KR20130029934A - Multi-layer film for electronics packaging - Google Patents

Abstract

PURPOSE: An electronic product package multilayer film having low moisture permeability and high surface resistance is provided to be utilized as a packaging material to pack electronic goods such as a product weak in moisture, an LCD and a keyboard. CONSTITUTION: An electronic product package multilayer film is composed of the layers successively laminated with an HDPE(high density polyethylene) layer(30) including HDPE; a mixed resin layer(20) including propylene-ethylene random copolymer resin; and an internal layer(10) including ethylene resin selected from LDPE(low density polyethylene), linear LDPE and metallocene LDPE, and quicklime. The electronic product package multilayer film is composed of the layers successively laminated with a mixed resin layer including propylene-ethylene random copolymer resin; an HDPE layer including HDPE; and an internal layer including ethylene resin selected from LDPE, linear LDPE and metallocene LDPE, and quicklime. The internal layer includes 0.2-0.7wt% of quicklime. The quicklime has 5-20μm of the average particle diameter. The HDPE has 0.941-0.965g/cm^3of density. The propylene-ethylene random copolymer resin has 0.900~0.910g/cm^3 of density. The LDPE has 0.910-0.925g/cm^3 of density. The linear LDPE has 0.918-0.945g/cm^3 of density. The metallocene linear LDPE resin has 0.905-0.945g/cm^3 of density.

Description

MULTI-LAYER FILM FOR ELECTRONICS PACKAGING}

The present invention is aluminum foil bag or aluminum anti-deposition It is related with the film which is low moisture permeability for replacing a film, and has high surface resistance and hygroscopicity.

Conventionally, as a packaging film for protecting a product, an aluminum foil bag or an aluminum anti-deposition film is used to prevent static electricity and protect it from moisture.

As the aluminum semi-deposited film, Korean Patent Laid-Open Publication No. 10-2004-0087284 has a step of coating and drying a PE (polyethylene) resin on one surface of a PET (Polyester) film coated in a translucent state of aluminum; Heating and compressing the foam film on the surface of the coated PE resin using a heating roller at 150 to 300 ° C .; Heating and compressing the HD film on the surface of the foam film using a heating roller at 150 to 300 ° C .; Disclosed is a method for manufacturing a wrapping paper comprising coating an antistatic agent on the surface of a high density (HD) film and a surface of a PET film and drying the same at a temperature of 50 to 90 ° C.

However, in the case of using expensive aluminum as in the preceding invention, the raw material cost and the production and processing cost are large, which is not economically disadvantageous, and requires the development of a new material.

Korean Patent Publication No. 10-2004-0087284 (2004.10.13)

The present invention is to replace the conventional film using aluminum, to provide an excellent film having a water vapor transmission rate of 0.5 g / ㎡ / 24h without containing aluminum. Specifically, the moisture absorbed water inside the package gives moisture to the dehumidification effect without the use of a dehumidifying agent such as silica gel or zeolite, and the absorbed water molecules make the way for electricity to flow without additives such as antistatic agents. It is intended to provide an excellent film having excellent antistatic properties by flowing in.

The present invention is to provide a film that is used as a packaging material for packaging products that are weak to moisture, electronic products such as LCD, keyboard, and the like.

The present invention relates to a multilayer film excellent in moisture resistance, dehumidification and antistatic properties for use in product packaging.

The present inventors use a mixture of a polyolefin resin and a specific dehumidifying agent, and in the case of manufacturing a multilayer film, exhibits the same physical properties as those of a conventional aluminum bag or an aluminum semi-deposited film, and is translucent so that internal identification is possible. I can make a color The present invention has been completed.

In particular, the present invention is characterized by using quicklime (CaO) as a dehumidifying agent, it is possible to achieve excellent hygroscopicity and antistatic properties by adding to the inner layer facing the product when packaging the product.

In addition, by using the low density polyethylene or linear low density polyethylene in the polyolefin resin when manufacturing the inner layer it is possible to achieve high heat sealability, adhesive strength, low temperature sealability, breaking strength.

In addition, the present invention is characterized in the laminated structure of the multilayer film, and if any one of the layers is excluded, the physical properties of the present invention can not be achieved.

In order to use for packaging of moisture vulnerable products and electrostatic sensitive electronic products, the moisture permeability is 0.5 g / ㎡ / 24h or less, and the physical resistance of 10 ⁸ to 10 ¹² Ω / ㎠ is required. And prevents moisture permeation with the middle layer film. Such a physical property can be satisfied by laminating | stacking in the following laminated structure using a moisture-permeable agent for a lower film. Since all three layers are ethylene-based, no adhesive or other additives are required for lamination, and three layers of film are adhered to three dies on one die by co-extrusion tubular method. Film can be produced.

More specifically, the present invention may consist of the following aspects, but is not limited thereto.

The first aspect of the invention

A high density polyethylene layer comprising a high density polyethylene;

A mixed resin layer comprising a propylene-ethylene random copolymer resin;

An inner layer comprising ethylene resin and quicklime (CaO) selected from low density polyethylene, linear low density polyethylene, and metallocene linear low density polyethylene;

This is a multilayer film for packaging electronic products sequentially stacked.

In addition, the second aspect of the present invention

A mixed resin layer comprising a propylene-ethylene random copolymer resin;

A high density polyethylene layer comprising a high density polyethylene;

An inner layer comprising ethylene resin and quicklime (CaO) selected from low density polyethylene, linear low density polyethylene, and metallocene linear low density polyethylene;

This is a multilayer film for packaging electronic products sequentially stacked.

Hereinafter, each configuration of the present invention will be described in more detail.

Referring to the multilayer film of the present invention with reference to the surface as follows.

First, Figure 1 shows a first aspect of the present invention, a high density polyethylene layer (30) comprising high density polyethylene; A mixed resin layer 20 comprising a propylene-ethylene random copolymer resin; And an inner layer 10 including an ethylene resin and quicklime (CaO) selected from low density polyethylene, linear low density polyethylene, and metallocene linear low density polyethylene.

2 shows a second embodiment of the present invention, comprising: a mixed resin layer 20 comprising a propylene-ethylene random copolymer resin; A high density polyethylene layer (30) comprising high density polyethylene; And an inner layer 10 including an ethylene resin and quicklime (CaO) selected from low density polyethylene, linear low density polyethylene, and metallocene linear low density polyethylene.

In the first and second aspects of the invention the inner layer 10 is a portion corresponding to the surface of the package to be packaged.

In the present invention, the high density polyethylene layer 30 is a layer for imparting moisture resistance and providing color and surface antistatic properties as necessary, and includes a high density polyethylene resin. In addition, if necessary, it may further include an additive commonly used in the art. The additive is preferably used in 0.01 to 0.07 parts by weight based on 100 parts by weight of high density polyethylene. The additive may be applied to a pigment for color, and an antistatic agent such as a conductive polymer or a surfactant may be used for antistatic property. And conductive ink treatment and printing are possible on the surface.

More preferably, 0.1 to 20 parts by weight of maleic anhydride graft copolymer is further included based on 100 parts by weight of the high density polyethylene. By adding the maleic anhydride graft copolymer, the adhesive strength between the high density polyethylene layer and the mixed resin layer may be further increased, and the extrusion kneading of the high density polyethylene layer and the miscibility with the additives may be improved. The maleic anhydride graft copolymer is maleic anhydride graft low density polyethylene (MAH-g-LDPE), maleic anhydride graft linear low density polyethylene (MAH-g-LLDPE), maleic anhydride graft high density polyethylene (MAH-g-HDPE) , Maleic anhydride graft ethylene vinyl acetate (MAH-g-EVA) or the like can be used.

The high density polyethylene resin is preferably a density of 0.941 ~ 0.965 g / cm ³ . When the density is less than 0.941 g / cm ³ , moisture resistance becomes poor, and the desired physical properties can be satisfied in the above range.

In the present invention, the mixed resin layer 20 serves to block water molecules once again blocked by the high-density polyethylene layer 30, and uses a propylene-ethylene random copolymer resin mixed with a propylene resin and an ethylene resin. . The propylene-ethylene random copolymer has a different molecular structure of high density polyethylene, so that the propylene-ethylene random copolymer fills the insufficient part of the molecular structure of the high density polyethylene, and thus provides excellent moisture resistance.

The propylene-ethylene random copolymer resin is made of propylene and a copolymer based on propylene. The density is preferable because the desired physical properties can be achieved in the range of 0.900 to 0.910 g / cm ³ . When only polypropylene is used, adhesion strength with ethylene is lowered, so it is necessary to force adhesion using an adhesive layer during co-extrusion. When only ethylene is used, adhesion between films is excellent but moisture resistance is low.

In the present invention, the inner layer 10 is to impart moisture resistance, hygroscopicity and antistatic properties in response to products such as products that are weak to moisture and electronics, in low density polyethylene, linear low density polyethylene, metallocene linear low density polyethylene Selected ethylene resin and quicklime (CaO) are included.

The inner layer is a mixture of low density polyethylene resin and quicklime (CaO), linear low density polyethylene resin and quicklime (CaO), metallocene linear low density polyethylene resin and quicklime (CaO), low density polyethylene resin and linear low density polyethylene resin and Mixes quicklime (CaO), mixes low density polyethylene resin and metallocene linear low density polyethylene resin and quicklime (CaO), and finally, adds low density polyethylene resin, metalsocene linear low density polyethylene resin, linear low density polyethylene resin and quicklime (CaO) It can be made by mixing.

The low density polyethylene resin may be the same or different from the ethylene resin in the mixed resin layer 20.

Specifically, the low density polyethylene, the linear low density polyethylene, and the metallocene linear low density polyethylene are preferably those having a density of 0.905 to 0.945 g / cm ³ . If the density is less than 0.905, heat resistance, abrasion resistance stiffness, slip resistance, hot sealability, etc. may be inferior, and if it is more than 0.945, adhesive strength, heat seal strength, low temperature sealability, breaking strength, etc. may be deteriorated. Do.

More specifically, it is preferable to use a low density polyethylene resin having a density of 0.910 to 0.925 g / cm ³ . In addition, it is preferable to use the linear low density polyethylene resin whose density is 0.918-0.925g / cm <^3> . Finally, it is preferable to use a metallocene linear low density polyethylene resin having a density of 0.915 to 0.925 g / cm ³ .

In the present invention, the quicklime (CaO) is not only hygroscopic but also excellent in antistatic properties, and its content is preferably 0.2 to 0.7% by weight. If the amount is less than 0.2% by weight, the effect is insignificant, and if it is used in excess of 0.7% by weight, the product may be stained and contaminated due to excessive hygroscopicity. Preference is given to using 0.3 to 0.5% by weight. Moreover, it is preferable to use a quicklime (Cao) average particle diameter of 5-20 micrometers. If the average particle diameter is less than 5㎛ hygroscopic effect is insignificant, if it exceeds 20㎛ when the film is made dispersibility may be lowered, the moisture absorption rate may be slow, it is preferable to use in the above range.

The method of laminating the multilayer film of the present invention may be manufactured by a conventional lamination method known in the art, such as coextrusion lamination and adhesion method, and laminating by a coextrusion tubular method is preferable because it reduces manufacturing costs.

In the method of manufacturing a multilayer film in the present invention, the resin, a mixture of resins or a mixture of a resin and a dehumidifying agent used in each layer is introduced into each extruder and then heated to a temperature at which the resin is melt-extruded, thereby discharging three discharge sites (dies lip) One die with) can be produced by coextrusion tubular method, can be uniaxially or biaxially stretched, or molded by coextrusion Ti-die method to produce a film.

In addition, it is also possible to inject into the master batch of the state kneaded in advance in the extruder.

Since the film according to the present invention is a semi-transparent film, the state of the inside can be observed, and the multilayer structure of the resin having different molecular structure is excellent in moisture resistance, and an excellent dehumidifying effect is expressed without the need for a separate dehumidifying agent (silica gel, zeolite). The metal component is not used, and it is excellent in antistatic property without the addition of an antistatic agent, and thus it can be usefully used for the packaging of products that are weak to moisture or electronic products.

1 is a cross-sectional view showing a first embodiment of the present invention.
2 is a cross-sectional view showing a second embodiment of the present invention.

Hereinafter, the present invention will be described in more detail with reference to Examples in order to explain the present invention. However, the present invention is not limited to the following Examples.

Physical properties were measured by the following measurement method.

1) density

The density of the resin was measured using ASTM D1505.

2) Water vapor permeability (g / ㎡ / 24h)

Physical properties were measured by the measuring method of KS K0594: 2008 (calcium chloride method).

At this time, the area of the moisture-permeable cup 0.00283㎡, the height of the moisture-permeable cup is 25mm, the absorbent was tested under CaCl ₂ , temperature 40 ± 2 ℃, relative humidity 90 ± 5%.

3) surface resistance

After leaving the sample for 8 hours under 25 ° C × 55% RH (relative humidity) conditions, the antistatic properties were evaluated using a surface resistance measuring instrument (SIMCO, model name: TRUSTAT ST-3), and the unit of surface resistance. Is Ω / cm 2.

Example 1

A high density polyethylene (Samsung Total Co., Ltd., HDPE F120A, density 0.956 g / cm ³ , melt index 0.044 g / 10 min) was introduced into the first extruder, and the mixture was melted at 190 ° C. to prepare a first composition. A propylene-ethylene random copolymer resin (Samsung Total Co., Ltd., RF401, density 0.9g / cm ³ , melt index 7g / 10min) was introduced into a second extruder and melted at 230 ° C. to prepare a second composition.

99.7% by weight of metallocene linear low density polyethylene (Daelim Poly, XP-3300, density 0.919g / cm ³ , melt index 2.0g / 10min) and 0.3% by weight of quicklime (CaO, average particle diameter 10㎛) Injected and melted at 190 ° C. to prepare a third composition.

The melt extruded from the first extruder, the second extruder and the third extruder is extruded by co-extrusion tubular method in the order of first composition / second composition / third composition using a multi-die to have a thickness of 80 μm. A film was prepared. The thickness ratio of each layer of the said multilayer film was 5: 3: 2 for the 1st composition layer: the 2nd composition layer: the 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

[Example 2]

A multilayer film was manufactured in the same manner as in Example 1, except that the composition was coextruded in the order of the second composition / first composition / third composition. The thickness ratio of each layer of the said multilayer film was 4: 4: 2 of 2nd composition layer: 1st composition layer: 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

[Example 3]

A high density polyethylene (Samsung Total Co., Ltd., HDPE F120A, density 0.956 g / cm ³ , melt index 0.044 g / 10 min) was introduced into the first extruder, and the mixture was melted at 190 ° C. to prepare a first composition. A propylene-ethylene random copolymer resin (Samsung Total Co., Ltd., RF402, density 0.9g / cm ³ , melt index 7g / 10min) was introduced into a second extruder, and the mixture was melted at 230 ° C. to prepare a second composition.

30 wt% of low density polyethylene, 69.7 wt% of linear low density polyethylene, and 0.3 wt% of quicklime (CaO, average particle diameter of 10 μm) were added to a third extruder and melted at 190 ° C. to prepare a third composition. Low-density polyethylene was used Hanwha 5321, the density is 0.921g / cm ³ , the melt index is 3.0g / 10min. Linear low density polyethylene was used SK FN410, the density is 0.919g / cm ³ , the melt index is 1.0g / 10min.

The melt extruded from the first extruder, the second extruder and the third extruder is extruded by co-extrusion tubular method in the order of first composition / second composition / third composition using a multi-die to have a thickness of 80 μm. A film was prepared. The thickness ratio of each layer of the said multilayer film was 5: 3: 2 for the 1st composition layer: the 2nd composition layer: the 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

Example 4

A multilayer film was manufactured in the same manner as in Example 1, except that the composition was coextruded in the order of the second composition / first composition / third composition. The thickness ratio of each layer of the said multilayer film was 4: 4: 2 of 2nd composition layer: 1st composition layer: 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

[Example 5]

A high density polyethylene was added to the first extruder and melted at 190 ° C. to prepare a first composition. High density polyethylene was used Samsung Total HDPE F120A, the density is 0.956g / cm ³ , the melt index is 0.044g / 10min. A propylene-ethylene random copolymer resin was added to a second extruder and melted at 230 ° C. to prepare a second composition. Propylene-ethylene random copolymer resin was used Samsung Total RF401, the density is 0.9g / cm ³ , the melt index is 7g / 10min.

99.5 wt% of linear low density polyethylene and 0.5 wt% of quicklime (CaO, average particle diameter of 10 μm) were added to a third extruder, and the mixture was melted at 190 ° C. to prepare a third composition. SKFN410 was used as the metallocene linear low density polyethylene. The density was 0.919 g / cm ³ and the melt index was 1.0 g / 10 min.

The melt extruded from the first extruder, the second extruder and the third extruder is extruded by co-extrusion tubular method in the order of first composition / second composition / third composition using a multi-die to have a thickness of 80 μm. A film was prepared. The thickness ratio of each layer of the said multilayer film was 5: 3: 2 for the 1st composition layer: the 2nd composition layer: the 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

[Example 6]

A multilayer film was manufactured in the same manner as in Example 1, except that the composition was coextruded in the order of the second composition / first composition / third composition. The thickness ratio of each layer of the said multilayer film was 4: 4: 2 of 2nd composition layer: 1st composition layer: 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

[Example 7]

In the high-density polyethylene layer, a multilayer film was prepared in the same manner as in Example 1 except that the maleic anhydride graft copolymer was mixed in an amount of 5 parts by weight based on 100 parts by weight of high density polyethylene.

Maleic anhydride graft high density polyethylene (Honam Petrochemical, ADPOLY BM-310) based on 100 parts by weight of high density polyethylene (Samsung Total, HDPE F120A, density 0.956 g / cm ³ , melt index 0.044 g / 10 min) in the first extruder 5 parts by weight was added and melted at 190 ° C. to prepare a first composition.

A propylene-ethylene random copolymer resin (Samsung Total Co., Ltd., RF401, density 0.9g / cm ³ , melt index 7g / 10min) was introduced into a second extruder and melted at 230 ° C. to prepare a second composition.

99.7% by weight of metallocene linear low density polyethylene (Daelim Poly, XP-3300, density 0.919g / cm ³ , melt index 2.0g / 10min) and 0.3% by weight of quicklime (CaO, average particle diameter 10㎛) Injected and melted at 190 ° C. to prepare a third composition.

The melt extruded from the first extruder, the second extruder and the third extruder is extruded by co-extrusion tubular method in the order of first composition / second composition / third composition using a multi-die to have a thickness of 80 μm. A film was prepared. The thickness ratio of each layer of the said multilayer film was 5: 3: 2 for the 1st composition layer: the 2nd composition layer: the 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

Comparative Example 1

A multilayer film was prepared in the same manner as in Example 1 except that no dehumidifying agent was used.

A high density polyethylene was added to the first extruder and melted at 190 ° C. to prepare a first composition. Samsung Total HDPE F120A was used, the density was 0.956g / cm ³ , and the melt index was 0.044g / 10min. A propylene-ethylene random copolymer resin was added to a second extruder and melted at 230 ° C. to prepare a second composition. Samsung Total RF401 was used, the density was 0.9g / cm ³ , and the melt index was 7g / 10min.

100 wt% of the metallocene linear low density polyethylene was added to the third extruder, and the mixture was melted at 190 ° C. to prepare a third composition. Daelim Poly XP-3300 was used as the metallocene linear low density polyethylene. The density was 0.919 g / cm ³ and the melt index was 2.0 g / 10 min.

The melt extruded from the first extruder, the second extruder and the third extruder is extruded by co-extrusion tubular method in the order of first composition / second composition / third composition using a multi-die to have a thickness of 80 μm. A film was prepared. The thickness ratio of each layer of the said multilayer film was 5: 3: 2 for the 1st composition layer: the 2nd composition layer: the 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

Comparative Example 2

A multilayer film was manufactured in the same manner as in Example 1, except that 0.1 wt% of a dehumidifying agent was used.

A high density polyethylene was added to the first extruder and melted at 190 ° C. to prepare a first composition. Samsung Total HDPE F120A was used, the density was 0.956g / cm ³ , and the melt index was 0.044g / 10min. A propylene-ethylene random copolymer resin was added to a second extruder and melted at 230 ° C. to prepare a second composition. Samsung Total RF401 was used, the density was 0.9g / cm ³ , and the melt index was 7g / 10min.

99.9% by weight of metallocene linear low density polyethylene and 0.1% by weight of quicklime (CaO) were added to a third extruder, and the mixture was melted at 190 ° C. to prepare a third composition. Daelim Poly XP-3300 was used as the metallocene linear low density polyethylene. The density was 0.919 g / cm ³ and the melt index was 2.0 g / 10 min.

The melt extruded from the first extruder, the second extruder and the third extruder is extruded by co-extrusion tubular method in the order of first composition / second composition / third composition using a multi-die to have a thickness of 80 μm. A film was prepared. The thickness ratio of each layer of the said multilayer film was 5: 3: 2 for the 1st composition layer: the 2nd composition layer: the 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

[Comparative Example 3]

A multilayer film was prepared in the same manner as in Example 1, except that magnesium sulfate was used instead of CaO as a dehumidifying agent.

A high density polyethylene was added to the first extruder and melted at 190 ° C. to prepare a first composition. Samsung Total HDPE F120A was used, the density was 0.956g / cm ³ , and the melt index was 0.044g / 10min. A propylene-ethylene random copolymer resin was added to a second extruder and melted at 230 ° C. to prepare a second composition. Samsung Total RF401 was used, the density was 0.9g / cm ³ , and the melt index was 7g / 10min.

99.3% by weight of metallocene linear low density polyethylene and 0.7% by weight of magnesium sulfate were added to a third extruder, and the mixture was melted at 190 ° C. to prepare a third composition. Daelim Poly XP-3300 was used as the metallocene linear low density polyethylene. The density was 0.919 g / cm ³ and the melt index was 2.0 g / 10 min.

The melt extruded from the first extruder, the second extruder and the third extruder is extruded by co-extrusion tubular method in the order of first composition / second composition / third composition using a multi-die to have a thickness of 80 μm. A film was prepared. The thickness ratio of each layer of the said multilayer film was 5: 3: 2 for the 1st composition layer: the 2nd composition layer: the 3rd composition layer. In addition, measured physical properties are shown in Table 1 below.

[Comparative Example 4]

An aluminum foil film in which PET (Toray Saehan) 12 μm, AL-FOIL 12 μm, LLDPE (SK, FN410, density 0.919 g / cm ³ , melt index 1.0 g / 10 min) 60 μm was used.

[Comparative Example 5]

An aluminum semi-deposited film was used, which was laminated with a 60 μm film of aluminum deposited PET (Toraye) 12 μm, an antistatic LLDPE (SK, FN410, density 0.919 g / cm ³ , melt index 1.0 g / 10 min).

[Comparative Example 6]

A high density polyethylene was added to the first extruder and melted at 190 ° C. to prepare a first composition. Samsung Total HDPE F120A was used, the density was 0.956g / cm ³ , and the melt index was 0.044g / 10min. 99.7% by weight of metallocene linear low density polyethylene and 0.3% by weight of quicklime (CaO) were added to a second extruder and melted at 190 ° C to prepare a second composition. Daelim Poly XP-3300 was used as a metallocene linear low density polyethylene. The density was 0.919 g / cm ³ and the melt index was 2.0 g / 10 min.

The melt melt-extruded in the first extruder and the second extruder was extruded by co-extrusion tubular method in the order of the first composition / second composition using a multi die to prepare a multilayer film having a thickness of 80 μm. The thickness ratio of each layer of the said multilayer film was 1st composition layer: 2nd composition layer 6: 4. In addition, measured physical properties are shown in Table 1 below.

[Comparative Example 7]

A propylene-ethylene random copolymer resin was added to the first extruder and melted at 230 ° C. to prepare a first composition. Samsung Total RF401 was used, the density was 0.9g / cm ³ , and the melt index was 7g / 10min.

99.7% by weight of metallocene linear low density polyethylene and 0.3% by weight of quicklime (CaO) were added to the second extruder and melted at 190 ° C. to prepare a third composition. Daelim Poly XP-3300 was used as a metallocene linear low density polyethylene. The density was 0.919 g / cm ³ and the melt index was 2.0 g / 10 min.

The melt melt-extruded in the first extruder and the second extruder was extruded by co-extrusion tubular method in the order of the first composition / second composition using a multi die to prepare a multilayer film having a thickness of 80 μm. The thickness ratio of each layer of the said multilayer film was 1st composition layer: 2nd composition layer 6: 4. In addition, measured physical properties are shown in Table 1 below.

Table 1

* The internal humidity after packing is the humidity after 24 hours after packing, and the humidity before packing is 50%. (50%, 24hr, 25 ℃)

* Antistatic property should have surface resistance of less than 10 ¹² Ω / ㎠ and surface voltage of less than 0.5kv. (50%, 24hr, 25 ℃)

10: inner layer
20: mixed resin layer
30: high density polyethylene layer

Claims (11)

A high density polyethylene layer comprising a high density polyethylene;
A mixed resin layer comprising a propylene-ethylene random copolymer resin;
An inner layer comprising ethylene resin and quicklime (CaO) selected from low density polyethylene, linear low density polyethylene, and metallocene linear low density polyethylene;
This sequentially laminated multilayer film for packaging electronic products. A mixed resin layer comprising a propylene-ethylene random copolymer resin;
A high density polyethylene layer comprising a high density polyethylene;
An inner layer comprising ethylene resin and quicklime (CaO) selected from low density polyethylene, linear low density polyethylene, and metallocene linear low density polyethylene;
This sequentially laminated multilayer film for packaging electronic products. 3. The method according to claim 1 or 2,
The inner layer is a multilayer film for packaging electronic products containing quicklime (CaO) 0.2 ~ 0.7 wt%. 3. The method according to claim 1 or 2,
The quicklime (CaO) is a multilayer film for packaging electronic products having an average particle diameter of 5 ~ 20㎛. 3. The method according to claim 1 or 2,
The high density polyethylene has a density of 0.941 ~ 0.965g / cm ³ multilayer film for packaging electronics. 3. The method according to claim 1 or 2,
The propylene-ethylene random copolymer resin has a density of 0.900 to 0.910 g / cm ³ Multilayer film for packaging electronics. The method according to claim 1 or 2,
The low density polyethylene has a density of 0.910 to 0.925 g / cm³sign Multilayer film for packaging electronic products. 3. The method according to claim 1 or 2,
The linear low density polyethylene has a density of 0.918 ~ 0.945 g / cm ³ multilayer film for packaging electronics. 3. The method according to claim 1 or 2,
The metallocene linear low density polyethylene resin has a density of 0.905 to 0.945 g / cm ³ Multilayer film for packaging electronics. 3. The method according to claim 1 or 2,
The high-density polyethylene layer is a multilayer film for packaging electronic products further comprises 0.1 to 20 parts by weight of maleic anhydride graft copolymer with respect to 100 parts by weight of high density polyethylene. The method of claim 10,
The maleic anhydride graft copolymer is maleic anhydride graft low density polyethylene (MAH-g-LDPE), maleic anhydride graft linear low density polyethylene (MAH-g-LLDPE), maleic anhydride graft high density polyethylene (MAH-g-HDPE) And multilayer film for electronics packaging using any one or a mixture of two or more selected from maleic anhydride graft ethylene vinyl acetate (MAH-g-EVA).

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