KR20090093313A - Antifouling-antimoist and antistatic film for packing bag of electronic products and the antifouling-antimoist and antistatic packing bag for electronic products, produced by the same - Google Patents

Abstract

An antifouling-moisture-proof antistatic film is provided as a packing bag of electronic components. An antifouling-moisture-proof antistatic film comprises: a multilayered base film containing metal-deposited polyester layers; an antifouling-moisture-proof antistatic coating layer(30a) formed on at least one side of the base film; and an ion-complex antistatic coating layer(30b) formed on the other side of the base film. The base film represents the multilayered film comprising two or more layers selected from the group consisting of polyolefin film, nylon film and their combination. The antifouling-moisture-proof antistatic coating layer is composed of 1-30wt% of conductive polymer, 5-30wt% of acryl-urethane copolymeric binder, 40-80wt% of water, organic solvent or their mixture, 0.1-5wt% of antifouling-moisture-proof additive and 0.5-5wt% of slipping additive and wetting additive.

Description

Antifouling antistatic film for packaging electronic components—Antifouling-antimoist and antistatic film for packing bag of electronic products and the antifouling-antimoist and antistatic packing bag for electronic products, produced by the same}

The present invention relates to a film for packaging an electronic component and an envelope for packaging an electronic component using the same, and an antifouling anti-moisture-proof antistatic film for an electronic component packaging bag having antifouling and moistureproof functions as well as an antistatic function and an antifouling film for packaging an electronic component using the same. It relates to a moisture proof antistatic bag.

Electrostatic dispersion bags for packaging electronic components or semiconductor components require electrostatic dispersion, antifouling function to prevent contamination from fingerprints and foreign substances, and moisture proof function to be protected from moisture. That is, the antifouling and moisture proof function means a function of preventing the penetration of water, oil or other contaminants into the interior.

Background Art [0002] The known film for electrostatic dispersion electronic component packaging moisture shielding bags generally used electronic component packaging moisture shielding bags using a film prepared by coating an antistatic agent to a surfactant type on a multilayer including an aluminum foil layer. However, in the case of the moisture shielding bag, the cost increases, productivity decreases, and causes the environmental pollution by using the metal foil.

Developed by this is a film for packaging bags for electrostatic dispersion electronic parts, and interfaces with metal-deposited polyester films prepared by depositing or sputtering metal materials such as aluminum, nickel, titanium, copper, chromium, and zinc on polyester films. Envelopes for packaging electronic components using laminates of polyethylene films coated with surface-active coatings with activators, carbon black, etc. have been developed, but surfactants react sensitively with moisture under the influence of surfactants, resulting in semi-permanent electrostatic dispersion effects. In addition, ions are transferred to the surface and deposited on the base plastic film, which is not suitable as an electrostatic dispersion bag for packaging semiconductor parts. The use of carbon black not only causes black carbon dust in the film production, There is a problem that does not have transparency, metal Using the deposited film has a problem of poor antifouling and moisture proof function than using the metal foil.

Recently, the electrostatic dispersion bag using the conductive polymer has advantages such as transparency, high electrical conductivity and no surface transition that carbon black and surfactant do not have, but the disadvantage of poor water shielding performance is still not solved. When manufactured as a resin, the thermal adhesion is significantly reduced, making the bag unsuitable for the function of the bag.

The present invention has been made to solve the above problems, an object of the present invention is to provide an electronic component packaging bag film having both antistatic performance and antifouling and moisture proof function at the same time.

Another object of the present invention is to provide an electronic component packaging bag having both antistatic performance and antifouling and moisture proof function.

The present invention to achieve the above object,

A two or more multilayer base films comprising a metal fully deposited polyester film layer;

An antifouling anti-moisture antistatic coating layer formed on at least one surface of the base film; And

It provides an antifouling anti-moisture-proof antistatic film for an electronic component packaging bag, characterized in that the ion complex antistatic coating layer is formed on the other side of the base film.

In order to achieve the object of the present invention,

Two or more multilayer base films comprising a metal fully deposited polyester film layer; And

An antifouling anti-moisture antistatic coating layer formed on at least one surface of the base film,

The base film provides an antifouling anti-moisture-proof antistatic film for an electronic component packaging bag, wherein the base film is an antistatic film having an ion complex antistatic agent embedded therein.

The antistatic film containing the ion complex antistatic agent may be prepared by laminating an antistatic polyolefin film containing the ion complex antistatic agent and a polyester film completely deposited with metal.

The metal may be aluminum, nickel, titanium, copper, chromium or zinc, preferably aluminum is used.

The base film may be a polyolefin film or a nylon film, or a multilayer film of two or more layers in which the polyolefin film and the nylon film are further laminated.

The antifouling anti-moisture-proof antistatic coating layer may include 1 to 30% by weight of a conductive polymer, 5 to 30% by weight of an acrylic-urethane copolymer binder, 40 to 80% by weight of water or an organic solvent or a mixed solvent thereof, and 0.1 to 5% by weight of an antifouling and moisture proof additive. The antifouling anti-moisture-proof antistatic coating composition comprising% and an additive (slip, wetting, etc.) 0.5 to 5% by weight may be obtained by coating and curing the base film.

The ion complex antistatic coating layer is coated with an antistatic coating composition comprising 1 to 10% by weight of a complex antistatic agent, 90 to 99% by weight of water or an organic solvent or a mixed solvent thereof, and then coated on one surface of the base film. Can be obtained.

The present invention also provides an electronic component packaging bag manufactured using the film for electronic component packaging bag.

According to one embodiment of the present invention, it is preferable that the ion complex antistatic coating layer is manufactured by thermally bonding the inner surface.

The electronic component packaging bag according to the present invention has a moisture shielding function that can replace the metal foil, that is, the aluminum foil, which may be environmentally contaminated, and even though the aluminum deposition film is used, the aluminum foil corresponds to the use. Moisture shielding function is shown. In addition, by using the ion complex antistatic coating layer or the internal ion-type ion complex antistatic film, the inner surface can provide an electronic component packaging bag having strong thermal adhesion and excellent antistatic performance.

That is, the envelope for packaging an electronic component according to the present invention is excellent in antistatic functionality, excellent in moisture shielding ability, and environmentally friendly, and does not require additional equipment in an existing facility, and thus may have economical and environmentally friendly advantages.

1 is a cross-sectional view of an antistatic moisture shielding film for packaging electronic components according to an embodiment of the present invention.

10: polyester film in which aluminum is completely deposited

20: linear low density polyethylene film

30a: antifouling anti-moisture antistatic coating layer added antifouling anti-moisture additive

30b: ion-complex antistatic layer

Hereinafter, the present invention will be described in more detail.

The present invention provides a bilayer or more multilayer base film comprising a metal fully deposited polyester film layer; An antifouling anti-moisture antistatic coating layer formed on at least one surface of the base film; And it provides an antifouling anti-moisture-proof antistatic film for packaging packaging electronic components, characterized in that the ion complex antistatic coating layer formed on the other side of the base film. Conventionally, as a base film, a film using aluminum foil was used for moisture-proof function, but in this case, there was a problem of cost increase and environmental pollution by using aluminum foil. However, in the case of the present invention by using a metal deposition film instead of a metal foil, it is possible to reduce the cost than using a metal foil, and to prevent environmental pollution.

In addition, the conventional surfactant coating used for antistatic has had problems of ion transfer problems and antistatic performance at constant temperature and humidity, but the antistatic coating layer according to the present invention does not cause the same problem as the surfactant, rather antifouling And by including a desiccant, it can exhibit not only an antistatic function but also additional functions of antifouling and moisture proof.

That is, according to an embodiment of the present invention, the antifouling anti-moisture antistatic coating layer may be coated with an antifouling anti-moisture antistatic coating composition including an antifouling and moisture resistant additive in the form of a fluorine-urethane copolymer and a conductive polymer in various coating methods (roll, Gravure, microgravure, comma, spray, slot die, etc.) may be formed by coating on one surface, preferably the outer surface of the base film, followed by thermal drying (50 ~ 150 ℃). As such, the film for packaging an electronic component according to the present invention may exhibit an antifouling and moisture proof function as well as an antistatic function.

In addition, according to an embodiment of the present invention, the other surface of the base film, that is the inner surface of the ion complex antistatic coating liquid coated by various coating methods (roll, gravure, microgravure, comma, spray, slot die, etc.) After heat drying (40 ~ 150 ℃) it can be formed an antistatic layer. As a result, an antistatic function is added to the inner surface to suppress the generation of static electricity, thereby preventing damage to electronic components, and even when manufactured as an electronic component packaging bag, the thermal adhesive force is maintained, unlike the conventional conductive polymer layer. Electronic parts packaging bag function can be maintained.

According to an embodiment of the present invention, the base film is a double layer of LDPE / PET-AL, or polyethylene film by laminating a metal on the polyester film (PET-Al) and then laminating with a polyethylene film (LDPE) and The nylon film may be laminated to be a triple layer multilayer film of LDPE / PET-AL / nylon.

The antifouling anti-moisture-proof antistatic coating layer may include 1 to 30% by weight of a conductive polymer, 5 to 30% by weight of an acrylic-urethane copolymer binder, 40 to 80% by weight of water or an organic solvent or a mixed solvent thereof, and 0.1 to 5% by weight of an antifouling and moisture proof additive. The antifouling anti-moisture-proof antistatic coating composition comprising% and an additive (slip, wetting, etc.) 0.5 to 5% by weight may be obtained by coating and curing the base film.

The ion complex antistatic coating layer is coated with an antistatic coating composition comprising 1 to 10% by weight of a complex antistatic agent, 90 to 99% by weight of water or an organic solvent or a mixed solvent thereof, and then coated on one surface of the base film. Can be obtained.

According to one embodiment of the invention, the internal-type ion complex antistatic film is a blow method, a tea-die method by using a mixture of 3 to 40% by weight of the ion complex antistatic masterbatch, 60 to 97% by weight of polyolefin resin Can be prepared by

As the conductive polymer, polyaniline, polypyrrole, polythiophene, poly (3,4-ethylenethiophene) or derivatives or copolymers thereof and π-conjugated electrically conductive polymer may be used.

The ion complex antistatic agent is a transparent-neutral-solution comprising using a cation-ion conductive material, an anion-ion conductive material, and a surfactant formed by coordinating an alkali metal or transition metal cation with an ion conductive organic compound. It is an antistatic agent. More specifically, an electron cation such as intramolecular oxygen, nitrogen, sulfur, phosphorus, etc., which uses alkali metal cations and transition metal cations as conductive cation-ion conducting materials and can form ligands for coordination with them. cation conducting organic compounds with pair electrons are used.

Examples of the organic solvent include polar organic solvents such as dimethyl sulfoxide (DMSO), dimethylformamide (DMF), N-methyl-2-pyrrolidone (NMP), 2-butanone and 4-methyl-2-pentanone; Alcohol, such as methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol, t-butyl alcohol, benzyl alcohol, ethylene glycol, etc. can be illustrated, Preferably DMSO, NMP, methyl alcohol, ethyl alcohol, isopropyl alcohol Etc. are used. These organic solvents can be used individually or in mixture of 2 or more types.

The antifouling and moisture proof additive is a perfluorine-urethane copolymer prepared by polymerizing a perfluorinated alkyl alcohol and a functional isocyanate comonomer in the form of a fluorine-urethane copolymer polymer by a urethane reaction of a hydroxyl group and an isocyanate group by a free radical polymerization reaction. And fluorine compositions comprising a compound or oligomer having at least one fluorine-containing end group and a polymer that is a continuous unit thereof. In a fluorine-urethane copolymer polymer, it is preferable that n is 1-20 and an average molecular weight is 1,000-10,000 in a perfluorine group [CF3 (CF2) n functional functional group]. The surface contact angle of the film coated with the electrostatic dispersion coating composition including the antifouling and moistureproof additive is 80 to 130 degrees, and the surface resistance is 103 to 109 Ω / sq.

The metal used for the base film of the present invention, for example, a polyester film completely deposited with aluminum, may be a film in which aluminum is completely deposited and a semi-deposited film on a polyethylene terephthalate (PET) film, which is a polyester film. Preferably, a film in which metal, for example aluminum, is completely deposited in order to maximize moisture shielding efficiency is preferable.

Polyolefin films include high density polyethylene film [HDPE (high-density polyethylene)], low density polyethylene film [LDPE (low-density polyethylene)], linear low density polyethylene film [LLDPE (Linear Low Density Polyethylene)], polypropylene, EVA film, etc. This can be used.

As the nylon film, polyamide-based nylon 6, 66, 610, 612, 46, 11, 12, 3, and the like may be used.

Hereinafter, referring to FIG. 1, an antifouling anti-moisture antistatic film for an electronic component packaging bag according to an embodiment of the present invention will be described. According to FIG. 1, a base film in which a linear low density polyolefin film 20 is laminated on one surface of a polyester film 10 on which aluminum is completely deposited to form a double layer, and the polyester film of the base film 10/20. An antifouling-moisture-proof antistatic coating layer 30a to which an antifouling-moisture-preventing agent is added is formed at 10, and an ion complex antistatic coating layer 30b is formed on the polyolefin film 20. The base film may be composed of a triple layer in which a nylon film is further laminated on an upper surface of the polyester film. Instead of separately forming the ion complex antistatic coating layer, an ion complex antistatic agent may be added to prepare an internal complex type antistatic film when the polyolefin film 20 is prepared. The polyolefin film may be heat-sealed with the inner surface of the polyolefin film to be used as an envelope.

The present invention will be described in more detail with reference to the following Examples. However, the following examples are only preferred examples of the present invention, and the present invention is not limited to the following examples.

Example  One

20% by weight of poly (3,4-ethylenedioxythiophene) (Baytron PH, HC Starck, Germany), 1% water-soluble polymer dispersion, 5% by weight of acrylic-urethane copolymer binder (Stahl Asia Pte Ltd., WF-4644), water 11 wt%, 52.5 wt% isopropyl alcohol, 10 wt% organic solvent (NMP and DMSO 1: 4 mixed solvent), 1 wt% perfluoro-urethane copolymer (BPI Co, Bondthane) as an antifouling and moisture proof additive, and wetting agent (BYK series) 0.5 wt% was used to prepare an antifouling anti-moisture antistatic coating solution.

An ion complex antistatic coating solution was prepared using 5% by weight of an ion complex antistatic agent (ELECON series, NanoCamtech Co., Ltd.) and 95% of isopropyl alcohol.

The antifouling-moisture-proof antistatic agent coating liquid was coated on a polyethylene terephthalate (PET) film surface in a double layer film formed of a fully deposited aluminum (600 Å) polyethylene terephthalate (PET) film and a linear low density polyethylene film (LLDPE, 56 um). Coating on the outer surface by gravure coating method, and thermally cured at 80-100 ° C. for 2 minutes to form an antifouling anti-moisture-proof antistatic layer, and the ion complex type antistatic agent was coated on the polyethylene film (LLDPE) surface (inner surface). The antifouling anti-moisture-proof antistatic film was prepared by coating the film by heat treatment and thermosetting at 50 to 60 ° C. for 2 minutes to form an antistatic layer.

The polyethylene film (LLDPE) surface (inner surface) of the antifouling anti-moisture-proof antistatic film prepared above was heat-bonded to prepare an antistatic electronic component packaging moisture shielding bag.

Example  2

 Antifouling-moisture-proof antistatic coating solution was prepared in the same manner as in Example 1.

Internal antistatic linear low density polyethylene film (LLDPE, 56) by blow method using 15% by weight of ion complex type antistatic masterbatch (POLYNOX series, NanoCamtech Co., Ltd.) and 85% by weight of linear low density polyethylene resin (LLDPE) um) was prepared.

Aluminum fully deposited (600 폴리에틸렌) polyethylene terephthalate (PET, 12 um) film and the above-mentioned internally-resistant antistatic linear low density polyethylene film (LLDPE, 56 um) were laminated with an acrylic adhesive to fully aluminum laminated (600Å) polyethylene. A bilayer film formed of terephthalate (PET, 12 um) film / antistatic linear low density polyethylene film (LLDPE, 56 um) was prepared. The antifouling anti-moisture-proof antistatic agent coating liquid prepared in Example 1 was coated on the polyethylene terephthalate (PET) film surface (outer surface) by a gravure coating method, and thermally cured at 80 to 100 ° C. for 2 minutes to form an antifouling anti-moisture antistatic layer. To prepare an antifouling anti-moisture antistatic film for an electronic component packaging bag.

The antifouling anti-moisture anti-static bag for packaging an antistatic electronic component was prepared by thermally bonding the internal antistatic polyethylene film (LLDPE) surface (inner surface) from the antifouling anti-moisture antistatic film prepared above.

Example  3

The antifouling prepared in Example 1 on a triple layer film formed of nylon film (15 um) / aluminum fully deposited polyethylene terephthalate (PET, 12 um) film / linear low density polyethylene film (LLDPE, 41 um)- The moisture-proof antistatic agent coating liquid was coated on the nylon film surface (outer surface) by a gravure coating method, and thermally cured at 80 to 100 ° C. for 2 minutes to form an antifouling anti-moisture-proof antistatic layer and the polyethylene film (LLDPE) surface (inner surface) The ion complex antistatic agent prepared in 1 was coated by a gravure coating method, and thermally cured at 50 to 60 ° C. for 2 minutes to form an antistatic layer, thereby preparing an antifouling anti-moisture antistatic film.

A polyethylene film (LLDPE) surface (inner surface) of the antifouling anti-moisture-proof antistatic film prepared above was thermally bonded to prepare an antifouling anti-moisture antistatic bag for packaging an antistatic electronic component.

Example  4 to 5

It carried out similarly to Example 1 except having carried out the antifouling | moisture-proof-moisture-additive ratio as described in Table 1.

Comparative example  One

Antifouling-moisture-proof in antifouling-moisture-proof antistatic coating liquid prepared in Example 1 on a double layer film formed of aluminum fully deposited (600 μs) polyethylene terephthalate (PET, 12 um) film / linear low density polyethylene film (LLDPE, 56 um) Antistatic coating solution, except for additives, was coated on the polyethylene terephthalate (PET) film surface (outer surface) by gravure coating method, and thermally cured at 80 to 100 ° C for 2 minutes to form an antistatic layer, and the polyethylene film (LLDPE) surface (inner surface) ) Was coated with the ionic complex antistatic agent by a gravure coating method, and thermally cured at 50 ~ 60 ℃ for 2 minutes to form an ion complex antistatic layer to prepare a film for moisture-shielding bags.

An antistatic bag for packaging an electronic component was manufactured by thermally bonding a polyethylene film (LLDPE) surface (inner surface) from the film for a moisture shielding bag prepared above.

Comparative example  2

In Comparative Example 1, instead of the ion complex antistatic agent, the antistatic coating liquid coated with PET film surface on the LLDPE surface (inner surface) to form an antistatic layer in the same manner as in Comparative Example 1 Proof bags were made.

Comparative example  3

The trilayer film formed of nylon film (15 um) / aluminum foil (7 um) film / linear low density polyethylene film (LLDPE, 46 um) was coated with a surfactant (tetravalent ammonium, ACL) antistatic coating on the nylon film surface (outer surface). Coated by a gravure coating method, and thermally cured at 60 to 80 ° C. for 2 minutes to form an antistatic layer, and a gravure coating method using an antistatic surfactant (tetravalent ammonium, ACL) on the polyethylene film (LLDPE) surface (inner surface). It was coated by, and thermally cured at 50 ~ 60 ℃ for 2 minutes to form an antistatic layer to prepare an antistatic film for packaging electronic components.

An antistatic bag for packaging an antistatic electronic component was manufactured by thermally bonding a polyethylene film (LLDPE) surface (inner surface) from the antistatic film prepared above.

Comparative example  4

Surfactant (tetravalent ammonium, ACL) antistatic coating was applied to a bilayer film formed of aluminum semi-deposited (0.4 OD) polyethylene terephthalate (PET, 12 um) film / linear low density polyethylene film (LLDPE, 56 um). Coating on phthalate (PET. Outer surface) by gravure coating method, heat cured at 60 ~ 80 ℃ for 2 minutes to form an antistatic layer and charging surfactant (tetravalent ammonium, ACL) on the polyethylene film (LLDPE) surface (inner surface) An antistatic coating was coated by a gravure coating method, and thermally cured at 50 to 60 ° C. for 2 minutes to form an antistatic layer, thereby preparing an antistatic film for an electronic component packaging bag.

An antistatic bag for packaging an antistatic electronic component was manufactured by thermally bonding a polyethylene film (LLDPE) surface (inner surface) in the antistatic film for packaging an electronic component prepared above.

Comparative example  5

The antifouling-moisture-proof antistatic coating solution prepared in Example 1 was applied to a double layer film formed of an aluminum semi-deposited (0.4 OD) polyethylene terephthalate (PET, 12 um) film / linear low density polyethylene film (LLDPE, 56 um). The phthalate (PET) film surface (outer surface) was coated by a gravure coating method, and thermally cured at 80 to 100 ° C. for 2 minutes to form an antifouling anti-moisture-proof antistatic layer and the polyethylene film (LLDPE) surface (inner surface) in Example 1 The prepared ion complex antistatic agent was coated by a gravure coating method, and thermally cured at 50 to 60 ° C. for 2 minutes to form an ion complex antistatic layer to prepare an antifouling anti-moisture-proof antistatic film for an electronic component packaging bag.

The antifouling anti-moisture antistatic bag for packaging an antistatic electronic component was manufactured by thermally bonding the polyethylene film (LLDPE) surface (inner surface) from the antifouling anti-moisture antistatic film prepared above.

Table 1 shows the physical property test results of the films prepared in Examples 1 to 5 and Comparative Examples 1 to 5.

Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Antifouling additives ratio 1 wt% 1 wt% 1 wt% 2 wt% 3 wt% 0% 0% 0% 0% 1 wt% Surface Resistance (External) Ω / sq 3 x 10 ⁵ 3 x 10 ⁵ 3 x 10 ^{5 5} x 10 ⁵ 8 x 10 ⁵ 2 x 10 ⁵ 2 x 10 ⁵ 9x10 ⁹ 9x10 ⁹ 3 x 10 ⁵ Surface Resistance (Internal) Ω / sq 2 x 10 ⁸ 1 x ^{10 9} 2 x 10 ⁸ 2 x 10 ⁸ 2 x 10 ⁸ 2 x 10 ⁸ 4 x 10 ⁵ 9x10 ⁹ 9x10 ⁹ 2 x 10 ⁸ Surface resistance (inside) after constant temperature and humidity 9x10 ⁸ 2 x 10 ⁹ 9x10 ⁸ 9x10 ⁸ 9x10 ⁸ 9x10 ⁸ 9 x 10 ⁵ 8 x 10 ¹² 8 x 10 ^{12 8} x 10 ⁸ Moisture shielding capacity (g / m ² day or less) 0.4 0.4 0.3 0.2 0.1 5.6 5.2 0.3 6.5 4.6 Inner adhesion 0 0 0 0 0 0 x 0 0 0 Measuring conditions Surface resistance: measured by ASTM D257 method. Surface contact angle: measured using a Phoneix 300 (SEO Co.) measuring device. Moisture shielding capacity: Manufacturer-MOCON (USA), Model name: PERMATRAN-W TWIN, Related test standard: KSM 3088: 2004, Temperature: 38 ± 2 degrees: 100%. Relative comparison value after 240 hours (50 degrees / 80%) 4. Surface resistance (inside) after constant temperature and humidity: After 72 hours (60 degrees / 80%), measured by ASTM D257 method 5. Inner adhesiveness: After heat bonding, give 20kg of force around the adhesive part and the adhesive part falls off (if it doesn't drop: 0, if it falls: x)

As can be seen from the results of Table 1, when comparing Comparative Example 3 and Comparative Examples 1, 2, 4, and 5, it can be seen that the aluminum deposition film is less water-shielding ability than using aluminum foil. On the other hand, when the antifouling-moisture-addition agent is added according to the present invention, it can be seen that the moisture shielding ability is increased to correspond with that of using aluminum foil. Therefore, it can be seen that the antifouling anti-moisture-proof antistatic film of the present invention is environmentally friendly. In addition, even when the antifouling-moisture-proof agent is used, it can be seen that the anti-deposition film has a poor water shielding ability. However, according to the present invention, it can be seen that the envelope for packaging an electronic component using an antifouling moisture-proofing agent and an aluminum complete deposition film has an antifouling function as well as an antistatic function. In addition, as can be seen from Comparative Example 2, in the case of the antistatic film coated with the conductive polymer on the inner surface, it can be seen that the thermal adhesive strength is significantly lowered when the bag is manufactured by thermal bonding.

Claims (14)

A two or more multilayer base films comprising a metal fully deposited polyester film layer; An antifouling anti-moisture antistatic coating layer formed on at least one surface of the base film; And An antifouling anti-moisture-proof antistatic film for an electronic component packaging bag, characterized in that an ion complex antistatic coating layer is formed on the other side of the base film. The method of claim 1, The antifouling anti-moisture-proof antistatic film for an electronic component packaging bag, wherein the metal is aluminum. The method of claim 1, The antifouling anti-moisture-proof antistatic film for an electronic component packaging bag, wherein the base film is a polyolefin film or a nylon film, or a multi-layered multilayer film in which a polyolefin film and a nylon film are further laminated. The method of claim 1, The antifouling anti-moisture-proof antistatic coating layer is 1-30% by weight of a conductive polymer, 5-30% by weight of an acrylic-urethane copolymer binder, 40-80% by weight of water or an organic solvent or a mixed solvent thereof, and 0.1-5% by weight of an antifouling / moisture-proof additive. Antifouling-moisture-proof antistatic film for packaging packaging electronic components, characterized in that consisting of antifouling-moisture-proof antistatic coating composition comprising% and 0.5 to 5% by weight of additives (slip, wetting, etc.). The method of claim 1, The ion complex antistatic coating layer for an electronic component packaging bag, characterized in that consisting of an antistatic coating composition containing 1 to 10% by weight of the complex antistatic agent, 90 to 99% by weight of water or organic solvents or a mixed solvent thereof Antifouling anti-moisture film. The method of claim 1, The conductive polymer is polyaniline, polypyrrole, polythiophene, polythiophene, poly (3,4-ethylenethiophene) or derivatives or copolymers thereof and a π-conjugated electrically conductive polymer. , Poly (3,4-ethylenethiophene) or derivatives or copolymers thereof and a π-conjugated electrically conductive polymer, an antifouling anti-moisture-proof antistatic film for an electronic component packaging bag. The method of claim 1, The ion complex antistatic agent is an electronic component packaging bag, characterized in that using the cation-ion conductive material, anion-ion conductive material and surfactant formed by the coordination bond of alkali metal or transition metal cation and ion conductive organic compound Antifouling anti-moisture film. The method of claim 1, The organic solvent is a polar organic solvent of dimethyl sulfoxide (DMSO), dimethylformamide (DMF), N-methyl-2-pyrrolidone (NMP), 2-butanone, 4-methyl-2-pentanone; Or antifouling-moisture-proof charging for electronic parts packaging bags, characterized in that methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol, t-butyl alcohol, benzyl alcohol, and alcohols of ethylene glycol are used alone or in combination of two or more thereof. Resistant film. The method of claim 1, The antifouling anti-moisture-proof antistatic film for an electronic component packaging bag, wherein the antifouling / moisture-proof additive is a perfluorine-urethane copolymer. The method of claim 9, The perfluorinated urethane copolymer is a perfluorinated group [CF3 (CF2) n functional functional group] n is an antifouling for packaging packaging electronic components, characterized in that the perfluorinated-urethane copolymer polymer 1 to 20, the average molecular weight of 1,000 to 10,000 -Moisture proof antistatic film. The method of claim 1, An antifouling anti-moisture-proof antistatic film for an electronic component packaging bag, wherein the base film is a double layer of a polyolefin film / aluminum deposited polyester film, or a triple layer of a polyolefin film / aluminum deposited polyester film / nylon. A two or more multilayer base films comprising a metal fully deposited polyester film layer; And An antifouling anti-moisture antistatic coating layer formed on at least one surface of the base film, The base film is an antifouling anti-moisture-proof anti-static bag for an electronic component packaging bag, wherein the antistatic polyolefin film having an ion complex type antistatic agent is embedded therein and a metal film fully deposited polyester film. film. The method of claim 12, The internal component of the ion complex type antistatic film is an electronic component, characterized in that produced by blow or tee-die method using a mixture of 3 to 40% by weight of the ion complex antistatic masterbatch, 60 to 97% by weight of polyolefin resin Antifouling anti-moisture antistatic film for packaging bags. In the antifouling anti-moisture bag for packaging electronic components, An electronic component comprising the envelope made of the antifouling anti-moisture-proof antistatic film according to any one of claims 1 to 13, wherein the ion complex antistatic coating layer or the internal additive type ion complex antistatic film is formed on the inner surface. Antifouling anti-moisture bag for packaging.