KR20090109598A - Fabrication of vertical structured light emitting diodes using group 3 nitride-based semiconductors and its related methods - Google Patents

Abstract

PURPOSE: Fabrication of vertical structured light emitting diodes using group 3 nitride-based semiconductors and its related methods are provided to improve horizontal current spreading. CONSTITUTION: The vertical structured light emitting diodes using group 3 nitride-based semiconductors includes a partial n-type ohmic contact electrode structure(210), a light-emitting structure for light emitting diode, a p-type electrode structure(110), and a heat sink supporter(160). The light-emitting structure for light emitting diode is comprised of a lower nitride group clad layer(20), a nitride group active layer(30), a top nitride group clad layer(40), and a superlattice structure(90) and a nitride group current injection layer(100). The p-type electrode structure includes a current blocking structure and a reflective current spreading layer. The heat sink supporter is formed at the lower part of the p-type electrode structure.

Description

Fabrication of vertical structured light emitting diodes using group 3 nitride-based semiconductors and its related methods

The present invention relates to a vertical structure using an epitaxial group 3 nitride-based semiconductor represented by the formula In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1). A group III-nitride semiconductor light emitting diode device having a structure and a method of manufacturing the same. More specifically, a growth substrate wafer on which a light emitting structure for a group III nitride semiconductor light emitting diode device is grown on a growth substrate and a functional bonding wafer manufactured by the present invention are used as a wafer-to-wafer. A combination of a wafer to wafer bonding process and a substrate lift-off process is provided to provide a group III nitride semiconductor light emitting diode device having a vertical structure and a method of manufacturing the same.

Recently, a light emitting diode (LED) device using a Group III nitride-based semiconductor single crystal is an In x Al y Ga 1-xy N (0≤x, 0≤y, x + y≤1 used as a nitride-based active layer). The material system has a wide range of energy band gaps. In particular, according to the composition of In is known as a material capable of emitting light in all areas of visible light, and according to the composition of Al can generate ultraviolet light, which is an ultra-short wavelength region, and the light emitting diodes manufactured using the same are used for display plates, display devices, Development of high quality light emitting diodes is very important in the application area of backlight, medical light source including white light source and the like, and the range of application is gradually expanded and increased.

Since a light emitting diode (hereinafter, referred to as a group III nitride semiconductor light emitting diode) device made of such a group III nitride semiconductor material system is generally grown on top of an insulating growth substrate (typically, sapphire), another group 3 Since two electrodes facing each other of the growth substrate cannot be provided like the Group-5 compound semiconductor light emitting diode device, two electrodes of the LED device must be formed on the crystal-grown semiconductor material system. A conventional structure of such a group III-nitride semiconductor light emitting diode device is schematically illustrated in FIGS. 1 to 4.

First, referring to FIG. 1, a group III-nitride semiconductor light emitting diode device includes a lower nitride-based cladding made of a sapphire growth substrate 10 and an n-type conductive semiconductor material sequentially formed on an upper surface of the growth substrate 10. A layer 20, a nitride based active layer 30 and an upper nitride based cladding layer 40 made of a p-type conductive semiconductor material. The lower nitride-based cladding layer 20 may be formed of an n-type In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer, and the nitride based active layer 30 Is composed of a multi-quantum well-structured semiconductor in which Group III-nitride-based In x Al y Ga 1-xy N (0≤x, 0≤y, x + y≤1) Can be. In addition, the upper nitride-based cladding layer 40 may be formed of a p-type In x Al y Ga 1-x-y N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer. In general, the lower nitride-based cladding layer / nitride-based active layer / upper nitride-based cladding layer 20, 30, or 40 formed of the group III-nitride-based semiconductor single crystal is a device such as MOCVD, MBE, HVPE, sputter, or PLD. Can be grown using. At this time, prior to growing the n-type In x Al y Ga 1-xy N semiconductor, which is the lower nitride-based cladding layer 20, in order to improve lattice matching with the sapphire growth substrate 10, such as AlN or GaN The buffer layer 201 may be formed therebetween.

As described above, since the sapphire growth substrate 10 is an electrically insulating material, both electrodes of the LED element should be formed on the same upper surface of the single crystal semiconductor growth direction. For this purpose, the upper nitride-based cladding layer 40 and the nitride-based A portion of the active layer 30 is etched (ie, etched) to expose a portion of the upper nitride cladding layer 20 to the atmosphere, and the n-type In, the lower nitride-based cladding layer 20 exposed to the atmosphere, is exposed. An n-type ohmic contact interface electrode and an electrode pad 80 are formed on the x Al y Ga 1-xy N semiconductor upper surface.

In particular, since the upper nitride-based cladding layer 40 has a relatively high sheet resistance due to low carrier concentration and small mobility, prior to forming the p-type electrode 70, There is a need for additional materials capable of forming the ohmic contact current spreading layer 501. In contrast, US Pat. No. 5,563,422 discloses a p-type In x Al y Ga 1-xy N (40) half, which is an upper nitride-based cladding layer 40 positioned on an upper layer of a light emitting structure for a group III nitride semiconductor light emitting diode device. Nickel-oxidized to form an ohmic contact current spreading layer 501 that forms an ohmic contact interface with a low specific contact resistance in the vertical direction before forming the p-type electrode 80 on the upper surface of the conductor. A material composed of gold (Ni-O-Au) has been proposed.

The ohmic contact current spreading layer 501 is disposed on the upper surface of the p-type In x Al y Ga 1-xy N semiconductor, which is the upper nitride-based cladding layer 40, while simultaneously improving current spreading in the horizontal direction. In addition, by forming an ohmic contact interface having a low specific contact resistance in the vertical direction, an effective current injection can be performed, thereby improving the electrical characteristics of the light emitting diode device. However, the ohmic contact current spreading layer 501 composed of oxidized nickel-gold has a low transmittance of 70% on average even after the heat treatment, and this low light transmittance is when the light generated by the light emitting diode device is emitted to the outside. It absorbs large amounts of light, reducing the overall external luminous efficiency.

As described above, in order to obtain a high-brightness light emitting diode device through high light transmittance of the ohmic contact current spreading layer 501, various kinds of materials including the recently oxidized nickel-gold (Ni-O-Au) material Instead of the ohmic contact current spreading layer 501 formed of a transparent metal or alloy, a method of forming a transparent conductive material such as indium tin oxide (ITO) or zinc oxide (ZnO), which has a transmittance of 90% or more, has been proposed. However, the transparent conductive material is a p-type In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor, which is the upper nitride-based cladding layer 40 (~ 7.5 eV or more). Small work function (4.7 ~ 6.1eV), and direct deposition on top of p-type In x Al y Ga 1-xy N semiconductor and subsequent process including heat treatment have a large specific contact resistance instead of ohmic contact interface. The formation of a schottky contact interface requires a new transparent conductive material or fabrication process that can solve the above problems.

The transparent conductive material such as ITO or ZnO is formed on the upper surface of the p-type In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor of the upper nitride-based cladding layer 40. In order to be able to fulfill its role as a good ohmic contact current spreading layer 501, recently, YK Su et al. Have described the transparent electroconductive material described above in various documents as the p-type In x Al y as the upper nitride-based cladding layer 40. Prior to the direct deposition of Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductors, a current spreading layer having an ohmic contact interface via a superlattice structure 501) Forming technology is proposed.

As shown in FIG. 2, the superlattice structure includes two wells (b1) and a barrier (a1) of a well (b1) and a barrier (a1) in a multi-quantum well structure. Although the points repeated periodically in one pair are similar, the thickness of the barrier (a1) of the multi-quantum well structure is relatively thick compared to the thickness of the well (b1), while the two layers constituting the superlattice structure ( a2 and b2) both have a thin thickness of 5 nm or less. Due to the above characteristics, the multi-quantum well structure is different from the role of confining electrons or holes, which are carriers, to the well b1 located between the thick barriers a1. It helps to facilitate transport.

Referring to FIG. 3, a light emitting diode device including an ohmic contact current spreading layer 60 using a superlattice structure proposed by YK Su et al. Is described with reference to FIG. 3. 10) an upper nitride-based cladding layer formed of a lower nitride-based cladding layer 20 formed of an n-type conductive semiconductor material, an nitride-based active layer 30, and a p-type conductive semiconductor material formed on an upper surface of the growth substrate 10 ( 40), and superlattice structure 90. In particular, the superlattice structure 90 is in-situ with the same growth equipment as the lower nitride-based cladding layer 20, the nitride-based active layer 30, and the upper nitride-based cladding layer 40. To grow and form. The lower nitride-based cladding layer 20 may be formed of an n-type In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer, and the nitride based active layer 30 Is a group III-nitride based In x Al y Ga 1-xy N (0≤x, 0≤y, x + y≤1) semiconductor multilayer composed of different composition of multi-quantum well structure. have. The upper nitride cladding layer 40 may be formed of a p-type In x Al y Ga 1-x-y N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer. In addition, the superlattice structure 90 is a group III-nitride-based In x Al y Ga 1-xy N (0≤x, 0≤y, x + y≤1) semiconductor or other conductive plate composed of different compositions. A group III-nitride-based In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor layer having a dopant may be formed.

P-type In x Al y Ga 1-xy N (0 ≦ x, 0), which is the upper nitride-based cladding layer 40, according to the composition and dopant type of the superlattice structure 90 ≤y, x + y≤1) Lower the dopant activation energy of the semiconductor to increase the net effective hole concentration, or through quantum mechanical tunneling conduction through energy bandgap engineering It is known to form an ohmic contact interface through a mechanical tunneling transport phenomenon.

In general, the lower nitride-based cladding layer / nitride-based active layer / the upper nitride-based cladding layer / superlattice structure 20, 30, 40, or 90 formed of the group III-nitride semiconductor single crystal is MOCVD, MBE, HVPE, or sputter. Or a device such as a PLD. At this time, prior to growing the n-type In x Al y Ga 1-xy N semiconductor of the lower nitride-based cladding layer 20, in order to improve lattice matching with the sapphire growth substrate 10, such as AlN or GaN The buffer layer 201 may be formed therebetween.

However, the material used for the ohmic contact current spreading layer 501 or 60 made of a transparent electroconductive material positioned on the upper nitride-based cladding layer 40 has a trade-off relationship between transmittance and electrical conductivity. have. In other words, when the thickness of the ohmic contact current spreading layer 501 or 60 is reduced to increase the transmittance, the conductivity decreases conversely, resulting in an increase in the series resistance of the group III nitride semiconductor light emitting diode device. Therefore, there existed a problem that it became the cause of the element reliability fall.

Therefore, a method of not using an ohmic contact current spreading layer composed of a transparent conductive material, and in the case of an optically transparent growth substrate, an electrically conductive material having high reflectance on the upper nitride-based cladding layer of the light emitting structure for a light emitting diode device A structure for forming the configured ohmic contact current spreading layer 502 may be considered. This is a cross-sectional view of the group III-nitride semiconductor light emitting diode device of the flip-chip structure shown in FIG.

As shown, the group III nitride semiconductor light emitting diode device of the flip chip structure is formed of an optically transparent sapphire growth substrate 10 and an n-type conductive semiconductor material sequentially grown on the upper surface of the growth substrate 10. The nitride-based cladding layer 20, the nitride-based active layer 30, and the upper nitride-based cladding layer 40 made of a p-type conductive semiconductor material are included. An ohmic contact current spreading layer 502 formed of an electrically conductive material having a high reflectance is formed on the upper nitride-based cladding layer 40, and light generated from the nitride-based active layer 30, which is a light emitting structure for a light emitting diode device, is formed. Is reflected in the opposite direction using the ohmic contact current spreading layer 502 having a high reflectance, and emits light toward the optically transparent growth substrate 10.

In general, a light emitting diode device that is widely used using a group III nitride semiconductor is generated using ultraviolet light, blue light, or green light using InGaN, AlGaN, etc. in the nitride active layer 30, and is used as a growth substrate 10. ) Is sapphire. Since the sapphire used as the growth substrate 10 is a material having a fairly wide band gap, all of the sapphire is transparent to the light emitted from the group III nitride semiconductor LED device. For this reason, in particular, in the group III-nitride semiconductor light emitting diode device, the above-described flip chip structure can be said to be a very effective means. However, the upper nitride cladding layer 40 having p-type conductivity forms an ohmic contact interface and has high reflectance. The substance having is limited. In general, metal materials having high reflectivity are silver (Ag), aluminum (Al), and rhodium (Rh). The silver (Ag) and rhodium (Rh) and alloys associated with them exhibit good ohmic contact interfaces with the upper nitride based cladding layer 40, but the metals or alloys of these materials emit light for the light emitting diode device. There is a problem in that a diffusion phenomenon of material movement occurs inside the structure, and the operating voltage of the light emitting diode device is lowered and the reliability is lowered. In addition, thermally unstable silver (Ag), rhodium (Rh), and their associated alloys exhibit low reflectance to ultraviolet light, which is a short wavelength region of 400 nm or less, resulting in ohmic contact current of the light emitting diode device for ultraviolet light. It is not desirable as the spreading layer 502 material. On the other hand, the aluminum (Al) and related alloys have a high reflectance up to the ultraviolet region, but cannot be used because they form a schottky contact interface with the upper nitride-based cladding layer 40 having p-type conductivity, which is not a desirable ohmic contact interface. It is a state. Therefore, in order to realize a group III-nitride semiconductor light emitting diode device having a flip chip structure, an ohmic contact current spreading layer having an ohmic contact interface and a high reflectance on the upper nitride cladding layer 40 having p-type conductivity ( There is a need to develop materials or structures capable of forming 502.

On the other hand, the group III nitride-based semiconductor LED device of the general structure and the flip chip structure is a horizontal structure, and is manufactured on the sapphire growth substrate 10 having low thermal conductivity and electrical insulation, so that it inevitably occurs when the LED device is driven. There is a problem in that it is difficult to discharge a large amount of heat to reduce the overall characteristics of the device.

In addition, as shown and described, in order to form two ohmic contact electrodes and electrode pads, a part of the nitride-based active layer 40 needs to be removed, and thus the light emitting area is reduced, making it difficult to realize a high quality light emitting diode device. The smaller number of chips in a sized wafer lags behind the cost competitiveness.

In addition, after the manufacturing process of the light emitting diode device on the wafer is completed, lapping, polishing, scribing, sawing, and braking for separating into a single light emitting diode device Due to the inconsistency between the cleavage plane of the sapphire growth substrate 10 and the group III-nitride-based semiconductor during mechanical processes such as breaking, the defect rate is high and the overall product yield is deteriorated.

Recently, to solve the problem of the group III-nitride semiconductor light emitting diode device having a horizontal structure, the growth substrate 10 is removed so that two ohmic contact electrodes and electrode pads face the upper and lower portions of the light emitting diode device. A group III-nitride-based semiconductor light emitting diode device having a vertical structure in which a current is applied from outside and flows in one direction to improve luminous efficiency is disclosed in many documents (US Patent, US 6,071,795, US 6,335,263, US 20060189098). have.

30 is a cross-sectional view illustrating a general manufacturing process of a group III-nitride semiconductor light emitting diode device having a vertical structure as an example of the prior art. As shown in FIG. 30, in the method of manufacturing a light emitting diode device having a general vertical structure, the light emitting diode light emitting device is formed on the sapphire growth substrate 10 using MOCVD or MBE growth equipment, and then light emitting the light emitting diode device. After forming the reflective p-type ohmic contact electrode structure 90 on the upper nitride-based cladding layer 50 present in the uppermost layer of the structure, the support substrate wafer prepared separately from the growth substrate wafer is soldered at a temperature of less than 300 ° C. After solder wafer bonding, the sapphire growth substrate is removed to manufacture a vertical light emitting diode device.

Referring to FIG. 30, the undoped GaN or InGaN buffer layer 20, the lower nitride-based cladding layer 30, using MOCVD growth equipment on the sapphire substrate 10 first. After forming a light emitting structure for a light emitting diode device in which the nitride-based active layer 40 formed of InGaN and GaN and the upper nitride-based cladding layer 50 were sequentially grown (FIG. 30A), an upper portion of the upper nitride-based cladding layer 50 was formed. The reflective p-type ohmic contact electrode structure 90 and the soldering reaction prevention layer 100 are sequentially formed to prepare a growth substrate wafer (FIG. 30B). Then, as shown in FIG. 30C, two ohmic contact electrodes 120 and 130 are formed on the upper and lower portions of the electrically conductive support substrate 110, respectively, and a soldering material for bonding the light emitting structure for the light emitting diode device ( 140 is deposited to prepare a support substrate wafer. Then, the grown substrate wafer The soldering material diffusion barrier layer 100 and the soldering material 140 of the substrate wafer are brought into contact with each other to bond the soldering wafers as shown in FIG. 30D. Subsequently, the sapphire growth substrate 10 is irradiated with a strong energy laser on the back surface of the sapphire growth substrate 10, which is a rear surface of the growth substrate wafer on which the united plurality of light emitting diode elements are manufactured. The undoped GaN or InGaN buffer layer 20 which was separated ( laser lift off; LLO ) and damaged by the laser was etched to the front until the lower nitride based cladding layer 30 was exposed using a dry etching process. 30E, an n-type ohmic contact electrode structure 80 is formed on the lower nitride-based cladding layer 30 corresponding to the plurality of light emitting diode elements (FIG. 30F). Finally, the plurality of light emitting diode elements and the conductive support substrate 110 may be mechanically wrapped, polished, scribed, sawed, and broken. The cleavage process is performed to separate the united light emitting diode device (FIG. 28G).

However, the conventional vertical light emitting diode manufacturing process technology has a number of problems as described below, it is difficult to secure a large amount of a secure light emitting diode device of a single vertical structure. That is, since the soldering wafer bonding is performed within a low temperature range, a subsequent high temperature process cannot be performed at a higher temperature than the soldering wafer bonding temperature, and thus it is difficult to implement a thermally stable light emitting diode device. Furthermore, since the thermal expansion coefficient and the lattice constant are bonded between the wafers (dissimilar wafer), the thermal stress is generated during the bonding, which has a fatal effect on the reliability of the light emitting diode device.

More recently, in order to solve the problems occurring in the vertical group III-nitride semiconductor light emitting diode device manufactured by the soldering wafer bonding described above, Cu, Ni, or the like instead of the electroconductive support substrate formed by the soldering wafer bonding. A technique for forming a thick metal film on the reflective p-type ohmic contact electrode structure 90 by an electroplating process has been developed and partially used for product production.

However, subsequent processes arising in the vertical structured light emitting diode manufacturing process combined with the electroplating process, ie, mechanical cutting processes such as high temperature heat treatment, lapping, polishing, scribing, sawing, and braking. When this is done, problems such as deterioration of the device and occurrence of defects still remain problems to be solved.

The present invention is made in recognition of the above-mentioned problems, a group represented by the formula In x Al y Ga 1-xy N (0≤x, 0≤y, x + y≤1) on the growth substrate A growth substrate wafer comprising a light emitting structure for a group III nitride semiconductor light emitting diode device, a p-type electrode structure including a current blocking structure and a reflective current spreading layer, and a support substrate devised by the present inventors The present invention relates to a vertical light emitting diode device and a manufacturing method by combining a functional bonding wafer.

More specifically, a growth substrate wafer and a functional bonded wafer on which a light emitting structure for a group III nitride semiconductor light emitting diode device including a superlattice structure and a nitride current injection layer are grown on a top surface of the growth substrate are bonded wafer-to-wafer. to wafer bonding), and then the growth substrate and the support substrate are sequentially removed through a substrate lift-off process to provide a group III-nitride semiconductor light emitting diode device having a vertical structure and a method of manufacturing the same.

In order to achieve the above object,

A partial n-type ohmic contact electrode structure; A light emitting structure for a light emitting diode device comprising a lower nitride based cladding layer, a nitride based active layer, an upper nitride based cladding layer, a superlattice structure, and a nitride based injection layer below the partial n-type ohmic contact electrode structure; A p-type electrode structure including a current blocking structure and a reflective current spreading layer under the light emitting structure; It provides a group III-nitride-based semiconductor light emitting diode device of a vertical structure including a heat sink support formed under the p-type electrode structure.

The partial n-type ohmic contact electrode structure (partial n -type ohmic contacting electrode system) may have a predetermined shape and dimensions of the upper surface on a portion of the lower nitride-based cladding layer, each having at least 50% reflectance in the wavelength region of less than 600nm Consists of a reflective ohmic contact electrode and an electrode pad.

The superlattice structure and the nitride-based current injection layer form an ohmic contacting interface with the upper nitride-based cladding layer to facilitate easy current injection in the vertical direction. current injecting) and a material forming the reflective current spreading layer serve to prevent diffusion movement into the light emitting structure.

In addition, the superlattice structure is a transparent multi-layer composed of nitride or carbon nitride of group 2, 3, or 4 elements having different dopant and composition elements. The thickness of each layer which forms these superlattice structures is 5 nm or less.

The nitride-based current injection layer is located on the superlattice structure and has a transparent single layer composed of nitride or carbon nitride of group 2, 3, or 4 elements having a thickness of 6 nm or more. layer or multi-layer film.

The current blocking structure is to allow the current applied from the outside to be evenly distributed to the entire region of the device without concentrating to one side, and face each other in a predetermined shape and dimension in the same manner as the n-type ohmic contact electrode structure. Place it to look.

In addition, the current blocking structure may be an electrically insulating thin film layer formed directly on the upper surface of the current injection layer or a thin film layer forming a schottky contacting interface.

Further, the current blocking structure may have a form of trench or via-hole in which a portion of the upper nitride based clad layer is etched to at least the upper nitride based clad layer.

The reflective current spreading layer is made of an electrically conductive material having a reflectivity of 80% or more in a wavelength band of 600 nm or less on the current blocking structure or the top surface of the current injection layer.

The heatsink support is an electroconductive material film having a thickness of at least 10 micrometers or more using electro-plating, physical vapor deposition (PVD), or chemical vapor deposition (CVD) methods. Is formed.

In the group III-nitride semiconductor light emitting diode device of the vertical structure of the present invention, the p-type electrode structure, in addition to preventing current concentration in the vertical direction and acting as a reflector for light, prevents diffusion of materials, improves bonding and bonding between materials, Or it is preferable to include a separate thin film layer that can perform the role of preventing the oxidation of the material.

On the other hand, instead of the superlattice structure located on top of the group III-nitride semiconductor light emitting diode light emitting structure, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less, or 5 nm It can be replaced with a p-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN single layer having the following thickness.

On the other hand, a vertical light emitting diode device is fabricated using a light emitting structure for a group III nitride semiconductor light emitting diode device in which a pair of the superlattice structure and the nitride current injection layer are repeatedly stacked. It can manufacture.

In order to achieve the above another object,

A front n-type ohmic contact electrode structure; A light emitting structure for a light emitting diode device comprising a lower nitride based cladding layer, a nitride based active layer, an upper nitride based cladding layer, a superlattice structure, and a nitride based injection layer below the front n-type ohmic contact electrode structure; A p-type electrode structure including a current blocking structure and a reflective current spreading layer under the light emitting structure; It provides a group III-nitride-based semiconductor light emitting diode device of a vertical structure including a heat sink support formed under the p-type electrode structure.

The front n-type ohmic contact electrode structure (full n -type ohmic contacting electrode system) is transparent ohmic having at least 70% transmittance in the wavelength range of less than the lower forming nitride-based cladding layer region and the ohmic contact interface with the entire upper surface of the 600nm It is formed on the upper surface of the contact electrode and the transparent ohmic contact electrode and comprises a reflective electrode pad having a reflectance of 50% or more in a wavelength band of 600 nm or less.

The superlattice structure and the nitride-based current injection layer form an ohmic contacting interface with the upper nitride-based cladding layer to facilitate easy current injection in the vertical direction. current injecting) and a material forming the reflective current spreading layer serve to prevent diffusion movement into the light emitting structure.

In addition, the superlattice structure is a transparent multi-layer composed of nitride or carbon nitride of group 2, 3, or 4 elements having different dopant and composition elements. The thickness of each layer which forms these superlattice structures is 5 nm or less.

The nitride-based current injection layer is formed on the upper surface of the superlattice structure and is composed of nitride or carbon nitride containing group 2, 3, or 4 element elements having a thickness of 6 nm or more. It is a transparent single layer or multi-layer film.

The current blocking structure allows the current applied from the outside to be evenly distributed to the entire region of the device without concentrating to one side, and has a predetermined shape and the same shape as that of the reflective electrode pad of the n-type ohmic contact electrode structure. Place them facing each other in the dimensions.

In addition, the current blocking structure may be an electrically insulating thin film layer formed directly on the upper surface of the current injection layer or a thin film layer forming a schottky contacting interface.

Further, the current blocking structure may have a form of trench or via-hole in which a portion of the upper nitride based clad layer is etched to at least the upper nitride based clad layer.

The reflective current spreading layer is made of an electrically conductive material having a reflectivity of 80% or more in a wavelength band of 600 nm or less on the current blocking structure or the top surface of the current injection layer.

The heatsink support is an electroconductive material film having a thickness of at least 10 micrometers or more using electro-plating, physical vapor deposition (PVD), or chemical vapor deposition (CVD) methods. Is formed.

In the group III-nitride semiconductor light-emitting diode device of the vertical structure of the present invention, the p-type electrode structure, in addition to preventing current concentration in the vertical direction and acting as a reflector for light, prevents diffusion of materials, improves bonding and bonding between materials, Or it is preferable to include a separate thin film layer that can perform the role of preventing the oxidation of the material.

On the other hand, instead of the superlattice structure located on top of the group III-nitride semiconductor light emitting diode light emitting structure, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less, or 5 nm It can be replaced with a p-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN single layer having the following thickness.

On the other hand, a vertical light emitting diode device is fabricated using a light emitting structure for a group III nitride semiconductor light emitting diode device in which a pair of the superlattice structure and the nitride current injection layer are repeatedly stacked. It can be manufactured.

In a preferred aspect for achieving the above object, the present invention provides a light emitting diode device manufacturing method of the vertical structure using a light emitting structure for group III nitride semiconductor light emitting diode device,

A light emitting structure for a group III nitride light emitting diode device comprising a lower nitride cladding layer, a nitride active layer, an upper nitride cladding layer, a superlattice structure, and a nitride current injection layer including a buffer layer is sequentially grown on the growth substrate. Preparing a grown substrate wafer; Forming a p-type electrode structure including a current blocking structure and a reflective current spreading layer on an upper surface of the nitride based injection layer, which is a top layer of the light emitting structure for the light emitting diode device; Preparing a functional bonded wafer in which a sacrificial separation layer, a heat sink support, and a wafer bonding layer are sequentially stacked on an upper surface of the support substrate; Forming a composite by wafer bonding the growth substrate wafer and the functional bonded wafer in a wafer-to-wafer manner; Separating the growth substrate of the growth substrate wafer from the composite; Forming surface irregularities and a partial n-type ohmic contact electrode structure on an upper surface of the lower nitride-based cladding layer of the composite from which the growth substrate is removed; And separating the support substrate of the functional bonding wafer from the composite in which the growth substrate is removed.

The current blocking structure is disposed to face each other at the same position in the vertical direction in a predetermined shape and dimension in the same manner as the n-type ohmic contact electrode structure.

In addition, the current blocking structure is an electrically insulating thin film layer formed directly on the upper surface of the current injection layer, or a thin film layer forming a schottky contacting interface.

Further, the current blocking structure may have a form of trench or via-hole in which a portion of the upper nitride based clad layer is etched to at least the upper nitride based clad layer.

The sacrificial separation layer of the functional bonded wafer is made of a material that is advantageous for separating the support substrate. In this case, when the photon-beam of a specific wavelength band having a strong energy is irradiated and separated, ZnO, GaN, InGaN, InN, ITO, AlInN, AlGaN, ZnInN, ZnGaN, MgGaN, or wet etching solution (wet) In the case of etching and separating in the etching solution) is formed of any one selected from the group consisting of Au, Ag, Pd, SiO2, SiNx.

The heatsink support of the functionally bonded wafer is formed of an electroconductive material film having a thickness of at least 10 microns using electro-plating, physical vapor deposition (PVD), and chemical vapor deposition (CVD) methods. .

The wafer bonding layer on the growth substrate and the support substrate is formed of an electrically conductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 ° C. or higher. At this time, it is formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr.

The partial n-type ohmic contact electrode structure includes a reflective ohmic contact electrode and an electrode pad having a predetermined shape and dimension in a portion of the upper surface of the lower nitride-based cladding layer and having a reflectance of 50% or more in a wavelength band of 600 nm or less.

The process of separating the growth substrate and the support substrate uses a thermal-chemical decomposition reaction by chemical-mechanical polishing (CMP), chemical etching decomposition using a wet etching solution, or a photon beam having strong energy.

In addition to the electrical and optical properties of the group III-nitride semiconductor light emitting diode devices, processes such as annealing and surface treatment are introduced before and after each step as a means for enhancing the mechanical bonding between the layers. It is desirable to.

In a preferred aspect for achieving the above another object, the present invention provides a light emitting diode device manufacturing method of the vertical structure using a light emitting structure for group III nitride semiconductor light emitting diode device,

A light emitting structure for a group III nitride light emitting diode device comprising a lower nitride cladding layer, a nitride active layer, an upper nitride cladding layer, a superlattice structure, and a nitride current injection layer including a buffer layer is sequentially grown on the growth substrate. Preparing a grown substrate wafer; Forming a p-type electrode structure including a current blocking structure and a reflective current spreading layer on an upper surface of the nitride based injection layer, which is a top layer of the light emitting structure for the light emitting diode device; Preparing a functional bonded wafer in which a sacrificial separation layer, a heat sink support, and a wafer bonding layer are sequentially stacked on an upper surface of the support substrate; Forming a composite by wafer bonding the growth substrate wafer and the functional bonded wafer in a wafer-to-wafer manner; Separating the growth substrate of the growth substrate wafer from the composite; Forming surface irregularities and a front n-type ohmic contact electrode structure on an upper surface of the lower nitride-based cladding layer of the composite from which the growth substrate is removed; And separating the support substrate of the functional bonding wafer from the composite in which the growth substrate is removed.

The current blocking structure is disposed to face each other at the same position in the vertical direction in a predetermined shape and dimension in the same manner as the reflective electrode pad of the front surface n-type ohmic contact electrode structure.

In addition, the current blocking structure may be an electrically insulating thin film layer formed directly on the upper surface of the current injection layer or a thin film layer forming a schottky contacting interface.

Further, the current blocking structure may have a form of trench or via-hole in which a portion of the upper nitride based clad layer is etched to at least the upper nitride based clad layer.

The sacrificial separation layer of the functional bonded wafer is made of a material that is advantageous for separating the support substrate. In this case, when the photon-beam of a specific wavelength band having a strong energy is irradiated and separated, ZnO, GaN, InGaN, InN, ITO, AlInN, AlGaN, ZnInN, ZnGaN, MgGaN, or wet etching solution (wet) In the case of etching and separating in the etching solution) is formed of any one selected from the group consisting of Au, Ag, Pd, SiO2, SiNx.

The heatsink support of the functionally bonded wafer is formed of an electroconductive material film having a thickness of at least 10 microns using electro-plating, physical vapor deposition (PVD), and chemical vapor deposition (CVD) methods. .

The wafer bonding layer on the growth substrate and the support substrate is formed of an electrically conductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 ° C. or higher. At this time, it is formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr.

The front n-type ohmic contact electrode structure forms an ohmic contact interface with an entire region of the upper surface of the lower nitride-based clad layer, and has a transparent ohmic contact electrode having a transmittance of 70% or more in a wavelength band of 600 nm or less and an upper surface of the transparent ohmic contact electrode. It is formed of a reflective electrode pad having a reflectance of 50% or more in the wavelength band of 600nm or less.

The process of separating the growth substrate and the support substrate uses a thermal-chemical decomposition reaction by chemical-mechanical polishing (CMP), chemical etching decomposition using a wet etching solution, or a photon beam having strong energy.

In addition to the electrical and optical properties of the group III-nitride semiconductor light emitting diode devices, processes such as annealing and surface treatment are introduced before and after each step as a means for enhancing the mechanical bonding between the layers. It is desirable to.

As described above, the vertical group III-nitride semiconductor light emitting diode manufactured by the present invention has a p-type electrode structure having a current blocking structure and a reflective current spreading layer. When driving, it is possible to prevent unidirectional vertical current injecting and to promote horizontal current spreading to improve the overall performance of the LED.

In addition, according to the method of manufacturing a group III-nitride semiconductor light emitting diode having a vertical structure according to the present invention, the wafer bending during wafer-to-wafer bonding and the light emitting structure of the united light emitting diode device are manufactured without any damage. Because of this, there is an effect that can improve the processability and yield of the fab process.

Hereinafter, with reference to the accompanying drawings, it will be described in more detail with respect to the light emitting diode and the device manufacturing a group III nitride-based semiconductor optoelectronic device manufactured according to the present invention.

5 is a cross-sectional view showing a first embodiment of a light emitting structure for a group III nitride semiconductor light emitting diode device having a vertical structure invented by the present invention.

Referring to FIG. 5, a light emitting structure A for a vertical light emitting diode device according to a first embodiment of the present invention, which is formed on a growth substrate 10 and is formed on a top surface of the growth substrate 10. A lower nitride-based cladding layer 20 made of an n-type conductive semiconductor material, a nitride-based active layer 30, an upper nitride-based cladding layer 40 made of a p-type conductive semiconductor material, and a super And a lattice structure 90 and a nitride based current injection layer 100.

The growth substrate 10 may be made of a material such as sapphire or silicon carbide (SiC).

The lower nitride-based cladding layer 20 formed of the n-type conductive semiconductor material may be formed of an In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer. The growth substrate 10 may include a buffer layer (not shown) formed on the top surface. The lower nitride cladding layer 20 may be formed by doping silicon (Si).

The nitride-based active layer 30 is a region where electrons and holes, which are carriers, are recombined and include InGaN, AlGaN, GaN, AlInGaN, and the like.

In addition, the nitride-based active layer 30 may be a multilayer film in which a quantum well layer and a barrier layer are repeatedly formed. The energy bandgap of the material constituting the barrier layer of the nitride based active layer 30 is larger than that of the material constituting the well layer, and the thickness of the barrier layer is greater than the thickness of the well layer. Thick is common. The barrier layer and the well layer may be a binary, ternary, or quaternary compound nitride-based semiconductor represented by the formula In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1). have. Furthermore, the barrier layer and the well layer may be formed by doping silicon (Si) or magnesium (Mg). The emission wavelength of light emitted from the light emitting diode device is determined according to the kind of material constituting the quantum well layer of the nitride based active layer 30.

The upper nitride-based cladding layer 40 formed of the p-type conductive semiconductor material may be formed of a p-type In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer. have. The upper nitride cladding layer 40 may be formed by doping zinc (Zn) or magnesium (Mg).

The superlattice structure 90 is positioned on the upper nitride-based cladding layer 40 made of the p-type conductive semiconductor material, and has a p-type p-type In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y≤1) Lower the dopant activation energy of the semiconductor to increase the effective hole concentration, or quantum-mechanical tunneling transport through energy band-gap engineering Can cause.

The superlattice structure 90 is generally formed in multiple layers, and the thickness of each layer constituting the superlattice structure is 5 nm or less, and each layer is formed of InN, InGaN, InAlN, AlGaN, GaN, AlInGaN, AlN, SiC, SiCN. , MgN, ZnN, or SiN. In one example, the superlattice structure 90 includes InGaN / GaN, AlGaN / GaN, InGaN / GaN / AlGaN, AlGaN / GaN / InGaN.

Furthermore, each layer of the superlattice structure 90 may be formed by doping silicon (Si), magnesium (Mg), zinc (Zn), or the like.

Instead of the superlattice structure 90 composed of the multilayer, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less, or InGaN, GaN of p-type conductivity having a thickness of 5 nm or less , AlInN, AlN, InN, AlGaN, AlInGaN single layer can be replaced.

The nitride-based current injection layer 100 is a transparent single layer made of nitride or carbon nitride containing group 2, 3, or 4 elements having a thickness of 6 nm or more. Or a multilayer film.

In addition, the nitride-based current injection layer 100 may be formed by doping silicon (Si), magnesium (Mg), zinc (Zn) and the like. For example, the nitride-based current injection layer 100 includes GaN doped with silicon (Si), GaN doped with magnesium (Mg), InGaN doped with silicon (Si), InGaN doped with magnesium (Mg), and silicon (Si). ) Doped AlGaN, magnesium (Mg) doped AlGaN and the like.

The light emitting structure A for the vertical light emitting diode device A is continuously grown in an in-situ state by using a device such as MOCVD, MBE, HVPE, sputter, or PLD. Furthermore, the lower nitride-based cladding layer 20, the nitride-based active layer 30, the upper nitride-based cladding layer 40, and the superlattice structure 90 of the light emitting structure A for the vertical light emitting diode device may be formed. In the in situ state, first, the growth is formed first, and then the nitride-based current injection layer 100 may be formed on the upper surface of the superlattice structure 90 in an ex-situ state.

6 is a cross-sectional view showing a second embodiment of a light emitting structure for a group III nitride semiconductor light emitting diode device having a vertical structure invented by the present invention.

Referring to FIG. 6, a light emitting structure (B) for a light emitting diode device having a flip chip structure according to the first embodiment of the present invention, which is formed on the growth substrate 10, and has a buffer layer on an upper surface of the growth substrate 10. A lower nitride-based cladding layer 20 made of an n-type conductive semiconductor material (not shown), a nitride-based active layer 30, an upper nitride-based cladding layer 40 made of a p-type conductive semiconductor material, A repeatedly stacked superlattice structure 90 and a nitride based current injection layer 100 are included.

The growth substrate 10 may be made of a material such as sapphire or silicon carbide (SiC).

The lower nitride-based cladding layer 20 formed of the n-type conductive semiconductor material may be formed of an In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer. The growth substrate 10 may include a buffer layer (not shown) formed on the top surface. The lower nitride cladding layer 20 may be formed by doping silicon (Si).

The nitride-based active layer 30 is a region where electrons and holes, which are carriers, are recombined and include InGaN, AlGaN, GaN, AlInGaN, and the like.

In addition, the nitride-based active layer 30 may be a multilayer film in which a quantum well layer and a barrier layer are repeatedly formed. The energy bandgap of the material constituting the barrier layer of the nitride based active layer 30 is larger than that of the material constituting the well layer, and the thickness of the barrier layer is greater than the thickness of the well layer. Thick is common. The barrier layer and the well layer may be a binary, ternary, or quaternary compound nitride-based semiconductor represented by the formula In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1). have. Furthermore, the barrier layer and the well layer may be formed by doping silicon (Si) or magnesium (Mg). The emission wavelength of light emitted from the light emitting diode device is determined according to the kind of material constituting the quantum well layer of the nitride based active layer 30.

The upper nitride cladding layer 40 made of the p-type conductive semiconductor material may be formed of a p-type In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) semiconductor multilayer. have. The upper nitride cladding layer 40 may be formed by doping zinc (Zn) or magnesium (Mg).

The superlattice structure 90 repeatedly stacked on the upper nitride cladding layer 40 is disposed on an upper surface of the upper nitride cladding layer 40 made of the p-type conductive semiconductor material. x Al y Ga 1-xy N (0≤x, 0≤y, x + y≤1) Lower the dopant activation energy of the semiconductor to increase the effective hole concentration, or band-gap engineering This can lead to quantum-mechanical tunneling transport.

The superlattice structure 90 is generally formed in multiple layers, and the thickness of each layer constituting the superlattice structure is 5 nm or less, and each layer is formed of InN, InGaN, InAlN, AlGaN, GaN, AlInGaN, AlN, SiC, SiCN. , MgN, ZnN, or SiN. In one example, the superlattice structure 90 includes InGaN / GaN, AlGaN / GaN, InGaN / GaN / AlGaN, AlGaN / GaN / InGaN.

Furthermore, each layer of the superlattice structure 90 may be formed by doping silicon (Si), magnesium (Mg), zinc (Zn), or the like.

Instead of the superlattice structure 90 composed of the multilayer, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less, or InGaN, GaN of p-type conductivity having a thickness of 5 nm or less , AlInN, AlN, InN, AlGaN, AlInGaN single layer can be replaced.

The nitride-based current injection layer 100 repeatedly stacked on the upper surface of the superlattice structure 90 includes nitrides or carbon nitrides containing group 2, 3, or 4 element elements having a thickness of 6 nm or more. It is a transparent single layer or multi-layer film made of (carbon nitride).

In addition, the nitride-based current injection layer 100 may be formed by doping silicon (Si), magnesium (Mg), zinc (Zn) and the like. For example, the nitride-based current injection layer 100 includes GaN doped with silicon (Si), GaN doped with magnesium (Mg), InGaN doped with silicon (Si), InGaN doped with magnesium (Mg), and silicon (Si). ) Doped AlGaN, magnesium (Mg) doped AlGaN and the like.

The light emitting structure A for the vertical light emitting diode device A is continuously grown in an in-situ state by using a device such as MOCVD, MBE, HVPE, sputter, or PLD. Furthermore, the lower nitride-based cladding layer 20, the nitride-based active layer 30, the upper nitride-based cladding layer 40, and the superlattice structure 90 of the light emitting structure A for the vertical light emitting diode device may be formed. In the in situ state, first, the growth is formed first, and then the nitride-based current injection layer 100 may be formed on the upper surface of the superlattice structure 90 in an ex-situ state.

7 is a cross-sectional view showing a first embodiment of a group III nitride semiconductor light emitting diode device having a vertical structure manufactured according to the present invention.

As shown, the lower nitride-based cladding layer 20, the nitride-based active layer 30, the upper nitride-based cladding layer 40, on the lower surface of the partial n-type ohmic contact electrode structure 210 on which the surface irregularities 200 are formed, A p-type electrode structure 110 composed of a superlattice structure 90, a nitride-based current injection layer 100, a current blocking structure 112, and a reflective current spreading layer 111, a material diffusion barrier layer 120, A light emitting diode, which is a light emitting device having a vertical structure including two wafer bonding layers 130 and 170 and a heat sink support 160, is formed.

In more detail, the concave-convex 200 is formed on the surface of the lower nitride-based cladding layer 20, which is a light emitting surface, in order to effectively emit light generated from the nitride-based active layer 30 to the outside. A partial n-type ohmic contact electrode structure 210 is formed in a portion of the upper surface of the lower nitride based cladding layer 20.

The partial n-type ohmic contact electrode structure 210 includes reflective ohmic contact electrodes and electrode pads having a reflectivity of 50% or more in a wavelength band of 600 nm or less in a portion of the upper surface of the lower nitride-based cladding layer 20. In this case, the partial n-type ohmic contact electrode structure 210 is made of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, and metallic silicide. It is formed of any one selected from the group.

 Although not shown, a passivation film is formed on the side of the vertical light emitting diode device to protect the nitride based active layer 30 exposed through the side surface. In this case, the passivation film is formed of an electrically insulating oxide, and specifically, is formed of any one selected from the group consisting of SiNx, SiO2, and Al2O3.

A superlattice structure 90 and a nitride-based current injection layer 100 are sequentially formed on the lower surface of the upper nitride-based cladding layer 40, and they are in ohmic contacting with the upper nitride-based cladding layer 40. By forming an interface, the material forming the p-type electrode structure 110 and easy current injecting in the vertical direction serve to prevent diffusion movement into the light emitting structure.

In addition, the superlattice structure 90 includes a nitride or carbon nitride containing a group 2, 3, or 4 group element having different dopants and composition elements. It is a transparent multi-layer film consisting of a), and the thickness of each layer constituting these superlattice structures 90 is preferably 5 nm or less.

The nitride-based current injection layer 100 is located on the superlattice structure, and includes nitride or carbon nitride containing group 2, 3, or 4 element elements having a thickness of 6 nm or more. It is a transparent single layer or multi-layer film composed of).

The p-type electrode structure 110 formed on the lower surface of the nitride-based current injection layer 100 basically includes the current blocking structure 112 and the reflective current spreading layer 111.

The current blocking structure 112 is to distribute the current applied from the outside to the whole area of the device without being concentrated to one side, and has the same shape and dimensions as the partial n-type ohmic contact electrode structure 210. Place them facing each other.

In addition, the current blocking structure 112 is an electrically insulating thin film layer formed directly on the upper surface of the current injection layer 100 or a thin film layer forming a schottky contacting interface. In this case, the current blocking structure 112 is an electrically insulating oxide film such as SiNx, SiO2, Al2O3, Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, It is formed of any one selected from the group consisting of metallic silicide (metallic silicide).

The reflective current spreading layer 111 is formed of an electrically conductive material having a reflectivity of 80% or more on the upper surface of the current injection layer 100 in a wavelength band of 600 nm or less. In this case, the reflective current spreading layer 111 may be formed of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, or metal silicide. It is formed of any one selected.

The p-type electrode structure 110 including the current blocking structure 112 and the reflective current spreading layer 111 may prevent diffusion of materials and bond between materials, in addition to preventing current concentration in the vertical direction and reflecting light. And a multi-layer thin film layer capable of improving bonding or preventing oxidation of the material.

The material diffusion barrier layer 120 serves to prevent material diffusion movement occurring between the p-type electrode structure 110 and the wafer bonding layers 130 and 170 in manufacturing a vertical light emitting diode device. do.

The material constituting the material diffusion barrier layer 120 is determined according to the type of the material constituting the p-type electrode structure 110 and the wafer bonding layers 130 and 170, but, for example, Pt, Pd, Cu , Rh, Re, Ti, W, Cr, Ni, Si, Ta, TiW, TiNi, NiCr, TiN, WN, CrN, TaN, TiWN, is formed of any one selected from the group consisting of metal silicide (metallic silicide).

The wafer bonding layers 130 and 170 are formed of an electrically conductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more. In this case, it is formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and metal silicide.

The heatsink support 160 is formed of an electroconductive material film having a thickness of at least 10 micrometers by using electro-plating, physical vapor deposition (PVD), and chemical vapor deposition (CVD). In this case, it is formed of any one selected from the group consisting of Ni, Cu, Nb, CuW, NiCu, NiCr, Au, Ti, Ta, and metal silicide.

On the other hand, instead of the superlattice structure 90 located above the light emitting structure for the group III-nitride semiconductor light emitting diode device, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less. Or a p-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN single layer having a thickness of 5 nm or less.

On the other hand, by using a light emitting structure for a group III nitride semiconductor light emitting diode device that is repeatedly stacked repeatedly a pair of the superlattice structure 90 and the nitride current injection layer 100. A light emitting diode device having a structure can be manufactured.

8 is a cross-sectional view showing a second embodiment of a group III nitride semiconductor light emitting diode device having a vertical structure manufactured according to the present invention.

As illustrated, the lower nitride-based cladding layer 20, the nitride-based active layer 30, and the upper nitride-based cladding layer 40 are disposed on the lower surfaces of the front n-type ohmic contact electrode structures 220 and 230 having the surface irregularities 200. , P-type electrode structure 110 composed of superlattice structure 90, nitride based injection layer 100, current blocking structure 112 and reflective current spreading layer 111, material diffusion barrier layer 120 The light emitting diode, which is a vertical light emitting device including two wafer bonding layers 130 and 170 and a heat sink support 160, is formed.

In more detail, the concave-convex 200 is formed on the surface of the lower nitride-based cladding layer 20, which is a light emitting surface, in order to effectively emit light generated from the nitride-based active layer 30 to the outside. Front n-type ohmic contact electrode structures 220 and 230 are formed on the entire upper surface of the lower nitride-based cladding layer 20.

The front n-type ohmic contact electrode structures 220 and 230 form an ohmic contacting interface with the entire area of the upper surface of the lower nitride-based cladding layer 20 and have a transmittance of 70% or more in a wavelength band of 600 nm or less. The transparent ohmic contact electrode 220 and the transparent ohmic contact electrode are formed on the upper surface and the reflective electrode pad 230 having a reflectance of 50% or more in a wavelength band of 600 nm or less. In this case, the transparent ohmic contact electrode 220 is formed of any one selected from the group consisting of TiN, TiO, ITO, ZnO, RuO2, IrO2, In2O3, SnO2, ZnGaO, InZnO, ZnInO, Ni-O-Au, and reflectivity. The electrode pad 230 is formed of any one selected from the group consisting of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, and metal silicide. .

 Although not shown, a passivation film is formed on the side of the vertical light emitting diode device to protect the nitride based active layer 30 exposed through the side surface. In this case, the passivation film is formed of an electrically insulating oxide, and specifically, is formed of any one selected from the group consisting of SiNx, SiO2, and Al2O3.

The superlattice structure 90 and the nitride-based current injection layer 100 are sequentially formed on the lower surface of the upper nitride-based cladding layer 40 of the light emitting diode device in which the passivation layer is formed, and the upper nitride-based cladding layer 40 is formed. ) And ohmic contacting interface (ohmic contacting interface) to prevent easy current injecting (vertical) in the vertical direction and the material constituting the p-type electrode structure 110 to prevent the diffusion movement into the light emitting structure ( diffusion barrier).

In addition, the superlattice structure 90 includes a nitride or carbon nitride containing a group 2, 3, or 4 group element having different dopants and composition elements. It is a transparent multi-layer film consisting of a), and the thickness of each layer constituting these superlattice structures 90 is preferably 5 nm or less.

The nitride-based current injection layer 100 is located on the superlattice structure, and includes nitride or carbon nitride containing group 2, 3, or 4 element elements having a thickness of 6 nm or more. It is a transparent single layer or multi-layer film composed of).

The p-type electrode structure 110 formed on the lower surface of the nitride-based current injection layer 100 basically includes the current blocking structure 112 and the reflective current spreading layer 111.

The current blocking structure 112 is to distribute the current applied from the outside to the whole area of the device without concentrating to one side, and is the same as the reflective electrode pad 230 of the front n-type ohmic contact electrode structure. Place them face to face in shape and dimension.

In addition, the current blocking structure 112 is an electrically insulating thin film layer formed directly on the upper surface of the current injection layer 100 or a thin film layer forming a schottky contacting interface. In this case, the current blocking structure 112 is an electrically insulating oxide film such as SiNx, SiO2, Al2O3, Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, It is formed of any one selected from the group consisting of metallic silicide (metallic silicide).

The reflective current spreading layer 111 is formed of an electrically conductive material having a reflectivity of 80% or more on the upper surface of the current injection layer 100 in a wavelength band of 600 nm or less. In this case, the reflective current spreading layer 111 may be formed of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, or metal silicide. It is formed of any one selected.

The p-type electrode structure 110 including the current blocking structure 112 and the reflective current spreading layer 111 may prevent diffusion of materials and bond between materials, in addition to preventing current concentration in the vertical direction and reflecting light. And it is preferable to include a separate thin film layer that can perform the role of improving the adhesion, or the oxidation of the material.

The material diffusion barrier layer 120 serves to prevent material diffusion movement occurring between the p-type electrode structure 110 and the wafer bonding layers 130 and 170 in manufacturing a vertical light emitting diode device. do.

The material constituting the material diffusion barrier layer 120 is determined according to the type of the material constituting the p-type electrode structure 110 and the wafer bonding layers 130 and 170, but, for example, Pt, Pd, Cu , Rh, Re, Ti, W, Cr, Ni, Si, Ta, TiW, TiNi, NiCr, TiN, WN, CrN, TaN, TiWN, is formed of any one selected from the group consisting of metal silicide (metallic silicide).

The wafer bonding layers 130 and 170 are formed of an electrically conductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more. In this case, it is formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr.

The heatsink support 160 is formed of an electroconductive material film having a thickness of at least 10 micrometers by using electro-plating, physical vapor deposition (PVD), and chemical vapor deposition (CVD). In this case, it is formed of any one selected from the group consisting of Ni, Cu, Nb, CuW, NiCu, NiCr, Au, Ti, Ta.

On the other hand, instead of the superlattice structure 90 located above the light emitting structure for the group III-nitride semiconductor light emitting diode device, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less. Or a p-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN single layer having a thickness of 5 nm or less.

On the other hand, by using a light emitting structure for a group III-nitride semiconductor light emitting diode device repeatedly stacked repeatedly a pair of the superlattice structure 90 and the nitride current injection layer 100, A light emitting diode device having a structure can be manufactured.

9 is a cross-sectional view showing a third embodiment of a group III-nitride semiconductor light emitting diode device having a vertical structure manufactured according to the present invention.

As shown, the lower nitride-based cladding layer 20, the nitride-based active layer 30, the upper nitride-based cladding layer 40, and the top surface of the partial n-type ohmic contact electrode structure 320 on which the surface irregularities 310 are formed. P-type electrode structure consisting of lattice structure 90, nitride based injection layer 100, current blocking structure 250 and reflective current spreading layer 260, material diffusion barrier layer 270, wafer bonding of two layers A light emitting diode, which is a vertical light emitting device including the layers 280 and 170 and the heat sink support 160, is formed.

In more detail, the unevenness 310 is formed on the surface of the lower nitride-based cladding layer 20, which is a light emitting surface, in order to effectively emit light generated from the nitride-based active layer 30 to the outside. The partial n-type ohmic contact electrode structure 320 is formed in a portion of the upper surface of the lower nitride based cladding layer 20.

The partial n-type ohmic contact electrode structure 320 includes reflective ohmic contact electrodes and electrode pads having a reflectivity of 50% or more in a wavelength band of 600 nm or less in a portion of the upper surface of the lower nitride-based cladding layer 20. In this case, the partial n-type ohmic contact electrode structure 320 is made of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, and metallic silicide. It is formed of any one selected from the group.

 Although not shown, a passivation film is formed on the side of the vertical light emitting diode device to protect the nitride based active layer 30 exposed through the side surface. In this case, the passivation film is formed of an electrically insulating oxide, and specifically, is formed of any one selected from the group consisting of SiNx, SiO2, and Al2O3.

A superlattice structure 90 and a nitride-based current injection layer 100 are sequentially formed on the lower surface of the upper nitride-based cladding layer 40, and they are in ohmic contacting with the upper nitride-based cladding layer 40. and an easy current injecting in the vertical direction and a material forming the p-type electrode structure prevents diffusion movement into the light emitting structure.

In addition, the superlattice structure 90 is a nitride or carbon nitride containing a group 2, 3, or 4 element element having a different dopant and composition elements It is a transparent multi-layer film made of nitride, and the thickness of each layer constituting these superlattice structures 90 is preferably 5 nm or less.

The nitride-based current injection layer 100 is located on the superlattice structure, and includes nitride or carbon nitride containing group 2, 3, or 4 element elements having a thickness of 6 nm or more. It is a transparent single layer or multi-layer film composed of).

The p-type electrode structure formed on the lower surface of the nitride-based current injection layer 100 is composed of a current blocking structure 250 and a reflective current spreading layer 260, and the current blocking structure 250 of the p-type electrode structure ) Is etched deeper than the thickness h of the sum of the thickness of the nitride-based current injection layer 100 and the thickness of the superlattice structure 90 to atmosphere a portion of the upper nitride-based cladding layer 40. It has a form of trench or via-hole exposed to air.

The current blocking structure 250 is to distribute the current applied from the outside evenly to one side, not even to one side, the trench or via hole of the current blocking structure 250 is the partial n-type ohmic contact electrode The reflective electrode pad 320 of the structure is positioned to face each other in a predetermined shape and dimension.

The reflective current spreading layer 260 of the p-type electrode structure has a top surface or side surface of the nitride based current injection layer 100, the superlattice structure 90, and the upper nitride based cladding layer 40 exposed to the air. Formed of an electroconductive material having a reflectivity of 80% or more in a wavelength band of 600 nm or less. In this case, the reflective current spreading layer 260 is formed of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, and metallic silicide. It is formed of any one selected.

The p-type electrode structure will be described in more detail. The upper nitride-based cladding layer 40 and the nitride-based current injection layer 100 and the superlattice structure 90 are etched in the form of the trench or via hole and exposed to the atmosphere. The reflective current spreading layer 260 in contact with the side forms a schottky contacting interface, while the reflective current spreading layer in contact with the upper surface of the nitride-based current injection layer 100 exposed to the atmosphere. 260 forms an ohmic contacting interface.

Meanwhile, a portion of the current blocking structure 250 in the form of trenches or via holes is formed of air or an electrically insulating material.

The p-type electrode structure composed of the current blocking structure 250 and the reflective current spreading layer 260 may prevent diffusion of materials in addition to preventing current concentration in the vertical direction and acting as a reflector for light. It is desirable to include a multi-layer thin film layer that can serve to enhance or prevent oxidation of the material.

The material diffusion barrier layer 270 prevents material diffusion movement occurring between the reflective current spreading layer 260 and the wafer bonding layers 280 and 170 of the p-type electrode structure when the light emitting diode device of the vertical structure is manufactured ( diffusion barrier).

The material constituting the material diffusion barrier layer 270 is determined according to the kind of material constituting the reflective current spreading layer 260 and the wafer bonding layers 280 and 170 of the p-type electrode structure. , Pt, Pd, Cu, Rh, Re, Ti, W, Cr, Ni, Si, Ta, TiW, TiNi, NiCr, TiN, WN, CrN, TaN, TiWN, selected from the group consisting of metallic silicide It is formed of either.

The wafer bonding layers 280 and 170 are formed of an electrically conductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more. In this case, it is formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and metal silicide.

The heatsink support 160 is formed of an electroconductive material film having a thickness of at least 10 micrometers by using electro-plating, physical vapor deposition (PVD), and chemical vapor deposition (CVD). In this case, it is formed of any one selected from the group consisting of Ni, Cu, Nb, CuW, NiCu, NiCr, Au, Ti, Ta, and metal silicide.

On the other hand, instead of the superlattice structure 90 located above the light emitting structure for the group III-nitride semiconductor light emitting diode device, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less. Or a p-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN single layer having a thickness of 5 nm or less.

On the other hand, by using a light emitting structure for a group III nitride semiconductor light emitting diode device that is repeatedly stacked repeatedly a pair of the superlattice structure 90 and the nitride current injection layer 100. A light emitting diode device having a structure can be manufactured.

10 is a cross-sectional view showing a fourth embodiment of a vertical group III-nitride semiconductor light emitting diode device manufactured according to the present invention.

As shown, the lower nitride-based cladding layer 20, the nitride-based active layer 30, and the upper nitride-based cladding layer 40 are formed on the lower surface of the front n-type ohmic contact electrode structures 330 and 340 on which the surface irregularities 310 are formed. , A superlattice structure 90, a nitride-based current injection layer 100, a p-type electrode structure composed of a current blocking structure 250 and a reflective current spreading layer 260, a material diffusion barrier layer 270, two layers A light emitting diode, which is a vertical light emitting device including the wafer bonding layers 280 and 170 and the heat sink support 160, is formed.

In more detail, unevenness 310 is formed on the surface of the lower nitride-based cladding layer 20, which is a light emitting surface, in order to effectively emit light generated from the nitride-based active layer 30 to the outside. Front n-type ohmic contact electrode structures 320 and 330 are formed on the entire upper surface of the lower nitride-based cladding layer 20.

The front n-type ohmic contact electrode structures 330 and 340 form an ohmic contacting interface with an entire region of the upper surface of the lower nitride-based cladding layer 20 and have a transmittance of 70% or more in a wavelength band of 600 nm or less. The transparent ohmic contact electrode 330 and the reflective ohmic contact electrode are formed on the upper surface and the reflective electrode pad 340 having a reflectance of 50% or more in a wavelength band of 600 nm or less. In this case, the transparent ohmic contact electrode 330 is formed of any one selected from the group consisting of TiN, TiO, ITO, ZnO, RuO 2, IrO 2, In 2 O 3, SnO 2, ZnGaO, InZnO, ZnInO, and Ni—O—Au, and is reflective. The electrode pad 340 is formed of any one selected from the group consisting of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, and metal silicide. .

 Although not shown, a passivation film is formed on the side of the vertical light emitting diode device to protect the nitride based active layer 30 exposed through the side surface. In this case, the passivation film is formed of an electrically insulating oxide, and specifically, is formed of any one selected from the group consisting of SiNx, SiO2, and Al2O3.

A superlattice structure 90 and a nitride-based current injection layer 100 are sequentially formed on the lower surface of the upper nitride-based cladding layer 40, and they are in ohmic contacting with the upper nitride-based cladding layer 40. and an easy current injecting in the vertical direction and a material forming the p-type electrode structure prevents diffusion movement into the light emitting structure.

In addition, the superlattice structure 90 includes a nitride or carbon nitride containing a group 2, 3, or 4 group element having different dopants and composition elements. It is a transparent multi-layer film consisting of a), and the thickness of each layer constituting these superlattice structures 90 is preferably 5 nm or less.

The nitride-based current injection layer 100 is located on the superlattice structure, and includes nitride or carbon nitride containing group 2, 3, or 4 element elements having a thickness of 6 nm or more. It is a transparent single layer or multi-layer film composed of).

The p-type electrode structure formed on the lower surface of the nitride-based current injection layer 100 is composed of a current blocking structure 250 and a reflective current spreading layer 260, and the current blocking structure 250 of the p-type electrode structure ) Is etched deeper than the thickness h of the sum of the thickness of the nitride-based current injection layer 100 and the thickness of the superlattice structure 90 to atmosphere a portion of the upper nitride-based cladding layer 40. It has a form of trench or via-hole exposed to air.

The current blocking structure 250 is to distribute the current applied from the outside to the entire area of the device without being concentrated to one side, the trench or via hole of the current blocking structure 250 is the front n-type ohmic contact electrode The reflective electrode pads 340 of the structure are positioned to face each other in a predetermined shape and dimension.

The reflective current spreading layer 260 of the p-type electrode structure has a top surface or side surface of the nitride-based current injection layer 100, the superlattice structure 90, and the upper nitride-based cladding layer 40 exposed to the air. Formed of an electroconductive material having a reflectivity of 80% or more in a wavelength band of 600 nm or less. In this case, the reflective current spreading layer 260 is formed of Al, Ag, Rh, Ti, Cr, V, Nb, TiN, Cu, Ta, Au, Pt, Pd, Ru, and metallic silicide. It is formed of any one selected.

The p-type electrode structure will be described in more detail. The upper nitride-based cladding layer 40 and the nitride-based current injection layer 100 and the superlattice structure 90 are etched in the form of the trench or via hole and exposed to the atmosphere. The reflective current spreading layer 260 in contact with the side forms a schottky contacting interface, while the reflective current spreading layer in contact with the upper surface of the nitride-based current injection layer 100 exposed to the atmosphere. 260 forms an ohmic contacting interface.

Meanwhile, a portion of the current blocking structure 250 in the form of trenches or via holes is formed of air or an electrically insulating material.

The p-type electrode structure composed of the current blocking structure 250 and the reflective current spreading layer 260 may prevent diffusion of materials in addition to preventing current concentration in the vertical direction and acting as a reflector for light. It is desirable to include a multi-layer thin film layer that can serve to enhance or prevent oxidation of the material.

The material diffusion barrier layer 270 prevents material diffusion movement occurring between the reflective current spreading layer 260 and the wafer bonding layers 280 and 170 of the p-type electrode structure when the light emitting diode device of the vertical structure is manufactured ( diffusion barrier).

The material constituting the material diffusion barrier layer 270 is determined according to the kind of material constituting the reflective current spreading layer 260 and the wafer bonding layers 280 and 170 of the p-type electrode structure. , Pt, Pd, Cu, Rh, Re, Ti, W, Cr, Ni, Si, Ta, TiW, TiNi, NiCr, TiN, WN, CrN, TaN, TiWN, selected from the group consisting of metallic silicide It is formed of either.

The wafer bonding layers 280 and 170 are formed of an electrically conductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more. In this case, it is formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr, and metal silicide.

The heatsink support 160 is formed of an electroconductive material film having a thickness of at least 10 micrometers by using electro-plating, physical vapor deposition (PVD), and chemical vapor deposition (CVD). In this case, it is formed of any one selected from the group consisting of Ni, Cu, Nb, CuW, NiCu, NiCr, Au, Ti, Ta, and metal silicide.

On the other hand, instead of the superlattice structure 90 located above the light emitting structure for the group III-nitride semiconductor light emitting diode device, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less. Or a p-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN single layer having a thickness of 5 nm or less.

On the other hand, by using a light emitting structure for a group III-nitride semiconductor light emitting diode device repeatedly stacked repeatedly a pair of the superlattice structure 90 and the nitride current injection layer 100, A light emitting diode device having a structure can be manufactured.

11 to 19 are cross-sectional views illustrating a method of manufacturing a group III nitride semiconductor LED device having a vertical structure as an embodiment according to the present invention.

FIG. 11 is a cross-sectional view illustrating a growth substrate wafer on which a light emitting structure for a group III nitride semiconductor light emitting diode device is grown on a growth substrate.

Referring to FIG. 11, a lower nitride-based cladding layer 20 made of an n-type conductive single crystal semiconductor material, a nitride-based active layer 30, and a p-type conductive layer may be formed on the growth substrate 10. An upper nitride-based cladding layer 40, a superlattice structure 90, and a nitride-based current injection layer 100 made of a single crystal semiconductor material are included.

More specifically, the lower nitride-based cladding layer 20 may be formed of an n-type conductive GaN layer and an AlGaN layer, and the nitride-based active layer 30 may be formed of a multi-quantum well structure. It may be formed of an undoped InGaN layer and a GaN layer. In addition, the upper nitride-based cladding layer 40 may be composed of a p-type conductive GaN layer and an AlGaN layer. Prior to growing the light emitting structure for a basic light emitting diode device composed of the group III-nitride-based semiconductor layer described above using a well-known process such as MOCVD or MBE single crystal growth method, the lower nitride-based cladding layer 20 and the Another buffer layer such as InGaN, AlN, SiC, SiCN, or GaN is placed on top of the growth surface, which is the top layer of the growth substrate 10, to improve lattice matching with the growth surface, which is the top layer of the growth substrate 10. It is preferable to further form). In addition, the superlattice structure 90 and the nitride current injection layer 100 formed on the upper nitride cladding layer 40 form an ohmic contacting interface with the upper nitride cladding layer 40. In this way, easy current injecting in the vertical direction and a material forming the p-type electrode structure 110 serve to prevent diffusion movement into the light emitting structure. The superlattice structure 90 may be formed of InGaN / GaN doped with silicon (Si). The thickness of InGaN doped with silicon (Si) and GaN doped with silicon (Si) constituting these superlattice structures 90 is preferably 5 nm or less. The nitride based injection layer 100 may be formed of GaN doped with magnesium (Mg) having a thickness of 6 nm or more.

12 is a cross-sectional view of sequentially forming a p-type electrode structure, a material diffusion barrier layer, and a wafer bonding layer formed of a current blocking structure and a reflective current spreading layer on an upper layer of a growth substrate wafer.

As shown, the p-type electrode structure 110 including the current blocking structure 112 and the reflective current spreading layer 111 is formed on the nitride-based current injection layer 100. The current blocking structure 112 is preferably an electrically insulating thin film layer or a thin film layer forming a schottky contacting interface. In this case, the current blocking structure 112 may be formed of an electrically insulating oxide layer such as SiNx, SiO 2, Al 2 O 3, or the like.

The reflective current spreading layer 111 may be formed of an electrically conductive material having a reflectivity of 80% or more on the upper surface of the current injection layer 100 in a wavelength band of 600 nm or less. In this case, the reflective current spreading layer 111 may be made of Ag or an alloy related to Ag.

Meanwhile, the p-type electrode structure 110 including the current blocking structure 112 and the reflective current spreading layer 111 may prevent diffusion of material in addition to preventing current concentration in the vertical direction and reflecting light. It is preferable to include a separate thin film layer that can serve to improve the binding and bondability of the liver, or to prevent the oxidation of the material.

The material diffusion barrier layer 120 serves to prevent material diffusion movement occurring between the p-type electrode structure 110 and the wafer bonding layer 130 during device fabrication. The material diffusion barrier layer 120 may be formed of TiW or TiWN.

The wafer bonding layer 130 may be formed of Au or an Au related alloy, which is an electrically conductive material having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more.

FIG. 13 is a cross-sectional view of a multi-functional bonding wafer including a supporting substrate proposed by the inventors.

Referring to FIG. 13, a sacrificial separation layer 150, a heat sink support 160, and a wafer bonding layer 170 are sequentially formed on an upper surface of the support substrate 140.

The support substrate 140 is preferably selected so as to suppress wafer bending and subsequent crystal defects introduced into the light emitting structure for the light emitting diode device. Further, if the growth substrate 101 and the thermal expansion coefficient (thermal expansion coefficient) is the same or similar material is not limited to use. The support substrate 140 may be formed of a sapphire substrate wafer.

The sacrificial separation layer 150 is not limited to the material used as long as the material decomposition reaction occurs using a mechanical chemical polishing (CMP), a chemical wet etching solution, a photon beam of a specific wavelength band. The sacrificial separation layer 150 may be made of InGaN, ZnO, or GaN.

The heat sink support 160 is a single layer or multilayer structure composed of metal, alloy, or solid solution, and furthermore, the heat sink support 302 has a deposition rate. Preference is given to using rapid electroplating, physical vapor deposition (PVD) and chemical vapor deposition (CVD) methods. The wafer bonding layer 402 may be made of Cu or Ni.

The wafer bonding layer 170 may be made of Au or an Au related alloy, which is an electrically conductive material having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more.

FIG. 14 illustrates a wafer to wafer bonding process of a multi-functional wafer including a growth substrate wafer and a support substrate on which a light emitting structure for a group III nitride semiconductor light emitting diode device is formed. Sectional view of the composite bonded together.

Referring to FIG. 14, a composite C having a wafer bonding interface 180 is formed by a wafer bonding process between the wafer bonding layer 130 of the growth substrate wafer and the wafer bonding layer 170 of the functional bonding wafer. .

The wafer bond is preferably formed by applying a predetermined hydrostatic pressure under a temperature of room temperature to 700 ° C. and under a vacuum, oxygen, argon, or nitrogen gas atmosphere. Do.

Furthermore, surface treatment and heat treatment processes may be introduced to improve the mechanical bonding force and ohmic contact interface formation between the two materials 130 and 170 before and after the wafer bonding.

15 is a cross-sectional view illustrating a process of lifting-off a growth substrate from a wafer-bonded composite.

The process of lifting off the growth substrate 10 which is part of the growth substrate wafer in the wafer-bonded composite (C) is performed by chemical-mechanical polishing and etching solution according to the optical and chemical properties of the growth substrate 10. At least one of the chemically wet etching used or the thermo-chemical decomposition process using a photon beam is used.

Referring to FIG. 15, as an embodiment of the growth substrate 10 separation process, the light 190 of the laser photon beam used only when the growth substrate 10 is optically transparent, such as sapphire and AlN substrate, is used. Substrate separation process using. More specifically, although the light 190 of the laser beam having a strong energy penetrates through the back of the transparent growth substrate 10 without absorption, the band gap wavelength of the buffer layer (not shown), which is a light emitting structure for a light emitting diode device, is laser. Since it is longer than the light wavelength of the beam, it absorbs the light of the laser beam and generates a temperature of 700 ° C. or more, thereby causing a thermal-chemical decomposition reaction of the buffer layer (not shown), thereby separating the growth substrate 10.

FIG. 16 is a cross-sectional view of a composite in which surface irregularities are introduced on the lower nitride-based cladding layer after the growth substrate of the growth substrate wafer is separated.

Referring to FIG. 16, as a process step of stably removing the growth substrate 10, the lower nitride-based clad layer 20 is etched to be exposed to air by using chemical wet etching or dry etching. Unevenness 200 is performed on the surface of the lower nitride-based cladding layer 20 exposed to the atmosphere by using wet or dry etching.

17 is a cross-sectional view of a composite in which an n-type ohmic contact electrode structure is formed in a portion of the upper surface of the nitride clad layer on which surface irregularities are formed.

Referring to FIG. 17A, a partial n-type ohmic contact electrode structure 210 is formed in a portion of the upper surface of the lower nitride-based cladding layer 20 on which the surface irregularities 200 are formed. The partial n-type ohmic contact electrode structure 210 is preferably formed of a reflective material having a reflectivity of 50% or more in a wavelength band of 600 nm or less. In this case, the partial n-type ohmic contact electrode structure 210 may be formed of Cr / Al / Cr / Au.

In addition, the partial n-type ohmic contact electrode structure 210 may have the same shape and dimensions as the current blocking structure 112 of the p-type electrode structure 110 formed on the upper nitride-based cladding layer 40. The light emitting diodes are arranged so as to face each other at the same position in the vertical direction from the viewpoint of the cross-sectional view.

Referring to FIG. 17B, front n-type ohmic contact electrode structures 220 and 230 may be formed on a portion of the upper surface of the lower nitride-based cladding layer 20 on which the surface irregularities 200 are formed. The front n-type ohmic contact electrode structures 220 and 230 form an ohmic contacting interface with the entire area of the upper surface of the lower nitride-based cladding layer 20 and have a transmittance of 70% or more in a wavelength band of 600 nm or less. The transparent ohmic contact electrode 220 and the transparent ohmic contact electrode are formed on the upper surface and the reflective electrode pad 230 having a reflectance of 50% or more in a wavelength band of 600 nm or less. In this case, the transparent ohmic contact electrode 220 may be made of ITO, InZnO, or ZnInO, and the reflective electrode pad 230 may be made of Ag / Ti / Pt / Au.

In addition, before or after forming the partial or front n-type ohmic contact electrode structures 210, 220, and 230 on the upper surface of the lower nitride-based cladding layer 20, a separate surface treatment is performed to improve the performance of the vertical light emitting diode device. (surface treatment) or heat treatment may be performed.

FIG. 18 is a cross-sectional view illustrating a process of lifting a support substrate from a wafer-bonded composite. FIG.

The process of separating the support substrate 140 which is a part of the functional bonding wafer from the bonded composite C may include chemical-mechanical polishing, chemical wet etching using an etching solution, or an optical and chemical property of the support substrate 140. At least one of the thermal-chemical decomposition processes using photon beams is used.

Referring to FIG. 18, as an embodiment of the support substrate 140 separation process, the light 240 of the laser photon beam used only when the support substrate 140 is optically transparent, such as sapphire and AlN substrate, is used. Support substrate separation process using. More specifically, although the light 240 of the laser beam having a strong energy penetrates through the transparent support substrate 140 without absorption, the band gap wavelength of the sacrificial layer 150, which is a light emitting structure for the light emitting diode device, is laser. Since it is longer than the light wavelength of the beam, it absorbs light of the laser beam and generates a temperature of 700 ° C. or more, thereby causing a thermo-chemical decomposition reaction of the sacrificial layer 150 to separate the support substrate 140.

19 is a cross-sectional view illustrating a vertical light emitting diode device finally completed after removing a sacrificial layer and a wafer bonding layer from a wafer-bonded composite.

Referring to FIG. 19A, the lower nitride-based cladding layer 20, the nitride-based active layer 30, the upper nitride-based cladding layer 40, and the lower surface of the partial n-type ohmic contact electrode structure 210 on which the surface irregularities 200 are formed are provided. A p-type electrode structure 110 composed of a superlattice structure 90, a nitride-based current injection layer 100, a current blocking structure 112, and a reflective current spreading layer 111, a material diffusion barrier layer 120, A light emitting diode, which is a light emitting device having a vertical structure including two wafer bonding layers 130 and 170 and a heat sink support 160, is formed.

Referring to FIG. 19B, the lower nitride-based cladding layer 20, the nitride-based active layer 30, and the upper nitride-based cladding layer 40 are formed on the lower surfaces of the front n-type ohmic contact electrode structures 220 and 230 having the surface irregularities 200. ), Superlattice structure 90, nitride-based current injection layer 100, current blocking structure 112 and reflective current spreading layer 111, p-type electrode structure 110, material diffusion barrier layer 120 ), A light emitting diode which is a vertical light emitting device including two wafer bonding layers 130 and 170 and a heat sink support 160 is formed.

20 to 29 are cross-sectional views illustrating a method of manufacturing a group III-nitride semiconductor light emitting diode device having a vertical structure as an embodiment according to the present invention.

FIG. 20 is a cross-sectional view illustrating a growth substrate wafer on which a light emitting structure for a group III nitride semiconductor light emitting diode device is grown on a growth substrate.

Referring to FIG. 20, a lower nitride-based cladding layer 20 made of an n-type conductive single crystal semiconductor material, a nitride-based active layer 30, and a p-type conductive layer may be formed on the growth substrate 10. An upper nitride-based cladding layer 40, a superlattice structure 90, and a nitride-based current injection layer 100 made of a single crystal semiconductor material are included.

More specifically, the lower nitride-based cladding layer 20 may be formed of an n-type conductive GaN layer and an AlGaN layer, and the nitride-based active layer 30 may be formed of a multi-quantum well structure. It may be formed of an undoped InGaN layer and a GaN layer. In addition, the upper nitride-based cladding layer 40 may be composed of a p-type conductive GaN layer and an AlGaN layer. Prior to growing the light emitting structure for a basic light emitting diode device composed of the group III-nitride-based semiconductor layer described above using a well-known process such as MOCVD or MBE single crystal growth method, the lower nitride-based cladding layer 20 and the Another buffer layer such as InGaN, AlN, SiC, SiCN, or GaN is placed on top of the growth surface, which is the top layer of the growth substrate 10, to improve lattice matching with the growth surface, which is the top layer of the growth substrate 10. It is preferable to further form). In addition, the superlattice structure 90 and the nitride current injection layer 100 formed on the upper nitride cladding layer 40 form an ohmic contacting interface with the upper nitride cladding layer 40. Accordingly, the material constituting the p-type electrode structure 110 and the current injecting in the vertical direction and prevent the diffusion movement into the light emitting structure (diffusion barrier). The superlattice structure 90 may be formed of InGaN / GaN doped with silicon (Si). The thickness of InGaN doped with silicon (Si) and GaN doped with silicon (Si) constituting these superlattice structures 90 is preferably 5 nm or less. The nitride based injection layer 100 may be formed of GaN doped with silicon (Si) having a thickness of 6 nm or more.

FIG. 21 is a cross-sectional view in which trenches or via holes are formed in an upper layer of a light emitting structure for a light emitting diode device to form a current blocking structure in an upper layer of a growth substrate wafer.

The current blocking structure 250 of the trench or via-hole is to distribute the current applied from the outside to the entire region without concentrating to one side, and the nitride-based current injection layer 100 Or a portion of the upper nitride-based cladding layer 40 exposed to the air by etching more deeply than the combined thickness h of the superlattice structure 90. It has a via-hole shape. The trench or via hole of the current blocking structure 250 is positioned to face each other in a predetermined shape and dimension in the same manner as the reflective electrode pad 330 of the n-type ohmic contact electrode structure.

FIG. 22 is a cross-sectional view of a p-type electrode structure including a current blocking structure and a reflective current spreading layer, a material diffusion barrier layer, and a wafer bonding layer sequentially formed on an upper layer of a light emitting structure for a light emitting diode device in which trenches or via holes are formed.

A nitride based current injection layer 100, a superlattice structure 90, exposed to air to complete the p-type electrode structure including the current blocking structure 250 and the reflective current spreading layer 260. And an electrically conductive material having a reflectivity of 80% or more in a wavelength blocking band of 600 nm or less in the current blocking structure 250 having a trench or via hole shape surrounded by the upper or side surface of the upper nitride based cladding layer 40. In this case, the reflective current spreading layer 260 may be formed of an Al or Al related alloy.

The p-type electrode structure will be described in more detail. The upper nitride-based cladding layer 40 and the nitride-based current injection layer 100 and the superlattice structure 90 are etched in the form of the trench or via hole and exposed to the atmosphere. The reflective current spreading layer 260 in contact with the side forms a schottky contacting interface, while the reflective current spreading layer in contact with the upper surface of the nitride-based current injection layer 100 exposed to the atmosphere. 260 forms an ohmic contacting interface.

Meanwhile, a portion of the current blocking structure 250 in the form of trenches or via holes is formed of air or an electrically insulating material.

The p-type electrode structure composed of the current blocking structure 250 and the reflective current spreading layer 260 may prevent diffusion of materials in addition to preventing current concentration in the vertical direction and acting as a reflector for light. It is desirable to include a multi-layer thin film layer that can serve to enhance or prevent oxidation of the material.

The material diffusion barrier layer 270 serves to prevent a diffusion diffusion of materials between the p-type electrode structure 110 and the wafer bonding layer 130 during device fabrication. The material diffusion barrier layer 120 may be formed of TiW or TiWN.

The wafer bonding layer 280 may be made of Au or an Au related alloy, which is an electrically conductive material having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more.

FIG. 23 is a cross-sectional view of a multi-functional bonding wafer including a supporting substrate proposed by the inventor.

Referring to FIG. 23, a sacrificial separation layer 150, a heat sink support 160, and a wafer bonding layer 170 are sequentially formed on an upper surface of the support substrate 140.

The support substrate 140 is preferably selected so as to suppress wafer bending and subsequent crystal defects introduced into the light emitting structure for the light emitting diode device. Further, if the growth substrate 101 and the thermal expansion coefficient (thermal expansion coefficient) is the same or similar material is not limited to use. The support substrate 140 may be formed of a sapphire substrate wafer.

The sacrificial separation layer 150 is not limited to the material used as long as the material decomposition reaction occurs using a mechanical chemical polishing (CMP), a chemical wet etching solution, a photon beam of a specific wavelength band. The sacrificial separation layer 150 may be made of InGaN, ZnO, or GaN.

The heat sink support 160 is a single layer or multilayer structure composed of metal, alloy, or solid solution, and furthermore, the heat sink support 302 has a deposition rate. It is desirable to use rapid electroplating, physical vapor deposition (PVD), and chemical vapor deposition (CVD) methods. The wafer bonding layer 402 may be made of Cu or Ni.

The wafer bonding layer 170 may be made of Au or an Au related alloy, which is an electrically conductive material having a strong bonding force at a predetermined pressure and a temperature of 300 degrees or more.

FIG. 24 illustrates a wafer to wafer bonding process of a multi-functional wafer including a growth substrate wafer and a support substrate on which a light emitting structure for a group III nitride semiconductor light emitting diode device is formed. Sectional view of the composite bonded together.

Referring to FIG. 24, a composite D having a wafer bonding interface 290 is formed by a wafer bonding process between the wafer bonding layer 280 of the growth substrate wafer and the wafer bonding layer 170 of the functional bonding wafer. .

The wafer bond is preferably formed by applying a predetermined hydrostatic pressure under a temperature of room temperature to 700 ° C. and under a vacuum, oxygen, argon, or nitrogen gas atmosphere. Do.

Furthermore, surface treatment and heat treatment processes may be introduced to improve mechanical bonding and formation of ohmic contact interfaces between the two materials 280 and 170 before and after the wafer bonding.

FIG. 25 is a cross-sectional view illustrating a process of lifting-off a growth substrate from a wafer-bonded composite.

In the wafer-bonded composite (D), a process of lifting off the growth substrate 10, which is part of the growth substrate wafer, is performed by chemical-mechanical polishing and etching solutions according to the optical and chemical properties of the growth substrate 10. At least one of the chemically wet etching used or the thermo-chemical decomposition process using a photon beam is used.

Referring to FIG. 25, as an embodiment of the growth substrate 10 separation process, the light 300 of the laser photon beam used only when the growth substrate 10 is optically transparent, such as sapphire and AlN substrate, may be used. Substrate separation process using. More specifically, although the light 300 of the laser beam having a strong energy penetrates through the back of the transparent growth substrate 10 without absorption, the band gap wavelength of the buffer layer (not shown), which is a light emitting structure for a light emitting diode device, is laser. Since it is longer than the light wavelength of the beam, it absorbs the light of the laser beam and generates a temperature of 700 ° C. or more, thereby causing a thermal-chemical decomposition reaction of the buffer layer (not shown), thereby separating the growth substrate 10.

FIG. 26 is a cross-sectional view of a composite in which surface irregularities are introduced on the lower nitride-based cladding layer after the growth substrate of the growth substrate wafer is separated.

Referring to FIG. 26, as a process step of stably removing the growth substrate 10, the lower nitride-based clad layer 20 is etched to be exposed to the air by using chemical wet etching or dry etching. Unevenness 310 is performed on the surface of the lower nitride-based cladding layer 20 exposed to the atmosphere by using wet or dry etching.

FIG. 27 is a cross-sectional view of a composite in which an n-type ohmic contact electrode structure is formed on a portion of the upper surface of the nitride clad layer on which surface irregularities are formed.

Referring to FIG. 27A, a partial n-type ohmic contact electrode structure 320 is formed in a portion of the upper surface of the lower nitride-based cladding layer 20 on which the surface irregularities 310 are formed. The partial n-type ohmic contact electrode structure 320 is preferably formed of a reflective material having a reflectivity of 50% or more in a wavelength band of 600 nm or less. In this case, the partial n-type ohmic contact electrode structure 320 may be formed of Cr / Al / Cr / Au.

In addition, the partial n-type ohmic contact electrode structure 320 has the same shape and dimensions as the trench or via hole that is the current blocking structure 250 of the p-type electrode structure formed on the upper nitride-based cladding layer 40. The light emitting diodes are disposed to face each other at the same position in the vertical direction from the perspective of the cross-sectional view.

Referring to FIG. 27B, front n-type ohmic contact electrode structures 330 and 340 are formed in a portion of the upper surface of the lower nitride-based cladding layer 20 on which the surface irregularities 310 are formed. The front n-type ohmic contact electrode structures 330 and 340 form an ohmic contacting interface with an entire region of the upper surface of the lower nitride-based cladding layer 20 and have a transmittance of 70% or more in a wavelength band of 600 nm or less. The transparent ohmic contact electrode 330 and the reflective ohmic contact electrode are formed on the upper surface and the reflective electrode pad 340 having a reflectance of 50% or more in a wavelength band of 600 nm or less. In this case, the transparent ohmic contact electrode 330 may be made of ITO, InZnO, or ZnInO, and the reflective electrode pad 340 may be made of Ag / Ti / Pt / Au.

In addition, before or after forming the partial or front n-type ohmic contact electrode structures 320, 330, and 340 on the upper surface of the lower nitride-based cladding layer 20, a separate surface treatment is performed to improve the performance of the vertical light emitting diode device. (surface treatment) or heat treatment may be performed.

FIG. 28 is a cross-sectional view illustrating a process of lifting a support substrate from a wafer-bonded composite. FIG.

The process of separating the support substrate 140 which is a part of the functional bonding wafer from the bonded composite D may include chemical-mechanical polishing, chemical wet etching using an etching solution, or the like, depending on the optical and chemical properties of the support substrate 140. At least one of the thermal-chemical decomposition processes using photon beams is used.

Referring to FIG. 28, as an embodiment of the support substrate 140 separation process, the light 350 of the laser photon beam used only when the support substrate 140 is optically transparent, such as sapphire and AlN substrate, is used. Support substrate separation process using. More specifically, although the light 350 of the laser beam having strong energy penetrates through the transparent support substrate 140 without absorption, the bandgap wavelength of the sacrificial layer 150, which is a light emitting structure for the light emitting diode device, is laser. Since it is longer than the light wavelength of the beam, it absorbs light of the laser beam and generates a temperature of 700 ° C. or more, thereby causing a thermo-chemical decomposition reaction of the sacrificial layer 150 to separate the support substrate 140.

FIG. 29 is a cross-sectional view illustrating a vertical light emitting diode device finally completed after removing a sacrificial layer and a wafer bonding layer from a wafer-bonded composite.

Referring to FIG. 29A, the lower nitride-based cladding layer 20, the nitride-based active layer 30, the upper nitride-based cladding layer 40, and the lower surface of the partial n-type ohmic contact electrode structure 320 having the surface irregularities 310 are formed. P-type electrode structure consisting of superlattice structure 90, nitride based injection layer 100, current blocking structure 250 and reflective current spreading layer 260, material diffusion barrier layer 270, two wafers A light emitting diode, which is a vertical light emitting device including the coupling layers 280 and 170 and the heat sink support 160, is formed.

Referring to FIG. 29B, the lower nitride-based cladding layer 20, the nitride-based active layer 30, and the upper nitride-based cladding layer 40 are disposed on the lower surfaces of the front n-type ohmic contact electrode structures 330 and 340 on which the surface irregularities 310 are formed. ), P-type electrode structure consisting of superlattice structure 90, nitride based injection layer 100, current blocking structure 250 and reflective current spreading layer 260, material diffusion barrier layer 270, two layers The light emitting diode, which is a vertical light emitting device including the wafer bonding layers 280 and 170 and the heat sink support 160, is formed.

The present invention is not limited to the above-described embodiments, but can be variously modified and changed by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. something to do.

1 is a cross-sectional view showing a representative example of a conventional Group 3 nitride-based semiconductor light emitting diode device,

2 is a cross-sectional view for comparing and comparing a multi-quantum well structure and a superlattice structure,

3 is a cross-sectional view showing a representative example of a conventional Group 3 nitride-based semiconductor LED device,

4 is a cross-sectional view showing a representative example of a group III-nitride semiconductor light emitting diode device having a conventional flip chip structure;

5 is a cross-sectional view showing a first embodiment of a light emitting structure for a group III nitride semiconductor light emitting diode device having a vertical structure invented by the present invention;

6 is a cross-sectional view showing a second embodiment of a light emitting structure for a group III nitride semiconductor light emitting diode device having a vertical structure invented by the present invention;

7 is a cross-sectional view showing a first embodiment of a group III nitride semiconductor light emitting diode device having a vertical structure manufactured according to the present invention;

8 is a cross-sectional view showing a second embodiment of a group III nitride semiconductor light emitting diode device having a vertical structure manufactured according to the present invention.

9 is a cross-sectional view showing a third embodiment of a vertical group III-nitride semiconductor light emitting diode device manufactured according to the present invention;

10 is a cross-sectional view showing a fourth embodiment of a vertical group III-nitride semiconductor light emitting diode device manufactured according to the present invention;

11 to 19 are cross-sectional views illustrating a method of manufacturing a group III-nitride semiconductor light emitting diode device having a vertical structure as an embodiment according to the present invention.

20 to 29 are cross-sectional views illustrating a method of manufacturing a group III-nitride semiconductor light emitting diode device having a vertical structure as an embodiment according to the present invention.

30 is a cross-sectional view illustrating a manufacturing process of a group III nitride semiconductor light emitting diode having a vertical structure according to the prior art.

Claims (45)

A partial n-type ohmic contact electrode structure; A light emitting structure for a light emitting diode device comprising a lower nitride based cladding layer, a nitride based active layer, an upper nitride based cladding layer, a superlattice structure, and a nitride based injection layer below the partial n-type ohmic contact electrode structure; A p-type electrode structure including a current blocking structure and a reflective current spreading layer under the light emitting structure; And a group III nitride semiconductor light emitting diode device having a vertical structure including a heat sink support formed under the p-type electrode structure. The method of claim 1, The superlattice structure is a transparent multilayer composed of nitride or carbon nitride of group 2, 3, or 4 elements having different dopants and composition elements. A group III nitride semiconductor light emitting diode device having a vertical structure of a multi-layer film and having a thickness of each layer constituting these superlattice structures of 5 nm or less. The method of claim 1, The nitride-based current injection layer is located on an upper surface of the superlattice structure, has a thickness of 6 nm or more, and includes group 2 and 3 groups having different dopants and composition elements. Or a vertical group III-nitride semiconductor light emitting diode device having a transparent single layer or multi-layer composed of a nitride or a carbon nitride of a Group 4 element. The method of claim 1, And the current blocking structure is a vertical group III-nitride semiconductor light emitting diode device positioned to face each other in a predetermined shape and dimension in the same manner as the partial n-type ohmic contact electrode structure. The method of claim 1, Wherein the current blocking structure is an electrically insulating thin film layer formed directly on an upper surface of the current injection layer or a thin film layer forming a schottky contacting interface. The method of claim 1, The current blocking structure is a group of vertical structures having a trench or via-hole shape in which a portion of the upper nitride-based cladding layer is etched to at least the upper nitride-based cladding layer. Group III nitride semiconductor light emitting diode device. The method of claim 1, The reflective current spreading layer (reflective current spreading layer) is a group III nitride system of the vertical structure consisting of an electrically conductive material having a reflectivity of 80% or more in the wavelength band of 600nm or less on the current blocking structure or the top surface of the current injection layer Semiconductor light emitting diode device. The method of claim 1, The heat-sink support is an electroconductive material film having a thickness of at least 10 microns or more using electro-plating, physical vapor deposition (PVD), or chemical vapor deposition (CVD) methods. A group group III nitride semiconductor light emitting diode device having a vertical structure. The method of claim 1, The p-type electrode structure includes a separate thin film layer capable of preventing current concentration in the vertical direction and reflecting light, and preventing diffusion of materials, improving bonding and bonding between materials, or preventing oxidation of materials. A group III nitride semiconductor light emitting diode device having a vertical structure. The method of claim 1, Instead of the superlattice structure, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less, or p-type conductive InGaN, GaN, AlInN, AlN, InN having a thickness of 5 nm or less A group III-nitride semiconductor light emitting diode device having a vertical structure that can be replaced with a single layer of Al, GaN, or AlInGaN. The method of claim 1, A group III-nitride semiconductor light emitting device having a vertical structure using a light emitting structure for group III-nitride semiconductor light emitting diode devices having repeatedly stacked one pair of the superlattice structure and a nitride current injection layer. The method of claim 1, The partial n-type ohmic contact electrode structure (partial n -type ohmic contacting electrode system) may have a predetermined shape and dimensions of the upper surface on a portion of the lower nitride-based cladding layer, each having at least 50% reflectance in the wavelength region of less than 600nm A group III-nitride semiconductor light emitting device having a vertical structure composed of a reflective material. A front n-type ohmic contact electrode structure; A light emitting structure for a light emitting diode device comprising a lower nitride based cladding layer, a nitride based active layer, an upper nitride based cladding layer, a superlattice structure, and a nitride based injection layer below the front n-type ohmic contact electrode structure; A p-type electrode structure including a current blocking structure and a reflective current spreading layer under the light emitting structure; And a group III nitride semiconductor light emitting diode device having a vertical structure including a heat sink support formed under the p-type electrode structure. The method of claim 13, The superlattice structure is a transparent multilayer composed of nitride or carbon nitride of group 2, 3, or 4 elements having different dopants and composition elements. A group III nitride semiconductor light emitting diode device having a vertical structure of a multi-layer film and having a thickness of each layer constituting these superlattice structures of 5 nm or less. The method of claim 13, The nitride-based current injection layer is located on an upper surface of the superlattice structure, has a thickness of 6 nm or more, and includes group 2 and 3 groups having different dopants and composition elements. Or a vertical group III-nitride semiconductor light emitting diode device having a transparent single layer or multi-layer composed of a nitride or a carbon nitride of a Group 4 element. The method of claim 13, The current blocking structure is a vertical group III-nitride semiconductor light emitting diode device positioned to face each other in a predetermined shape and dimension in the same manner as the reflective electrode pad of the front surface n-type ohmic contact electrode structure. The method of claim 13, Wherein the current blocking structure is an electrically insulating thin film layer formed directly on an upper surface of the current injection layer or a thin film layer forming a schottky contacting interface. The method of claim 13, The current blocking structure is a group of vertical structures having a trench or via-hole shape in which a portion of the upper nitride-based cladding layer is etched to at least the upper nitride-based cladding layer. Group III nitride semiconductor light emitting diode device. The method of claim 13, The reflective current spreading layer (reflective current spreading layer) is a group III nitride system of the vertical structure consisting of an electrically conductive material having a reflectivity of 80% or more in the wavelength band of 600nm or less on the current blocking structure or the top surface of the current injection layer Semiconductor light emitting diode device. The method of claim 13, The heat-sink support is an electroconductive material film having a thickness of at least 10 microns or more using electro-plating, physical vapor deposition (PVD), or chemical vapor deposition (CVD) methods. A group group III nitride semiconductor light emitting diode device having a vertical structure. The method of claim 13, The p-type electrode structure includes a separate thin film layer capable of preventing current concentration in the vertical direction and reflecting light, and preventing diffusion of materials, improving bonding and bonding between materials, or preventing oxidation of materials. A group III nitride semiconductor light emitting diode device having a vertical structure. The method of claim 13, Instead of the superlattice structure, n-type conductive InGaN, GaN, AlInN, AlN, InN, AlGaN, AlInGaN having a thickness of 5 nm or less, or p-type conductive InGaN, GaN, AlInN, AlN, InN having a thickness of 5 nm or less A group III-nitride semiconductor light emitting diode device having a vertical structure that can be replaced with a single layer of Al, GaN, or AlInGaN. The method of claim 13, A group III-nitride semiconductor light emitting device having a vertical structure using a light emitting structure for group III-nitride semiconductor light emitting diode devices having repeatedly stacked one pair of the superlattice structure and a nitride current injection layer. The method of claim 13, The front n-type ohmic contact electrode structure (full n -type ohmic contacting electrode system) is transparent ohmic having at least 70% transmittance in the wavelength range of less than the lower forming nitride-based cladding layer region and the ohmic contact interface with the entire upper surface of the 600nm A group III-nitride semiconductor light emitting device having a vertical structure formed on a contact electrode and an upper surface of the transparent ohmic contact electrode and having reflective electrode pads having a reflectance of 50% or more in a wavelength band of 600 nm or less. A light emitting structure for a group III nitride light emitting diode device comprising a lower nitride cladding layer, a nitride active layer, an upper nitride cladding layer, a superlattice structure, and a nitride current injection layer including a buffer layer is sequentially grown on the growth substrate. Preparing a growth substrate wafer; Forming a p-type electrode structure including a current blocking structure and a reflective current spreading layer on an upper surface of the nitride based injection layer, which is the uppermost layer of the light emitting structure for the light emitting diode device; and Preparing a functional bonded wafer in which a sacrificial separation layer, a heat sink supporter, and a wafer bonding layer are sequentially stacked on an upper surface of the support substrate; and Forming a composite by wafer bonding the growth substrate wafer and the functional bonded wafer in a wafer-to-wafer manner; and Separating the growth substrate of the growth substrate wafer from the composite; and Forming surface irregularities and a partial n-type ohmic contact electrode structure on an upper surface of the lower nitride-based cladding layer of the composite from which the growth substrate is removed; and Separating the support substrate of the functional bonding wafer from the composite from which the growth substrate is removed. A method of manufacturing a group III nitride semiconductor light emitting diode device having a vertical structure. The method of claim 25, The current blocking structure is a manufacturing method of a group III-nitride semiconductor light emitting diode device having a vertical structure disposed to face each other at the same position in the vertical direction with a predetermined shape and dimensions in the same manner as the partial n-type ohmic contact electrode structure. . The method of claim 25, The sacrificial separation layer of the functional bonding wafer is a vertical group III-nitride semiconductor light emitting diode device having a vertical structure of an oxide, nitride, or metal, which is advantageous for lifting off a support substrate. The method of claim 27, When the sacrificial separation layer of the functional bonded wafer is separated by irradiating a photon beam of a specific wavelength band having a strong energy, ZnO, GaN, InGaN, InN, ITO, AlInN, AlGaN, ZnInN, ZnGaN, MgGaN A method of manufacturing a group III nitride semiconductor light emitting diode device having a vertical structure formed of any one selected from the group consisting of: The method of claim 27, A method of manufacturing a group III nitride semiconductor light emitting diode device having a vertical structure formed by any one selected from the group consisting of Au, Ag, Pd, SiO 2, and SiN x when etching by separating in a wet etching solution. The method of claim 25, The heatsink support of the functional bonded wafer is formed of an electroconductive material film having a thickness of at least 10 microns or more by using electroplating, physical vapor deposition (PVD), or chemical vapor deposition (CVD) methods. A method of manufacturing a group III-nitride semiconductor light emitting diode device having a structure. The method of claim 25, And a wafer bonding layer formed on the growth substrate and the support substrate, wherein the wafer bonding layer is formed of an electroconductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 ° C. or higher. The method of claim 31, wherein The wafer bonding layer is a manufacturing method of a vertical group III nitride semiconductor light emitting diode device having a vertical structure formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr. The method of claim 25, The process of separating the growth substrate and the support substrate may be performed by chemical-mechanical polishing (CMP), chemical etching using wet etching solution, or vertical structure using thermal-chemical decomposition by irradiating strong energy photon beam. Method of manufacturing a group nitride semiconductor light emitting diode device. The method of claim 25, In addition to the electrical and optical properties of the group III-nitride semiconductor light emitting diode devices, processes such as annealing and surface treatment are introduced before and after each step as a means for enhancing the mechanical bonding between the layers. A method for producing a group III nitride semiconductor light emitting diode device having a vertical structure. A light emitting structure for a group III nitride light emitting diode device comprising a lower nitride cladding layer, a nitride active layer, an upper nitride cladding layer, a superlattice structure, and a nitride current injection layer including a buffer layer is sequentially grown on the growth substrate. Preparing a growth substrate wafer; Forming a p-type electrode structure including a current blocking structure and a reflective current spreading layer on an upper surface of the nitride-based current injection layer, which is a top layer of the light emitting structure for the light emitting diode device; and Preparing a functional bonded wafer in which a sacrificial separation layer, a heat sink supporter, and a wafer bonding layer are sequentially stacked on an upper surface of the support substrate; and Forming a composite by wafer bonding the growth substrate wafer and the functional bonded wafer in a wafer-to-wafer manner; and Separating the growth substrate of the growth substrate wafer from the composite; and Forming surface irregularities and a front surface n-type ohmic contact electrode structure on an upper surface of the lower nitride-based cladding layer of the composite from which the growth substrate is removed; and Separating the support substrate of the functional bonding wafer from the composite from which the growth substrate is removed. A method of manufacturing a group III nitride semiconductor light emitting diode device having a vertical structure. The method of claim 35, wherein The front n-type ohmic contact electrode structure forms an ohmic contact interface with an entire region of the upper surface of the lower nitride-based clad layer, and has a transparent ohmic contact electrode having a transmittance of 70% or more in a wavelength band of 600 nm or less and an upper surface of the transparent ohmic contact electrode. A method for manufacturing a group III-nitride semiconductor light emitting diode device having a vertical structure formed of a reflective electrode pad having a reflectance of 50% or more in a wavelength band of 600 nm or less. The method of claim 35, wherein The current blocking structure is a group III-nitride semiconductor light emitting diode of a vertical structure disposed to face each other at the same position in the vertical direction with a predetermined shape and dimensions in the same manner as the partial n-type ohmic contact electrode structure or the reflective electrode pad. Method of manufacturing the device. The method of claim 35, wherein And a sacrificial separation layer of the functional bonded wafer is an oxide, nitride, or metal that is advantageous for lifting off a support substrate. The method of claim 38, When the sacrificial separation layer of the functional bonded wafer is separated by irradiating a photon beam of a specific wavelength band having a strong energy, ZnO, GaN, InGaN, InN, ITO, AlInN, AlGaN, ZnInN, ZnGaN, MgGaN A method of manufacturing a group III nitride semiconductor light emitting diode device having a vertical structure formed of any one selected from the group consisting of: The method of claim 38, A method of manufacturing a group III nitride semiconductor light emitting diode device having a vertical structure formed by any one selected from the group consisting of Au, Ag, Pd, SiO 2, and SiN x when etching by separating in a wet etching solution. The method of claim 35, wherein The heatsink support of the functional bonded wafer is formed of an electroconductive material film having a thickness of at least 10 microns or more by using electroplating, physical vapor deposition (PVD), or chemical vapor deposition (CVD) methods. A method of manufacturing a group III-nitride semiconductor light emitting diode device having a structure. The method of claim 35, wherein And a wafer bonding layer formed on the growth substrate and the support substrate, wherein the wafer bonding layer is formed of an electroconductive material film having a strong bonding force at a predetermined pressure and a temperature of 300 ° C. or higher. The method of claim 42, wherein The wafer bonding layer is a manufacturing method of a vertical group III nitride semiconductor light emitting diode device having a vertical structure formed of any one selected from the group consisting of Au, Ag, Al, Rh, Cu, Ni, Ti, Pd, Pt, Cr. The method of claim 35, wherein The process of separating the growth substrate and the support substrate may be performed by chemical-mechanical polishing (CMP), chemical etching using wet etching solution, or vertical structure using thermal-chemical decomposition by irradiating strong energy photon beam. Method of manufacturing a group nitride semiconductor light emitting diode device. The method of claim 35, wherein In addition to the electrical and optical properties of the group III-nitride semiconductor light emitting diode devices, processes such as annealing and surface treatment are introduced before and after each step as a means for enhancing the mechanical bonding between the layers. A method for producing a group III nitride semiconductor light emitting diode device having a vertical structure.

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