KR100679238B1 - A film for packaging bags of electronic parts with electrostatic dissipative and Packaging bags of electronic parts with electrostatic dissipate using it - Google Patents

Abstract

The present invention relates to a film for an electrostatic dispersion electronic component packaging bag and an electrostatic dispersion electronic component packaging bag using the same, wherein at least one surface of a single layer or multilayer base plastic film is contained in an amount of 1 to 10% by weight of a conductive polymer, and an acrylic-urethane copolymer binder is 5 to 30. Coated with a coating composition for electrostatic dispersion comprising 30% by weight to 80% by weight, water or an organic solvent or a mixed solvent thereof, 0.1 to 5% by weight of antifouling and moistureproof additives, and 0.5 to 5% by weight of a heat-adhesive functional resin. Provided are a film for electrostatic dispersion electronic component packaging bags.

Description

Film for packaging bags of electronic parts with electrostatic dissipative and Packaging bags of electronic parts with electrostatic dissipate using it}

1 is a cross-sectional view of a film for electrostatic dispersion electronic component packaging bags according to an embodiment of the present invention.

Figure 2 is a bottom view of the film for electrostatic dispersion electronic component packaging bags according to another embodiment of the present invention.

Figure 3 is a cross-sectional view of the film for electrostatic dispersion electronic component packaging bags according to another embodiment of the present invention.

The present invention relates to a film for an electrostatic dispersion electronic component packaging bag and an electrostatic dispersion electronic component packaging bag using the same, and more particularly, a film for an electrostatic dispersion electronic component packaging bag having an antifouling and moistureproof function and a strong thermal adhesiveness, and an electrostatic dispersion thereof. The present invention relates to an electronic component packaging bag.

Electrostatic dispersion bags for packaging electronic components or semiconductor components require electrostatic dispersion, antifouling function to prevent contamination from fingerprints and foreign substances, and moisture proof function to be protected from moisture. In other words, the antifouling and moisture proof function prevents the penetration of water, oil or other contaminants into the inside. This means that the contact surface is minimized, preventing contaminants from penetrating inside.

Background Art [0002] The known films for packaging electrostatic dispersion electronic components generally interface with metal deposited polyester films prepared by depositing or sputtering metal materials such as aluminum, nickel, titanium, copper, chromium, and zinc on polyester films. The polyethylene film having the surface coated with an active agent, carbon black and the like is manufactured by laminating, and an envelope for packaging an electronic component is manufactured using the same. In the case of electrostatic dispersion bags using surfactants, they do not react semi-permanently due to sensitive reaction with moisture under the influence of surfactants having ions, and do not transfer semi-permanent electrostatic dispersion effect to the surface and are deposited on the base plastic film, which leads to electrostatic packaging for semiconductor parts. It is not suitable as a distributed envelope. In addition, in the case of electrostatic dispersion bags using carbon black, there is a concern that black carbon dust may be generated during film production, and there is a problem of not having transparency, which is not suitable as an electrostatic dispersion film for packaging semiconductor parts.

Recently, in order to compensate for this problem, the production of electrostatic dispersion bags using conductive polymers has been attempted. The conductive polymer has the advantages that carbon black and surfactants do not have transparency, high electrical conductivity, and no surface transition. Therefore, the conductive polymer has recently been widely used as a coating composition for electrostatic dispersion bags for packaging electronic parts and semiconductor parts.

Coating compositions using conductive polymers have been developed and sold in Bayer, Germany, by developing a conductive polythiophene solution called "Baytron". Information on these compositions is disclosed in US Pat. No. 5,372,924.

Related patents of electrostatic dispersion moisture shielding bags coated on a base plastic film in various ways using these conductive polymer coating compositions are known from US Pat. Nos. 5,759,649, 5,478,616 and Korean Patent No. 426792. After laminating a metal-deposited polyester film and a general polyethylene, the surface is treated with a conductive polymer coating composition, and the film is used to prepare an envelope for packaging an electronic component.

However, in the case of the electrostatic dispersion film produced using the conductive polymer coating composition, the transparency and the surface resistance are good, but the metal deposition polyester film is used to reinforce the antifouling and moisture proof function, thereby increasing the cost, lowering the productivity, and polluting the metal environment. Caused by. Moreover, the manufacture of bags after coating the endothelial surface with known conductive polymer compositions significantly reduces the thermal adhesion and is not suitable for the function of the bags. Polyethylene films have strong adhesion to each other by heat, but films coated with conductive polymers have a significant decrease in adhesion by heat, resulting in loss of commercial value.

The present invention has been made to solve the above problems, an object of the present invention is to provide an electronic component packaging bag film coated with a conductive coating composition for electrostatic dispersion having both antifouling, moisture-proof and heat adhesive function.

Another object of the present invention to provide an electronic component packaging bag manufactured using the film for the electronic component packaging bag.

In order to achieve the above object, the present invention provides 1 to 10% by weight of a conductive polymer, 5 to 30% by weight of an acrylic-urethane copolymer binder, water or an organic solvent, or a mixed solvent thereof on at least one surface of a single or multilayer base plastic film. Provided are a film for electrostatic dispersion electronic component packaging bags coated with a coating composition for electrostatic dispersion comprising a weight%, antifouling and moistureproof additives 0.1 to 5% by weight, and a heat adhesion functional resin 0.5 to 5% by weight.

The electrostatic dispersion coating composition may be completely coated on the outer surface of the film, and the inner surface may be partially coated in a mesh or lattice form.

The present invention also provides an electrostatic dispersion electronic component packaging bag manufactured by thermally bonding the film.

Hereinafter, the present invention will be described in more detail.

The present invention relates to an electronic component packaging bag film coated with a conductive coating composition for electrostatic dispersion having antifouling, moisture proof, and thermal adhesion functions.

The present invention is a heat adhesion function for the adhesion of the antifouling and moisture-proof additives in the form of fluorine-urethane copolymer polymer and heat adhesion instead of laminating with a polyethylene film after depositing a metal on the polyester film for moisture shielding purposes A coating composition for electrostatic dispersion comprising a resin is prepared and coated on one or both sides of the base plastic to provide a film for electrostatic dispersion electronic component packaging bags. In addition, the outer surface of the film may be completely coated and the inner surface may be partially coated in the form of a mesh or a lattice, whereby the outer surface and the endothelial surface have antifouling and moistureproof functions and strong thermal adhesion at the same time. The skin film can further have strong adhesion. In addition, when coating the outer surface and the inner surface at the same time coating the coating composition for electrostatic dispersion of the present invention on the endothelial surface, the outer surface is coated in the coating composition for electrostatic dispersion except the heat adhesive functional resin to the adhesive force I can regulate it.

Electrostatic dispersion coating composition of the present invention is 1 to 10% by weight of conductive polymer, 5 to 30% by weight of acrylic-urethane copolymer binder, 30 to 80% by weight of water or organic solvent or mixed solvent thereof, antifouling and moisture proof additives 0.1 to 5 % By weight and 0.5 to 5% by weight of a thermal adhesive functional resin.

As the conductive polymer, polyaniline, polypyrrole, polythiophene, poly (3,4-ethylenethiophene) or derivatives or copolymers thereof and π-conjugated electrically conductive polymer may be used.

Examples of the organic solvent include polar organic solvents such as dimethyl sulfoxide (DMSO), dimethylformamide (DMF), N-methyl-2-pyrrolidone (NMP), 2-butanone and 4-methyl-2-pentanone; Alcohol, such as methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol, t-butyl alcohol, benzyl alcohol, ethylene glycol, etc. can be illustrated, Preferably DMSO, NMP, isopropyl alcohol is used. These organic solvents can be used individually or in mixture of 2 or more types.

The antifouling and moisture proof additive is a perfluorine-urethane copolymer prepared by polymerizing a perfluorinated alkyl alcohol and a functional isocyanate comonomer in the form of a fluorine-urethane copolymer polymer by a urethane reaction of a hydroxyl group and an isocyanate group by a free radical polymerization reaction. And fluorine compositions comprising a compound or oligomer having at least one fluorine-containing end group and a polymer that is a continuous unit thereof. In the fluorine-urethane copolymer polymer, n is 1 to 20 and an average molecular weight is 1,000 to 10,000 in the perfluorine group [CF ₃ (CF ₂ ) n functional functional group]. The surface contact angle of the film coated with the electrostatic dispersion coating composition including the antifouling and moistureproof additive is 80 to 130 degrees, and the surface resistance is 10 ³ to 10 ⁹ dl / cm ² .

Examples of the heat-adhesive functional resin include an olefin copolymer containing an acyloxy group in a molecule, and an ethylene copolymer such as ethylene-vinyl acetate copolymer and ethylene-ethylene diacetate copolymer; Propylene copolymers such as propylene-vinyl acetate copolymers and propylene-ethylene diacetate copolymers; poly (vinylpyrrolidone), poly (oxyethylene), poly (vinyl alcohol) as water-soluble hot melt thermal adhesive functional resins; One, or a mixture of two or more selected from acrylic acid, poly (ethylene acrylic acid) and poly (ethylene vinyl copolymer) may be used. The water-soluble hot melt thermal adhesive functional resin can be used in admixture with additives such as tackifying resins and waxes or plasticizers.

Base plastics of the present invention include polyester, polystyrene, polyimide, polyamide, polysulfone, polycarbonate, polyvinyl chloride, polyethylene, polypropylene mixtures and copolymers thereof, phenolic resins, epoxy resins, urethane resins, ABS resins. One film selected from or a film formed of one or more selected multilayers may be used. Preferably, the multilayer film in which the polyester film and the polyethylene film are laminated | stacked on the outer skin surface is mentioned. In addition, a multilayer film in which an internal antistatic film and a general plastic film are laminated may also be used. The coating composition for electrostatic dispersion of the present invention is coated on a plastic film of the outer surface by a general coating method such as gravure coating, roll coating, bar coating, spray coating, and then thermally cured to produce an excellent surface conductive film, and The surface-mounted antistatic film may be bonded to produce an electrostatic dispersion electronic component packaging bag.

1 is a cross-sectional view of a film for electrostatic dispersion electronic component packaging bags according to an embodiment of the present invention. The film is composed of a polyester film outer layer 10, a polyethylene film inner layer 20 and the electrostatic dispersion coating layers 30a and 30b formed on the outer layer 10 and the inner layer 20, respectively. The electrostatic dispersion coating layers 30a and 30b are formed by coating the polymer coating liquid composition for electrostatic dispersion. Electrostatic dispersion polymer coating composition is poly (3,4-ethylenedioxythiophene) (Baytron PH from HC Starck, Germany), an acrylic-urethane copolymer binder, water and organic solvents (NMP, DMSO), antifouling and moistureproof It was prepared by adding a perfluorinated-urethane copolymer (BPI Co, Bondthane UD-50), a water-soluble heat adhesive resin, and a slip additive.

Figure 2 shows a bottom view of a film for electrostatic dispersion electronic component packaging bags according to another embodiment of the present invention. The coating composition for electrostatic dispersion is coated in a mesh or lattice form on the polyethylene film inner skin surface 120 of the film. When the coating composition for electrostatic dispersion is coated in a mesh or lattice form by adjusting the intervals of various widths, heights, and hole widths by general coating methods such as gravure, roll, screen, and spray, the electrostatic dispersion effect is maintained at 100% and heat Adhesion can be increased significantly. As the mesh or lattice form, a mesh form having a width of 0.01 to 5 mm, a height of 0.1 to 5 μm, and a hole width of 0.1 to 5 mm is preferable, and may be formed in various forms of mesh or lattice such as lattice, square, rhombus, and sphere. . When the mesh or lattice shape is out of the range, the adhesion may decrease as the surface resistance is improved and the surface resistance may be increased as the adhesion is improved.

Figure 3 shows a cross-sectional view of the film for electrostatic dispersion electronic component packaging bags according to another embodiment of the present invention. The film consists of a polyester film outer layer 210, an electrostatic dispersion coating layer 230 and an internal antistatic polyethylene film inner layer 240 formed on the outer layer 210. The film is coated with a gravure coating method of the electrostatic dispersion coating solution of the present invention on a polyester film in a polyester film 210 and the internal antistatic polyethylene film (240, surface resistance 10 ⁹ Ω / cm ² ) laminated film It was prepared by thermal curing for 2 minutes at 80 ~ 100 ℃. The surface resistance of the polyester film coated with the electrostatic dispersion coating solution was 10 ⁵ Ω / cm ² , the surface contact angle (Phoneix 300) was 95 degrees. An internal component antistatic polyethylene film, which is an inner skin surface of the electrostatic dispersion film coated with the coating solution, may be thermally bonded to each other at 160 ° C. to manufacture an electronic component packaging bag.

The present invention will be described in more detail with reference to the following Examples. However, the following examples are only preferred examples of the present invention, and the present invention is not limited to the following examples.

<Example 1>

30% by weight of poly (3,4-ethylenedioxythiophene) (Baytron PH, HC Starck, Germany) as a 1% water-soluble polymer dispersion, 15% by weight of acrylic-urethane copolymer binder (Stahl Asia Pte Ltd., WF-4644), water 11% by weight, Isopropyl alcohol 30% by weight, 10% by weight organic solvent (NMP and DMSO 1: 4 mixed solvent), 1% by weight perfluorinated-urethane copolymer (BPI Co, Bondthane UD-50) And 3 wt% of a thermal adhesive functional resin (Vixxol Co., TKW-1080) to prepare a conductive coating solution.

The coating solution is coated on the inner surface of the base plastic (the outer film is a polyester film and the inner film is a polyethylene film) by a gravure coating method, and the outer surface is coated with a conductive coating solution except for heat adhesive functional resin in the coating solution. It thermosetted at -100 degreeC for 2 minutes.

<Examples 2-3 and Comparative Example 1>

It carried out similarly to Example 1 except the ratio of the antifouling | moisture-proof moisture additive and the heat-adhesive functional additive.

The physical property test results of the films prepared in Examples 1 to 3 and Comparative Example 1 are shown in Table 1.

Example 1 Example 2 Example 3 Comparative Example 1 Antifouling, moisture proof, heat adhesion functional additives ratio 1 wt% 2 wt% 3 wt% 0% Surface resistance 2 x 10 ⁵ mm / cm ² 3 x 10 ⁵ mm / cm ² 4 x 10 ⁵ mm / cm ² 2 x 10 ⁵ mm / cm ² Surface contact angle 75 degrees 95 degrees 115 degrees 60 degrees Adhesion 40 45 50 10 Condition 1. Surface resistance was measured by ASTM D257 method. 2. Surface contact angle was measured using a Phoneix 300 (SEO Co.) measuring device. 3. The adhesion is the result of the thermal adhesion of the inner polyethylene. (Based on 100 Thermal Adhesion of Uncoated Polyethylene)

<Examples 4 to 5 and Comparative Examples 2 to 3>

Using the conductive coating solution prepared in Example 1 partially coated on the endothelial surface (polyethylene) of the base plastic in the form of a mash in the form of a mash and heat-cured at 80 to 100 ℃ for 2 minutes to give a coating layer having a mash-shaped structure Formed. The outer surface (polyester) was completely coated with the conductive coating liquid except for the thermal adhesive functional resin from the conductive coating liquid and thermally cured at 80 to 100 ° C. for 2 minutes.

The films of Examples 4 to 6 and Comparative Example 2 were prepared by varying the mash form as described in Table 2 below. Table 2 shows the physical properties of the polyethylene endothelial surface of the films prepared according to Examples 4 to 5 and Comparative Examples 2 to 3.

Example 4 Example 5 Comparative Example 2 Comparative Example 3 Spacing of hole width (width of 0.5mm, fixed 1μm in height) 3 mm 5 mm 10 mm 0 mm Surface resistance 8 x 10 ⁵ mm / cm ² 3x10 ⁶ mm / cm ² 2 x 10 ⁷ cm / cm ² 3 x 10 ⁵ mm / cm ² Surface contact angle 91 degrees 85 degrees 71 degrees 95 degrees Adhesion 91 93 95 50 Condition 1. Surface resistance was measured by ASTM D257 method. 2. Surface contact angle was measured using a Phoneix 300 (SEO Co.) measuring device. 3. The adhesion is the result of the thermal adhesion of the inner polyethylene. (Based on 100 Thermal Adhesion of Uncoated Polyethylene)

The present invention is designed to compensate for the weakness of the electrostatic dispersion functional packaging bags using the existing conductive polymer coating composition, but the lack of antifouling and moisture-proof functionality, but also the adhesive strength due to heat during bag production. As the electrostatic dispersion coating composition according to the present invention is coated on one or both sides of the base plastic film, or by partially coating the inner surface in a mesh or lattice form, the film for electrostatic dispersion electronic component packaging bags of the present invention is an outer surface. In addition to the anti-fouling and moisture-proof functionality and excellent heat adhesion at the same time, and because of the use of the existing metal film can be economical and environmentally friendly.

Claims (7)

1 to 10% by weight of conductive polymer, 5 to 30% by weight of acrylic-urethane copolymer binder, 30 to 80% by weight of water or organic solvent or mixed solvent thereof, and 0.1 to 10% of antifouling and moisture proof additives on at least one surface of a single layer or multilayer base plastic film A film for electrostatic dispersion electronic component packaging bags, characterized in that a coating composition for electrostatic dispersion comprising 5% by weight and 0.5 to 5% by weight of a heat-adhesive functional resin is coated. The film for electrostatic dispersion electronic component packaging bags according to claim 1, wherein the electrostatic dispersion coating composition is completely coated on the outer surface of the film, and the inner surface is partially coated in a mesh or lattice form. 3. The film for electrostatic dispersion electronic component packaging bags according to claim 2, wherein the mesh or lattice form has a width of 0.1 to 5 mm, a height of 0.1 to 5 m, and a hole width of 0.1 to 5 mm. The method of claim 1, wherein the conductive polymer is selected from polyaniline, polypyrrole, polythiophene, poly (3,4-ethylenethiophene) or derivatives or copolymers thereof and π-conjugated electrically conductive polymers. Film for packaging bags of electrostatic dispersion electronic components. The perfluorinated-urethane copolymer according to claim 1, wherein the antifouling and moisture-proof additive is a perfluoro group [CF ₃ (CF ₂ ) n functional functional group] in the fluorine-urethane copolymer polymer having n of 1 to 20 and an average molecular weight of 1,000 to 10,000. Film for electrostatic dispersion electronic component packaging bag, characterized in that the polymer. The method of claim 1, wherein the thermal adhesive functional resin is selected from poly (vinylpyrrolidone), poly (oxyethylene), poly (vinyl alcohol), acrylic acid, poly (ethylene acrylic acid), poly (ethylene vinyl copolymer) Film for electrostatic dispersion electronic component packaging bag, characterized in that one or two or more kinds. An electrostatic dispersion electronic component packaging bag, which is produced by thermally bonding a film according to any one of claims 1 to 6.

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