CN110349923A - A kind of CMOS chip flexible support structure - Google Patents
A kind of CMOS chip flexible support structure Download PDFInfo
- Publication number
- CN110349923A CN110349923A CN201910618369.1A CN201910618369A CN110349923A CN 110349923 A CN110349923 A CN 110349923A CN 201910618369 A CN201910618369 A CN 201910618369A CN 110349923 A CN110349923 A CN 110349923A
- Authority
- CN
- China
- Prior art keywords
- chip
- support structure
- flexible arm
- flexible
- cmos chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of CMOS chip flexible support structure, including soft section, the soft section include support frame and flexible arm, and the multiple flexible arm is evenly arranged on the outside of the support frame, and each flexible arm is equipped with the soft slot of S type that radial distribution bending is formed.Chip is influenced to be deformed in refrigeration work by temperature change, and the soft slot of S type can absorb the deformation of chip, is reduced flexible support structure to the pulling force of chip, can be effectively reduced the variation of chip surface face shape PV value, keep chip performance more excellent.
Description
Technical field
The invention belongs to remote sensing technology field, in particular to a kind of CMOS chip flexible support structure.
Background technique
For Space Remote Sensors when being detected, the superiority and inferiority of imager chip performance is directly related to the good of remote sensor image quality
It is bad.Particularly with the remote sensor for carrying out space exploration, image device usually works under refrigerating environment, to the light of image device
Electrical property has very high requirement, and the structural parameters such as position to detector and surface face shape PV value also have very high requirement.
Traditional detector mounting means predominantly rigidly fixes installation, and mechanical environment smaller for size requires not tight
The detector of lattice, is installed as a whole after usually chip pin is soldered on pcb board；It is biggish to volume weight
Under detector or the more demanding operating condition of environmental mechanics, usually detector is installed to corresponding outline border, installation is fixed.
It is the decline for not adapting to surface face shape PV value caused by chip is deformed by temperature loading that detector, which rigidly fixes the shortcomings that installation,
Component is when by temperature loading, due to multichip ceramic substrate and the swollen mismatch of support construction line of material, chip and support construction
Between can generate relative deformation.
Summary of the invention
In view of this, being solved in the prior art it is an object of the invention to propose a kind of CMOS chip flexible support structure
Existing chip does not adapt to the problem of face shape PV value caused by being deformed by temperature loading declines.
To achieve the above object, the flexible support structure of a kind of CMOS chip of the invention, including soft section, the soft section packet
Support frame and flexible arm are included, the multiple flexible arm is evenly arranged on the outside of the support frame, and each flexible arm is equipped with radial distribution
The soft slot of S type that bending is formed.
Preferably, the multiple flexible arm is 3 or 4.
Preferably, the multiple flexible arm is 3.
It preferably, further include chip, heat conduction copper sheet and nut, metal installation base, the metal is arranged in the chip lower end
Screw rod is arranged in mounting base lower end, and the heat conduction copper sheet and the flexible arm are equipped with through-hole compatible with screw rod, and the screw rod is worn
The through-hole is crossed, the nut is mounted on the screw rod, tightens the nut for the heat conduction copper sheet and the flexible arm pressure
Tightly in the metal installation base.
Preferably, the heat conduction copper sheet is mounted between the metal installation base and soft section.
The beneficial effects of the present invention are: the flexible support structure of CMOS chip provided by the invention, for leading for refrigeration
Hot copper sheet is between soft section and chip；For multiple flexible arm circumference uniform distributions on the outside of support frame, the installation that can satisfy chip is fixed
Position requires, and each flexible arm is equipped with the radially-arranged soft slot of S type, reduces radial rigidity, chip is in refrigeration work Shi Shouwen
Degree variation influences to be deformed, and the soft slot of S type can absorb the deformation of chip, reduce soft section to the pulling force of chip, can be effective
Ground reduces the variation of chip surface face shape PV value, keeps chip performance more excellent.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of CMOS chip flexible support structure of the present invention；
Fig. 2 is the front view of CMOS chip flexible support structure of the present invention；
Fig. 3 is the structural schematic diagram of the soft section of the present invention.
Wherein: 1- chip；2- metal installation base；3- heat conduction copper sheet；The soft section of 4-；41- support frame；42- flexible arm；421-S
The soft slot of type；5- nut.
Specific embodiment
The present invention is described in more detail with reference to the accompanying drawings and examples.
In conjunction with shown in Fig. 1 and Fig. 2: a kind of flexible support structure of CMOS chip provided by the invention, including soft section 4, it is soft
Section 4 includes support frame 41 and flexible arm 42, and multiple flexible arms 42 are evenly arranged on 41 outside of support frame, and the installation that can satisfy chip is fixed
Position requires, and each flexible arm 42 is equipped with the soft slot 421 of S type that radial distribution bending is formed, and reduces radial rigidity, chip is being made
It is influenced to be deformed by temperature change when cold work, the soft slot of S type can absorb the deformation of chip, reduce flexible support structure pair
The pulling force of chip can be effectively reduced the variation of chip surface face shape PV value, keep chip performance more excellent.
The soft slot of S type can be formed by a S type structure or multiple S type folded structures.
Further, multiple flexible arms 42 are 3 or 4.
Multiple flexible arms are 3.
The shape of support frame 41 is round or regular polygon.
As shown in Figure 3: in the present embodiment, the shape of support frame 41 is positive triangle, and the quantity of flexible arm is three, equal respectively
Cloth is on three angles on the outside of positive triangle.
It further include chip 1, heat conduction copper sheet 3 and nut 5, metal installation base 2,2 lower end of metal installation base is arranged in 1 lower end of chip
Screw rod is set, and heat conduction copper sheet 3 and flexible arm 42 are equipped with through-hole compatible with screw rod, and screw rod passes through through-hole, and nut 5 is mounted on spiral shell
On bar, tightens nut and heat conduction copper sheet 3 and flexible arm 42 are pressed in metal installation base 2.
Heat conduction copper sheet 3 is mounted between metal installation base 2 and soft section 4.
The flexible support structure of CMOS chip provided by the invention, the heat conduction copper sheet for refrigeration be located at soft section and chip it
Between directly contacted with chip, multiple flexible arm circumference uniform distributions can satisfy the installation positioning requirements of chip on the outside of support frame；Often
A flexible arm is equipped with the radially-arranged soft slot of S type, reduces radial rigidity, chip is influenced in refrigeration work by temperature change
It can be deformed, the soft slot of S type can absorb the deformation of chip, and reduction flexible support structure, can be effectively to the pulling force of chip
The variation for reducing chip surface face shape PV value, keeps chip performance more excellent.
It should also be noted that, the terms "include", "comprise" or its any other variant are intended to nonexcludability
It include so that the process, method, commodity or the equipment that include a series of elements not only include those elements, but also to wrap
Include other elements that are not explicitly listed, or further include for this process, method, commodity or equipment intrinsic want
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including described want
There is also other identical elements in the process, method of element, commodity or equipment.
The above description is only an example of the present application, is not intended to limit this application.For those skilled in the art
For, various changes and changes are possible in this application.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of the claims of this application.
Claims (5)
1. a kind of CMOS chip flexible support structure, which is characterized in that including soft section (4), the soft section (4) includes support frame
(41) with flexible arm (42), the multiple flexible arm (42) circumference uniform distribution is on the outside of the support frame (41), each flexible arm
(42) it is equipped with the soft slot of S type (421) that radial distribution bending is formed.
2. CMOS chip flexible support structure as described in claim 1, which is characterized in that the multiple flexible arm (42) is 3
Or 4.
3. CMOS chip flexible support structure as claimed in claim 2, which is characterized in that the multiple flexible arm (42) is 3.
4. CMOS chip flexible support structure as described in claim 1, which is characterized in that further include chip (1), heat conduction copper sheet
(3) and metal installation base (2) are arranged in nut (5), chip (1) lower end, and screw rod is arranged in metal installation base (2) lower end,
The heat conduction copper sheet (3) and the flexible arm (42) are equipped with through-hole compatible with screw rod, and the screw rod passes through the through-hole, institute
It states nut (5) to be mounted on the screw rod, tightens the nut (5) and press the heat conduction copper sheet (3) and the flexible arm (42)
Tightly on the metal installation base (2).
5. CMOS chip flexible support structure as claimed in claim 4, which is characterized in that the heat conduction copper sheet (3) is mounted on institute
It states between metal installation base (2) and soft section (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910618369.1A CN110349923A (en) | 2019-07-10 | 2019-07-10 | A kind of CMOS chip flexible support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910618369.1A CN110349923A (en) | 2019-07-10 | 2019-07-10 | A kind of CMOS chip flexible support structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110349923A true CN110349923A (en) | 2019-10-18 |
Family
ID=68176952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910618369.1A Pending CN110349923A (en) | 2019-07-10 | 2019-07-10 | A kind of CMOS chip flexible support structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110349923A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008302499A (en) * | 2007-06-05 | 2008-12-18 | Toyota Motor Corp | Jig for cooling piping and method for manufacturing cooling apparatus |
| JP2010194896A (en) * | 2009-02-25 | 2010-09-09 | Brother Ind Ltd | Substrate storage member, and liquid delivery device |
| KR101317251B1 (en) * | 2007-12-31 | 2013-10-10 | (주) 미코에스앤피 | Probe Card |
| CN203491869U (en) * | 2013-09-02 | 2014-03-19 | 比亚迪股份有限公司 | Motor and lens module group |
| CN103792645A (en) * | 2014-01-24 | 2014-05-14 | 中国科学院长春光学精密机械与物理研究所 | Small reflector ultrahigh power thermal stability supporting structure |
| CN109116502A (en) * | 2018-08-15 | 2019-01-01 | 中国科学院光电技术研究所 | Optical element flexible support and surface shape precision improving method |
| CN109683278A (en) * | 2019-01-30 | 2019-04-26 | 杭州电子科技大学 | Heavy caliber infrared telescope adjustable support based on gradient type porous structure |
-
2019
- 2019-07-10 CN CN201910618369.1A patent/CN110349923A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008302499A (en) * | 2007-06-05 | 2008-12-18 | Toyota Motor Corp | Jig for cooling piping and method for manufacturing cooling apparatus |
| KR101317251B1 (en) * | 2007-12-31 | 2013-10-10 | (주) 미코에스앤피 | Probe Card |
| JP2010194896A (en) * | 2009-02-25 | 2010-09-09 | Brother Ind Ltd | Substrate storage member, and liquid delivery device |
| CN203491869U (en) * | 2013-09-02 | 2014-03-19 | 比亚迪股份有限公司 | Motor and lens module group |
| CN103792645A (en) * | 2014-01-24 | 2014-05-14 | 中国科学院长春光学精密机械与物理研究所 | Small reflector ultrahigh power thermal stability supporting structure |
| CN109116502A (en) * | 2018-08-15 | 2019-01-01 | 中国科学院光电技术研究所 | Optical element flexible support and surface shape precision improving method |
| CN109683278A (en) * | 2019-01-30 | 2019-04-26 | 杭州电子科技大学 | Heavy caliber infrared telescope adjustable support based on gradient type porous structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101242723A (en) | Spring slice fixing structure and heat radiation module | |
| CN102811588A (en) | Electronic equipment | |
| CN111024235B (en) | Infrared focal plane supporting structure with thermal stress unloading function | |
| US11264305B2 (en) | Heat sink load balancing apparatus | |
| WO2017118198A1 (en) | Elastic support structure and display device including same | |
| US20070115641A1 (en) | Heat sink apparatus | |
| CN110349923A (en) | A kind of CMOS chip flexible support structure | |
| WO2019024656A1 (en) | Floating-type heat sink and elastic bracket therefor | |
| CN106255403B (en) | Tooling device for the installation of dual-in-line imaging sensor connector | |
| CN204795321U (en) | Camera and device of jiao's adjustment thereafter with burnt adjustment device in back | |
| CN209609107U (en) | Teeth radiator and optical communication equipment | |
| CN102681634A (en) | Radiator | |
| CN211901258U (en) | Connecting piece, folding screen and electronic equipment of folding screen | |
| CN208547785U (en) | A kind of liquid crystal display die set test board | |
| CN204423289U (en) | A kind of heat radiation module and electronic equipment | |
| CN206927075U (en) | A kind of pcb board flashboard rack | |
| CN206742234U (en) | Ceramic pinboard for the installation of large-size ceramic shell | |
| CN110146383A (en) | A kind of Poron foam shock resistance detection device | |
| CN101394731A (en) | Heat radiator | |
| CN214123859U (en) | Integrated circuit packaging shell | |
| CN221429231U (en) | Round lead device forming tool | |
| CN220474595U (en) | Wafer transfer device convenient for replacing sensor | |
| CN104923450A (en) | Optical fiber array dispensing device | |
| CN220065551U (en) | Patch reed switch | |
| CN211489417U (en) | Electronic components pin crib crimper |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191018 |
|
| RJ01 | Rejection of invention patent application after publication |