KR20130139159A - Multilayer film for packaging electronic part and electronic part bag - Google Patents

Abstract

Disclosed is a multilayer film for packaging electronic parts and an electronic part bag. The multilayer film for packaging electronic parts and bag for electronic parts according to the present invention comprise a three-layer base film having an outer layer, center layer and inner layer, and the three layers have a width of 50~250μm and are composed of polyolefine films. The present invention has an excellent moisture barrier property, gas permeability, strength property, shrinkage property and heat-adhesive property. In addition, the present invention is appropriate for packaging electronic parts, is environment-friendly, has high recyclability and contains a surface with an antistatic agent. The polyolefine film and packaging bag disclosed by the present invention effectively protect objects inside while transporting or packaging electronic elements, display panel, complete product, semiconductor chip, PCB, cartridge for secondary batteries, and solar batteries since static electricity and corona discharge during arc discharge are prevented.

Description

MULTILAYER FILM FOR PACKAGING ELECTRONIC PART AND ELECTRONIC PART BAG}

The present invention relates to a multilayer film and a bag for packaging electronic components used for protecting various electronic components, display liquid crystal, electronic products, semiconductor chips, printed circuit boards, secondary battery process cartridges, solar cells, etc. Preferably, the base layer is made of Uni-Material, which is friendly and recyclable, and has a multi-layered structure having a surface layer containing an antistic agent. The present invention relates to a multilayer film and a bag for packaging an electronic component that effectively protects internal objects while preventing the generation of static electricity and preventing corona from being opened during arc discharge.

Recently, aluminum deposition bags and packaging bags deposited using heterogeneous materials are widely used as packaging bags for electronic devices, display liquid crystals, finished products, semiconductor chips, PCBs, secondary battery processes, cartridges, and solar cells. It is required to package and handle the product for the purpose of preventing scratches of the product, improving sealing properties, 10 ppm or less of metal ionicity, and preventing foreign material transfer.

Conventionally known packaging films and bags are products in which aluminum foil (Al) and polymer films (LDPE, LLDPE, NYLON, PET, etc.) are laminated (aluminum pouch, AL-Bag). Is inserted and laminated composite film, which is used because of excellent oxygen and moisture blocking property and vacuum sealing property, but when it is produced as a bag due to the sharpness of metal when the composite film is folded, the stability of packaging of electronic parts is produced. There was a problem that is significantly reduced to easily cause damage to the internal object.

In addition, a polyethylene plastic film and a non-crosslinked foamed polyethylene foam are laminated to manufacture an electronics packaging bag. In the case of the polyethylene (Polyethylene) plastic film and the non-crosslinked foam polyethylene foam as the recent electronic products (TV, monitors, etc.) are highly integrated slimmer and very sensitive to external factors such as moisture during the transport process, Since there is no effect that can protect from external factors, there was a problem that is not appropriate as an envelope for packaging electronics.

In addition, the metal or inorganic oxide metal is deposited on the polymer (Nylon, LLDPE) and PET with completely different properties, and it is used for lamination.The cost of the packaging material is expensive, it cannot be recycled, and the charging coating is unstable because it needs to be charged separately after completion. In addition, there is a problem in the product or the finished product packaged with an abnormality of the coating agent, and also the problem of VOC due to the residual of the organic solvent during lamination, the environmental problem has emerged.

Korean Patent Publication No. 10-1050389, p. 3, Claim 1, Drawing 1

The present invention was created to solve the problems of the prior art as described above, and an object of the present invention is to provide a multi-layer film and bag for packaging a non-materialized electronic component excellent in environmental friendliness and recyclability.

Another object of the present invention is to provide a multilayer film and a bag for packaging an electronic component that can protect the internal object by preventing the generation of static electricity and preventing the corona from being opened during the arc discharge while effectively protecting the internal object according to moisture permeation.

The multilayer film and bag for packaging electronic components according to a preferred embodiment of the present invention for achieving the above object is a multilayer film for packaging electronic components consisting of a three-layer base film by sequentially stacking the outer layer, the center layer and the inner surface layer. In one embodiment, the outer layer, the center layer, and the inner layer each have a thickness of 50 to 250 μm, and at least one layer is a multilayer film for packaging electronic components, characterized in that a polyolefin (polyolefine) film.

As a preferable feature of the present invention, the outer layer is a polyolefin resin as a base resin, a conductive polymer and an antistatic agent are used, and an intrinsic dispassive polymer (IDP) and derivatives, copolymers and surfactants thereof. It is characterized by being formed by forming any one or more than one.

As another preferred feature of the present invention, the center layer is a polyolefin resin as a base resin, characterized in that composed of low density polyethylene (LDPE: Low Density PolyEthylene) or high density polyethylene (HDPE) resin.

As another preferable feature of the present invention, the high density polyethylene resin is extruded to have a thickness ratio of 50% to 90%, and the outer layer and the inner layer are configured to mix the linear low density polyethylene resin with the permanent antistatic polymer so that the inner and outer layers have the same ratio. It is characterized by.

The multilayer film and bag for packaging an electronic component according to the present invention are composed of an outer layer, a center layer, and an inner layer, and are subjected to melt kneading with resins of the outer layer, the center layer, and the inner layer on the basis of a polyolefin resin. It is produced by extrusion by T-Die Extrusion molding method. The outer and inner layers are made of an electronic device packaging film containing a permanent antistatic polymer for performance, and the packaging bag is completed through a sealing process according to the size of the inner object.

Eco-friendly and recyclable polyolefin film and packaging by unifying the packaging film and bag for protecting electronic devices, display liquid crystal, finished product, semiconductor chip, PCB, secondary battery process, cartridge, solar cell, etc. through the present invention My bag contains a permanent antistatic polymer? By using an electronic device packaging bag having a multi-layer structure, which includes an outer layer, etc., it is possible to effectively protect the internal objects caused by moisture permeation while suppressing the generation of static electricity and preventing the corona from opening during arc discharge, thereby enabling an excellent effect of protecting the internal objects safely. It became.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

1 is a schematic diagram for explaining the layer structure of a multilayer film and a bag for packaging electronic components according to the present invention.

Hereinafter, a multilayer film and a bag for packaging an electronic component according to the present invention will be described with reference to the accompanying drawings. first,

It should be noted that like elements or parts in the figures are denoted by the same reference numerals as much as possible. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1 is a schematic diagram illustrating the layer structure of a multilayer film and a bag for packaging an electronic component according to the present invention, and comprises an inner and outer layers including a permanent antistatic polymer and a central layer provided with a polyolefin film.

The outer layer 10, the center layer 20, and the inner layer 30 of the multilayer film for packaging electronic components and the bag according to the present invention have a thickness of 50 to 250 μm, and at least one layer is made of a polyolefine film. The polyolefin is a polymer compound produced by the polymerization of a chain hydrocarbon compound having one double bond and belongs to the lightest plastic. The polyolefin is excellent in transparency, and examples thereof include polyethylene and polypropylene.

The outer layer 10 is applied to reduce and suppress the generation of static electricity in the present invention, and when provided in the form of a bag to form an outer layer surface exposed to the outside.

The outer layer 10 uses a polyolefin resin as a base resin, and a conductive polymer and an antistatic agent, for example, a permanent antistatic polymer and derivatives or copolymers thereof.

On the other hand, the outer layer 10 in the present invention may sometimes be used together with the conductive polymer and the permanent antistatic polymer. When the conductive polymer is used, the surface resistance is 10 ¹⁰ Ω, thereby improving the problem caused by static electricity.

In addition, the outer layer 10 of the present invention is a polyolefin resin as a base resin, a conductive polymer and an antistatic agent are used, and any one or one of an Intrinsic dispassive polymer (IDP) and derivatives or copolymers thereof The conductive polymer is an electrically conductive plastic, while maintaining the advantages of light and easy processing, which is an inherent property of the polymer, and examples thereof include polyacetylene, polyaniline, and polypyrrole. . The permanent antistatic polymer is an additive containing an antistatic material composed of a metal salt. When surface grounding occurs, ions existing in the three-dimensional mesh may autonomously move to the surface to suppress the generation of static electricity.

Accordingly, the thicker the outer layer 10 is, the better the thickness is, but in consideration of economics, 5 to 25% of the total film ratio has sufficient performance.

The center layer 20 may be made of polyolefin resin as a basic resin, and low density polyethylene or high density polyethylene resin may be used.

The thickness of the center layer 20 is composed of 50 to 90% of the total film ratio in the present invention to enable economical manufacturing without causing performance degradation.

The center layer 20 extrudes a high-density polyethylene resin to a thickness ratio of 50 to 90%, and the outer layer 10 and the inner layer 30 form a linear low-density polyethylene resin with a permanent antistatic polymer (mass ratio of 10 to 20%). And the inner and outer layers are mixed in the same ratio.

Linear low density polyethylene is similar to the molecular structure of high density polyethylene and has a relatively high melt viscosity when heated and its crystallinity is better than that of low density polyethylene. Therefore, it is used in packaging materials, industrial and agricultural films.

The core layer 20 is made of polyolefin resin as a base resin, and is composed of low density polyethylene (LDPE: Low Density PolyEthylene) or high density polyethylene (HDPE: High Density PolyEthylene) resin. 0.94) Polyethylene, which is a transparent solid at room temperature, has low crystallization, and is excellent in processability, flexibility, and transparency, and is used as a raw material for agricultural and packaging transparent films, wire coating, and various wraps.

High-density polyethylene is a highly crystalline (density 0.94 or more) polyethylene, a semi-transparent solid, excellent in strength but poor in flexibility and processability, and is mainly used for films, pipes, various containers, injection molding, and blow molding.

On the other hand, the center layer 20 in the present invention can be prepared by adding a colorant according to the properties of the package object, in which the colorant may be carried out by a known technique, in the present invention is a low-cost colorant in general For the purpose of separating carbon blacks or products, a masterbatch containing various colorants such as cyan and magenta and colorants may be used.

In addition, the colorant may be both a dye and a pigment, but if a pigment is used, after mixing with a resin, an appropriate dispersant may be introduced for dispersing, and stirring may be performed for at least 60 minutes using a dispersion device such as a ball mill, a sand mill, or a dynomill. shall.

In addition, the colorant may be used 0.01 to 1 parts by weight with respect to 100 parts by weight of the resin, if the content of the colorant is less than 0.01 parts by weight it is difficult to obtain a sufficient coloring effect, when more than 1 part by weight is economical lowered is preferred Not. In addition, when the particle size is too large, such a colorant hinders the film formation, so that the particle size is preferably as small as possible, and it is more preferable to use a colorant having a particle size of 100 nm or less.

The inner layer 30 uses a polyolefin resin and suggests a thickness of 5 to 25% of the total film ratio as a part to be a sealing to be a packaging bag.

The inner layer 30 may be formed by using polyolefin resin as a base resin, and by forming any one or one or more of a conductive polymer, a permanent antistatic polymer, and derivatives or copolymers thereof.

Hereinafter, a multilayer film and a bag for packaging an electronic component according to an embodiment of the present invention will be described.

(Example 1)

 The outer layer 10, the center layer 20, and the inner layer 30 are coextruded to produce a triple layer multilayer film. At this time, the outer layer 10 and the inner layer 30 is a mixture of linear low-density polyethylene, a permanent antistatic agent is extruded to a thickness of 10㎛ each. The center layer 20 is extruded to a high density polyethylene to a thickness of 80㎛.

At this time, a carbon black masterbatch is used as a coloring agent and 0.5 weight part is used with respect to 100 weight part of said center layer resins.

(Example 2)

 The outer layer 10, the center layer 20, and the inner layer 30 are coextruded to produce a triple layer multilayer film. At this time, the outer layer 10 and the inner layer 30 is a mixture of linear low-density polyethylene, a permanent antistatic agent is extruded to a thickness of 20㎛ each. The permanent antistatic agent uses 10 parts by weight based on 100 parts by weight of the resin. The center layer 20 is extruded to a high density polyethylene to a thickness of 60㎛.

At this time, magenta is used as a coloring agent. The colorant uses 0.5 parts by weight based on 100 parts by weight of the center layer resin.

(Example 3)

The outer layer 10, the center layer 20, and the inner layer 30 are coextruded to produce a triple layer multilayer film. At this time, the outer layer 10 and the inner layer 30 are extruded to a linear low density polyethylene so that the thickness of each 10㎛. The center layer 20 is extruded to a high density polyethylene to a thickness of 80㎛. PEDOT coating with micro gravure on the inside of the coextruded film and dried to form a coating layer of 2.5㎛ thickness.

(Comparative Example 1)

A 100 μm thick film is made of a single high density polyethylene film.

(Comparative Example 2)

Al Moisture Barrier Bag 3400, currently available (3M), is about 100 µm thick.

[Measurement of Properties]

 In Examples 1 to 3 and Comparative Examples 1 to 2, thickness, tensile strength, elongation, moisture permeability, and surface resistance were measured, and the results are shown in Table 1 below.

Metrics Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Thickness (㎛) 100 100 100 100 100 The tensile strength
(kg / cm2) MD 516 520 445 500 564 TD 415 428 366 550 645 Elongation (%) MD 680 ↑ 680 ↑ 680 ↑ 450 145 TD 975 950 897 380 94 Moisture permeability (g / ㎡.day) 0.9 0.9 0.9 3 0.03 Surface Resistance (Ω) 10 ^ 10 10 ^ 10 10 ^ 10 10 ^ 15 ↑ 10 ^ 12

* Thickness: Measured based on KS M ISO 7214.

* Tensile strength, tearing strength: measured based on ASTM D-882-83.

(Measurement conditions: Measure 9 samples in the MD / TD direction for each sample and measure 7 average values minus the maximum and minimum values.) The equipment uses QM100S-20 manufactured by Cumsys.

* Elongation: Measured based on ASTM D-882-83 Method A.

(Measurement conditions: Measure 9 samples in the MD / TD direction for each sample and measure 7 average values minus the maximum and minimum values.) The equipment uses QM100S-20 manufactured by Cumsys.

* Surface resistance: measured based on ASTM D 257. The instrument uses Agilent's Agilent-4339B.

* Water vapor permeability: measured based on ASTM F 1249. (Measurement condition: Temperature 37.8 ℃, Humidity 100%) The equipment uses MOCON PERMATRAN-W 3/33 PLUS.

As shown in Table 1, it can be seen that the multilayer film and bag for packaging an electronic component according to the present invention have sufficient strength and elongation, have good moisture permeability, low surface resistance, and excellent antistatic properties.

It is to be understood that the present invention is not limited to the disclosed embodiment and that various changes and modifications may be made without departing from the spirit and scope of the present invention as set forth in the appended claims. It is obvious to those who have knowledge. It is therefore intended that such variations and modifications fall within the scope of the appended claims.

10: outer layer
20: center layer
30: inner layer

Claims (6)

In the multilayer film for packaging electronic components consisting of a triple-layer base film by sequentially laminating the outer layer, the center layer and the inner layer,
The outer layer, the center layer and the inner layer each have a thickness of 50 ~ 250㎛, at least one layer is a multilayer film for packaging electronic components, characterized in that the polyolefin (polyolefine) film.
The method of claim 1, wherein the outer layer,
A polyolefin resin is used as the base resin, and a conductive polymer and an antistatic agent are used, and are formed by forming one or more of an intrinsic dispassive polymer (IDP) and derivatives, copolymers, and surfactants thereof. A multilayer film for packaging electronic components.
The method of claim 1, wherein the center layer
A polyolefin resin based resin, low density polyethylene (LDPE: Low Density PolyEthylene) or high density polyethylene (HDPE: High Density PolyEthylene) multilayer film for packaging electronic components, characterized in that composed of resin.
The method of claim 1, wherein the center layer,
Multi-layer packaging for electronic components, characterized in that the high-density polyethylene resin is extruded to have a thickness ratio of 50% to 90%, and the outer layer and the inner layer are mixed with the linear low density polyethylene resin with the permanent antistatic polymer so that the inner and outer layers have the same ratio. film .
The method of claim 1, wherein the inner layer,
A multilayer film for packaging electronic components, comprising polyolefin resin as a base resin, and formed by forming one or more of conductive polymers, permanent antistatic polymers, and derivatives and copolymers thereof.
An electronic part packaging bag made of a film prepared according to claim 1.

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