KR20090083502A - 반도체 패키지 제조용 세라믹 기판 - Google Patents
반도체 패키지 제조용 세라믹 기판 Download PDFInfo
- Publication number
- KR20090083502A KR20090083502A KR1020080009327A KR20080009327A KR20090083502A KR 20090083502 A KR20090083502 A KR 20090083502A KR 1020080009327 A KR1020080009327 A KR 1020080009327A KR 20080009327 A KR20080009327 A KR 20080009327A KR 20090083502 A KR20090083502 A KR 20090083502A
- Authority
- KR
- South Korea
- Prior art keywords
- notch
- substrate
- singulation
- ceramic substrate
- cross
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (2)
- 반도체 패키지의 제조 공정에서 몰딩 공정 후 패키지 유닛 간 기판을 서로 분리하는 스냅 싱귤레이션 공정에서 패키지 유닛 간 경계부위의 싱귤레이션 라인을 따르는 크랙 발생을 유도하기 위해 상기 싱귤레이션 라인을 따라 상면과 하면에 각각 노치가 형성된 반도체 패키지 제조용 세라믹 기판에 있어서,상기 상면에 형성된 노치의 단면 구조가 양 측방으로 위치되는 두 개의 하단 모서리를 가지는 사각 단면 구조로 형성되어 있는 것을 특징으로 하는 반도체 패키지 제조용 세라믹 기판.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080009327A KR100914051B1 (ko) | 2008-01-30 | 2008-01-30 | 반도체 패키지 제조용 세라믹 기판 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080009327A KR100914051B1 (ko) | 2008-01-30 | 2008-01-30 | 반도체 패키지 제조용 세라믹 기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090083502A true KR20090083502A (ko) | 2009-08-04 |
KR100914051B1 KR100914051B1 (ko) | 2009-08-28 |
Family
ID=41204275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080009327A KR100914051B1 (ko) | 2008-01-30 | 2008-01-30 | 반도체 패키지 제조용 세라믹 기판 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100914051B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101383254B1 (ko) * | 2012-07-18 | 2014-04-10 | 삼화콘덴서공업주식회사 | 박막 커패시터의 제조방법 |
WO2014078320A1 (en) * | 2012-11-16 | 2014-05-22 | Electro Scientific Industries, Inc. | Method and apparatus for processing a workpiece and an article formed thereby |
US10885894B2 (en) | 2017-06-20 | 2021-01-05 | Korea Advanced Institute Of Science And Technology | Singing expression transfer system |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284291A (ja) * | 2000-03-31 | 2001-10-12 | Toyoda Gosei Co Ltd | 半導体ウエハーのチップ分割方法 |
JP2006278610A (ja) | 2005-03-29 | 2006-10-12 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
-
2008
- 2008-01-30 KR KR1020080009327A patent/KR100914051B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101383254B1 (ko) * | 2012-07-18 | 2014-04-10 | 삼화콘덴서공업주식회사 | 박막 커패시터의 제조방법 |
WO2014078320A1 (en) * | 2012-11-16 | 2014-05-22 | Electro Scientific Industries, Inc. | Method and apparatus for processing a workpiece and an article formed thereby |
US10885894B2 (en) | 2017-06-20 | 2021-01-05 | Korea Advanced Institute Of Science And Technology | Singing expression transfer system |
Also Published As
Publication number | Publication date |
---|---|
KR100914051B1 (ko) | 2009-08-28 |
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