KR20140003740A - An coating solution using preventing breathablity film for electrionic part - Google Patents

Abstract

The present invention relates to a barrier coating aqueous solution preventing moisture permeation of a film for an electronic material. A multilayer film for packaging electronic parts is formed of a base film of the electronic material, having four layers obtained by successively stacking an outer layer, a central layer, an inner layer, and a coating layer. A surface layer is formed using low density polyethylene resin as a basic resin and an antistatic resin, and includes polyaniline, polypyrrole, polythiophene, polyethylendioxythiophene (PEDOT), derivatives thereof, and copolymers thereof. The central layer includes a resin which is a synthetic resin obtained by polymerizing ethylene of high density polyenthylene (HDPE) and is obtained by mixing HDPE, M-PE, and LLDPE. The inner layer is sealed into a thickness of 5-20 um using LLDPE as a basic resin. The coating layer is obtained by thermally cross-linking a PEG, PU, and LLDPE based emulsion solution on the inner layer into a thickness of 5-50 um for coating. The present invention provides the barrier coating aqueous solution preventing the moisture movement of the film for the electronic material which is formed of coating liquid for preventing the moisture movement of the film by being injected to the inside of an edge surface of the film while sealing the inside of the multilayer film.

Description

Barrier coating solution for moisture permeation prevention of film for electronic materials {AN COATING SOLUTION USING PREVENTING BREATHABLITY FILM FOR ELECTRIONIC PART}

The present invention uses aluminum laminates in packaging materials for packaging electronic materials such as display substrates, PCBs, printer cartridges, electronic components, etc., and replaces them to prevent moisture permeation to a layer provided with a multilayer structure of a general oligomer single material and to prevent antistatic charge. The present invention relates to a barrier coating aqueous solution for preventing moisture permeation of a film for an electronic material that can be used in the synthesis and blending of a water-soluble coating solution of an oligomer-based system that improves heat sealing property.

Electrostatic dispersion bags for packaging electronic components or semiconductor components require electrostatic dispersion, antifouling function to prevent contamination from fingerprints and foreign substances, and moisture proof function to be protected from moisture. In other words, the antifouling and moisture proof function prevents the penetration of water, oil or other contaminants into the inside. This means that the contact surface is minimized, preventing contaminants from penetrating inside.

Background Art [0002] The known films for packaging electrostatic dispersion electronic components generally interface with metal deposited polyester films prepared by depositing or sputtering metal materials such as aluminum, nickel, titanium, copper, chromium, and zinc on polyester films. The polyethylene film having the surface coated with an active agent, carbon black and the like is manufactured by laminating, and an envelope for packaging an electronic component is manufactured using the same. In the case of electrostatic dispersion bags using surfactants, they do not react semi-permanently due to sensitive reaction with moisture under the influence of surfactants having ions, and do not transfer semi-permanent electrostatic dispersion effect to the surface and are deposited on the base plastic film, which leads to electrostatic packaging for semiconductor parts. It is not suitable as a distributed envelope. In addition, in the case of the electrostatic dispersion bag using carbon black, there is a concern that black carbon dust is generated during film production, and there is a problem in that it does not have transparency, which is not suitable as an electrostatic dispersion film for packaging semiconductor parts.

Recently, in order to compensate for this problem, the production of electrostatic dispersion bags using conductive polymers has been attempted. The conductive polymer has the advantages of transparency, high electrical conductivity, and no surface transition that carbon black and surfactant do not have, and thus have recently been widely used as a coating composition for electrostatic dispersion bags for packaging electronic components and semiconductor components.

In addition, a metal-deposited polyester film and a general polyethylene are laminated, and then the surface is treated with a conductive polymer coating composition, and the film is used to prepare an envelope for packaging an electronic component.

However, in the case of the electrostatic dispersion film produced using the conductive polymer coating composition, the transparency and the surface resistance are good, but the metal deposition polyester film is used to reinforce the antifouling and moisture proof function, thereby increasing the cost, lowering the productivity, and polluting the metal environment. Caused by. Moreover, the manufacture of bags after coating the endothelial surface with known conductive polymer compositions significantly reduces the thermal adhesion and is not suitable for the function of the bags. Polyethylene films have strong adhesion to each other by heat, but films coated with conductive polymers have a significant decrease in adhesion by heat, resulting in loss of commercial value.

In addition, nylon and LLDPE are laminated to aluminum film used for packaging electronic materials, and it is used as a packaging material. However, it is completely moisture-permeable.

Utility Utility Publication 20-0162796 Patent Publication 10-2006-0125999

The present invention has been made to solve the problems of the prior art as described above, an object of the present invention is to prevent the moisture permeable to the layer of the multi-layer structure of the oligomer single material, to improve the antistatic, heat sealing properties It is to provide a barrier coating aqueous solution for preventing moisture permeability of the film for electronic materials.

Another object of the present invention is to dissolve at a low temperature and improve the sealing property in the manufacture of packaging materials, by coating the inside of the film of the oligomeric multilayer structure, the surface that is permeable to the edge surface of the film during sealing from the inside easy to reuse. The present invention provides a barrier coating aqueous solution for preventing moisture permeation of an electronic material film that can be detached and recycled.

The barrier coating aqueous solution for preventing moisture permeation of an electronic material film according to a preferred embodiment of the present invention for achieving the above object is the basis of a four-layer electric material formed by sequentially laminating an outer surface layer, a central layer, an inner surface layer and a coating layer. In the multilayer film for packaging electronic components consisting of a film, a low density polyethylene resin (LLDPE) is used as the base resin, and an antistatic resin is used, and polyaniline, polypyrrole, polythiophene, polythiophene, PEDOT (polyethylendioxythiophene) and A surface layer composed of derivatives and copolymers thereof, and a synthetic resin prepared by polymerizing ethylene of high density polyethylene (HDPE: High Density Polyenthylene), comprising: a center layer comprising a resin formed by mixing HDPE, M-PE, and LLDPE; Coating the inner layer 30 and the inner layer sealed with a thickness of 5-20 μm using a low density polyethylene resin (LLDPE) base resin In order to provide a coating layer coated with a PEG, PU, LLDPE-based emulsion aqueous solution by thermal crosslinking to a thickness of 5 ~ 50㎛ on the inner layer, the inside of the surface that is moisture-permeable to the edge surface of the film when sealing the inside of the multilayer structure film It characterized in that consisting of a coating solution to administer to prevent moisture permeation of the sound.

As a preferred feature of the invention, the surface layer is a low-density polyethylene resin (LLDPE) as a base resin, polycarbonate resin, polyacetal resin, acrylic resin, styrene resin, polyester resin, vinyl resin, polyphenylene Ether resins, polyolefin resins, polyamide resins, polyamideimide resins, acrylonitrile-butadiene-styrene copolymer resins, polyarylate resins, polyarylsulfone resins, polyetherimide resins, polyethersulfone resins, polyphenylene sulfones Feed resin, fluorine resin, polyether ketone resin, polyimide resin, polyoxadiazole resin, polybenzoxazole resin, polybenzothiazole resin, polybenzimidazole resin, polypyridine resin, polytriazole resin, polypyrrolidine resin , Polydibenzofuran resin, polysulfone resin, polyphosphazene resin, polyurea resin From there it is configured to selectively use by having at least one thermoplastic resin selected.

As another preferred feature of the present invention, the center layer is based on a synthetic resin prepared by polymerizing ethylene with high density polyethylene (HDPE: High Density Polyenthylene). It consists of what consists of resin mixed with HDPE, M-PE, and LLDPE.

As a preferred feature of the invention, the coating of the coating layer is to be configured to be used by gravure, roll to roll, reverse coating.

The barrier coating aqueous solution for preventing moisture permeability of the film for electronic materials according to the present invention can prevent moisture permeation to a layer having a multi-layered structure of an oligomer single material, and can improve antistatic and heat sealing properties.

In addition, the barrier coating aqueous solution for preventing moisture permeability of the film for electronic materials according to the present invention can be dissolved at a low temperature and improves the sealing property when manufacturing a packaging material, and the coating surface of the film of the oligomeric multilayer structure is applied to the edge surface of the film during sealing. The moisture-permeable side is treated from the inside to be easily removed and reused, thus providing an effect to solve the environmental problems caused by the recycling of resources.

In addition, the barrier coating aqueous solution for preventing moisture permeability of the film for electronic materials according to the present invention minimizes the moisture permeability by coextrusion of LLDPE, LDPE, HDPE, PP, etc. of a single component for each layer, and absorbs moisture from the final coating solution. For example, the moisture that is no longer impregnated by the swelling due to the inflammation mixed with the synthesized material does not affect the product, and it dissolves at low temperature, improving the sealing property when manufacturing the packaging material, and having a slight moisture. It can improve the prevention performance.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

1 is a schematic diagram for explaining the structure for the barrier coating for moisture permeation of the film for electronic materials according to the present invention.
Figure 2 is a schematic diagram showing the object of the substance administered to the structural layer according to Figure 1

Hereinafter, a barrier coating aqueous solution for preventing moisture permeation of an electronic material film according to the present invention with reference to the accompanying drawings. first,

It should be noted that like elements or parts in the figures are denoted by the same reference numerals as much as possible. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

Figure 1 is a schematic diagram for explaining the moisture-proof barrier coating aqueous solution structure of the electronic material film according to the present invention, Figure 2 is a schematic diagram showing the object of the material to be administered to the structural layer according to Figure 1, including an antistatic agent It consists of a surface layer, a central layer provided by a polyolefin film, an inner surface layer having a property of moisture permeation prevention, and a coating layer to which an aqueous emulsion solution for moisture permeation is administered.

The surface layer 10 is applied to reduce and suppress the generation of static electricity in the present invention, and when provided in the form of a bag to form an outer layer surface exposed to the outside.

The surface layer 10 is an antistatic resin using a low density polyethylene resin (LLDPE) as the base resin, polyaniline (polyaniline), polypyrrole (polypyrrole), polythiophene (polythiophene), PEDOT (polyethylendioxythiophene) and derivatives thereof The copolymer etc. are mentioned, for example.

On the other hand, the surface layer 10 in the present invention is a polycarbonate resin, polyacetal resin, acrylic resin, styrene resin, polyester resin, vinyl resin, polyphenylene ether resin, polyolefin resin, polyamide resin according to the application field , Polyamideimide resin, acrylonitrile-butadiene-styrene copolymer resin, polyarylate resin, polyarylsulfone resin, polyetherimide resin, polyethersulfone resin, polyphenylene sulfide resin, fluorine resin, polyetherketone Resin, polyimide resin, polyoxadiazole resin, polybenzoxazole resin, polybenzothiazole resin, polybenzimidazole resin, polypyridine resin, polytriazole resin, polypyrrolidine resin, polydibenzofuran resin, polysulfone At least one thermoplastic resin selected from the group consisting of resins, polyphosphazene resins, and polyurea resins. It can be selectively used.

The central layer 20 may be a synthetic resin prepared by polymerizing ethylene with high density polyethylene (HDPE).

In addition, the center layer 20 is provided with a predetermined thickness using a resin formed by mixing HDPE, M-PE and LLDPE.

The thickness of the center layer 20 proposes a thickness of 5 to 40 μm in the present invention to enable economical manufacturing without causing performance degradation.

On the other hand, the center layer 20 in the present invention can be prepared by adding a colorant according to the properties of the package object, in which the colorant may be carried out by a known technique, in the present invention is a low-cost colorant in general Various colorants, such as cyan and magenta, can be used for the purpose of carbon black or product separation.

In addition, the colorant may be both a dye and a pigment, but if a pigment is used, after mixing with a resin, an appropriate dispersant may be introduced for dispersing, and stirring may be performed for at least 60 minutes using a dispersion device such as a ball mill, a sand mill, or a dynomill. shall.

In addition, the colorant may be used 0.01 to 1 parts by weight with respect to 100 parts by weight of the resin, if the content of the colorant is less than 0.01 parts by weight it is difficult to obtain a sufficient coloring effect, when more than 1 part by weight is economical lowered is preferred Not. In addition, when the particle size is too large, such a colorant hinders the film formation, so that the particle size is preferably as small as possible, and it is more preferable to use a colorant having a particle size of 100 nm or less.

The inner surface layer 30 is a portion to be a sealing bag to be a packaging bag using a low density polyethylene resin (LLDPE) as the surface layer 10 and proposes that the thickness is 5 ~ 20μm.

In order to coat the inner layer 30, the coating layer 40 is coated with a PEG, PU, or LLDPE emulsion aqueous solution to a thickness of 5 to 50 μm on the inner layer 30 to be thermally crosslinked.

At this time, the coating of the coating layer 40 may be used by gravure, roll to roll, reverse coating.

In the case of the packaging material of the electronic material film configured as described above, in general, when the extruded oligomer resin by co-extrusion of each of 3 to 5 layers, the moisture permeability is significantly reduced compared to the extrusion of one layer, and the metallocene PE, etc. are mixed. By forming a layer, it gives a sense of toughness at a low temperature or a high temperature and causes a decrease in moisture permeability. In order to prevent moisture permeation, some hydroxyl substituents having a polyurethane-based property in polyethylene glycol are synthesized and mixed with an LLDPE emulsion solution. After mixing by adjusting pH and coating with coating thickness of 5 to 50 microns, thermal cross-linking gives stability at a temperature of 30 to 50 degrees for more than 24 hours, and sealing it with packaging materials prevents stable sealing and moisture permeation. To provide recyclable packaging.

That is, the present invention minimizes permeation by co-extrusion of single-component LLDPE, LDPE, HDPE, PP, etc. for each layer, and absorbs moisture from the final coating solution by swelling in the inferior mixture mixed with the synthesized material. Moisture is no longer affected by the product moisture, it is dissolved at a low temperature to improve the sealing properties when manufacturing the packaging material, and has a little moisture to improve the antistatic performance.

According to the present invention, the barrier coating aqueous solution for preventing moisture permeation of an electronic material film can be dissolved at a low temperature, improves sealing property in manufacturing a packaging material, and is permeable to the edge surface of the film during sealing by coating the inside of an oligomeric multilayer structure film. By coating the cotton from the inside, it can be easily detached and reused to solve environmental problems caused by the recycling of resources.

It is to be understood that the present invention is not limited to the disclosed embodiment and that various changes and modifications may be made without departing from the spirit and scope of the present invention as set forth in the appended claims. It is obvious to those who have knowledge. It is therefore intended that such variations and modifications fall within the scope of the appended claims.

10: surface layer
20: center layer
30: inner layer
40: coating layer

Claims (4)

In the multilayer film for packaging electronic components comprising a base film of a four-layer electric material by sequentially laminating an outer layer, a central layer, an inner layer and a coating layer,
Surface layer composed of polyaniline, polypyrrole, polythiophene, PEDOT (polyethylendioxythiophene) and derivatives or copolymers thereof using low-density polyethylene resin (LLDPE) as base resin and using antistatic resin )and,
A synthetic resin prepared by polymerizing ethylene of high density polyethylene (HDPE: HDPE), comprising: a core layer 20 having a resin formed by mixing HDPE, M-PE, and LLDPE;
Inner layer 30 sealed with a thickness of 5 ~ 20μm using a low density polyethylene resin (LLDPE),
In order to coat the inner layer 30, PEG, PU, LLDPE-based emulsion aqueous solution is provided as a coating layer 40 coated by heat crosslinking to the inner layer 30 to a thickness of 5 ~ 50㎛,
Barrier coating aqueous solution for preventing moisture permeation of the electronic material film, characterized in that consisting of a coating liquid for administering the inside of the film of the multi-layer structure to be moisture-permeated to the edge surface of the film during sealing to prevent moisture from penetrating the inside.
The method of claim 1, wherein the surface layer,
Low density polyethylene resin (LLDPE) as the base resin, polycarbonate resin, polyacetal resin, acrylic resin, styrene resin, polyester resin, vinyl resin, polyphenylene ether resin, polyolefin resin, polyamide resin, polyamide Mid resin, acrylonitrile-butadiene-styrene copolymer resin, polyarylate resin, polyarylsulfone resin, polyetherimide resin, polyethersulfone resin, polyphenylene sulfide resin, fluorine resin, polyetherketone resin, poly Mid resin, polyoxadiazole resin, polybenzoxazole resin, polybenzothiazole resin, polybenzimidazole resin, polypyridine resin, polytriazole resin, polypyrrolidine resin, polydibenzofuran resin, polysulfone resin, poly With at least one thermoplastic resin selected from the group consisting of phosphazene resin, polyurea resin Optional anti-moisture permeation barrier coating solution of the film for an electronic material, characterized in that configured to use.
The method of claim 1,
The center layer 20 is based on a synthetic resin prepared by polymerizing ethylene with high density polyethylene (HDPE: High Density Polyenthylene). Barrier coating aqueous solution for preventing moisture permeation of the film for electronic materials, characterized in that consisting of a resin composed of HDPE, M-PE and LLDPE mixed.
The method of claim 1,
Coating of the coating layer 40 is a gravure, roll-to-roll, a barrier coating aqueous solution for preventing moisture permeation of the film for electronic materials, characterized in that it is configured to use

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