KR20090094556A - Photosensitive resin composition which is capable of being cured at a low temperature - Google Patents

Abstract

A photosensitive resin composition, a color filter using the composition, and an LCD device containing the color filter are provided to allow it to be cured completely even at a low temperature, to reduce the generation of gas and to form a cured film of excellent heat resistance and chemical resistance. A photosensitive resin composition comprises 1-50 weight% of at least one kind of alkali soluble resin as a binder resin; 0.1-10 weight% of an epoxy curing agent; 1-30 weight% of a crosslinkable monomer having an ethylene-based double bond; 10-70 weight% of a pigment; 0.3-5 weight% of a photopolymerization initiator; and 5-60 weight% of a solvent. The alkali soluble resin is selected from an epoxy resin, an acrylate resin, a photopolymer resin and their mixture.

Description

Low temperature curable photosensitive resin composition {PHOTOSENSITIVE RESIN COMPOSITION WHICH IS CAPABLE OF BEING CURED AT A LOW TEMPERATURE}

The present invention relates to a photosensitive resin composition for color filters of flat panel displays, which is curable at low temperatures.

The manufacture of a color filter substrate generally consists of the formation of a black matrix using Cr / CrO _x , the formation of a color filter by the pigment dispersion method, and the formation of a common electrode.

As in the TFT-array process, Cr / CrO _x is deposited on the cleaned glass substrate by reactive sputtering to form a black matrix pattern, and then an RGB pattern for realizing color is photographed. ) Is formed using the process technology. In general, the RGB pattern is formed by moving the same mask, and the photopolymerization reaction by exposure stops when reaching a certain level, so post-bake is separately performed to sustain the polymerization reaction by heat. Dipping, puddle, shower, spray, etc. may be used. The common electrode for operating the liquid crystal cell together with the pixel electrode formed on the lower TFT substrate is formed after the RGB pattern, which is a transparent electrode material having good transmittance and conductivity and excellent chemical and thermal stability. ITO is deposited by sputtering, and ITO as a common electrode does not form a separate pattern. In order to protect and planarize the RGB pattern, an overcoat may be formed using an acrylic or polyimide resin prior to forming the common electrode.

In the color filter process, the RGB pattern is mainly coated using a spin or slit coater, and then exposed to light after pre-baking and development. Following the development, a post-baking process is applied that lasts more than 220 degrees of heat. In general, glass used hardly deforms at this temperature, but plastics used in flexible displays have temperatures of more than 220 degrees. Cause severe deformation.

Eventually, to reduce the deformation of the substrate, the temperature of the post-baking process must be lowered. If the temperature of the post-baking is lowered, hardening does not occur completely, thereby increasing the amount of gas generated, resulting in an afterimage, as well as chemical and heat resistance. Problems such as falling off are caused.

Korean Patent Publication No. 2002-0048675 discloses a photosensitive resin composition which can provide excellent heat resistance and chemical resistance by including an epoxide treated with an acid anhydride. However, even in the case of the photosensitive resin composition comprising an epoxide treated with an acid anhydride, if the post-baking process is performed at a low temperature of 200 degrees or less, the afterimage may be caused by increasing the amount of gas generation without increasing chemical resistance or heat resistance. The problem still appeared.

Accordingly, an object of the present invention is to provide a photosensitive resin composition suitable for the formation of a color filter of a flat panel display, which can be completely cured at a low temperature to provide a cured film having not only a small amount of gas but also excellent heat resistance and chemical resistance. will be.

The present invention to achieve the above object,

(A) a binder resin, comprising: (i) an epoxy resin, and (ii) at least one alkali-soluble resin selected from acrylate resins, photopolymer resins, and mixtures thereof;

(B) an epoxy curing agent;

(C) a crosslinkable monomer having an ethylenic double bond;

(D) pigments;

(E) photoinitiator; And

(F) It provides the photosensitive resin composition containing a solvent.

When the photosensitive resin composition which concerns on this invention is used, even if it is a low temperature hardening process of 200 degrees C or less, a reliable cured film with little gas generation amount and excellent heat resistance and chemical resistance can be obtained. In addition, by using the photosensitive resin composition, it is possible to develop in an aqueous alkali solution, have excellent sensitivity and resolution, obtain a cured film pattern having a good shape, and provide a highly reliable color filter and a flat panel display including the same. Can provide.

The photosensitive resin composition of the present invention is characterized in that the degree of curing by heat is improved by including an epoxy resin and an epoxy curing agent together with an alkali-soluble acrylate resin or a photopolymer resin. Thereby, the photosensitive resin composition of this invention can provide the cured film excellent in heat resistance and chemical resistance which does not differ in high temperature and a physical property even by the low temperature hardening process.

In the photosensitive resin composition of the present invention, the epoxy resin (component (A) (i)) serves to improve the degree of curing of the photosensitive resin composition, and not only can be cured at low temperatures depending on the type of curing agent, but also shortens the curing time. To provide various characteristics. Moreover, compared with other resin, hardening shrinkage is few and it is excellent also in chemical resistance, heat resistance, etc.

Examples of the epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, and mixtures thereof. As a commercial item, As bisphenol-A epoxy resin, Epicoat 1001, 1002, 1003, 1004, 1007, 1009, 1010, 828 (made by Yuka Shell Epoxy Co., Ltd.) etc. are mentioned; As bisphenol F-type epoxy resin, Epicoat 807, 834 (made by Yuka Shell Epoxy Co., Ltd.) etc. are mentioned; As phenol novolak type epoxy resin, Epicoat 152, 154, 157H65 (manufactured by Yuka Shell Epoxy Co., Ltd.), EPPN-201, EPPN-501N, EPPN-501H, EPPN-502N, EPPN-501HY, EOCN-1020 (Nippon Kayaku) Co., Ltd.); Cresol novolac epoxy resins include EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, EOCN-1027 (manufactured by Nippon Kayaku Co., Ltd.), Epicoat 180S75 (manufactured by Yuka Shell Epoxy Co., Ltd.), etc. The other epoxy resins include NC-3000, NC-3000H (manufactured by Nippon Kayaku Co., Ltd.), CY175, CY177, CY179 (manufactured by CIBA-GEIGY AG).

The epoxy resin is preferably used in an amount of 1 to 30% by weight based on the total weight of the photosensitive resin composition. When the epoxy resin is more than 30% by weight, there is a problem in developability. Curing degree may be lowered.

In the photosensitive resin composition of the present invention, the acrylate resin (component (A) (ii)) preferably has a glass transition temperature of 150 ° C. or less in terms of flexibility of the dried photosensitive resin composition. The acrylate resin may be obtained by polymerizing an unsaturated carboxylic acid, an aromatic monomer, a monomer for imparting surface flexibility, and other acrylic monomers in a solvent.

The unsaturated carbonic acid is used for alkali solubility, and specific examples thereof may include acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, vinyl acetic acid, acid anhydrides thereof, and mixtures thereof. The content of the unsaturated carbonic acid in the polymer is preferably 20 to 50% by weight, and when the content of the unsaturated carbonic acid is more than 50% by weight, it is easy to gelate during polymerization, difficult to control the degree of polymerization, and storage stability of the photosensitive resin composition is increased. Deterioration, when the content of unsaturated carboxylic acid is less than 20% by weight, there is a disadvantage that the development time is long during the development process.

The aromatic monomer is used for improving the chemical resistance and heat resistance of the formed photosensitive resin composition. Examples of the aromatic monomers include styrene, benzyl methacrylate, benzyl acrylate, phenyl acrylate, phenyl methacrylate, 2 or 4-nitrophenyl acrylate, 2 or 4-nitrophenyl methacrylate, 2 or 4-nitro Benzyl methacrylate, 2 or 4-chlorophenyl acrylate, 2 or 4-chlorophenyl methacrylate, mixtures thereof, and the like. The content in the polymer of the aromatic monomer is preferably 15 to 45% by weight, more preferably 20 to 40% by weight. When the content of the aromatic monomer exceeds 45% by weight, the flexibility of the thin film decreases and the durability of the substrate deteriorates when the coating film is formed, and when the content of the aromatic monomer is less than 15% by weight, Due to the poor adhesion of the pattern, the tearing of the pattern is severe, and the straightness of the formed pattern is deteriorated, making it difficult to implement a stable pattern.

Examples of the monomer for imparting surface flexibility include methacrylic ester, isotridecyl methacrylate, steryl methacrylate, isodecyl methacrylate, ethylhexyl methacrylate and ethyltriglycol methacrylate of ethoxylated fatty alcohol. , Methoxy polyethylene glycol methacrylate, butyl diglycol methacrylate, and mixtures thereof. The content in the polymer of the monomer having flexibility imparting ability is preferably 3 to 15% by weight, more preferably 5 to 10% by weight. When the content of the monomer having the flexibility imparting ability exceeds 15% by weight, the tearing of the pattern becomes worse during the developing process, and the straightness of the formed pattern is deteriorated. In addition, when the content thereof is less than 3% by weight, the glass transition point of the polymer is increased, thereby deteriorating the flexibility of the easily formed or photosensitive resin composition.

In addition, the other acrylic monomers control the polarity of the polymer. Examples of such acrylic monomers include 2-hydroxyethylethyl (meth) acrylate, 2-hydroxyoctyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl acrylate and And mixtures thereof. The content of these monomers in the polymer is preferably 10 to 30% by weight in consideration of heat resistance, dispersibility, hydrophilicity with the developer, and the like.

The acrylate polymer resin may be obtained by polymerization in a solvent having an appropriate polarity to prevent gelation of the four monomers, the weight average molecular weight of the low glass transition point acrylate resin formed is preferably 10,000 to 35,000 More preferably around 20000.

In the photosensitive resin composition of this invention, the said photopolymer resin (component (A) (ii)) functions to improve the sensitivity of the photosensitive resin composition. The photopolymer resin may be represented by the following Chemical Formula 1 or 2 as a resin dissolved in an aqueous alkali solution:

[Formula 1]

[Formula 2]

Where

Each R ₁ is independently hydrogen or an alkyl group having ₁ to 2 carbon atoms,

R ₂ is alkylene having 2 to 5 carbon atoms which is unsubstituted or substituted with a hydroxy group,

a + b + c = 1, 0.1 <a <0,4, 0 <b <0.5, 0.1 <c <0.6.

The weight average molecular weight of the photopolymer resin is preferably 10,000 to 80,000, more preferably 15,000 to 50,000. When the weight average molecular weight of the photopolymer is in the above range, the development time and the degree of removal of the residual film are better.

It is preferable to use a mixture of such an epoxy resin and an alkali-soluble resin of an acrylate resin and / or a photopolymer resin, that is, a binder resin in an amount of 1 to 50% by weight based on the total weight of the photosensitive resin composition, and the content thereof. When it exists in this said range, the photosensitive resin composition of moderate viscosity can be obtained, and there exists an advantage that thickness control is easy.

In the photosensitive resin composition of this invention, an amine type, an acid anhydride type, an imidazole type, an isocyanine type, a mercaptan type compound etc. can be used as said epoxy hardening | curing agent (component (B)), More specifically, diethylene tri Amines (DETA), triethylene tetraamine (TETA), triethylene pentaamine (TEPA), diamino diphenyl methane (DDM), diamino diphenyl sulfone (DDS), polyamide amine, dicyan di Amine compounds such as amides; Acid anhydride compounds such as polyamide resin, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydro phthalic anhydride, methyl tetrahydro phthalic anhydride, hexahydro phthalic anhydride and methyl hydrophthalic anhydride; Imidazole compounds such as 2MZ and 2E4MZ; Isocyanine compounds; And mercaptan compounds such as polymer captan.

The epoxy curing agent is preferably used in an amount of 0.1 to 10% by weight based on the total weight of the composition.

At this time, the epoxy curing agent may be used in an amount of preferably 0.5 to 1.5 equivalents, more preferably 0.7 to 1.2 equivalents relative to 1 equivalent of the epoxy group of the epoxy resin. When the content is less than 0.5 equivalents or more than 1.5 equivalents, a good degree of curing cannot be obtained.

According to the kind of epoxy hardening | curing agent used, a hardening accelerator can be used arbitrarily as a catalyst for promoting reactivity with an epoxy resin. Curable accelerators that can be used include imidazoles such as 2-methyl imidazole, 2-ethyl imidazole and 2-ethyl-4-methyl imidazole; Tertiary amines such as 2-dimethyl phenol; Phosphines such as triphenyl phosphine; Metal compounds, such as octylic acid tin, are mentioned. The curing accelerator may be used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the epoxy resin.

In the photosensitive resin composition of this invention, as a crosslinkable monomer (component (C)) which has the said ethylene-type double bond, 1, 4- butanediol diacrylate, 1, 3- butylene glycol diacrylate, ethylene glycol diacrylate , Pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol diacrylate, sorbitol triacrylate, bisphenol A diacrylate derivative, trimethyl propane triacrylate, dipentaerythritol polyacrylic Rates, these methacrylates, mixtures thereof and the like can be used.

The crosslinkable monomer having an ethylene-based double bond may be used in an amount of preferably 1 to 30% by weight, more preferably 3 to 20% by weight based on the total weight of the photosensitive resin composition. When the content is less than 1% by weight, the softness of the photosensitive resin composition may not be realized, and when the content is more than 30% by weight, developability and adhesion may be reduced.

In the photosensitive resin composition of the present invention, both the organic pigment or the inorganic pigment can be used as the pigment (component (D)), and specific examples of the organic pigment include C.I. Pigment Yellow 83, C.I. Pigment Yellow 150, C.I. Pigment Yellow 138, C.I. Pigment Yellow 128, C.I. Pigment Orange 43, C.I. Pigment Red 177, C.I. Pigment Red 202, C.I. Pigment Red 209, C.I. Pigment Red 254, C.I. Pigment Red 255, C.I. Pigment Green 7, C.I. Pigment Green 36, C.I. Pigment Blue 15, C.I. Pigment Blue 15: 3, C.I. Pigment Blue 15: 4, C.I. Pigment Blue 15: 6, C.I. Pigment Violet 23, C.I. Pigment Black 1, C.I. Pigment black 7 and the like. In addition, specific examples of the inorganic pigments include titanium oxide, titanium black, carbon black and the like. These pigments can be used in mixture of 1 or more types in order to make a color tone match.

The pigment may be preferably used in 10 to 70% by weight based on the total weight of the photosensitive resin composition.

In the photosensitive resin composition of this invention, the said photoinitiator (component (E)) has an effect | action which starts superposition | polymerization of the said crosslinkable monomer by wavelengths, such as visible light, an ultraviolet-ray, and an ultraviolet-ray. As the photopolymerization initiator, a triazine-based compound, a benzoin-based compound, an acetophenone-based compound, a xanthone-based compound, an imidazole-based compound, a mixture thereof, and the like may be used. Specifically, 2,4-bistrichloromethyl-6-p -Methoxystyryl-s-triazine, 2-p-methoxystyryl-4,6-bistrichloromethyl-s-triazine, 2,4-trichloromethyl-6-triazine, 2,4 Triazine-based compounds such as -trichloromethyl-4-methylnaphthyl-6-triazine; Benzoin compounds such as benzophenone and p- (diethylamino) benzophenone; 2,2-dichloro-4-phenoxyacetophenone, 2,2-diethoxyacetophenone, 2,2-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone Acetophenone series compounds, such as these; Xane, such as xanthone, thioxanthone, 2-methyl thioxanthone, 2-isobutyl thioxanthone, 2-dodecyl thioxanthone, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone Ton compound; And 2,2-bis-2-chlorophenyl-4,5,4,5-tetraphenyl-2-1,2-bisimidazole, 2,2-bis (2,4,6-tricyanophenyl)- Imidazole compounds such as 4,4,5,5-tetraphenyl-1,2-bisimidazole and the like can be used.

The photopolymerization initiator may be used in an amount of preferably 0.3 to 5% by weight, more preferably 0.5 to 2% by weight based on the total weight of the photosensitive resin composition. If the content is less than 0.3% by weight, the degree of hardening is lowered, and the low sensitivity makes it difficult to realize a pattern of a normal shape and is not good for the straightness of the pattern.If it exceeds 5% by weight, problems with storage stability may occur. Due to the high degree of cure, the resolution can be lowered and residues are more likely to occur in portions other than the formed pattern.

In the photosensitive resin composition of the present invention, suitable solvents may be used as the solvent (component (F)) in view of solubility and coating properties. Specific examples of suitable solvents include propylene glycol monoethyl ether acetate, ethyl ethoxypropionate, and butyl. Acetic acid, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, cyclohexanone, 3-methoxypropionate, 3-ethoxypropionic acid Methyl, a mixture thereof, etc. are mentioned, It is preferable to use especially propylene glycol monoethyl ether acetate, ethyl ethoxy propionate, or butyl acetic acid.

The solvent may be included in the remaining amount except the solids used in the photosensitive composition of the present invention by varying the content depending on the viscosity or the total solids content in the composition, the content is 5 to 60 weight based on the total weight of the photosensitive resin composition It is preferable that it is%. When the solvent is out of the above range, there is a problem that the thickness deviation cannot be overcome and the uniformity of the photosensitive resin composition is lowered.

In addition, the photosensitive resin composition of the present invention may further include additives such as a surfactant, a sensitizer, and a catalyst as necessary. In particular, the surfactant may be a silicone-based or fluorine-based surfactant.

The additive is preferably used in an amount of up to 2% by weight based on the total weight of the photosensitive resin composition, and when the content exceeds 2% by weight, a residual film is generated or stability is lowered.

According to another embodiment of the present invention, there is provided a cured film obtained by curing the photosensitive resin composition, a color filter including the cured film, and a panel display including the color filter.

When the photosensitive resin composition which concerns on this invention is used, even if it is a low temperature hardening process of 200 degrees C or less, a reliable cured film with little gas generation amount and excellent heat resistance and chemical resistance can be obtained. In addition, by using the photosensitive resin composition, it is possible to develop in an aqueous alkali solution, have excellent sensitivity and resolution, obtain a cured film pattern having a good shape, and provide a highly reliable color filter and a flat panel display including the same. Can provide.

Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the following examples are only for illustrating the present invention, and the scope of the present invention is not limited thereto. In the following examples, percentages and mixing ratios are by weight unless otherwise indicated.

EXAMPLE

Example 1

After dissolving 1 g of Irgacure 369 (manufactured by Ciba Specialty Chemical) and 0.6 g of DETX-S at room temperature for 30 minutes in a solvent of 35 g of propylene glycol methyl ether acetate (PGMEA) as a photopolymerization initiator, an alkali-soluble photo 5 g of DJB250 (manufactured by Dongjin Semichem Co., Ltd.) as a polymer resin, 2.5 g of NC-3000H (manufactured by Nippon Kayaku Co., Ltd.) as an epoxy resin, and DPHA (Japanese Chemical Co., Ltd.) as a crosslinkable monomer having an ethylene-type double bond. 5 g, 0.7 g of MCD (manufactured by Nippon Kayaku Co., Ltd.) as an epoxy curing agent, and stirred at room temperature for 1 hour, followed by CI as a pigment Pigment Blue 15: 6 and C.I. 50 g of the mixture of pigment violet 23 and 0.2 g of an additive were added thereto, and the mixture was stirred at room temperature for 1 hour.

The composition thus obtained was filtered two or more times to remove impurities to obtain the photosensitive resin composition of the present invention.

Example 2

As a pigment, C.I. Photosensitive resin composition was obtained in the same manner as in Example 1 except that 50 g of Pigment Red 254 was used.

Example 3

As a pigment, C.I. Pigment Green 36 45 g and C.I. A photosensitive resin composition was obtained in the same manner as in Example 1 except that 5 g of Pigment Yellow 138 was used.

Example 4

A photosensitive resin composition was obtained in the same manner as in Example 1 except that 50 g of carbon black (20% solution) was used as the pigment.

Example 5

A photosensitive resin composition was obtained in the same manner as in Example 1, except that 5 g of HIB (manufactured by Dongjin Semichem Co., Ltd.) was used as the acrylate resin as the alkali-soluble resin.

Example 6

The photosensitive properties were the same as in Example 1, except that 2.5 g of DJB250 (manufactured by Dongjin Semichem Co., Ltd.) as an alkali-soluble photopolymer resin and 2.5 g of HIB (manufactured by Dongjin Semichem Co., Ltd.) as an acrylate resin were used. A resin composition was obtained.

Comparative Example 1

A photosensitive resin composition was obtained in the same manner as in Example 1 except that the epoxy resin and the epoxy curing agent were not used.

Comparative Example 2

A photosensitive resin composition was obtained in the same manner as in Example 5 except that the epoxy resin and the epoxy curing agent were not used.

Comparative Example 3

Except not using an epoxy curing agent, a photosensitive resin composition was obtained in the same manner as in Example 1.

Comparative Example 4

A photosensitive resin composition was obtained in the same manner as in Example 1 except that no epoxy resin was used.

The compositions (g) of Examples 1 to 6 and Comparative Examples 1 to 4 are shown in Table 1 below.

TABLE 1

division Example Comparative example 1-4 5 6 One 2 3 4 Acrylate resin 0 5 2.5 0 5 0 0 Photopolymer resin 5 0 2.5 5 0 5 5 Epoxy resin 2.5 2.5 2.5 0 0 2.5 0 Epoxy curing agent 0.7 0.7 0.7 0 0 0 0.7 Crosslinkable acrylic monomer 5 5 5 5 5 5 5 Pigment 50 50 50 50 50 50 50 Photopolymerization initiator Igacure 369 One One One One One One One DETX-S 0.6 0.6 0.6 0.6 0.6 0.6 0.6 solvent PGMEA 35 35 35 35 35 35 35 additive 0.2 0.2 0.2 0.2 0.2 0.2 0.2

Experimental Example  : Cured film  Property evaluation

The physical properties of the cured film obtained from the photosensitive resin compositions prepared in Examples 1 to 6 and Comparative Examples 1 to 4 were evaluated in terms of gas generation amount, chemical resistance, and heat resistance.

First, the prepared photosensitive resin composition was spin coated to have a thickness of 1 to 2 μm, and then dried for 2 minutes on a hot plate at 80 ° C. to obtain a coating film. After placing the photomask on the obtained coating film, using an ultra-high pressure mercury lamp having a wavelength of 200 nm to 400 nm, and exposed for a predetermined time to about 100 mJ / ㎠ based on 365 nm, KOH developer (DCD-260CF, (Dongjin Semichem Co., Ltd.) was developed through a spray nozzle for a predetermined time, and then a cured film was prepared by performing a post-baking process at four temperatures of 150 degrees, 170 degrees, 190 degrees, and 230 degrees for 30 minutes. .

(1) Gas generation amount measurement

Four specimens according to the above temperature were cut into 10mm * 70mm size pieces and placed in a JTD-505 Autosampler (Jai Co., Ltd.) for 30 minutes under a vacuum condition of 240 ° C. Collected from the tube. This was separated by GC-MS and quantitatively analyzed for each material. The evaluation results are shown in Table 2 below.

0: less than 100% of the photosensitive resin composition in which gas generation amount is mass produced

Δ: 100 to 200% of the gas generation amount compared to the photosensitive resin composition

X: more than 200% compared to the photosensitive resin composition mass produced gas

TABLE 2

Example Comparative example One 2 3 4 5 6 One 2 3 4 230 degrees 0 0 0 0 0 0 0 0 0 0 190 degrees 0 0 0 0 0 0 Δ X Δ Δ 170 degrees 0 0 0 0 0 0 X X X X 150 degrees 0 0 0 0 Δ 0 X X X X

(2) heat resistance evaluation

The four specimens were subjected to heat treatment again at 230 ° C. for 3 hours to evaluate the change of the pattern, the change of chromaticity, and the change of thickness. The results are shown in Table 3 below.

0: No change of pattern, color difference (ΔEab) is 3.0 or less

Δ: slight change in pattern and color difference (ΔEab) in the range of 3.0 to 5.0

X: large pattern change or color difference (ΔEab) is 5.0 or more

※ Pattern change: Recrystallization phenomenon on pattern surface, pattern swelling

TABLE 3

Example Comparative example One 2 3 4 5 6 One 2 3 4 230 degrees 0 0 0 0 0 0 0 0 0 0 190 degrees 0 0 0 0 0 0 X X Δ X 170 degrees 0 0 0 0 0 0 X X X X 150 degrees 0 Δ 0 0 0 0 X X X X

(3) chemical resistance evaluation

Four specimens were immersed in 5% aqueous HCl solution, 5% aqueous NaOH solution, NMP, xylene, and isopropyl alcohol for 60 minutes and dried to evaluate the change of pattern and chromaticity. The results are shown in Table 4 below.

In addition, the absorbance of the substance eluted in the NMP solution was measured and shown in FIG.

0: No change of pattern, color difference (ΔEab) is 3.0 or less

Δ: slight change in pattern and color difference (ΔEab) in the range of 3.0 to 5.0

X: large pattern change or color difference (ΔEab) is 5.0 or more

※ Pattern change: pattern tearing or melting, pattern swelling

TABLE 4

Example Comparative example One 2 3 4 5 6 One 2 3 4 230 degrees 0 0 0 0 0 0 0 0 0 0 190 degrees 0 0 0 0 0 0 X X Δ X 170 degrees 0 0 0 0 0 0 X X X X 150 degrees 0 Δ 0 Δ 0 0 X X X X

From the results of Tables 2 to 4 and FIG. 1, even when the cured film obtained from the resin composition prepared in Examples 1 to 6 according to the present invention was cured at a low temperature of 200 ° C. or lower, compared to the case of Comparative Examples 1 to 4, It has a gas generation amount, it can be seen that excellent heat resistance and chemical resistance.

1 is a view showing the results obtained by measuring the absorbance of the eluted material after immersing the cured film obtained from the photosensitive resin composition prepared in Example 1 and Comparative Example 1 in the NMP solution in the experimental example.

Claims (14)

(A) a binder resin, comprising: (i) an epoxy resin, and (ii) at least one alkali-soluble resin selected from acrylate resins, photopolymer resins, and mixtures thereof; (B) an epoxy curing agent; (C) a crosslinkable monomer having an ethylenic double bond; (D) pigments; (E) photoinitiator; And (F) solvent Photosensitive resin composition comprising a. The method of claim 1, (A) 1 to 50% by weight of at least one alkali-soluble resin selected from (i) an epoxy resin and (ii) an acrylate resin, a photopolymer resin and a mixture thereof; (B) 0.1 to 10% by weight epoxy curing agent; (C) 1 to 30% by weight of a crosslinkable monomer having an ethylenic double bond; (D) 10 to 70 weight percent of pigment; (E) 0.3 to 5 wt% of a photopolymerization initiator; And (F) 5 to 60% by weight solvent Photosensitive resin composition comprising a. The method of claim 1, The said epoxy resin is chosen from bisphenol-A epoxy resin, bisphenol F-type epoxy resin, phenol novolak-type epoxy resin, cresol novolak-type epoxy resin, and mixtures thereof. The method of claim 1, Said acrylate resin has a weight average molecular weight of 10,000-35,000, The photosensitive resin composition characterized by the above-mentioned. The method of claim 1, The photopolymer resin is a photosensitive resin composition, characterized in that represented by the following formula (1) or (2): [Formula 1]

[Formula 2]

Where Each R ₁ is independently hydrogen or an alkyl group having ₁ to 2 carbon atoms, R ₂ is alkylene having 2 to 5 carbon atoms which is unsubstituted or substituted with a hydroxy group, a + b + c = 1, 0.1 <a <0,4, 0 <b <0.5, 0.1 <c <0.6. The method of claim 1, The photopolymer resin has a weight average molecular weight of 10,000 to 80,000. The method of claim 1, The epoxy curing agent is selected from amines, acid anhydrides, imidazoles, isocyanine, mercaptan compounds, and mixtures thereof. The method of claim 9, The said epoxy curing agent is contained in the quantity of 0.5-1.5 equivalent with respect to 1 equivalent of epoxy groups of an epoxy resin, The photosensitive resin composition characterized by the above-mentioned. The method of claim 1, The photosensitive resin composition, further comprising a curing accelerator in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the epoxy resin. The method of claim 1, The cure accelerator is selected from 2-methyl imidazole, 2-ethyl imidazole, 2-ethyl-4-methyl imidazole, 2-dimethyl phenol, triphenyl phosphine, octylic acid tin and mixtures thereof Photosensitive resin composition. The method of claim 1, The crosslinkable monomer having an ethylene double bond includes 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, pentaerythritol tetraacrylate, triethylene glycol diacrylate, Selected from polyethylene glycol diacrylate, dipentaerythritol diacrylate, sorbitol triacrylate, bisphenol A diacrylate derivative, trimethylpropanetriacrylate, dipentaerythritol polyacrylate, methacrylates thereof and mixtures thereof The photosensitive resin composition characterized by the above-mentioned. The cured film obtained by hardening | curing the photosensitive resin composition of any one of Claims 1-11. The color filter containing the cured film of Claim 12. A panel display comprising the color filter of claim 13.

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