KR20090099990A - Coverlay film punching machine and thereof method - Google Patents

Abstract

PURPOSE: A cover lay film punching method is provided to control row gap of a punching hole according to the expansion of a printed circuit board possessively by making a punching operation gradually with at least one row. CONSTITUTION: A cover lay film punching apparatus forms a punching hole group by supplying a cover lay film for a printed circuit board of a roll form. The cover lay film punching apparatus includes a low mold(110) and an upper mold(120), an LM guide unit(130), and a supporting member(140). The upper mold is equipped in a structure corresponding to the upper side of the low mold. The LM guide unit is equipped at the one side of the lower mold to move vertically based on the supply direction of the cover lay film. In the supporting member, a lower plate and an upper plate are equipped. The low plate is installed on the upper side of the LM guide unit to be operated to gather and the lower mold is fixed on the lower plate. The upper plate is fixed on several sections and the lower plate with support and is formed at constant intervals.

Description

Coverlay film punching machine and method thereof

The present invention relates to a coverlay film punching device and a method thereof, and more particularly, to a coverlay film punching device and a method for automating a punching operation while continuously supplying a coverlay film in a roll-to-roll manner.

In general, a printed circuit board (PCB: Printed Circuit Board or PWB: Printed Wire Board) is for electrically connecting a variety of components, depending on the number of wiring circuit surface, single-sided circuit board, double-sided circuit board and multilayer circuit board, etc. It is classified into a rigid circuit board, a flexible circuit board, and a rigid flexible circuit board according to the bending characteristics of the substrate.

Among them, the flexible circuit board and the hard-flex circuit board are widely applied to small electronic products such as the recent rapid development in the electronic industrial technology field. It is useful for the present product.

The flexible circuit board is a laminated structure in which several materials are overlapped, and the manufacturing process is a cutting process of cutting a copper clad laminated board to meet specifications, a drilling process of forming guide holes in the cut disc, and a copper foil surface having guide holes formed thereon. An exposure step of printing a circuit on the substrate, an etching step of forming a circuit by corroding the copper foil, and a coverlay film pressing step of pressing the coverlay film at a high temperature after attaching the coverlay film to the copper foil.

Here, the coverlay film is attached to the insulation and circuit protection of the surface of the substrate, processed to expose the circuit portion by a punching operation prior to being attached to the substrate and then attached to the original plate, such a punching operation is its form Depending on the so-called sheet (sheet) method, roll to roll (Roll to Roll) method.

The sheet method is punched by putting a sheet of coverlay film cut to an appropriate size in a mold, and the user has to transfer the coverlay film by hand, thereby having a very low work efficiency and a high defective rate of the product.

In addition, the roll-to-roll method is devised to solve the problem of the sheet method is to perform the automated punching operation while continuously supplying the coverlay film using a reel (reel) wound coverlay film.

Such a conventional roll-to-roll coverlay film punching device, as shown in Figure 1, the press portion for punching the coverlay film (F), the supply portion for supplying the coverlay film (F) to the press portion, punched It comprises a loading section for cutting and loading the coverlay film (F).

The press part has a lower mold 11 fixed to the upper side of the die 10, and the upper mold 12 and the upper mold 12 that is vertically operated as a structure corresponding to the lower mold 11 for It is configured to include an actuator (13).

Here, each of the molds 11 and 12 has a structure that can form a plurality of punching holes at the same time.

The supply part is a reel 20 to which the coverlay film F is wound and rotatably mounted, a plurality of support rollers 21 for guiding the coverlay film F, and the reel 20 and the support. And a tension unit 22 which is vertically conveyed to maintain the tension state of the coverlay film F conveyed between the rollers 21 and a position sensor 23 which detects the vertical conveying position of the tension unit 22. It is composed.

The stacking unit is a cutter 31 and the cutter 31 for cutting a pair of feed rollers 30 closely arranged up and down, the coverlay film F conveyed by the feed rollers 30 at regular intervals. It is configured to include a loading unit 32 for loading a film cut into a sheet (sheet) in the form of ().

According to the conventional coverlay film punching apparatus described above, the coverlay film F is unwound and conveyed by the conveying roller 30 to be supplied to the punching position between the respective molds 11 and 12 and supplied to the actuator 13. The upper mold 12 is operated to cover the coverlay film (F) is punched, the punched coverlay film (F) is cut by the cutter 31, and then stored in the loading unit to complete the punching operation.

Here, a group of punching holes is simultaneously formed by one punching operation in the structure of both molds 11 and 12, and a predetermined interval is maintained between the rows and rows of the punching holes.

According to the conventional roll-to-roll coverlay film punching apparatus as described above, the printed circuit board is contracted or stretched in the longitudinal direction according to climatic conditions to deform the standard, so that the punching hole thermal gap of the coverlay film needs to be adjusted.

However, the manufacturing cost of each mold (11, 12) is high, it is difficult to replace frequently, the punching of the coverlay film (F) according to the uneven formation of the punching hole by using each mold (11, 12) without replacement The problem of inferior precision arises.

In addition, when the arrangement of the punching holes is deformed, the replacement of molds is indispensable, and there is a problem in that mold maintenance costs are excessively increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a coverlay film punching device and a method for reducing coverlay film punching defects.

In order to achieve the above object, the present invention provides a coverlay film punching apparatus for forming a punching hole group while continuously supplying a rolllay coverlay film for a printed circuit board, the lower mold; An upper mold provided with a structure corresponding to an upper side of the lower mold; An LM guide unit provided at one side of the lower mold to vertically move based on a supply direction of the coverlay film; A support member installed on the LM guide unit to be interlocked with the LM guide unit and having a lower plate fixed to the lower mold, and an upper plate fixed to and spaced apart from the lower plate by a support; The upper mold is fixed to the lower side, and installed on the upper plate in the vertical direction supported by the hydraulic cylinder coupled to the upper and lower conveyance, and the support plate is provided in plurality on the side of the support plate in accordance with the hydraulic pressure of the hydraulic cylinder A shanghai song unit provided with a slider installed on an outer circumferential surface of the support to guide the vertical conveyance of the support plate; The vertical movement of the LM guide unit according to the amount of expansion and contraction of the printed circuit board is formed at regular intervals so that the punching hole group is repeatedly formed at least one row unit parallel to the supply direction of the coverlay film by the shanghai conveying unit. A control unit for controlling movement; It provides a coverlay film punching device comprising.

In addition, the present invention, the punching hole initial value is set to the number of columns of the punching hole group and the distance between the punching hole column so that the punching hole group on the coverlay film is repeatedly formed in at least one column unit according to the amount of stretch of the printed circuit board Setting step; A coverlay film supplying step of continuously supplying a roll-shaped coverlay film by a predetermined amount; A punching hole forming step in which at least one row of punching holes parallel to a feeding direction of the coverlay film is punched out by a press unit; When the punching hole group formed in the punching hole forming step is smaller than the number of columns of the punching hole group in the punching hole initial value setting step, the press unit is moved perpendicular to the supply direction of the coverlay film to form the next punching hole. Punching hole spacing step of adjusting the distance distance of the punching hole to be; The punching hole forming step is performed after the step of adjusting the punching hole spacing, and when the formed punching hole group is equal to or larger than the number of columns of the punching hole group in the initial setting of the punching hole, the punching hole is formed. Provided is a coverlay film punching method, characterized in that the end.

As described above, according to the present invention, the punching operation is performed in steps of at least one row (the feeding direction of the coverlay film) so that the thermal spacing of the punching holes according to the stretching amount of the printed circuit board can be actively controlled. There is an advantage that the punching defect can be easily reduced without changing the mold.

Hereinafter, with reference to the accompanying drawings looks at in detail with respect to the coverlay film punching apparatus according to an embodiment of the present invention.

Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the configuration shown in the drawings are only the most preferred embodiment of the present invention, and do not represent all of the technical idea of the present invention, these can be replaced at the time of the present application It should be understood that there may be various equivalents and variations.

Figure 2 is a front view showing a roll-to-roll coverlay film punching apparatus according to an embodiment of the present invention, Figure 3 is an enlarged left side view of the press portion of Figure 2, Figure 4 is a moving state of the press portion of Figure 2 Is a plan view schematically showing.

As shown in the figure, the coverlay film punching apparatus of the present invention is supported on the ground and the main body (B) is provided with a die (D) on the upper surface, the cover on the upper surface of the die (D) of the body (B) The press unit 100 provided to form a plurality of punching holes (not shown) in the ray film F, and the supply unit 200 provided to supply the coverlay film F from one side of the press unit 100. It comprises a loading unit 300 which is provided to cut and load the coverlay film F punched from the other side of the press unit 100.

The press unit 100 includes a lower mold 110, an upper mold 120, a linear motor (LM) guide unit 130, a support member 140, a shanghai song unit 150, and a control unit ( Not shown).

The lower mold 110 is provided on the upper side of the die (D), the upper mold 120 is provided on the upper side of the lower mold (110) has a structure corresponding to each other.

The linear motor (LM) guide unit 130 is provided to be vertically moved based on a supply direction of the coverlay film F on one side of the lower mold 110, and a guide rail 131 arranged side by side in pairs. ) Is made.

The support member 140 is installed in conjunction with the LM guide unit 130 on the upper side of the guide rail 131, and the lower mold 141 is fixed to the lower mold 110, and the lower plate 141 and many It is provided with the upper plate 142 fixed in place by the annular support body A. FIG.

The shanghai conveying unit 150 is a support plate 151, the upper mold 120 is fixed to the lower side, and installed on the upper plate 142 in a vertical direction and the support plate 151 is hydraulically coupled to the vertical transport A plurality of cylinders 152 and side portions of the support plate 151 are provided to insert the bearings into the contact outer circumferential surface of the support plate A to guide the vertical movement of the support plate 151 according to the hydraulic pressure of the hydraulic cylinder 152. It comprises a slider 153 which is installed by.

The control unit is measured to be provided on one side of the main body (B) to control the vertical movement of the LM guide unit 130 by a predetermined interval according to the amount of expansion and contraction of the printed circuit board based on the data measured by a separate external device An input unit for numerically inputting a stretch amount of the printed circuit board is provided separately.

By the control unit configured as described above, the LM guide unit 130 has a punching hole formed in one row (the supply direction of the coverlay film), and then steps the bottom plate of the support member 140 at a predetermined interval (step-by-step). By controlling the vertical movement by), the entire press portion 100 can be vertically moved together to adjust the punching hole row spacing of the coverlay film (F). Here, the punching holes may be formed simultaneously in a plurality of rows according to the shapes of the upper and lower molds 110 and 120.

On the other hand, the supply unit 200 is a reel 220 is rotatably mounted to the roll-shaped coverlay film (F), a plurality of support rollers 221 for guiding the coverlay film (F), and the Tension unit 222 which is vertically conveyed to maintain the tension state of the coverlay film F conveyed between the reel 220 and the support roller 221, and a position for sensing the vertical conveying position of the tension unit 222. And a sensor 223 and an ionizer bar type static elimination unit 224.

In addition, the stacking unit 300 is arranged up and down close to the pair of feed rollers 330 operated by a torque (torque) motor and the coverlay film (F) which is conveyed by the feed roller 330 It comprises a cutter 331 for cutting into a sheet state having a predetermined interval and a loading unit 332 is cut by the cutter 331 to load the film in the form of a sheet (sheet).

Here, the cutter 331 may be excluded, without forming the coverlay film F in which the punching holes are formed, and winding it continuously to produce the coverlay film F in a roll state. .

Reference numeral '160', which is not described above, is a geared (geared) motor for adjusting the height of the shanghai song unit 150.

Hereinafter, the coverlay film punching apparatus of the present invention as shown in Figure 5 is operated in the following manner.

First, as a punching hole initial value setting step (S1), the user inputs the amount of stretch of the printed circuit board measured by an external device to the input unit of the control unit numerically to form the number of columns of the punching hole group and the distance between the punching hole columns. To be set. After the punching hole initial value setting step (S1), all are performed in an automated process.

Next, as the coverlay film supplying step S2, the coverlay film F in the roll state is wound on the reel 220 to the torque motor of the transfer roller 330 supported by the support roller 221. As it is pulled out, it is conveyed by a certain pitch from the left (see Fig. 2) to the right.

At the same time, the tension of the coverlay film (F) by the tension unit 222 is transferred up and down according to the tension state of the coverlay film (F) conveyed between the reel 220 and the support roller 221. It is adjusted in real time and is released elastically.

Thus, a portion of the coverlay film F is placed and fixed on the punching position between the molds 110 and 120.

Next, as the punching hole forming step (S3), the hydraulic cylinder 152 is hydraulically operated once downward in a state in which the hydraulic cylinder 152 is safely supported by the support member 140, thereby transferring the support plate 151 to the lower side so that the upper mold 120 is closed. Punched in the lower mold 110 to form a punching hole of at least one row (the feed direction of the coverlay film) in the coverlay film (F).

Subsequently, when the punching hole group formed in the punching hole forming step S3 as the punching hole spacing adjusting step S4 is smaller than the number of columns of the punching hole group in the punching hole initial value setting step S1, FIG. As shown in FIG. 4, the Shanghai Song Unit 150 including the hydraulic cylinder 152 is vertically spaced vertically by the LM guide unit 130 based on the feeding direction of the coverlay film F (downward direction in the drawing). Let it move At this time, the LM guide unit 130 is controlled by the control unit the vertical movement at a predetermined interval in accordance with the amount of stretching of the printed circuit board.

In the punching hole spacing adjusting step (S4), when the number of punching hole formation is equal to or greater than the initial value, the formation of the punching hole is terminated.

Then, the punching hole forming step (S3) is performed again, and the hydraulic cylinder 152 is hydraulically operated downward again to transfer the supporting plate 151 to the lower side to form the punching holes in the next row.

As such, the punching hole spacing adjusting step S4 and the punching hole forming step S3 may be repeated several times to determine the punching hole group of the coverlay film F disposed between the molds 110 and 120. When the formation is completed, the feed roller 330, the support roller 221 and the tension unit 222 transfers a predetermined amount of the coverlay film (F), the press unit 100 again the punching hole group Will be formed.

In addition, the coverlay film F, in which the punching hole formation is completed, is cut by the cupper 331 while being transferred to the loading part 300 side, and is subsequently accommodated in the loading unit 332 to form a punching hole. The coverlay film (F) of the production is completed.

As described above, according to the coverlay film punching device and the method of the present invention, the formation of the punching holes is performed stepwise by at least one row (the supply direction of the coverlay film), thereby replacing the mold according to the stretching of the printed circuit board as in the prior art. It is possible to effectively improve the punching failure of the coverlay film (F) caused by not responding quickly to the demand.

On the other hand, the coverlay film punching device of the present invention is not limited to only punching the coverlay film, it is obvious that it can also be used for punching bonding sheets (Bonding Sheet), such as prepreg (interpret).

1 is a schematic view showing a conventional roll-to-roll coverlay film punching device.

Figure 2 is a front view showing a roll-to-roll coverlay film punching apparatus according to an embodiment of the present invention.

3 is an enlarged left side view of the press part of FIG. 2.

4 is a plan view schematically illustrating a moving state of the press unit of FIG. 2.

5 is a flowchart illustrating a coverlay film punching method using the punching apparatus of FIG. 2.

Claims (2)

In the coverlay film punching device for forming a punching hole group while continuously supplying a roll-shaped coverlay film for a printed circuit board, Lower mold; An upper mold provided with a structure corresponding to an upper side of the lower mold; An LM guide unit provided at one side of the lower mold to vertically move based on a supply direction of the coverlay film; A support member installed on the LM guide unit to be interlocked with the LM guide unit and having a lower plate fixed to the lower mold, and an upper plate fixed to and spaced apart from the lower plate by a support; The upper mold is fixed to the lower side, and installed on the upper plate in the vertical direction supported by the hydraulic cylinder coupled to the upper and lower conveyance, and the support plate is provided in plurality on the side of the support plate in accordance with the hydraulic pressure of the hydraulic cylinder A shanghai song unit provided with a slider installed on an outer circumferential surface of the support to guide the vertical conveyance of the support plate; The vertical movement of the LM guide unit according to the amount of expansion and contraction of the printed circuit board is formed at regular intervals so that the punching hole group is repeatedly formed at least one row unit parallel to the supply direction of the coverlay film by the shanghai conveying unit. A control unit for controlling movement; Coverlay film punching device comprising. A punching hole initial value setting step of setting the number of columns of the punching hole group and the distance between the punching hole columns such that the punching hole group on the coverlay film is repeatedly formed in at least one column unit according to the amount of stretching of the printed circuit board; A coverlay film supplying step of continuously supplying a roll-shaped coverlay film by a predetermined amount; A punching hole forming step in which at least one row of punching holes parallel to a feeding direction of the coverlay film is punched out by a press unit; When the punching hole group formed in the punching hole forming step is smaller than the number of columns of the punching hole group in the punching hole initial value setting step, the press unit is moved perpendicular to the supply direction of the coverlay film to form the next punching hole. Punching hole spacing step of adjusting the distance distance of the punching hole to be; Including, After the punching hole spacing adjustment step, the punching hole forming step is performed, and when the formed punching hole group is equal to or larger than the number of columns of the punching hole group in the initial setting of the punching hole, punching hole formation is completed. Coverlay film punching method.

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