KR20090098648A - Sealing method of electric device with transparent part and electric device with transparent part - Google Patents

Abstract

A sealing method of an electric device with a transparent part and the electric device with a transparent part are provided to effectively protect an electric device, thereby having a superior lifetime feature. A sealing method of an electric device comprises the following steps. A final lower surface immediately before combination of an upper sealing member or a final upper surface immediately before a lower sealing member are coated by a thermosetting resin compositions(5). The upper sealing member and the lower sealing member are combined to contact a coating surface of the upper sealing member and a final upper surface of a lower sealing member or the final lower surface of the upper sealing member and a coating surface of the lower sealing member. Heat is applied to the combined assembly to cure the thermosetting resin compositions.

Description

 Sealing method of an electric element having a light-transmitting part and an electric element having a light-transmitting part {SEALING METHOD OF ELECTRIC DEVICE WITH TRANSPARENT PART AND ELECTRIC DEVICE WITH TRANSPARENT PART}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing method of an electric element having a light transmitting portion and an electric element having a light transmitting portion. In particular, the electric device in the electric element is effectively protected to have excellent lifespan characteristics, and the inflow of light is effectively made to exhibit excellent device characteristics. In addition, the strength of the electric device can be improved, and in particular, the sealing thermosetting resin composition applied to the present invention has a low viscosity, so that an ODF (One Drop Fill) process can be applied, the amount of coating is easily controlled, and the coating speed is also high. It has the advantages of fast process, which reduces the cost of the process, shortens the curing time, and has excellent light transmittance characteristics, so it can be applied to the top emission type display, and gas and moisture introduced into the panel during sealing. It can also be applied to panels that use color filters, and can be used without deterioration of the device. It is possible to manufacture the material, and it is possible to effectively protect the material which is weak against heat due to the low curing temperature, and at the same time, it is possible to realize the characteristics such as sufficient adhesive strength and color prevention, and the sealing method of the electric element having the light-transmitting part which has excellent economic efficiency due to the low manufacturing cost. And an electric element having a light transmitting portion.

In general, an electronic device such as an OLED or a display panel integrating the same, an LED or a display panel integrating the same, or a solar cell transmits light generated by an electrical device existing therein to the outside, or transmits external light therein. In order to perform the process of transmitting to the electrical device present in, or to transmit the light for one of the two to have a light-transmitting portion for light emission or absorption or light transmission, and in the manufacture of an electrical device having such an electric device and the light-transmitting portion Sealing process for sealing the sealing member and the lower sealing member is included.

For example, a display panel using an OLED as a display element, which is one of the electric elements, can produce a panel with a thinner thickness than a conventional display panel, has excellent process ease in manufacturing the panel, and is a next-generation display flexible display. Due to its process suitability, it has been spotlighted as the next generation display. In addition, OLED displays are very bright, have excellent color contrast and wide viewing angle, and have many advantages such as high brightness, light weight, and low driving voltage.

However, OLED devices are extremely weak in moisture, and the interface between the metal electrode and the organic EL layer is easily peeled off due to the influence of moisture, or the metal electrode is likely to deteriorate due to reaction with oxygen and moisture, resulting in dark spots and pixel shrinkage. Generation | occurrence | production and the yield falls.

In order to solve such a problem, a method of manufacturing a device by applying a resin composition in the form of a frame along the outside of the device and placing a getter composition on the upper surface of the device as a sealing method in manufacturing the device has been invented. When manufacturing a device by applying a resin composition to the outside of the gas, the gas generated during the curing reaction flows into the panel, and a perfect seal is not formed, dark spots, pixel shrinkage, etc. occur, transparent transparent getter material is not developed It was impossible to apply the top emission method.

In addition, OLED devices manufactured using three light emitting materials, red, green, and blue, have a lower lifespan than red and green, so that afterimages are deteriorated due to deterioration of the blue pixels as the use time of the display increases. The remaining phenomenon can be observed.

In order to solve this problem, three light emitting materials are formed in three layers, or three light emitting materials are dissolved in a solvent to make a device to emit white light, and to realize red, green, and blue colors through color filters. Are invented. However, when the device is manufactured in this way, the photocurable resin composition, which is generally used, has a light source that comes into contact with the composition through a color filter, and thus the composition cannot absorb UV and thus cannot be applied.

In view of this aspect, there is still an urgent need for the development of a technology capable of effectively sealing various electric devices having a light transmitting part and the development of electric devices manufactured by this, which greatly improves durability.

Therefore, an object of the present invention is to effectively protect the electrical device in the electrical device to have excellent life characteristics, the inflow of light is effective to exhibit excellent device characteristics, can improve the strength of the electrical device, in particular ODF (One Drop) It is possible to apply the Fill process, easy to control the coating amount, and the application speed is fast, so it has the advantages of the process, so it is less expensive to process, the curing time can be shortened, and the light transmittance is excellent. It can be applied to the display of the type, it blocks the gas and water flowing into the panel during sealing, and can be applied to the panel adopting the color filter, and it is possible to manufacture the device without deterioration of the device, and the curing temperature. It is low, so it can effectively protect the material that is weak to heat, and at the same time, sufficient adhesive strength and color prevention It can be implemented, and sex, is to provide an electrical device having low manufacturing costs that are economical and light-transmitting parts of the sealing method of an electric device having excellent light-transmitting portion.

The present invention to achieve the above object,

In the method for sealing an electric element having a light transmitting portion formed by bonding the lower sealing member and the upper sealing member,

a) applying the entire surface of the final surface immediately before the bonding of the upper sealing member or the final upper surface just before the bonding of the lower sealing member with a thermosetting resin composition;

b) bonding the upper sealing member and the lower sealing member so that the application surface of the upper sealing member and the final upper surface of the lower sealing member or the final surface of the upper sealing member and the application surface of the lower sealing member are in contact with each other; And

c) providing a sealing method for an electric element having a light-transmitting part, comprising the step of applying heat to the bonded binder to cure the thermosetting resin composition.

In addition, the present invention

Lower sealing member;

An upper sealing member spaced apart from the lower sealing member and positioned above the lower sealing member;

An electrical device located between the lower sealing member and the upper sealing member; And,

A cured layer of a thermosetting resin composition filled between the bonding surfaces of the upper sealing member and the lower sealing member to contain the electrical device and to join the upper sealing member and the lower sealing member,

Provided is an electric element having a light-transmitting portion, wherein the cured layer of the thermosetting resin composition forms part or all of the light-transmitting portion.

According to the electric element having the light transmitting part of the present invention and the sealing method of such an electric element, the electric device in the electric element is effectively protected to have excellent life characteristics, the inflow of light is effective to exhibit excellent device characteristics, The strength of the device can be improved, and in particular, the sealing thermosetting resin composition applied to the present invention has a low viscosity, so that an ODF (One Drop Fill) process can be applied, the coating amount is easily controlled, and the coating speed is also high. It has the advantages of low cost for the process, shortening the curing time, and excellent light transmittance, so it can be applied to the top emission type display, and it blocks gas and moisture flowing into the panel when sealing. Also, it can be applied to panels adopting color filters, and it is possible to manufacture devices without deteriorating them. And to, and the curing temperature can effectively protect the weak column material is low, can be implemented properties, such as sufficient adhesion strength and prevent coloration and at the same time, has an excellent effect of low manufacturing cost is economical.

The present invention relates to a sealing method of an electric element having a light-transmitting part, and more particularly, to a method of sealing an electric element having a light-transmitting part formed by joining a lower sealing member and an upper sealing member, a) immediately before the upper sealing member is bonded. Applying the entire upper surface to the final surface or just before the bonding of the lower sealing member with a thermosetting resin composition; b) bonding the upper sealing member and the lower sealing member so that the application surface of the upper sealing member and the final upper surface of the lower sealing member or the final surface of the upper sealing member and the application surface of the lower sealing member are in contact with each other; And c) applying heat to the bonded binder to cure the thermosetting resin composition.

That is, the electric element having the light transmitting portion is an electric device that performs the purpose of the electric element through the light emitting, absorbing, or light-transmitting, there is an electric device for emitting or absorbing or light-transmitting therein, between the electric device and the outside It has a light transmitting portion to be made to be transmitted to, the outside thereof is an electric element having a structure that is sealed through the lower sealing member and the upper sealing member. Specific examples thereof include OLEDs or LEDs themselves (in this case, electrodes or light emitting layers correspond to electrical devices) or display panels in which these panels are integrated to form one panel (in this case, OLEDs or LEDs correspond to electrical devices). Or a sub-module incorporating a signal lamp or light fixture (in this case, an OLED or LED lamp corresponds to an electric device) or a solar cell (particularly a dye-sensitized solar cell) cell (in this case, a solar cell cell corresponds to an electric device). ) Or a solar cell module incorporating them (in this case, a solar cell submodule or the like corresponds to an electrical device) or an optical connection terminal or a hub module integrating them.

Each of these forms a lower sealing member or an upper sealing member or an electrical device required on both sides for the construction of the device, and finally combines them, in which case the upper sealing member is provided with the required devices. Formed on the lower surface thereof to form a final surface immediately before the upper sealing member is bonded (it may not form anything), and the lower sealing member likewise forms the final upper surface just before the lower sealing member is bonded. The final upper surface just before the bonding or the final upper surface just before the bonding of the lower sealing member is completely coated with the thermosetting resin composition. In this case, the electrical device therein is completely sealed by the resin composition through the entire surface application.

Wherein the thermosetting resin composition preferably comprises a) 25-90 parts by weight of an epoxy resin; b) 9-70 parts by weight of a thermosetting agent; And c) 0.1-5 parts by weight of a curing accelerator, the viscosity of 10-3000 cps (at 25 ℃) can obtain a low thermal curing temperature and high viscosity, minimizing the damage of the device during the curing process, coating operation It is good because it can facilitate.

That is, the thermosetting resin composition for sealing of the present invention has a viscosity of 10-3000 cps at 25 ° C., preferably 100-2,000 cps. More preferably, by having a viscosity of 100-1,000 cps, the ODF (One Drop Fill) process is possible when applying to the sealing member of the thermosetting resin composition for sealing, so that the coating amount can be easily controlled, and the application speed is also high. It has a low cost to enter a process and can shorten hardening time.

In addition, the sealing thermosetting resin composition applied to the present invention is a low viscosity resin composition in which a thermosetting agent and a curing accelerator are dispersed together with an epoxy resin, and may further include a coupling agent or an antioxidant.

The components used for the sealing thermosetting resin composition of this invention are demonstrated in detail.

1) epoxy resin

The epoxy resin applied to the sealing thermosetting resin composition of the present invention is bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol type epoxy resin, alicyclic epoxy resin, aromatic epoxy resin, novolac type, dicyclopentadiene type An epoxy resin etc. are mentioned, The compound which has these epoxy groups can be used individually or in mixture.

In addition, the viscosity of the compound having an epoxy group is preferably 100-1000 cps.

2) thermosetting agent

Usually, as long as it can be used for thermosetting an epoxy resin, it can use, and it is not specifically limited. Specific examples include polyamine curing agents such as diethylenetriamine, triethylenetetramine, N-aminoethyl piperazine, diaminodiphenylmethane and dihydric acid dihydrazide; Acid anhydride curing agents such as phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride and methylnadic acid anhydride; Phenol novolak-type hardening | curing agent; Polymercaptan hardening | curing agents, such as a trioxane tristyrene mercaptan; Tertiary amine compounds such as benzyldimethylamine and 2,4,6-tris (dimethylaminomethyl) phenol; Imidazole compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-methylimidazole can be used. Moreover, the latent hardener of a solid dispersion type, the latent hardener encapsulated in a microcapsule, etc. can also be used.

3) Curing accelerator

As the curing accelerator, quaternary ammonium salts, quaternary sulfonium salts, various metal salts, imidazoles, tertiary amines and the like can be used. Specific examples of the quaternary ammonium salts include tetramethyl ammonium bromide, tetrabutylammonium bromide, quaternary sulfonium salts such as tetra phenyl phosphonium bromide, tetrabutylphosphonium bromide, and metal salts such as octylate and tin octylate. Benzyl dimethyl amine etc. are mentioned as tertiary amines, such as 1-benzyl- 2-methyl imidazole, 1-benzyl- 2-phenyl imidazole, and 2-ethyl- 4-methyl imidazole.

4) coupling agent

As a coupling agent, a silane coupling agent, a titanate coupling agent, an aluminate coupling agent, a silicone compound, etc. are mentioned, These coupling agents can be used individually or in mixture. When the coupling agent is included, the adhesiveness of the resin composition may be improved and the viscosity may be reduced. The sealing thermosetting resin composition of the present invention may be included in an amount of 0.001 to 5 parts by weight, preferably 0.01 to 1 part by weight. .

5) antioxidant

Antioxidant can be added to the thermosetting resin composition for sealing of this invention in order to prevent the oxidative deterioration at the time of thermosetting, and to improve the heat resistance stability of hardened | cured material further. As said antioxidant, a phenol type, sulfur type, phosphorus antioxidant etc. can be used. Specific examples include phenolic antioxidants such as dibutyl hydroxy toluene, 2,6-di-tetra-butyl-p-cresol (hereinafter referred to as BHT), sulfur-based antioxidants such as mercapto propionic acid derivatives, and triphenyl phosphite , Phosphorus-based antioxidants such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (hereinafter referred to as HCA), and the like. It can be used, it is preferably included in the sealing thermosetting resin composition of the present invention 0.001 to 5 parts by weight, preferably 0.01 to 0.5 parts by weight.

Such a sealing method of the present invention is preferably applied to an OLED device or a panel incorporating the same because it can maximize the effect. That is, as shown in the specific examples of Figs. 1 to 3, the electric element is an organic material formed by bonding the lower sealing member and the upper sealing member including a lower substrate, and an anode, a light emitting layer and a cathode stacked thereon; A light emitting device, wherein step a) is a step of applying the entire surface of the upper sealing member or the cathode surface of the lower sealing member with a thermosetting resin composition, the step b) is the coating surface of the upper sealing member and the cathode surface of the lower sealing member, Or bonding the upper sealing member and the lower sealing member such that one surface of the upper sealing member and the coated surface of the lower sealing member are in contact with each other, and the step c) is a step of curing the thermosetting resin composition by applying heat to the bonded assembly. By doing this, an organic light emitting diode as shown in FIG. 1 may be manufactured.

Here, the lower sealing member is an anode, a light emitting layer and a cathode are sequentially provided on the lower substrate, preferably a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL) or an electron transport layer (ETL) It may further comprise. The formation of the anode, the light emitting layer, the cathode, the hole injection layer (HIL), the hole transport layer (HTL), the electron injection layer (EIL) or the electron transport layer (ETL) on the lower substrate can be carried out by conventional methods.

Also preferably, as described above, the sealing method of the present invention is a method of sealing a device by bonding the lower sealing member and the upper sealing member, wherein the sealing thermosetting resin composition is formed on one surface of the upper sealing member or the lower sealing member. One surface is completely coated by a one drop filling process, and the upper sealing member and the lower sealing member are bonded together. Heat is applied to the bonded upper sealing member and the lower sealing member to cure the sealing thermosetting resin composition.

As a specific example, the sealing method of the OLED device according to the present invention includes applying the entire surface of the upper sealing member or the cathode surface of the lower sealing member with the thermosetting resin composition, preferably using an ODF process (process glass). . After such coating is performed, the two sealing members are bonded together, which can be carried out by a conventional bonding method. Preferably, the upper sealing member and the lower sealing member are bonded under a nitrogen atmosphere, preferably 10 ^-6 torr. It is better in terms of cleanliness and pollution prevention to carry out in a vacuum atmosphere of less than ^10,7 torr or less preferably. Particularly in the case of OLED fabrication, the upper sealing member and the lower sealing member are bonded to each other such that the coating surface of the upper sealing member and the cathode surface of the lower sealing member, or the one surface of the upper sealing member and the coating surface of the lower sealing member are in contact with each other. Under vacuum preferably at below 10 ^-6 torr, more preferably at most 10 ^-7 torr.

After the bonding process, a thermosetting process is performed, which is applied to heat the bonded upper sealing member or lower sealing member (the combination thereof) to harden the thermosetting resin composition for sealing. Suitable thermosetting temperatures are preferably 75 to 120 ° C.

In addition, if necessary, a photocurable resin composition or glass frit may be further applied to the lower edge of the upper sealing member or the upper edge of the lower sealing member. As a specific example of this, the OLED manufacturing process is shown in FIGS. 2 to 3. Through this, in addition to the airtightness of the electrical device, the edge of the electric element may be kept as a separate material to satisfy other characteristics required by the electric element.

That is, as shown in the case of the OLED, the application method, preferably screen printing process (precision and workability glass) of the upper sealing member or the edge of the lower sealing member of the anode, the light emitting layer, and the cathode laminated surface are used. It can apply | coat with a well-known photocurable resin composition or glass frit.

When the photocurable resin composition is applied to the edge of the sealing member, the photocuring process may be performed simultaneously or sequentially with the thermosetting, and thermal curing after photocuring is preferable in terms of stability. The light may use light capable of curing the photocurable resin composition, and may use ultraviolet light as a specific example. In addition, when the glass frit is applied to the edge of the sealing member, a laser may be used for firing the glass frit powder. Through the heating, the sealing thermosetting resin composition is cured to form a cured body, and an airtight filling adhesive is bonded between the upper sealing member and the lower sealing member with the cured body.

The photocurable resin composition used in the present invention is (1) 50 to 90 parts by weight of an epoxy resin, (2) 0.1 to 5 parts by weight of photoinitiator, (3) 1 to 40 parts by weight of inorganic filler, and (4) 0.1 to 5 parts by weight of coupling agent, and (5) 1 to 20 parts by weight of spacer and mineral acid The generator may further contain 0.001 to 1 parts by weight.

The photocurable resin composition of the present invention has a viscosity of 5,000 to 150,000 cps (at 25 ° C.), preferably 10,000 to 100,000 cps (at 25 ° C.), which enables screen printing to shorten the process time, and This has the advantage of reducing the cost of entering.

(1) epoxy resin composition

As the epoxy resin composition which can be applied to the photocurable resin composition of the present invention, an aromatic epoxy resin, an alicyclic epoxy resin, or a mixture thereof can be used. As the aromatic epoxy resin, biphenyl type, bisphenol A type, bisphenol F type, phenol novolak type, dicyclopentadiene type, epoxy resin can be used, and a mixture thereof can also be used.

(2) photoinitiator

As a photoinitiator applicable to the photocurable resin composition of this invention, if the said epoxy resin can be hardened by light, it will not specifically limit. Specific examples of the photoinitiator include aromatic diazonium salts, aromatic sulfonium salts, aromatic iodine aluminum salts, aromatic sulfonium aluminum salts, metallocene compounds, and iron-array compounds. Preferably, an aromatic sulfonium salt may be used, and specific examples thereof include an aromatic sulfonium hexafluoro phosphate compound and an aromatic sulfonium hexafluoro antimonate compound.

(3) inorganic fillers

Inorganic fillers applicable to the photocurable resin composition of the present invention include talc, silica, magnesium oxide, mica, montmorillonite, alumina, graphite, beryllium oxide, aluminum nitride, silicon carbide, and mullite. (mullite), a plate-like or spherical inorganic filler such as silicon, or an inorganic filler having a diameter or long axis of 0.1 to 20 um having a substituent introduced therein may be used. Inorganic fillers added to the resin composition are evenly dispersed in the composition after curing to disperse the stress acting on the composition to enhance adhesion, as well as effectively prevent moisture from penetrating into the composition to diffuse moisture permeability. It has the effect of improving.

(4) coupling agent

The coupling agent applicable to the photocurable resin composition of this invention can use a silane type or titanium type coupling agent, and a silicone compound individually or in mixture. Preferably, a silane coupling agent containing alkoxysilane and diglycidyl ether in one molecule is preferable.

(5) spacer

The spacer applicable to the photocurable resin composition of the present invention is not particularly limited as long as it can maintain a constant thickness of the panel after curing, and the thickness of the panel can be maintained at 5 to 50 um, preferably 5 to 25 um. It is good to be. The shape of the spacer is spherical, log, and the like, and the shape of the spacer is not particularly limited as long as the thickness of the panel can be kept constant.

(6) photoacid generator

The photoacid generator which can be applied to the photocurable resin composition of the present invention is not particularly limited as long as it can generate Lewis acid or Bronsted acid by exposure, and is based on sulfur compounds such as sulfonic acid compounds such as eutectic acid and onium salts. Compounds can be used. Preferably, phthalimidotrifluoromethanesulfonate, dinitrobenzyltosilicate, n-decyldisulfone, naphthylimidotrifluoromethanesulfonate, diphenyl iodo salt, hexafluorophosphate, diphenyl iodo salt, hexa Fluoroarsenate, diphenylurodo salt, hexafluoroantimonate, diphenylparamethoxyphenylsulfonium triflate, diphenylparatoluenylsulfonium triflate, diphenylparaisobutylphenylsulfonium triflate, tri Phenylsulfonium hexafluoro arsenate, triphenylsulfonium hexafluoro antimonate, triphenylsulfonium triflate, dibutylnaphthylsulfonium triflate and mixtures thereof can be used.

In another aspect, the present invention provides an electric element having a light transmitting portion, which includes a lower sealing member; An upper sealing member spaced apart from the lower sealing member and positioned above the lower sealing member; An electrical device located between the lower sealing member and the upper sealing member; And a cured layer of a thermosetting resin composition filled between the mating surfaces of the upper sealing member and the lower sealing member to contain the electrical device and to join the upper sealing member and the lower sealing member. The cured product layer has a configuration that forms part or all of the light transmitting portion.

Here, the electric element having the light-transmitting portion and the electric device included therein are as described above, and specific examples thereof may include an OLED, an LED, or a dye-sensitized solar cell. As shown in the present invention, the OLED can have excellent sealing properties by having the upper sealing member and the lower sealing member filled and filled with no empty space by the cured product of the thermosetting resin composition.

In addition, the electric element of the present invention may be filled in the edge between the bonding surface of the upper sealing member and the lower sealing member, it may further include a photocurable resin composition cured body edge surrounding the thermosetting resin composition layer, which is a figure It may be formed through the method shown in 2 to 3, and the like.

The electric element having the light transmitting portion of the present invention described above can be manufactured through the sealing method of the electric element having the light transmitting portion of the present invention described above, especially when the electric element is an OLED shown in Figs. It may have a final configuration as described above, such a configuration may be preferably manufactured through the manufacturing method of FIGS. In this case, the electric element is an organic light emitting diode formed by bonding a lower sealing member including a lower substrate, and an anode, a light emitting layer and a cathode stacked thereon, and an upper sealing member, preferably the lower sealing member is a lower plate. The hole injection layer (HIL), the hole transport layer (HTL), the electron injection layer (EIL), or the electron transport layer (ETL) may be further included on the substrate.

As such, it is preferable that the organic light emitting diode is filled and bonded to the upper sealing member and the lower sealing member of the electrical device by a cured body of the thermosetting resin composition without empty space to improve durability.

In addition, both the lower sealing member and the upper sealing member of the electrical device are preferably made of glass, thereby ensuring strength and stability.

Hereinafter, preferred examples are provided to help understanding of the present invention, but the following examples are merely to illustrate the present invention, and the scope of the present invention is not limited to the following examples.

EXAMPLE

Example 1-6 Preparation of Thermosetting Resin Composition

A thermosetting resin composition for sealing was prepared in the composition shown in Table 1 below.

TABLE 1

Composition of thermosetting resin composition (parts by weight) Epoxy resin Thermosetting agent Curing accelerator  100MF YL983U CELLOXIDE 2021P Epikote 152 MH-700 EMI-24 K61B Example 1 9 37 0 0 53 One 0 Example 2 9 37 0 0 52 2 0 Example 3 9 37 0 0 52 0 2 Example 4 0 38 10 0 50 2 0 Example 5 0 23 23 0 52 2 0 Example 6 0 0 19 29 50 2 0

EPOLIGHT 100MF: Aliphatic Glycidyl Ether Compound (KYOEISHA)

YL983U: Bisphenol F type epoxy resin (Japan Epoxy)

CELLOXIDE 2021P: Alicyclic Epoxy Resin (DICEL Chemical Industry Co., Ltd.)

Epikote 152: cresol-novolak type epoxy resin (Japan epoxy company)

RIKACID MH-700: Liquid Alicyclic Acid Anhydride Curing Agent

EMI-24: imidazole curing accelerator (air-product)

K61B: Amine curing accelerator (Air-product)

The light transmittance, adhesive strength, viscosity and curability of each of the thermosetting resin compositions prepared in Examples 1-6 were measured and shown in Table 2, respectively.

1. Light Transmittance Measurement

The measurement of the light transmittance was performed by dispensing the thermosetting composition using a dispenser so that a thickness of about 20 μm was placed on a transparent glass substrate (Samsung Corning Precision Glass Co., Ltd., product name: Eagle 2000) of 50 mm × 50 mm × 0.7 mm. The coating was applied over the entire surface of the coating. After curing for 1 hour on a hot plate at 100 ℃, using a reference glass substrate (Samsung Corning Precision Glass, product name: Eagle 2000) was measured for the transmittance of light when passing through the substrate, as a measuring instrument Using the spectrum analyzer MCPD-3000, the transmittance of each point of the glass substrate coated with the thermosetting composition in the wavelength range of 380 to 780 nm was measured as an average value within the wavelength range obtained.

2. Measurement of adhesive strength

The thermosetting resin composition was dropped to a size of 2 mm in diameter on a substrate having a glass of 50 mm x 50 mm x 1.1 mm, and the upper and lower plates were joined and cured for 1 hour on a hot plate at 100 ° C. Instron, product name: Stud set was measured using an adhesive strength meter (Instron, product name: UTM-5566).

3. Measurement of viscosity

The viscosity measured the viscosity when 0.5 g of a thermosetting composition showed the torque of about 80% using the viscometer (brand name: Brook Field viscometer).

4. Curable

The case where the thermosetting composition was curable for 1 hour on a hot plate at 100 ° C. was referred to as Good, and the case where the curing was not sufficient under the above curing conditions was referred to as Not good.

TABLE 2

Light transmittance (%) Adhesive Strength (kgf / cm ² ) Viscosity (cps) Curable Example 1 98.85 97 372 Good Example 2 99.16 117 459 Good Example 3 99.24 115 332 Good Example 4 99.29 146 381 Good Example 5 99.27 110 225 Good Example 6 99.46 94 584 Good

From the results in Table 2, it can be confirmed that the thermosetting resin composition for sealing of Examples 1 to 6 of the present invention exhibits excellent physical properties while being suitable for sealing.

Examples 7 to 11 Preparation of Photocurable Resin Compositions

TABLE 3

Composition of the photocurable resin composition (parts by weight) Epoxy resin Photoinitiator Inorganic fillers Coupling agent YL983U NC7300L SP170 P-3 KBM403 Example 7 61 12 0.8 20 0.2 Example 8 66 12 2.4 20 0.2 Example 9 58 10 1.4 30 0.2 Example 10 62 12 1.4 24 0.2 Example 11 62 12 1.8 25 0.2

YL983U: Bisphenol F type epoxy resin (Japan Epoxy)

NC7300L: Biphenyl Epoxy Resin (Nippon Kayaku Co., Ltd.)

SP170: Cationic Polymerization Initiator (Asa Hiden Kasa)

P-3: inorganic filler, talc (Nippon Talc)

KBM 403: Silane Coupling Agent (Shin-Etsu Co., Ltd.)

The light transmittance, moisture transmittance, adhesive strength, thermal stability, and viscosity of each of the photocurable resin compositions prepared in Examples 7 to 11 were measured and shown in Table 4, respectively.

1. Measurement of moisture permeability

Coating the surface of the polyethylene terephthalate film with a bar applicator to a size of 50 mm ⅹ 50 mm ⅹ 0.1 mm, and then irradiated with UV of 6000 mJ / cm ² , on a hot plate at 80 ℃ After curing for a period of time, the moisture permeability for 24 hours at 37.8 ° C. and 100% RH by ASTM F1249 was measured by a moisture permeability meter (product name: PERMATRAN-W3 / 33).

2. Measurement of adhesive strength

Drop the photocurable resin composition to 5 mm diameter on the bottom glass substrate of 50 mm ⅹ 50 mm ⅹ 1.1 mm, and then prepare the glass substrate of the same size as the bottom plate by joining the top plate and the bottom plate, and then 6000 mJ / cm ² , irradiated with UV, cured for 1 hour on a hot plate at 80 ° C., and then using a T-shaped jig (Instron, product name: Stud set), using an adhesive strength measuring instrument (Instron, product name: UTM-5566). Was measured.

3. Measurement of thermal stability

The photocurable resin composition was coated on the surface of the release-treated polyethylene terephthalate film using a bar applicator to have a size of 50 mm × 50 mm × 0.1 mm, and then irradiated with UV of 6000 mJ / cm ² , A portion of the coating film obtained by curing for 1 hour on a hot plate was cut out, and the glass transition temperature (T _g ) of the photocurable resin composition was measured using a differential scanning calorimeter (TA, product name: DSC).

4. Light transmittance measurement

The light transmittance was measured using a bar applicator on a transparent glass substrate (Samsung Corning Corporation, product name: Eagle 2000) of 50 mm × 50 mm × 0.7 mm so that the thermosetting resin composition was coated to 20 μm and hot at 100 ° C. After curing for 1 hour on a plate, the transmittance when light passes through the substrate was measured using a reference glass substrate (Samsung Corning, product name: Eagle 2000). It was used as the average value within the wavelength range obtained by measuring the transmittance for each 6 points of the glass substrate coated with the thermosetting resin composition in the wavelength range of 380 to 780 nm.

5. Measurement of viscosity

0.5 g of the resin composition was measured using a viscometer (brand name: Brook Field viscometer) to exhibit a viscosity at about 80% torque.

TABLE 4

Moisture Permeability (g / m ² day) Adhesive Strength (kgf / cm ² ) Glass transition temperature (T _g ) Viscosity (cps) Example 7 5.34 115.71 110 27,915 Example 8 5.14 136.5 120 27,168 Example 9 4.52 70.52 118 98,000 Example 10 4.87 108.11 117 54,895 Example 11 4.78 113.77 116 53,012

From the results in Table 4, it can be seen that the photocurable resin compositions of Examples 7 to 11 of the present invention exhibit excellent physical properties while being suitable for the purpose of use.

Example 12 Sealing of Display Elements

A lower sealing member and an upper sealing member including a lower substrate, and an anode, a light emitting layer (red, green, blue surface emitting light) and a cathode stacked thereon were prepared. The negative electrode front surface of the lower sealing member was applied to the thermosetting resin composition of Example 1 by using an ODF process. Separately, the edge of the upper sealing member was applied to the photocurable resin composition using a screen printing process. The upper sealing member and the lower sealing member were bonded together under a nitrogen atmosphere in a vacuum atmosphere of 10 ^-7 torr so that the coated surface of the upper sealing member and the coating surface of the lower sealing member were in contact with each other. The cured photocurable resin composition was irradiated with UV of 6000 mJ / cm ² to the bonded upper and lower sealing members, and then heated to 80 ° C. to cure the thermosetting resin composition, thereby manufacturing a display device. 2, (1): anode deposition process, (2) light emitting material (Red, Green, Blue surface light emission), (3) cathode deposition process, (4): color filter deposition process, (5 ): Photocurable resin coating process, (6): sealing thermosetting resin coating process (ODF process: coating the entire surface of substrate), (7): thermosetting process after bonding, (a): dispenser, (b) : Thermosetting composition, (c): heating)).

Example 13: Sealing of Display Elements

Sealing was performed in the same manner except that glass frit was used instead of the photocurable resin of Example 12, and a process diagram is shown in FIG. 3. (In Figure 3 (1): anode deposition process, (2): light emitting material (Red, Green, Blue surface light emission), (3): cathode deposition process, (4): glass frit coating and plasticity process, (5): Color filter film forming process, (6): thermosetting resin coating process (ODF process: coating the entire surface of substrate), (7): thermosetting process after bonding, (a): dispenser, (b): thermosetting composition, (c) heating)

The devices manufactured in Examples 12 and 13 have the structure as shown in FIG. 1, and are excellent in light transmittance, moisture transmittance, adhesive strength and thermal stability, and the light emitting body of the upper sealing member and the lower sealing member are in contact with each other. It is inherently prevented from causing damage.

1 is a schematic diagram of a display device according to an embodiment of the present invention, Figures 2 and 3 is a process chart of a sealing method according to an embodiment of the present invention.

<Drawing symbol>

DESCRIPTION OF SYMBOLS 1 Lower glass substrate, 2 anode, 3 light emitting layer, 4 cathode, 5 thermosetting resin composition, 6 color filter, 7 glass frit or photocurable resin composition, 8 top glass substrate

(1): anode deposition process, (2): light emitting material (Red, Green, Blue surface light emission), (3): cathode deposition process, (4): color filter deposition process (FIG. 2) or glass frit coating and plasticity process (FIG. 3), (5): photocurable resin coating (FIG. 2) or color filter film forming process (FIG. 3), (6): thermosetting resin coating process (ODF process: coating a predetermined interval on the front of the substrate), (7 ): Thermosetting process after bonding, (a): dispenser, (b): thermosetting composition, (c): heating)

Claims (26)

In the method for sealing an electric element having a light transmitting portion formed by bonding the lower sealing member and the upper sealing member, a) applying the entire surface of the final surface immediately before the bonding of the upper sealing member or the final upper surface just before the bonding of the lower sealing member with a thermosetting resin composition; b) bonding the upper sealing member and the lower sealing member so that the application surface of the upper sealing member and the final upper surface of the lower sealing member or the final surface of the upper sealing member and the application surface of the lower sealing member are in contact with each other; And c) a method of sealing an electric element having a light-transmitting part, comprising the step of applying heat to the bonded binder to cure the thermosetting resin composition. The method of claim 1, The thermosetting resin composition a) 25-90 parts by weight of epoxy resin; b) 9-70 parts by weight of a thermosetting agent; And c) 0.1-5 parts by weight of a curing accelerator, wherein the viscosity is 10-3000 cps (at 25 ° C.), the thermosetting resin composition having a light transmitting part. The method of claim 2, Said thermosetting resin composition further comprises 0.001 to 5 parts by weight of coupling agent or 0.001 to 0.5 parts by weight of antioxidant. The method of claim 2, The epoxy resin is a group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol type epoxy resin, alicyclic epoxy resin, aromatic epoxy resin, novolac type and dicyclopentadiene type epoxy resin, and mixtures thereof Sealing method of an electric element having a light transmitting portion, characterized in that selected from. The method of claim 1, And the viscosity of the thermosetting resin composition is 100-1000 cps (at 25 ° C). The method of claim 2, The thermosetting agent is diethylenetriamine, triethylenetetramine, N-aminoethylpiperazine, diaminodiphenylmethane, adipic dihydrazide, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydro anhydride Phthalic acid, methylhexahydrophthalic anhydride, methylnadic acid anhydride, phenol novolak-type curing agent, trioxane tritylenmercaptan, benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 2-methylimidazole And 2-ethyl-4-methylimidazole, and 1-benzyl-2-methylimidazole. The sealing method for an electric element having a light transmitting part, characterized in that at least one member is selected. The method of claim 2, The curing accelerator is tetramethylammonium bromide, tetrabutylammonium bromide, tetraphenylphosphonium bromide, tetrabutylphosphonium bromide, zinc octylate, octylic acid tin, 1-benzyl-2-methyl imidazole, 1-benzyl-2- A phenyl imidazole, 2-ethyl-4-methyl imidazole, and benzyl dimethylamine is selected from the group consisting of at least one member. The method of claim 3, And at least one member selected from the group consisting of a silane coupling agent, a titanate coupling agent, an aluminate coupling agent, and a silicone compound. The method of claim 3, The antioxidants include dibutyl hydroxy toluene, 2,6-di-tetra-butyl-p-cresol, mercaptopropionic acid derivatives, and triphenyl phosphite, 9,10-dihydro-9-oxa-10-phosphape Sealing method of an electric element having a light transmitting portion, characterized in that at least one member selected from the group consisting of nansrene-10-oxide. The method of claim 1, Application of the thermosetting resin composition to the sealing member is a sealing method of an electric element having a light-transmitting portion, characterized in that made by a one-drop filling (One Drop Filling) process. The method of claim 1, The electric device is an organic light emitting device formed by bonding a lower sealing member and an upper sealing member including a lower substrate, and an anode, a light emitting layer and a cathode stacked thereon, Step a) is a step of applying the entire surface of the one surface of the upper sealing member or the cathode surface of the lower sealing member with a thermosetting resin composition, Step b) is a step of bonding the upper sealing member and the lower sealing member so that the application surface of the upper sealing member and the cathode surface of the lower sealing member, or one surface of the upper sealing member and the application surface of the lower sealing member contact each other, The c) step is a step of curing the thermosetting resin composition by applying heat to the bonded binder, the sealing method of the electric element having a light transmitting portion. The method of claim 1, Bonding of the upper sealing member and the lower sealing member in a vacuum atmosphere of less than 10 ^-6 torr under a nitrogen atmosphere sealing method for an electric element having a light transmitting portion. The method of claim 1, Sealing method of an electric element having a light transmitting portion, characterized in that the curing of the thermosetting resin composition is carried out at a temperature of 75 to 120 ℃. The method of claim 1, In the step a), the lower edge of the upper sealing member, or the upper edge of the lower sealing member is additionally coated with a photocurable resin composition or glass frit. The method of claim 14, The photocurable resin composition includes 50 to 90 parts by weight of epoxy resin, 0.1 to 5 parts by weight of photoinitiator, 1 to 40 parts by weight of inorganic filler, and 0.1 to 5 parts by weight of coupling agent. Way. The method of claim 14, And the photocurable resin composition has a viscosity of 5,000 to 150,000 cps (at 25 ° C.). The method of claim 14, Coating of the said photocurable resin composition to the sealing member is performed by the screen printing process, The sealing method of the electrical element which has a light transmitting part characterized by the above-mentioned. The method of claim 14, Sealing method of an electric element having a light transmitting portion, characterized in that after performing the photocuring of the photocurable resin composition, the thermosetting of the thermosetting resin composition. Lower sealing member; An upper sealing member spaced apart from the lower sealing member and positioned above the lower sealing member; An electrical device located between the lower sealing member and the upper sealing member; And, A cured layer of a thermosetting resin composition filled between the bonding surfaces of the upper sealing member and the lower sealing member to contain the electrical device and to join the upper sealing member and the lower sealing member, An electric element having a light transmitting portion, wherein the cured layer of the thermosetting resin composition forms part or all of the light transmitting portion. The method of claim 19, An electric element having a light-transmitting portion further comprising a photocurable resin composition cured body edge filled in the edge between the upper sealing member and the bonding surface of the lower sealing member and surrounding the thermosetting resin composition layer. The method of claim 19, The electrical device having a light transmitting portion, characterized in that the electrical device is manufactured by the sealing method of claim 1 to claim 13. The method of claim 20, The electrical device having a light transmitting portion, characterized in that the electrical device is produced by the sealing method of claim 14 to 18. The method of claim 19, The electric element is an electric element having a light-transmitting portion, characterized in that the lower substrate and the lower sealing member including an anode, a light emitting layer and a cathode stacked thereon, and an organic light emitting diode formed by bonding the upper sealing member. The method of claim 23, wherein And the lower sealing member further comprises a hole injection layer (HIL), a hole transport layer (HTL), an electron injection layer (EIL), or an electron transport layer (ETL) on a lower substrate. The method of claim 23, wherein And an upper sealing member and a lower sealing member of the electric device are filled and bonded to each other by a cured body of a thermosetting resin composition without a void space. The method of claim 19, Both the lower sealing member and the upper sealing member of the electric device is an electric element having a light transmitting portion, characterized in that the glass.

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