KR20090073746A - Probe card - Google Patents

Abstract

A probe card is to minimize the damage of the flexible substrate by connecting the flexible substrate and main substrate by using a socket part. The probe substrate comprises a probe(110), a first guide, a second guide, a first bar, a flexible substrate(160) and main substrate(170). The flexible substrate is connected to the probe and delivers the electric signal. The flexible substrate is connected to the main substrate and delivers the electric signal. The flexible substrate is connected to main substrate by a socket part(172). The socket part is installed on the main substrate.

Description

Probe Card

The present invention relates to a probe card in contact with an electrode pad of a semiconductor chip to determine whether the semiconductor chip is defective. More specifically, the present invention relates to a probe card that can be less affected by noise signals applied from the outside by reducing the signal transmission path from the main substrate to the probe.

In general, a semiconductor device is manufactured through a fabrication process of forming a pattern on a wafer and an assembly process of assembling the wafer on which the pattern is formed into individual chips, and between the fabrication process and the assembly process. An electrical die sorting (EDS) process is performed to examine electrical characteristics of each chip constituting the wafer.

The EDS process is a process for determining a defective chip among the chips constituting the wafer, that is, applying an electrical signal to each chip constituting the wafer to determine whether the defect is determined by a signal checked from the applied electrical signal. To this end, it is necessary to have a probe card including a probe for applying an electrical signal while being in direct contact with the pattern of each chip on the wafer.

Typically, a probe card includes a main substrate, a sub substrate (or a ceramic substrate called a space transformer), an interface means for interfacing the main substrate and the sub substrate (or probe), and a probe for directly transmitting an electrical signal to the semiconductor chip. It is made by the basic configuration.

Recently, semiconductor devices are becoming increasingly integrated, and therefore, development of probe cards for highly integrated semiconductor devices is essential. In the probe card for the highly integrated semiconductor device, the role of the interface means for connecting the main board and the sub board is very important. The interface means should allow the electrical signal transmission from the main substrate to the sub-substrate accurately while gradually reducing the circuit pattern from the main substrate to the sub-substrate.

In the conventional probe card, the interface means is a rod or wire having a circular or elliptical cross section, and the upper and lower portions thereof are connected to the main substrate and the sub substrate by welding or soldering so that electrical signals are transmitted. But. Since the conventional interface means has little connection flexibility, there is a problem in that damage (that is, damage to the welded or soldered portion between the substrate and the interface means) is generated by the impact that may occur during the contact process between the probe and the pad.

A probe card for solving the above problems has been disclosed in Korean Utility Model Registration No. 0394134.

1 is a view showing the configuration of a probe card according to the prior art. 2 is a diagram illustrating a configuration of a needle block applied to the probe card of FIG. 1.

As shown, the conventional probe card is a main board member 10, a flexible substrate member 20 that is detachably coupled to the main substrate member 10, the upper reinforcing plate member 30, the flexible substrate member 20 A guide plate member 40 having a plurality of long holes formed at regular intervals so that the plurality of holes can pass therethrough, and a plurality of socket members 50 through which flexible board members penetrate and screwed to the guide plate member 40; The upper and lower connection ends are each formed with a needle block 60 having a plurality of needles 62 embedded therein, and a circuit pattern connected to the other end pattern of the flexible substrate member so that the upper and lower connection ends are finely projected upwards and downwards. The bonding pattern is formed to be electrically connected to the connecting end which protrudes upward of the needle 62 of the needle block while the bonding pattern is formed, and the connecting pattern between the upper and lower surfaces is electrically connected to each other, and the lower substrate. The reinforcing plate member 80 is comprised.

However, the conventional probe card configured as described above has the following problems. First, there is a problem in that it takes a long time to manufacture a probe card by manually connecting the sub substrate, the needle and the needle block, the sub substrate and the flexible substrate, the flexible substrate, and the main substrate. In addition, since the load of the card assembly is increased because of the plurality of substrate members, there is a problem in that the bending of the substrate member occurs. In addition, by mounting the flexible substrate in the socket through the main substrate, there is a problem that damage to the flexible substrate occurs to inhibit signal transmission.

Accordingly, an object of the present invention is to provide a probe card capable of minimizing deformation, such as bending, by reducing the load by providing only a guide and a bar as a structure. In addition, an object of the present invention is to provide a probe card that is easy to repair and easy to manufacture by having a configuration for connecting a signal line to a flexible substrate coupled to the socket portion provided on the main substrate.

In addition, an object of the present invention is to provide a probe card that can minimize the damage to the flexible substrate by having a configuration in which the flexible substrate is coupled to the socket portion provided on the upper surface of the main substrate without penetrating the main substrate.

In order to achieve the above object, the probe card according to the present invention comprises a probe in contact with the electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective; A first guide supporting the probe, wherein the first guide is formed with a hole through which the probe is inserted; A second guide for receiving a portion of the probe; A first bar supporting the first guide while receiving the probe penetrating the first guide; A flexible substrate connected to the probe to transmit an electrical signal to the probe; And a main substrate connected to the flexible substrate so that an electrical signal is transmitted to the flexible substrate, wherein the flexible substrate and the main substrate are connected through a socket part provided on the main substrate.

The probe may include a body portion having a shape of “a” passing through the first guide; A post part formed at one end of the body part; And a tip part formed at one end of the post part to be in contact with a pad of the semiconductor chip, and a protruding part may be formed on a side of the body part to prevent the body part from falling downward from the first guide.

The body portion and the protrusion may be fixed with the first guide and epoxy.

The material of the first and second guides may include silicon.

The display device may further include a second bar connected to a bottom surface of the first bar to support the first bar.

The material of the first and second bars may include invar.

The probe and the flexible substrate may be connected through a conductive line.

Reinforcing members for preventing deformation of the main substrate may be connected to the main substrate.

According to the present invention, by providing only the configuration of the guide and the bar as a structure of the probe card, the load is reduced, thereby reducing the deformation such as bending.

In addition, according to the present invention, by providing a configuration for connecting the signal line to the flexible substrate coupled to the socket portion provided on the main substrate there is an effect that is easy to repair and easy to manufacture.

In addition, according to the present invention, the flexible substrate is provided with a configuration coupled to the socket portion provided on the upper surface of the main substrate without penetrating the main substrate, thereby minimizing damage to the flexible substrate.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art may easily implement the technical idea of the present invention. do.

3 and 4 are cross-sectional views and exploded perspective views showing the configuration of the probe card 100 according to an embodiment of the present invention. 5 is a perspective view illustrating a connection state between the probe 110 and the signal line 164.

3 and 4, the probe card 100 includes a probe 110, first and second guides 120 and 130, first and second bars 140 and 150, a main substrate 170, and The reinforcing member 180 is a main configuration.

The probe 110 contacts the electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective. Here, the material used to fabricate the probe 110 may include tungsten (W), copper (Cu), nickel-cobalt (Ni-Co) alloy, beryllium-copper (Be-Cu), or the like.

In the present invention, the probe 110 includes a body portion 112, a post portion 114, a tip portion 116, and a protruding terminal portion 118.

The body portion 112 has a vertical portion 112a and a horizontal portion 112b connected to each other to be formed in a "b" shape, and a post portion 114 having a predetermined length is formed at an end of the horizontal portion 112b. In addition, as the horizontal cross-sectional area is gradually reduced at the end of the post portion 114, the tip portion 116 is formed in a polygonal or conical shape so that the tip portion 116 directly contacts the pad of the semiconductor chip. The protruding terminal portion 118 protruding from the body portion 112 is formed near the middle of the body portion 112. The protruding terminal portion 118 is formed to protrude in opposite directions with respect to the body portion 112 of the probe 110. Protruding terminal portion 118 is preferably formed in the same shape and size.

The body part 112, the post part 114, the tip 116, and the protruding terminal part 118 constituting the probe 110 are integrally manufactured using an electroplating method or a fine pattern processing method. The probe 110 is preferably manufactured to have a thickness in the range of 30 to 50 μm.

The signal line 164 is soldered to the end of the vertical portion 112a of the body 112 constituting the probe 110, and the circuit pattern of the probe 110 and the main substrate 170 to be described later is connected to the signal line 164. A flexible printed circuit (FPCB) 160 for connecting is soldered.

The first guide 120 serves to fix and support the probe 110. Referring to FIG. 4, the plurality of probes 110 are inserted into the first guide 120 in two rows, and the probes 110 in each row have an opposite structure.

In general, the guide used in the probe card is fixed to support the probe to prevent the probe from moving from its original position by moving in the X- or Y-axis direction due to the pressure generated when the probe and the electrode pad of the semiconductor chip contact each other. As the semiconductor chip is highly integrated, the gap between the pads of the semiconductor chip decreases, and thus the gap between the probes decreases, so that electrical contact between the probes may occur, so that the guide may serve as an insulating film between the probes.

The vertical part 112a of the body part 112 penetrates and is supported by the first guide 120 through the through hole 122. At this time, the protruding terminal portion 118 is in contact with the upper surface of the first guide 120, the degree of penetration of the probe 110 is limited, and as a result, the probe 110 does not escape downward from the first guide 120. . The protruding terminal portion 118 is firmly fixed to the upper surface of the first guide 120 by the epoxy molding 190, and in this process, the epoxy molding 190 also comes into contact with the body portion 112, so that the probe 110 is formed. 1 Guide 120 may be more firmly fixed support. In a state where the protruding terminal portion 118 is fixed to the first guide 120, the horizontal portion 112b is spaced apart from the upper surface of the first guide 120.

Meanwhile, in the present invention, a plurality of first guides 120 may be installed, and a plurality of probes 110 may be fixedly supported on each of the first guides 120. For example, a plurality of probes 110 capable of measuring electrical characteristics of five device under tests (DUTs), that is, five semiconductor chips, may be inserted and received in one first guide 120. A plurality of guides 120 may be assembled to manufacture a probe card. As a result, even when some of the probes are damaged, only the guide in which the corresponding probe is installed can be removed from the probe card, thereby facilitating repair of the probe card.

The second guide 130 serves to minimize the interference between the probes 110 by limiting the range of motion of the probes 110. The second guide 130 is disposed in a spaced space between the horizontal portion 112b of the body portion 112 and the upper surface of the first guide 120, particularly when the tip portion 116 is in contact with the electrode pad. A predetermined portion of the probe 110 is installed directly below the tip portion 116 to be easily received. The second guide 130 is provided with a receiving groove 132 in which a predetermined portion of the probe 110, that is, a portion of the horizontal portion 112b and the post portion 114 is accommodated. That is, the probe 110 is limited in a range in which a predetermined portion is accommodated in the receiving groove 132 of the second guide 130. In particular, when the probe 110 is in contact with the electrode pad of the semiconductor chip, the movement of the probe 110 in the horizontal direction can be suppressed as much as possible, thereby minimizing the influence between the probes 110. In addition, the impact received when the probe 110 contacts the electrode pad of the semiconductor chip by the second guide 130 may be alleviated. As described above, in the present invention, the probe 110 is fixedly supported by the first 120 and the second guide 120 so that the position control of the probe can be finely adjusted so that the probe can easily contact the terminal of the highly integrated device. There is an advantage to that.

It is preferable to use silicon as the material of the first and second guides 120 and 130. This is because silicon can be microfabricated to manufacture micrometer-level unit structures, and it is easy to form an insulating film that may be necessary when applied to an electronic device such as a probe card.

The first and second guides 120 and 130 may be manufactured separately and then may be installed to be combined with each other or may be manufactured integrally. In the former case, the first and second guides 120 and 130 are joined using epoxy molding (not shown).

The first bar 140 supports the first guide 120 while receiving the probe 110 penetrating the first guide 120. The first bar 140 is disposed below the first guide 120, and the first bar 140 is formed with a first hole 142 to accommodate the probe 110. Here, the diameter of the first hole 142 is formed sufficiently larger than the size of the vertical portion 112a of the body portion 112 so that the outer periphery of the vertical portion 112a of the body portion 112 and the inner circumference of the first hole 142. It is desirable to make the spaced apart. The first bar 140 is bonded to the first guide 120 using an epoxy molding 190.

The second bar 150 supports the first bar 140. The second bar 150 is disposed below the first bar 140, and the second bar 150 has a second hole 152 formed therein to accommodate the signal line 164 connected to the probe 110. do.

It is preferable to use Invar as the material of the first and second bars 140 and 150. This is because it is possible to minimize various changes in characteristics of the probe card due to temperature changes. The first bar 140 and the second bar 150 are bonded using the epoxy molding 190.

The signal line 164 accommodated in the second hole 152 formed in the second bar 150 is connected to the flexible substrate 160 connected to the socket portion 172 of the main substrate 170, which will be described later. In the flexible substrate 160, wirings are formed for each signal line 164 connected to each of the probes 110, and first contact terminals 162 for connecting to the sockets 172 are formed at each wiring end. A signal applied in a circuit pattern of the main substrate 170 may be applied to each probe 110.

As such, the probe card of the present invention has the advantage of minimizing deformation such as bending by reducing the load by providing only the guide and the bar as a structure.

5 is a perspective view illustrating the configuration of the probe unit 110A. As shown, the probe unit 110A includes a probe card 100 including a plurality of probes 110 / first and second guides 120 and 130 and first and second bars 140 and 150. It is the basic unit that constitutes. That is, the probe card 100 is manufactured by connecting the plurality of probe units 110A to the main board 170 to be described later.

The main board 170 corresponds to, for example, a printed circuit board (PCB), and is a board on which a circuit pattern for applying an electrical signal to the probe 110 is formed. The bottom of the second bar 150 is fixed.

A socket part 172 is formed on the main board 170 to receive an external signal, and the circuit pattern of the main board 170 penetrates the inside of the main board 170 in the socket 172 part. A second contact terminal 174 is connected to (not shown).

As a result, the electric signal in the probe card 110 is finally passed through the circuit pattern / main board 170 of the main board 170, the socket part 172, the flexible board 160, the signal line 164, and the probe 110 of the main board 170. It is applied to the electrode pad of a semiconductor chip.

A connection relationship between the socket 172 and the flexible substrate 160 will be described in more detail with reference to FIG. 6 as follows.

Wires are formed in the flexible substrate 160 for each signal line 164 connected to each of the probes 110, and a first contact terminal 162 is provided at an end of the wire. As shown in FIG. 6A, the first contact terminal 162 is formed at the end of the flexible substrate 160 and is coupled to the socket 172.

The second contact terminal 174 coupled to the first contact terminal 162 is installed in the socket 172. The first contact terminal 162 is formed in a rod shape, and the end of the second contact terminal 174 is bent in a “U” shape. Therefore, the first contact terminal 162 is inserted into the second contact terminal 174 to be in elastic contact. In this case, a protrusion may be formed at an end portion of the second contact terminal 174 to improve contact between the first contact terminal 162 and the second contact terminal 174 and to facilitate the maintenance of the state of being coupled to each other. have. In addition, the shapes of the first contact terminal 162 and the second contact terminal 174 are not necessarily limited to those illustrated in FIG. 6 as long as they can be in contact with each other to transmit a signal and maintain a contact state.

As a result, the first contact terminal 162 is brought into contact with the second contact terminal 174, and then a predetermined pressure is applied to the flexible substrate 160 (see FIG. 6A). And the second contact terminal 174 are coupled so that an electrical signal can be transmitted from the main substrate 170 to the probe 110 through the first contact terminal 162 and the second contact terminal 174 coupled to each other. (See Fig. 6 (b)).

As described above, the probe card of the present invention is easier to repair than the conventional probe card because the circuit pattern of the probe 110 and the main substrate 170 is connected by using the flexible substrate 160 and the socket portion 172. This has the advantage of being easier. In addition, the flexible substrate 160 has an advantage of minimizing damage to the flexible substrate 160 by having a configuration in which the flexible substrate 160 is coupled to the socket portion 172 provided on the upper surface of the main substrate without penetrating the main substrate 170. .

A reinforcing member 180 is disposed below the main substrate 170 to support the main substrate 170 and prevent the main substrate from being bent downward by an external force. The reinforcing member 180 is coupled to the main substrate 170 using bolts 182.

7 is a perspective view illustrating a coupling state of the probe unit 110A and the main substrate 170. As shown, the probe unit 110A is coupled to the main substrate 170 by bolts 182.

8 is a perspective view showing the final completion state of the probe card 100 according to an embodiment of the present invention. As illustrated, the probe card 100 is manufactured by assembling a plurality of probe units 110A meeting the specifications of the probe card to the main board 170.

Although the present invention has been shown and described with reference to preferred embodiments as described above, it is not limited to the above embodiments and should be made by those skilled in the art without departing from the spirit of the invention. Many variations and modifications are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

1 is a view showing the configuration of a probe card according to the prior art.

FIG. 2 is a diagram illustrating a configuration of a needle block used in the probe card of FIG. 1. FIG.

3 is a cross-sectional view showing the configuration of a probe card according to an embodiment of the present invention.

Figure 4 is an exploded perspective view showing the configuration of a probe card according to an embodiment of the present invention.

5 is a perspective view illustrating a configuration of a probe unit.

6 is a view for explaining a coupling relationship between a flexible substrate and a socket portion.

7 is a perspective view illustrating a coupling state of a probe unit and a main substrate.

8 is a perspective view showing the final completion state of the probe card according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: probe card

110: probe

110A: Probe Unit

112: body part

114: post part

116: tip portion

118: protruding terminal portion

120: first guide

122: through hole

130: second guide

132: accommodation home

140: first bar

142: first hole

150: second bar

152: second hall

160: flexible substrate

162: first contact terminal

164: signal line

170: main board

172: socket

174: second contact terminal

180: reinforcing member

182: Bolt

190: epoxy molding

Claims (8)

A probe in contact with an electrode pad of the semiconductor chip to determine whether the semiconductor chip is defective; A first guide supporting the probe, wherein the first guide is formed with a hole through which the probe is inserted; A second guide for receiving a portion of the probe; A first bar supporting the first guide while receiving the probe penetrating the first guide; A flexible substrate connected to the probe to transmit an electrical signal to the probe; And A main substrate connected to the flexible substrate so that an electrical signal is transmitted to the flexible substrate Including; And the flexible substrate and the main substrate are connected through a socket part provided on the main substrate. The method of claim 1, The probe, A body portion having a shape of “a” passing through the first guide; A post part formed at one end of the body part; And A tip portion formed at one end of the post portion and in contact with a pad of the semiconductor chip Including; The side of the body portion is a probe card, characterized in that the protrusion is formed so that the body portion does not escape downward from the first guide. The method of claim 2, And the body portion and the protrusion are fixed with the first guide and epoxy. The method of claim 1, Probe card, characterized in that the material of the first and second guide comprises silicon. The method of claim 1, And a second bar connected to a bottom surface of the first bar to support the first bar. The method of claim 5, Probe card, characterized in that the material of the first and second bars include invar (invar). The method of claim 1, And the probe and the flexible substrate are connected through a conductive line. The method of claim 1, And a reinforcing member connected to the main substrate to prevent deformation of the main substrate.

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