KR101050389B1 - Antifouling-antimoist film for packing bag of electronic products and the antifouling-antimoist packing bag for electronic products, produced by the same - Google Patents

Abstract

The present invention relates to an antifouling anti-moisture bag for packaging electronic products having excellent antifouling moisture-proof functionality and product packaging stability, comprising: a multilayer base film of two or more layers comprising a metal fully deposited polyester film layer; An antifouling moisture-proof coating layer formed on at least one surface of the base film; And an antifouling moisture-proof film for an electronic component packaging bag, wherein a foam foam layer is formed on the other surface of the base film. The antifouling moisture-proof bag for packaging electronic products according to the present invention attaches foam foam to the antifouling-moisture-proof layer of the outer skin and the inner skin, so that not only the shielding function from contamination and moisture, There is an advantage.

Description

Antifouling-moisture-proof film for packaging electronic components, and antifouling-moisture-proof bag for packaging electronic components using the same {antifouling-antimoist film for packing bag of electronic products and the antifouling-antimoist packing bag for electronic products, produced by the same}

The present invention relates to a film for packaging an electronic component and an envelope for packaging an electronic component using the same, and an antifouling / moisture-proof film for an electronic component packaging bag having a function of packaging stability and scratch protection for an electronic product as well as an antifouling and moisture proof function. It relates to an antifouling moisture-proof bag for packaging an electronic component using the same.

The present invention uses the coating composition having antifouling-moisture-proof functionality, and for packaging electronic products using foamed foams (non-crosslinking, chemical crosslinking, electron beam crosslinking PE, PP, etc.) to protect high-gloss injection products of electronic products (TV, monitor, etc.). Relates to an antifouling moisture-proof bag.

Envelopes for packaging electronic components or semiconductor components need anti-fouling functions to prevent contamination from fingerprints and foreign substances, as well as moisture-proof functions to protect them from moisture, as well as packaging stability of products. That is, the antifouling and moisture proof function means a function of preventing the penetration of water, oil or other contaminants into the interior.

BACKGROUND ART Conventionally known electronic packaging bags are generally manufactured by using polyethylene plastic film and uncrosslinked foamed polyethylene foam to manufacture electronic packaging bags. In the case of the bag using the polyethylene plastic film and the non-crosslinked foamed polyethylene foam, electronic products (TVs, monitors, etc.) have recently become slimmer and highly sensitive to external factors such as moisture during the transportation process. It is not suitable as a packaging bag for electronics as it does not have the effect of protecting against external factors.

In order to secure these shortcomings, recently, metal materials such as aluminum are deposited on plastic films such as polyethylene terephthalate, polyester, and nylon, or aluminum foil is used. Or the production of antifouling moisture-proof bag using a film formed of one or more multiple layers has been tried.

In particular, aluminum deposition film and aluminum foil (Foil) has the advantage of high moisture permeability has been widely used as a material of the antifouling moisture-proof bag for packaging of electronic products, electronic components, semiconductor components and the like.

However, these materials also have not yet solved the disadvantages of poor moisture shielding performance, and furthermore, when manufactured as a bag, the packaging stability of the electronic product is significantly reduced, which is not suitable for the function of the bag.

The present invention has been made to solve the above problems, an object of the present invention is to provide an electronic component packaging bag film having a packaging stability (impact), scratch protection and antifouling and moisture-proof function of electronic products at the same time.

Another object of the present invention is to provide an electronic component packaging bag having packaging stability (impact), scratch protection, and antifouling and moistureproof functions of electronic products.

The present invention to achieve the above object

A two or more multilayer base films comprising a metal fully deposited polyester film layer;

An antifouling moisture-proof coating layer formed on at least one surface of the base film; And

It provides an antifouling moisture-proof film for electronic component packaging bags, characterized in that the foam is formed on the other side of the base film.

The metal may be aluminum, nickel, titanium, copper, chromium or zinc, preferably aluminum is used.

The base film may be a polyolefin film or a nylon film, or a multilayer film of two or more layers in which the polyolefin film and the nylon film are further laminated.

The antifouling-moisture-proof coating layer is 5-30% by weight of a thermosetting binder, 50-90% by weight of water or an organic solvent or a mixed solvent thereof, 0.1-5% by weight of an antifouling / moisture-proof additive, and an additive (slip, wetting, etc.) 0.5∼ It can be obtained by coating and curing the antifouling moisture-proof coating composition comprising 5% by weight to the base film.

The foam may be a polyolefin foam (PE (Polyethylene), PP (Polypropylene), etc.), PU (Poly Urethane), EVA (Ethylene Vinyl Acetate), etc., which are manufactured by non-crosslinking, electron crosslinking, and chemical crosslinking.

The present invention also provides an electronic component packaging bag manufactured using the film for electronic component packaging bag.

The electronic component packaging bag according to the present invention has a moisture shielding function that can replace the metal foil, that is, the aluminum foil, which may be environmentally contaminated, and even though the aluminum deposition film is used, the aluminum foil corresponds to the use. Moisture shielding function is shown. In addition, the inner surface of the foam can be used to provide an envelope for packaging electronic components with excellent impact stability and scratch protection that can occur when packaging electronic products. It becomes possible.

In other words, the envelope for packaging an electronic component according to the present invention is excellent in impact stability and scratch protection performance, has excellent water shielding ability, is an environmentally friendly envelope, and does not require additional equipment in an existing facility, and thus has an economical and environmentally friendly advantage. Can be.

The present invention is described in more detail below.

The present invention provides a bilayer or more multilayer base film comprising a metal fully deposited polyester film layer; An antifouling moisture-proof coating layer formed on at least one surface of the base film; And it provides an antifouling moisture-proof film for packaging packaging electronic components, characterized in that the foam layer is formed on the other side of the base film. Conventionally, as a base film, a film in which aluminum foil and polyethylene film are laminated is used for moisture-proof function, but in this case, problems of cost increase and environmental pollution due to use of aluminum foil and impact of packaging of electronic products by inner polyethylene film There was a disadvantage that the scratch protection is reduced. However, in the case of the present invention by using a metal deposition film instead of a metal foil, it is possible to reduce the cost than using a metal foil, and to prevent environmental pollution.

In addition, by including an antifouling and desiccant layer, it can exhibit additional functions such as secondary pollution reduction and moisture shielding by pollution.

That is, according to an embodiment of the present invention, the antifouling-moisture-proof coating layer is a coating solution formed of an antifouling / moisture-proof additive and binder in the form of a fluorine-urethane copolymer polymer in various coating methods (roll, gravure, microgravure, comma, spray, slot). Die) and the like may be formed by coating on one surface, preferably an outer surface of the base film, and then thermally drying (50 to 150 ° C.). As a result, the film for packaging an electronic component according to the present invention may exhibit antifouling and anti-moisture capability.

In addition, according to an embodiment of the present invention, the polyolefin foam [PE (Polyethylene), PP (Polypropylene), etc.], PU (Poly Urethane), which is prepared by cross-linking, chemical cross-linking, electron beam cross-linking on the other surface of the base film, that is, the inner surface ) Is a bag manufacturing method formed by laminating foam material layers such as EVA (Ethylene Vinyl Acetate), by heat melting, adhesive, and extrusion lamination. As a result, a function of reinforcing physical (brokenness, repeated buffering) fragility is added to the inner surface to prevent damage to electronic parts by reinforcing shock buffering properties, and even if manufactured as an electronic part packaging bag, Unlike the polyethylene film, the thermal adhesive force is maintained to maintain the electronic component packaging bag function.

According to an embodiment of the present invention, the base film is a double layer of LDPE (polyolefin film) / PET-AL by completely depositing a metal (PET-Al) on a polyester film and then laminating with a polyolefin film (LDPE) Or a polyolefin film and a nylon film may be laminated to be a triple layer multilayer film of LDPE / PET-AL / nylon.

The antifouling-moisture-proof coating layer is 5 to 30% by weight of a thermosetting binder, 60 to 90% by weight of water or an organic solvent or a mixed solvent thereof, 0.1 to 5% by weight of an antifouling and moistureproof additive and 0.5 to 5 additives (slip, wetting, etc.) It can be obtained by coating and curing the base film with an antifouling-moisture-proof coating composition comprising a weight%.

The antifouling and moisture proof additive is a perfluorourethane copolymer prepared by polymerizing a perfluorinated alkyl alcohol and a functional isocyanate comonomer in the form of a fluorine-urethane copolymer polymer by a urethane reaction of a hydroxyl group and an isocyanate group by a free radical polymerization reaction. And fluorine compositions comprising a compound or oligomer having at least one fluorine-containing end group and a polymer that is a continuous unit thereof. In a fluorine-urethane copolymer polymer, it is preferable that n is 1-20 and an average molecular weight is 1,000-10,000 in a perfluorine group [CF3 (CF2) n functional functional group]. The surface contact angle of the film coated with the electrostatic dispersion coating composition including the antifouling and moistureproof additive is 80 to 130 degrees, and the surface resistance is 103 to 109 Ω / sq.

The metal used for the base film of the present invention, for example, a polyester film completely deposited with aluminum, may be a film in which aluminum is completely deposited and a semi-deposited film on a polyethylene terephthalate (PET) film, which is a polyester film. Preferably, a film in which metal, for example aluminum, is completely deposited in order to maximize moisture shielding efficiency is preferable.

Examples of the organic solvent include polar organic solvents such as dimethyl sulfoxide (DMSO), dimethylformamide (DMF), N-methyl-2-pyrrolidone (NMP), 2-butanone and 4-methyl-2-pentanone; Alcohol, such as methyl alcohol, ethyl alcohol, isopropyl alcohol, isobutyl alcohol, t-butyl alcohol, benzyl alcohol, ethylene glycol, etc. can be illustrated, Preferably DMSO, NMP, methyl alcohol, ethyl alcohol, isopropyl alcohol Etc. are used. These organic solvents can be used individually or in mixture of 2 or more types.

As the binder, a thermosetting resin of urethane, acryl, urethane acryl, epoxy, amide, or ester type may be used.

Polyolefin films include high density polyethylene films [HDPE (high-density polyethylene)], low density polyethylene films [LDPE], linear low density polyethylene films [LLDPE] of 5 to 50 micrometers, Polypropylene, EVA film and the like can be used.

As the nylon film, polyamide-based nylon 6, 66, 610, 612, 46, 11, 12, 3, and the like may be used.

Foam foams include 0.1 ~ 2.0mm non-crosslinked, chemical crosslinked, polyolefin foam made by electron beam crosslinking (PE, PP, EVA foam), PP foam made by electron beam crosslinking, EVA foam made by pressure crosslinking And the like can be used.

Hereinafter, referring to FIG. 1, an antifouling moisture-proof film for packaging an electronic component according to an embodiment of the present invention will be described. According to FIG. 1, a base film in which a linear low density polyolefin film 20 is laminated on one surface of a polyester film 10 on which aluminum is completely deposited to form a double layer, and the polyester film of the base film 10/20. An antifouling-moisture-proof coating layer 30a to which an antifouling-moisture-preventing agent is added is formed at 10, and a polyolefin foam foam layer 30b is formed on the polyolefin film 20. The base film may be composed of a triple layer in which a nylon film is further laminated on an upper surface of the polyester film. The polyolefin foam foam layer may be heat bonded to an inner surface thereof, and then used as a bag.

The present invention will be described in more detail with reference to the following Examples. However, the following examples are only preferred embodiments of the present invention, and the present invention is not limited to the following examples.

Example  One

10% by weight of acrylic-urethane copolymer binder (Stahl Asia Pte Ltd., WF-4644), 20% by weight of water, 68% by weight of isopropyl alcohol, perfluorinated-urethane copolymer (BPI Co, Bondthane) 1.5 An antifouling-moisture-proof coating liquid was prepared using the wt% and 0.5 wt% of the wetting agent (BYK series).

Polyethylene terephthalate (PET) film surface (outer surface) of the antifouling-moisture-proof coating liquid on a double layer film formed of aluminum fully deposited (600 Å) polyethylene terephthalate (PET, 12 um) film / low density polyethylene film (LDPE, 20 um) Coated with a gravure coating method, and thermally cured at 80 to 100 ° C. for 2 minutes to form an antifouling layer, and to form an uncrosslinked polyethylene foam foam (0.5 mm) layer on the polyethylene film (LDPE) surface (inner surface). A moisture proof film was prepared.

The non-crosslinked polyethylene foam foam layer (inner surface) of the antifouling-moisture-proof film prepared above was heat-bonded to prepare an electronic part packaging moisture shielding bag.

Example  2 to 3

It carried out similarly to Example 1 except having carried out the antifouling | moisture-proof-moisture-additive ratio as described in Table 1.

Example  4 to 5

Example 1 except that the foam foam (0.5 mm) layer adhering to the polyethylene film (LDPE) surface (inner surface) was formed with a chemically crosslinked polypropylene foam foam (Example 4) and an electron beam crosslinked polyethylene foam foam layer. It carried out similarly.

Example  6

The antifouling and moisture proof prepared in Example 1 on a triple layer film formed of nylon film (15 um) / aluminum fully deposited polyethylene terephthalate (PET, 12 um) film / low density polyethylene film (LDPE, 41 um) The coating solution is coated on the nylon film surface (outer surface) by a gravure coating method, and thermally cured at 80 to 100 ° C. for 2 minutes to form an antifouling and moistureproof layer, and the crosslinked polyethylene foam foam (0.5) on the polyethylene film (LDPE) surface (inner surface). mm) layer was formed to prepare an antifouling moisture-proof film.

The non-crosslinked polyethylene foam foam layer (inner surface) of the antifouling-moisture-proof film prepared above was heat-bonded to prepare an electronic part packaging moisture shielding bag.

Comparative example  One

A bilayer film formed of a polyethylene terephthalate (PET, 12 um) film / low density polyethylene film (LDPE, 56 um) completely aluminum deposited (600 mm 3) was prepared.

A polyethylene film (LDPE) surface (inner surface) was heat-bonded from the film for moisture-sealing bags manufactured above to prepare an electronic part packaging bag.

Comparative example  2

A crosslinked polyethylene foam foam (0.5 mm) layer was formed on the polyethylene film (LDPE) side (inner surface) of the bilayer film prepared in Comparative Example 1 to prepare a film for moisture shielding bags.

The non-crosslinked polyethylene foam foam layer (inner surface) of the film for moisture shielding bag prepared above was heat-bonded to prepare an electronic part packaging moisture shielding bag.

Comparative example  3

Moisture shielding for electronic component packaging bags by forming a multilayer film formed of a nylon film (15 um) / aluminum foil (7 um) film / low density polyethylene film (LDPE, 46 um) / crosslinked polyethylene foam foam (0.5 mm) A film was prepared.

In the moisture-shielding film prepared above, an uncrosslinked polyethylene foam foam (inner surface) was thermally bonded to prepare an envelope for packaging an electronic component.

Table 1 shows the physical property test results of the films and bags prepared in Examples 1 to 6 and Comparative Examples 1 to 3.

practice
Example 1 practice
Example 2 practice
Example 3 practice
Example 4 practice
Example 5 practice
Example 6 compare
Example 1 compare
Example 2 compare
Example 3 Antifouling
Additive ratio 1 wt% 2 wt% 3 wt% 1 wt% 1 wt% 1 wt% 0% 0% 0% Water shielding ability
(g / m ² day or less) 0.4 0.3 0.25 0.4 0.4 0.2 5 4 0.6 Surface contact angle 105 110 118 105 105 105 85 85 84 Inner adhesion 0 0 0 0 0 0 △ 0 0 Impact stability 0 0 0 0 0 0 x 0 0 Measuring conditions 1. Surface contact angle: measured using a Phoneix 300 (SEO Co.) measuring device.
2. Moisture shielding capacity: manufacturer-MOCON (USA), model name: PERMATRAN-W TWIN, related test standards: KSM 3088: 2004, temperature: 38 ± 2 degrees: 100% was measured. Relative comparison value after 240 hours (50 degrees / 80%)
3. Impact stability: Put the plastic material in the bags prepared in Examples and Comparative Examples, seal and drop it at a constant height (2m) to check the surface condition (determination of scratchability of the surface state, no scratch: 0, present: x)
4. Adhesion of inner surface: After heat adhesion, apply strength of 20kg around adhesive part to the extent that adhesive part falls (unless falling: 0, middle: △, falling: x)

As can be seen from the results of Table 1, comparing Comparative Examples 1 and 2, it can be seen that the aluminum deposition film is less water-shielding ability than using the aluminum foil. On the other hand, when the antifouling-moisture-addition agent is added according to the present invention, it can be seen that the moisture shielding ability is increased to correspond with that of using aluminum foil. Therefore, it can be seen that the antifouling moisture-proof film of the present invention is environmentally friendly. In addition, as can be seen from Comparative Example 1, when the film using the polyolefin foam foam on the inner surface, it can be seen that the thermal adhesive strength is remarkably excellent when produced in the bag by thermal bonding, it was also excellent in impact stability.

1 is a cross-sectional view of a film for packaging moisture shield bags for electronic components according to an embodiment of the present invention.

10: polyester film in which aluminum is completely deposited

20: low density polyethylene film

30a: antifouling-moisture-proof coating layer with antifouling-moisture-proof additive added

30b: polyolefin foam layer

Claims (9)

A two to three layer base film comprising a metal fully deposited polyester film layer; An antifouling moisture-proof coating layer formed on at least one surface of the base film; And Foam foam layer is formed on the other side of the base film, The metal is aluminum, As the foamed foam, a polyolefin foam (PE, PP, EVA foam) manufactured by 0.1-2.0 mm of no crosslinking, chemical crosslinking, and electron beam crosslinking, PP foam, PU foam, and pressure crosslinking prepared by electron beam crosslinking Anti-fouling film for electronic component packaging bags, characterized in that at least one member selected from the group consisting of EVA foam. delete The method of claim 1, The base film is a polyolefin film or a nylon film, or an antifouling-moisture-proof film for an electronic component packaging bag, characterized in that the film of a two to triple layer in which the polyolefin film and the nylon film are further laminated. The method of claim 1, 5 to 30% by weight of the antifouling-moisture-proof coating layer thermosetting binder, 60 to 90% by weight of water or an organic solvent or a mixed solvent thereof, 0.1 to 5% by weight of antifouling and moisture proof additives and additives (slip or wetting, or mixtures thereof) ) Antifouling-moisture-proof film for packaging bags for electronic components, characterized in that consisting of an antifouling-moisture-proof coating composition containing 0.5 to 5% by weight. delete 5. The method of claim 4, The antifouling / moistureproof film for an electronic component packaging bag, wherein the antifouling / moisture-proof additive is a perfluorine-urethane copolymer. The method of claim 6, The perfluorinated urethane copolymer is a perfluorinated group [CF3 (CF2) n functional functional group] n is an antifouling for packaging packaging electronic components, characterized in that the perfluorinated-urethane copolymer polymer 1 to 20, the average molecular weight of 1,000 to 10,000 -Moisture proof film. The method of claim 1, The base film is a double layer of polyolefin film / aluminum deposited polyester film, or a triple layer of polyolefin film / aluminum deposited polyester film / nylon. In the antifouling moisture-proof bag for packaging electronic components, The anti-fouling film for packaging electronic components, characterized in that the bag is made of the antifouling-moisture-proof film of any one of claims 1, 3, 4, and 6 to 8, and made of the foamed foam layer as an inner surface. -Moisture proof envelope.

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