KR20090105162A - 인쇄회로기판 제조방법 - Google Patents
인쇄회로기판 제조방법 Download PDFInfo
- Publication number
- KR20090105162A KR20090105162A KR1020080030450A KR20080030450A KR20090105162A KR 20090105162 A KR20090105162 A KR 20090105162A KR 1020080030450 A KR1020080030450 A KR 1020080030450A KR 20080030450 A KR20080030450 A KR 20080030450A KR 20090105162 A KR20090105162 A KR 20090105162A
- Authority
- KR
- South Korea
- Prior art keywords
- seed layer
- substrate
- sputtering
- circuit pattern
- metal
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (6)
- 제1 금속을 기판의 표면에 스퍼터링(sputtering)하여 제1 시드층을 형성하는 단계;제2 금속을 상기 제1 시드층의 표면에 스퍼터링(sputtering)하여 제2 시드층을 형성하는 단계;상기 제2 시드층 위에 회로패턴에 상응하는 개구부가 형성된 필름층을 형성하는 단계;상기 개구부를 통해 드러난 상기 제2 시드층 표면에 전해도금하여 회로패턴을 형성하는 단계;상기 필름층을 제거하는 단계; 및상기 기판의 표면에 드러난 상기 제2 시드층 및 제1 시드층을 제거하는 단계를 포함하는 인쇄회로기판 제조방법.
- 제1항에 있어서,상기 제1 금속은 Ni 또는 Ni/Cr합금을 포함하는 것을 특징으로 하는 인쇄회로기판 제조방법.
- 제1항에 있어서,상기 제2 금속은 Cu를 포함하는 것을 특징으로 하는 인쇄회로기판 제조방법.
- 제1항에 있어서,상기 제1 시드층을 형성하는 단계 이전에,상기 기판의 표면을 이온 빔(Ion Beam)처리하는 단계를 더 포함하는 인쇄회로기판 제조방법.
- 제1항에 있어서,상기 시드층을 형성하는 단계 이전에 기판에 비아홀을 형성하는 드릴링 단계를 더 포함하며,상기 시드층은 상기 기판의 표면 및 상기 비아홀의 내벽에 형성되는 것을 특징으로 하는 인쇄회로기판 제조방법.
- 제1항에 있어서,상기 기판은 표면에 절연수지를 포함하고,상기 절연수지는 에폭시와 시안산염(cyanate)를 포함하는 것을 특징으로하는 인쇄회로기판 제조방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080030450A KR100936079B1 (ko) | 2008-04-01 | 2008-04-01 | 인쇄회로기판 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080030450A KR100936079B1 (ko) | 2008-04-01 | 2008-04-01 | 인쇄회로기판 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090105162A true KR20090105162A (ko) | 2009-10-07 |
KR100936079B1 KR100936079B1 (ko) | 2010-01-12 |
Family
ID=41534894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080030450A KR100936079B1 (ko) | 2008-04-01 | 2008-04-01 | 인쇄회로기판 제조방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100936079B1 (ko) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011142500A1 (en) * | 2010-05-11 | 2011-11-17 | Lg Innotek Co., Ltd. | Double-sided flexible printed circuit board and method of manufacturing the same |
WO2012008686A2 (en) * | 2010-07-15 | 2012-01-19 | Lg Innotek Co., Ltd. | Printing plate and method of manufacturing the same |
KR101144281B1 (ko) * | 2009-12-04 | 2012-05-15 | 스템코 주식회사 | 연성 회로 기판의 제조 방법 |
KR101380939B1 (ko) * | 2013-01-11 | 2014-04-01 | 피코맥스(주) | 인쇄회로기판용 액상절연조성물 및 이것의 제조방법, 이를 이용한 인쇄회로기판 제조방법 |
WO2015072775A1 (ko) * | 2013-11-14 | 2015-05-21 | 주식회사 아모그린텍 | 연성인쇄회로기판과 그 제조 방법 |
US9095063B2 (en) | 2013-11-19 | 2015-07-28 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
CN114745841A (zh) * | 2020-12-24 | 2022-07-12 | 东友精细化工有限公司 | 电路板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006024902A (ja) * | 2004-06-07 | 2006-01-26 | Shinko Electric Ind Co Ltd | 極細線パターンを有する配線基板の製造方法および配線基板 |
JP4632038B2 (ja) * | 2005-04-08 | 2011-02-16 | 三菱瓦斯化学株式会社 | 銅配線基板製造方法 |
JP2007290162A (ja) | 2006-04-21 | 2007-11-08 | Seiko Epson Corp | 成膜方法、デバイスの製造方法及び液滴吐出ヘッドの製造方法 |
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2008
- 2008-04-01 KR KR1020080030450A patent/KR100936079B1/ko active IP Right Grant
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101144281B1 (ko) * | 2009-12-04 | 2012-05-15 | 스템코 주식회사 | 연성 회로 기판의 제조 방법 |
WO2011142500A1 (en) * | 2010-05-11 | 2011-11-17 | Lg Innotek Co., Ltd. | Double-sided flexible printed circuit board and method of manufacturing the same |
KR101149026B1 (ko) * | 2010-05-11 | 2012-05-24 | 엘지이노텍 주식회사 | 양면 연성 인쇄회로기판 및 그 제조 방법 |
WO2012008686A2 (en) * | 2010-07-15 | 2012-01-19 | Lg Innotek Co., Ltd. | Printing plate and method of manufacturing the same |
WO2012008686A3 (en) * | 2010-07-15 | 2012-04-26 | Lg Innotek Co., Ltd. | Printing plate and method of manufacturing the same |
KR101380939B1 (ko) * | 2013-01-11 | 2014-04-01 | 피코맥스(주) | 인쇄회로기판용 액상절연조성물 및 이것의 제조방법, 이를 이용한 인쇄회로기판 제조방법 |
WO2015072775A1 (ko) * | 2013-11-14 | 2015-05-21 | 주식회사 아모그린텍 | 연성인쇄회로기판과 그 제조 방법 |
US9095063B2 (en) | 2013-11-19 | 2015-07-28 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
CN114745841A (zh) * | 2020-12-24 | 2022-07-12 | 东友精细化工有限公司 | 电路板 |
Also Published As
Publication number | Publication date |
---|---|
KR100936079B1 (ko) | 2010-01-12 |
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