路有限公司 Improved process for burr by using forming auxiliary groove

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