KR102322839B1 - Film composition for vacuum compression bag using the butene copolymer resin - Google Patents
Film composition for vacuum compression bag using the butene copolymer resin Download PDFInfo
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Abstract
Description
본 발명은 별도로 두께를 증가시키지 않더라도 우수한 인장강도, 연신율 및 저투습도 성능을 발현할 수 있도록 하며, 이로 인해 MLCC 제조 시 그 작업성 및 생산성을 향상시킬 뿐만 아니라, 특히 두께가 너무 두꺼우면 작업성이 나오지 않는 MLCC 제품의 제조 공정에 용이하게 적용할 수 있도록 하는, 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물에 관한 것이다.The present invention makes it possible to express excellent tensile strength, elongation, and low moisture permeability performance without separately increasing the thickness, thereby not only improving the workability and productivity of MLCC manufacturing, but also improving the workability when the thickness is too thick. It relates to a film composition for vacuum compression bags using a butene-based copolymer resin, which can be easily applied to the manufacturing process of MLCC products that do not appear.
일반적인 타입의 커패시터인 적층형 세라믹 콘덴서(MLCC, Multi-Layer Ceramic Capacitors)는 모든 전자부품에 들어가는 좁쌀만큼 작은 크기의 회로부품으로 불과 1 ~ 2 mm 정도의 높이에 얇은 세라믹층을 300 ~ 400층 정도 쌓을 정도로 고집약 기술이 필요한 제품으로서 전자제품의 소형 경량화, 디지털화 고주파화에 따라 수요가 증가하고 있다. 한편, 그 본체는 유전체 층과 보통 니켈로 된 내부전극층이 상호 교차된 층 구조로 되어 있으며, 외부전극은 적층형 세라믹 콘덴서를 인쇄회로 기판 또는 하이브리드 IC(Hybrid IC) 모듈에 물리적 및 전기적 연결되도록 하는 역할을 한다.Multi-Layer Ceramic Capacitors (MLCCs), a general type of capacitor, are circuit components as small as a millet used in all electronic components. As a product that requires high-density technology, the demand is increasing with the miniaturization and weight reduction of electronic products, digitalization and high frequency. On the other hand, the body has a layer structure in which a dielectric layer and an inner electrode layer usually made of nickel are crossed with each other, and the external electrode serves to physically and electrically connect the multilayer ceramic capacitor to a printed circuit board or a hybrid IC module. do
한편, 적층형 세라믹 콘덴서의 제조과정을 살펴보면, 특허문헌 1은 도 1에 도시된 바와 같이 그린칩(40)을 상부 탄성판(10a)와 하부 탄성판(10b)으로 덮은 후 진공포장용 백(20)에 넣고, 압착매질은 60 ~ 100℃의 온도조건과 200 ~ 500㎏/㎠의 압력 조건하에서 수행하여 진공을 가해 진공포장하여 그린칩을 제조하는 적층형 세라믹 전자부품의 제조방법 및 그 제조장치가 알려져 있으며, 특허문헌 2는 내부전극을 갖춘 복수의 세라믹 생시트를 적층한 세라믹 적층체를 프레스용 금형에 넣는 다음 가요성 봉투에 넣은 후 세라믹 적층체를 대략 50 ~ 70℃에 가온해 대략 6 ~ 10 kg／cm2으로 압착하여 적층 세라믹 전자부품을 제조하는 방법이 알려져 있다.On the other hand, looking at the manufacturing process of the multilayer ceramic capacitor, Patent Document 1 covers the green chip 40 with an upper
상기 특허문헌들에 알려진 방법들과 같은 적층형 세라믹 콘덴서의 제조과정은 도 2에 도시된 바와 같이, 파우더를 세라믹 첨가제, 유기용제, 가소제, 결합제, 분산제와 혼합하여 바스킷 밀(Basket Mill) 등을 이용하여 슬러리(slurry)를 제조한 후 성형, 적층, 압착 등의 공정을 거쳐 세라믹 판을 제작하며, 이 세라믹 판을 적층하여 적층형 세라믹 콘덴서 제조용 진공압착 백(bag) 속에 넣어 진공을 시킨 후 대략 90℃의 온수에 넣어 1 톤(ton)의 압력을 가하여 콘덴서 플레이트(plate)를 제조한 후, 140℃ 정도의 온도에서 열처리를 하고 있다.As shown in FIG. 2, the manufacturing process of the multilayer ceramic capacitor, such as the methods known in the above patent documents, is performed by mixing powder with a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersing agent, and the like using a basket mill. After preparing a slurry using A condenser plate is manufactured by putting it in hot water at ℃ and applying a pressure of 1 ton, and then heat treatment is performed at a temperature of about 140℃.
하지만, 종래의 진공압착 백은 도 3에 도시된 바와 같이, 90℃의 온수에 넣어 1 톤의 압력으로 열처리 시, 미세한 수분의 침투로 불량이 빈번히 발생하여 그 두께를 지속적으로 올려야하는 문제점이 있었다.However, as shown in FIG. 3, the conventional vacuum compression bag has a problem in that when it is put into hot water at 90° C. and heat treated at a pressure of 1 ton, defects frequently occur due to the penetration of fine moisture, and the thickness has to be continuously increased. .
본 발명은 상기와 같은 문제점을 해결하기 위한 것으로, 부텐 공중합체(butene copolymer), mLLDPE(metallocene linear low-density polyethylene), LLDPE(linear low-density polyethylene) 및 LDPE(low-density polyethylene)로 이루어지는 진공압착 백용 필름 조성물을 제공함으로써, 별도로 두께를 증가시키지 않더라도 우수한 인장강도, 연신율 및 저투습도 성능을 발현할 수 있도록 하며, 이로 인해 MLCC 제조 시 그 작업성 및 생산성을 향상시킬 뿐만 아니라, 특히 두께가 너무 두꺼우면 작업성이 나오지 않는 MLCC 제품의 제조 공정에 용이하게 적용할 수 있도록 함을 과제로 한다.The present invention is to solve the above problems, butene copolymer (butene copolymer), mLLDPE (metallocene linear low-density polyethylene), LLDPE (linear low-density polyethylene) and LDPE (low-density polyethylene) made of vacuum By providing a film composition for compression bags, excellent tensile strength, elongation, and low moisture permeability performance can be expressed without separately increasing the thickness, thereby improving the workability and productivity of MLCC manufacturing, and especially when the thickness is too high The task is to make it easy to apply to the manufacturing process of MLCC products that do not show workability when they are thick.
본 발명은 진공압착 백용 필름 조성물에 있어서, 부텐 공중합체(butene copolymer), mLLDPE(metallocene linear low-density polyethylene), LLDPE(linear low-density polyethylene) 및 LDPE(low-density polyethylene)로 이루어지는 것을 특징으로 하는, 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물을 과제의 해결 수단으로 한다.The present invention is a film composition for a vacuum compression bag, characterized in that it consists of a butene copolymer, a metallocene linear low-density polyethylene (mLLDPE), a linear low-density polyethylene (LLDPE), and a low-density polyethylene (LDPE). A film composition for a vacuum compression bag using a butene-based copolymer resin is used as a means to solve the problem.
보다 구체적으로 상기 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물은, 부텐 공중합체 40 ~ 60 중량%, mLLDPE 10 ~ 15 중량%, LLDPE 10 ~ 15 중량% 및 LDPE 20 ~ 30 중량%를 혼합하여 이루어지는 것이 바람직하다.More specifically, the film composition for a vacuum compression bag using the butene-based copolymer resin is prepared by mixing 40 to 60% by weight of butene copolymer, 10 to 15% by weight of mLLDPE, 10 to 15% by weight of LLDPE, and 20 to 30% by weight of LDPE. It is desirable to do
그리고 상기 부텐 공중합체는, MI(Melting Index) 1 ~ 1.5g/10min, 밀도 0.89 ~ 0.92g/cm3, 융점 110 ~ 115℃인 것이 바람직하다.And it is preferable that the butene copolymer has a Melting Index (MI) of 1 to 1.5 g/10min, a density of 0.89 to 0.92 g/cm 3 , and a melting point of 110 to 115°C.
본 발명은 부텐 공중합체, mLLDPE, LLDPE 및 LDPE로 이루어지는 진공압착 백용 필름 조성물을 제공함으로써, 별도로 두께를 증가시키지 않더라도 우수한 인장강도, 연신율 및 저투습도 성능을 발현할 수 있도록 하며, 이로 인해 MLCC 제조 시 그 작업성 및 생산성을 향상시킬 뿐만 아니라, 특히 두께가 너무 두꺼우면 작업성이 나오지 않는 MLCC 제품의 제조 공정에 용이하게 적용할 수 있는 효과가 있다.The present invention provides a film composition for vacuum compression bags made of butene copolymer, mLLDPE, LLDPE and LDPE, so that excellent tensile strength, elongation and low moisture permeability performance can be expressed without separately increasing the thickness. In addition to improving the workability and productivity, there is an effect that can be easily applied to the manufacturing process of an MLCC product that does not have workability, especially if the thickness is too thick.
도 1은 종래의 방법에 의해 그린칩을 제조하기 위한 정수압 압착장치를 나타낸 도면.
도 2는 통상적인 방법에 의해 적층형 세라믹 콘덴서 제조용 진공압착 백을 사용하여 적층형 세라믹 콘덴서를 제조하는 과정을 나타낸 도면.
도 3은 통상적인 방법에 의해 적층형 세라믹 콘덴서를 제조 시 진공압착 백을 사용하는 상세 과정을 나타낸 도면1 is a view showing a hydrostatic pressure compression apparatus for manufacturing green chips by a conventional method.
2 is a view showing a process of manufacturing a multilayer ceramic capacitor using a vacuum compression bag for manufacturing a multilayer ceramic capacitor by a conventional method.
3 is a view showing a detailed process of using a vacuum compression bag when manufacturing a multilayer ceramic capacitor by a conventional method
상기의 효과를 달성하기 위한 본 발명은 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물에 관한 것으로서, 본 발명의 기술적 구성을 이해하는데 필요한 부분만이 설명되며 그 이외 부분의 설명은 본 발명의 요지를 흩트리지 않도록 생략될 것이라는 것을 유의하여야 한다.The present invention for achieving the above effect relates to a film composition for a vacuum compression bag using a butene-based copolymer resin, and only the parts necessary for understanding the technical configuration of the present invention are described, and the description of other parts is the gist of the present invention It should be noted that will be omitted so as not to distract from
이하, 본 발명에 따른 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물을 상세히 설명하면 다음과 같다.Hereinafter, the film composition for vacuum compression bag using the butene-based copolymer resin according to the present invention will be described in detail as follows.
본 발명에 따른 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물은 부텐 공중합체(butene copolymer), mLLDPE(metallocene linear low-density polyethylene), LLDPE(linear low-density polyethylene) 및 LDPE(low-density polyethylene)로 이루어지는 것을 특징으로 한다.The film composition for vacuum compression bags using the butene-based copolymer resin according to the present invention is a butene copolymer, metallocene linear low-density polyethylene (mLLDPE), linear low-density polyethylene (LLDPE) and low-density polyethylene (LDPE). ) is characterized in that it consists of.
보다 구체적으로는 부텐 공중합체 40 ~ 60 중량%, mLLDPE 10 ~ 15 중량%, LLDPE 10 ~ 15 중량% 및 LDPE 20 ~ 30 중량%를 혼합하여 이루어지는 것을 특징으로 한다.More specifically, it is characterized in that 40 to 60% by weight of the butene copolymer, 10 to 15% by weight of mLLDPE, 10 to 15% by weight of LLDPE, and 20 to 30% by weight of LDPE are mixed.
상기 부텐 공중합체는 폴리부텐으로써 일렘 사에서 제조되는 BPC-1(제품명) 등을 적용할 수 있으며, 바람직하게는 MI(Melting Index) 1 ~ 1.5g/10min, 밀도 0.89 ~ 0.92g/cm3, 융점 110 ~ 115℃인 것을 사용한다. 한편, MI, 밀도 및 함량이 상기 범위 미만일 경우 인장강도, 연신율 및 저투습도 성능의 향상 효율이 저하될 우려가 있으며, 상기 범위를 초과할 경우 가공성이 저하될 우려가 있다.The butene copolymer is polybutene, and BPC-1 (product name) manufactured by Ilem, etc. can be applied, preferably MI (Melting Index) 1 to 1.5 g/10 min, density 0.89 to 0.92 g/cm 3 , Use those having a melting point of 110 to 115°C. On the other hand, if the MI, density, and content are less than the above range, there is a fear that the improvement efficiency of tensile strength, elongation, and low moisture permeability performance may decrease, and if it exceeds the above range, there is a risk of deterioration of workability.
상기 mLLDPE는 메탈로센 촉매하에서 중합시킨 에틸렌 공중합체로써 인장강도 등 우수한 강도를 발현시킬 수 있으며, 그 함량이 10 중량% 미만일 경우 상기 효과의 발현이 어렵고, 15 중량%를 초과할 경우 가공성이 저하될 우려가 있다.The mLLDPE is an ethylene copolymer polymerized under a metallocene catalyst and can express excellent strength such as tensile strength. When the content is less than 10% by weight, it is difficult to express the effect, and when it exceeds 15% by weight, processability is reduced there is a risk of becoming
상기 LLDPE는 긴 체인 올레핀과 에틸렌과의 공중합에 의해 만들어진 짧은 가지의 상당수와 실질적으로 선형 고분자로써, 에틸렌과 부텐, 헥센, 옥텐 또는 같은 고급 α-올레핀의 공중합에 의해 저온와 고압에서 생성되며, 가공성과 저투습도를 향상시킬 수 있다. 한편, 그 함량이 10 중량% 미만일 경우 상기 효과의 발현이 어렵고, 15 중량%를 초과할 경우 투습도가 높아질 우려가 있다.The LLDPE is a substantially linear polymer with a significant number of short branches made by copolymerization of long chain olefins with ethylene. Low moisture permeability can be improved. On the other hand, when the content is less than 10% by weight, it is difficult to express the effect, and when it exceeds 15% by weight, there is a fear that the moisture permeability is increased.
상기 LDPE는 에틸렌으로 만든 합성수지로 내수성, 내약품성, 전기절연성이 우수해 포장재나 단열재, 흡음재, 케이블 절연체 등으로 사용되며, 그 함량이 그 함량이 20 중량% 미만일 경우 상기 효과의 발현이 어렵고, 30 중량%를 초과할 경우 가공성이 저하될 우려가 있다.The LDPE is a synthetic resin made of ethylene and has excellent water resistance, chemical resistance, and electrical insulation, so it is used as a packaging material, insulation material, sound absorbing material, cable insulator, etc. If it exceeds the weight %, there is a fear that the workability may be deteriorated.
이하, 본 발명을 아래 실시예에 의거하여 더욱 상세히 설명하지만, 본 발명이 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail based on the following examples, but the present invention is not limited by the examples.
1. 진공압착 백용 필름 조성물의 제조1. Preparation of film composition for vacuum compression bag
(실시예 1)(Example 1)
부텐 공중합체(BPC-1, 일렘 사/MI 1g/10min, 밀도 0.89g/cm3, 융점 110℃) 40 중량%, mLLDPE 15 중량%, LLDPE 15 중량% 및 LDPE 30 중량%를 혼합하여 제조하였다.Butene copolymer (BPC-1, Ilem company / MI 1 g / 10 min, density 0.89 g / cm 3 , melting point 110 ° C.) 40% by weight, mLLDPE 15% by weight, LLDPE 15% by weight and
(실시예 2)(Example 2)
부텐 공중합체(BPC-1, 일렘 사/MI 1.5g/10min, 밀도 0.92g/cm3, 융점 115℃) 60 중량%, mLLDPE 10 중량%, LLDPE 10 중량% 및 LDPE 20 중량%를 혼합하여 제조하였다.Prepared by mixing 60% by weight of butene copolymer (BPC-1, Ilem Corporation/MI 1.5g/10min, density 0.92g/cm 3 , melting point 115° C.), 10% by weight of mLLDPE, 10% by weight of LLDPE and 20% by weight of LDPE did.
(비교예 1)(Comparative Example 1)
LLDPE 100 중량%를 사용하여 제조하였다.It was prepared using 100% by weight of LLDPE.
(비교예 2)(Comparative Example 2)
mLLDPE 25 중량%, LLDPE 25 중량% 및 LDPE 50 중량%를 혼합하여 제조하였다.It was prepared by mixing 25% by weight of mLLDPE, 25% by weight of LLDPE and 50% by weight of LDPE.
2. 진공압착 백용 필름 조성물의 평가2. Evaluation of film composition for vacuum compression bag
상기 실시예 및 비교예에 따른 조성물을 팽창비 1.4로 두께 220㎛의 필름을 제조하였으며, 이에 대한 인장강도, 연신율 및 수분투습도를 평가하였다. 그 심사기준 및 결과는 아래 [표 1]에 나타내었다.A film having a thickness of 220 μm was prepared by using the compositions according to Examples and Comparative Examples with an expansion ratio of 1.4, and tensile strength, elongation, and moisture permeability thereof were evaluated. The evaluation criteria and results are shown in [Table 1] below.
(N/cm2)tensile strength
(N/cm 2 )
(%)elongation
(%)
(g/m2*24h)moisture permeability
(g/m 2 *24h)
상기 [표 1]에서와 같이 본 발명의 실시예에 따른 진공압착 백용 필름 조성물은 동일 두께(220㎛)에서 비교예에 비하여 우수한 인장강도, 연신율 및 저투습도 성능을 발현할 수 있도록 하며, 이로 인해 MLCC 제조 시 그 작업성 및 생산성을 향상시킬 뿐만 아니라, 특히 두께가 너무 두꺼우면 작업성이 나오지 않는 MLCC 제품의 제조 공정에 용이하게 적용할 수 있음을 알 수 있다.As shown in [Table 1], the film composition for a vacuum compression bag according to an embodiment of the present invention can express superior tensile strength, elongation, and low moisture permeability performance compared to the comparative example at the same thickness (220 μm), and due to this It can be seen that not only improves the workability and productivity of MLCC manufacturing, but also it can be easily applied to the manufacturing process of MLCC products that do not have workability, especially if the thickness is too thick.
상술한 바와 같은, 본 발명의 바람직한 실시예에 따른 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물을 상기한 설명 및 도면에 따라 설명하였지만 이는 예를 들어 설명한 것에 불과하며 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 다양한 변화 및 변경이 가능하다는 것을 이 분야의 통상적인 기술자들은 잘 이해할 수 있을 것이다.As described above, the film composition for a vacuum compression bag using a butene-based copolymer resin according to a preferred embodiment of the present invention has been described according to the above description and drawings, but this is merely an example and does not deviate from the technical spirit of the present invention. It will be well understood by those skilled in the art that various changes and modifications can be made without departing from the scope of the present invention.
Claims (3)
부텐 공중합체 40 ~ 60 중량%, mLLDPE 10 ~ 15 중량%, LLDPE 10 ~ 15 중량% 및 LDPE 20 ~ 30 중량%를 혼합하여 이루어지되,
상기 부텐 공중합체는 MI(Melting Index) 1 ~ 1.5g/10min, 밀도 0.89 ~ 0.92g/cm3, 융점 110 ~ 115℃인 것을 특징으로 하는, 부텐계공중합체 수지를 이용한 진공압착 백용 필름 조성물.In the film composition for vacuum compression bags consisting of butene copolymer, mLLDPE (metallocene linear low-density polyethylene), LLDPE (linear low-density polyethylene) and LDPE (low-density polyethylene),
40 to 60% by weight of butene copolymer, 10 to 15% by weight of mLLDPE, 10 to 15% by weight of LLDPE and 20 to 30% by weight of LDPE,
The butene copolymer has a MI (Melting Index) of 1 to 1.5 g/10min, a density of 0.89 to 0.92 g/cm 3 , and a melting point of 110 to 115° C. A film composition for vacuum compression bags using a butene-based copolymer resin.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213275A (en) | 1995-02-07 | 1996-08-20 | Nec Corp | Manufacture of multilayer ceramic electronic part |
| JP2005319583A (en) * | 2001-09-28 | 2005-11-17 | Showa Denko Plastic Products Co Ltd | Laminated film, sealant film and package |
| KR100834913B1 (en) | 2006-08-29 | 2008-06-03 | 삼성전기주식회사 | Method of manufacturing multi-layered electronics parts and apparatus thereof |
| KR20130029934A (en) * | 2011-09-16 | 2013-03-26 | 박현창 | Multi-layer film for electronics packaging |
| JP2014088181A (en) * | 2012-10-29 | 2014-05-15 | Toppan Printing Co Ltd | Packaging bag |
| KR101400845B1 (en) * | 2013-10-15 | 2014-05-29 | 금정산업 주식회사 | High-temperature vacuum compression bag for multilayer ceramic capacitors manufacturing |
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- 2020-09-07 KR KR1020200113965A patent/KR102322839B1/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08213275A (en) | 1995-02-07 | 1996-08-20 | Nec Corp | Manufacture of multilayer ceramic electronic part |
| JP2005319583A (en) * | 2001-09-28 | 2005-11-17 | Showa Denko Plastic Products Co Ltd | Laminated film, sealant film and package |
| KR100834913B1 (en) | 2006-08-29 | 2008-06-03 | 삼성전기주식회사 | Method of manufacturing multi-layered electronics parts and apparatus thereof |
| KR20130029934A (en) * | 2011-09-16 | 2013-03-26 | 박현창 | Multi-layer film for electronics packaging |
| JP2014088181A (en) * | 2012-10-29 | 2014-05-15 | Toppan Printing Co Ltd | Packaging bag |
| KR101400845B1 (en) * | 2013-10-15 | 2014-05-29 | 금정산업 주식회사 | High-temperature vacuum compression bag for multilayer ceramic capacitors manufacturing |
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