JP2010194896A - Substrate storage member, and liquid delivery device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate storage member capable of miniaturizing a device installed with a flexible substrate, and a liquid delivery device. <P>SOLUTION: This substrate storage member 64 includes a base part 170, the first component support part 172 formed projected from the base part 170, and having the first support face 190a for supporting the first driver IC together with one part of the first flexible substrate, and the second component support part 174 formed projected from the base part 170 along the same direction same to that of the first component support part 172, formed separated from the first component support part 172, and having the second support face 194a for supporting the second driver IC together with one part of the second flexible substrate, and a storage space J for storing the other parts of the first flexible substrate F1 and the second flexible substrate F2 is constituted in an area in a base part 170 side of the first support face 190a and the second support face 194a between the first component support part 172 and the second component support part 174. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides a first flexible substrate having flexibility and a first electronic component disposed on a surface thereof, and a second flexible substrate having a second electronic component disposed on a surface thereof. The present invention relates to a substrate accommodation member that accommodates a flexible substrate, and a liquid ejection apparatus that includes the substrate accommodation member.

  As one of “liquid ejecting apparatuses” that eject liquid toward an ejection target, an “ink ejecting apparatus” of an ink jet printer is well known, and an example thereof is disclosed in Patent Document 1. The “ink ejection device” of Patent Document 1 includes a plurality of nozzles that eject ink, and a plurality of pressure chambers that individually communicate with the nozzles, and a plurality of pressure chambers that individually correspond to the pressure chambers. Lands (individual electrode terminals) on the surface, an actuator unit that applies discharge pressure to ink in a pressure chamber corresponding to the land based on an actuator driving voltage applied to the land, and an actuator for each of the lands And a flexible substrate having a plurality of connection wirings for applying a driving voltage. The flexible substrate is divided into a first flexible substrate for applying an actuator driving voltage to a group of lands and a second flexible substrate for applying an actuator driving voltage to another group of lands. Each of the first flexible substrate and the second flexible substrate is provided with a driver IC for generating an actuator drive voltage, and the first flexible substrate and the second flexible substrate are mounted with the flow path unit and the actuator unit. Is routed around the driver IC.

JP 2005-324453 A

  In the conventional ink ejection device, the flexible substrate is divided into two, and in the two flexible substrates, since the connection wiring is drawn out from the land of the actuator unit in different directions, the connection wiring drawn out to either one of them The number of connection wires can be reduced, and an increase in the number of connection wirings accompanying the increase in nozzle density can be easily accommodated. However, since it is necessary to secure two paths for routing the two flexible substrates, there is a problem that the apparatus in which the flexible substrate is incorporated is enlarged. As a means to solve this problem, it is considered that each of the two flexible boards is appropriately folded and routed along a path suitable for miniaturization. However, “to dissipate the heat generated in the driver IC” It is not easy to fold a flexible board in consideration of "preventing the heat from adversely affecting other components (actuator unit, etc.)". It was not possible to reduce the size sufficiently.

  SUMMARY An advantage of some aspects of the invention is that it provides a substrate housing member and a liquid ejection device capable of downsizing an apparatus in which a flexible substrate is incorporated.

  In order to solve the above-described problems, a substrate housing member according to the present invention has a flexible first surface on which a first electronic component is disposed and a flexible surface. A substrate housing member that houses a second flexible substrate on which a second electronic component is disposed, and is formed to protrude from the base portion and the base portion, and the first electronic component is disposed on the first flexible substrate. A first component support portion having a first support surface that is supported together with a part of the first component support portion, protruding from the base portion in the same direction as the first component support portion, and spaced apart from the first component support portion. A second component support portion having a second support surface for supporting the second electronic component together with a part of the second flexible substrate, and between the first component support portion and the second component support portion. The first support surface and the second support surface In the region of the base portion than the accommodating space for accommodating the other portion of the first flexible substrate and the second flexible substrate is formed.

  In this configuration, the first electronic component and the second electronic component are supported by the first component support portion and the second component support portion, and a part of each of the first flexible substrate and the second flexible substrate is accommodated in the accommodation space. Therefore, the first flexible substrate and the second flexible substrate can be accommodated in a compact manner. Further, since the accommodation space is formed in the region closer to the base portion than the first support surface and the second support surface, the heat generated in the first electronic component and the second electronic component can be radiated from the accommodation space. The malfunction of the first electronic component and the second electronic component due to the heat can be prevented. In addition, the heat propagation path when the heat propagates to the base portion can be made long, and other components (actuator units, etc.) disposed close to the base portion are prevented from being affected by the heat. can do.

  At least one of the first component support portion and the second component support portion has a recess that is open toward the accommodation space on the base portion side than the first support surface and the second support surface. It may be.

  In this configuration, the cross-sectional area of the first component support portion and the second component support portion can be reduced in the portion where the recess is provided, so that the heat generated in the first electronic component and the second electronic component is transferred to the base portion. Can be suppressed in this portion. In addition, a space for accommodating the first flexible substrate and the second flexible substrate can be secured by making the recess and the accommodation space continuous, and the first flexible substrate and the second flexible substrate introduced into the recess. Since the first flexible substrate and the second flexible substrate can be prevented from being undesirably detached from the accommodation space.

  A guide surface that serves as a guide for introducing a part of the first flexible substrate or the second flexible substrate is provided on the inner surface of the recess opposite to the base portion side. It may be formed to be inclined so as to be closer to the base portion as it goes to the side.

  In this configuration, since the guide surface formed on the surface of the recess opposite to the base portion side is formed so as to be closer to the base portion toward the back side, the first flexible member is inserted into the recess. The substrate or the second flexible substrate can be easily introduced.

  The base part has a substantially rectangular plate shape in plan view, and the first part support part and the second part support part are formed in the vicinity of two parallel sides of the base part. In the vicinity of the other two sides parallel to each other, a guide portion serving as a guide for pulling out the first flexible substrate and the second flexible substrate accommodated in the accommodation space is provided from the base portion to the first component. The structure which protrudes in the same direction as a support part and the said 2nd component support part may be sufficient.

  In this configuration, since the first component support portion and the second component support portion are formed in the vicinity of the two parallel sides of the base portion, the first flexible substrate and the second flexible substrate are formed from the other two sides. The substrate can be pulled out. Further, when these are pulled out, the guide portion guides them, so that the drawing work can be easily performed.

  In order to solve the above problems, a liquid ejection device according to the present invention includes a plurality of flow path units having a plurality of nozzles for ejecting liquid and a plurality of pressure chambers individually connected to the plurality of nozzles. Actuator unit having a plurality of lands individually corresponding to each of the pressure chambers on the surface, and applying discharge pressure to the liquid in the pressure chamber corresponding to the lands based on the actuator driving voltage applied to the lands A first driver IC is provided on the surface of the first land, and a first flexible board for applying an actuator driving voltage to the group of lands; and on the surface of the first flexible board. A second driver IC is provided, a second flexible board for applying an actuator driving voltage to the other group of lands, and the first flexible board. And a substrate accommodating member that accommodates the second flexible substrate, the substrate accommodating member being formed to protrude from the base portion, and the first driver IC is part of the first flexible substrate. A first component support portion having a first support surface to be supported, and protruding from the base portion in the same direction as the first component support portion and spaced apart from the first component support portion, A second component support portion having a second support surface for supporting a two-driver IC together with a part of the second flexible substrate, and the second component support portion between the first component support portion and the second component support portion. In the region closer to the base portion than the first support surface and the second support surface, an accommodation space for accommodating another part of the first flexible substrate and the second flexible substrate is configured.

  In this configuration, the substrate housing member is used in a liquid ejection apparatus.

  The present invention is configured as described above, and the first flexible substrate and the second flexible substrate can be folded in a compact manner while solving the problems related to heat generated in the electronic component, so that the flexible substrate is incorporated. The apparatus can be miniaturized.

It is a top view which shows the structure of the inkjet printer in which the ink discharge apparatus which concerns on embodiment was used. It is a perspective view which shows the structure of the carriage which mounts the ink discharge apparatus which concerns on embodiment. It is sectional drawing which shows the structure of the carriage which mounts the ink discharge apparatus which concerns on embodiment. 1 is a perspective view illustrating a configuration of an ink ejection device according to an embodiment. It is the VV sectional view taken on the line in FIG. It is the VI-VI sectional view taken on the line in FIG. FIG. 2 is an exploded perspective view illustrating a configuration of an ink ejection apparatus according to an embodiment. FIG. 3 is an exploded perspective view illustrating a configuration of an ink discharge head used in the ink discharge apparatus according to the embodiment. FIG. 4 is a partially enlarged plan view showing a configuration in which an actuator unit is joined to the upper surface of a flow path unit. It is sectional drawing which shows the structure which joined the flexible wiring board with respect to the structure shown in FIG. It is the figure which looked at the structure when a flexible wiring board is expand | deployed on the plane from the lower side. It is the figure which looked at the structure when a wiring board is expand | deployed on the plane from the upper side. It is a circuit diagram which shows the wiring structure of the wiring board shown in FIG. It is the figure which looked at the structure when each of a flexible wiring board, a 1st relay board | substrate, and a 2nd relay board | substrate was expand | deployed on the plane from the upper side. It is a perspective view which shows the structure of the board | substrate holding member used for the ink discharge apparatus which concerns on embodiment. It is sectional drawing which shows the 1st use condition of the board | substrate holding member used for the ink discharge apparatus which concerns on embodiment. It is sectional drawing which shows the 2nd use condition of the board | substrate holding member used for the ink discharge apparatus which concerns on embodiment. It is a perspective view which shows the structure of the board | substrate accommodating member used for the ink discharge apparatus which concerns on embodiment. It is the XIX-XIX sectional view taken on the line in FIG. It is the XX-XX sectional view taken on the line in FIG. It is a perspective view which shows the state which attached the 2nd heat sink to the board | substrate accommodation member. It is a perspective view which shows the state which attached the 2nd heat sink and the 1st heat sink to the board | substrate accommodation member. It is a partial expansion perspective view which shows the state which hold | maintained two heat sinks with the heat sink support part. It is a figure which shows the process of hold | maintaining two heat sinks, (A) is a partial expansion perspective view which shows the process of hold | maintaining a 2nd heat sink, (B) is a partial expansion which shows the process of hold | maintaining a 1st heat sink. It is a perspective view.

  Hereinafter, a “liquid ejection device” according to a preferred embodiment of the present invention will be described with reference to the drawings. The “substrate housing member” according to a preferred embodiment of the present invention will be described as a component constituting the “liquid ejection device”. The “liquid ejecting apparatus” according to the following embodiment is an “ink ejecting apparatus” that ejects ink onto paper in an “inkjet printer”, but the present invention provides a filter base material in a “color filter manufacturing apparatus”. It can also be applied to other “liquid ejecting devices” such as “conductive liquid ejecting device” that ejects conductive liquid onto an insulating substrate in “colored liquid ejecting device” or “wiring forming device” that ejects colored liquid, When the present invention is applied to a “colored liquid discharge device” or “conductive liquid discharge device”, “ink” as “liquid” described in the following description is replaced with “colored liquid” or “conductive liquid”. And In the following description, “downward” means the direction in which ink is ejected, “upward” means the opposite direction, and “side” means “with respect to the vertical direction”. The “perpendicular direction” is meant, and the “planar shape” means “the shape when viewed from above”.

[Overall configuration of inkjet printer]
FIG. 1 is a plan view showing a configuration of an ink jet printer 10 in which an ink ejection device 14 according to the embodiment is used. As shown in FIG. 1, the ink jet printer 10 forms an image on the surface of the paper P by ejecting ink onto the paper P, and has an ink ejection head 12 that ejects ink. 14, an ink supply unit 16 that supplies ink to the ink ejection head 12, a scanning unit 18 that reciprocates the ink ejection device 14 linearly, and a paper conveyance that conveys the paper P to the scanning region U of the ink ejection device 14. A unit 20 and a control unit 22 that executes various controls for image formation are provided. Hereinafter, first, the configuration of the ink supply unit 16, the scanning unit 18, the paper transport unit 20, and the control unit 22 will be briefly described, and then the configuration of the ink ejection device 14 will be described in detail.

[Configuration of ink supply unit]
As shown in FIG. 1, the ink supply unit 16 includes four ink tanks 24 a to 24 d that store four color inks of black (BK), yellow (Y), cyan (C), and magenta (M), and ink. A damper device 26 that reduces pressure fluctuations of ink supplied to the ejection head 12 and four ink tubes 28 a to 28 d that supply the ink in the ink tanks 24 a to 24 d to the damper device 26 are provided.

  As shown in FIG. 1, the damper device 26 includes a damper portion 26 a having four damper chambers (not shown) that individually store the four colors of ink supplied to the ink discharge head 12, and ink tubes 28 a to 28 d. Tube connector 26b having four connection ports to which each of these is connected, and a communication portion 26c for individually communicating each damper chamber of damper portion 26a and each connection port of tube connector 26b. The damper device 26 is disposed above the ink ejection head 12, and each of the ink tanks 24 a to 24 d is disposed at a predetermined position below the ink ejection head 12. When ink is supplied to the ink discharge head 12, ink in the ink tanks 24a to 24d is given to the damper device 26 via the ink tubes 28a to 28d, and the pressure variation of the ink in each damper chamber of the damper portion 26a. Is alleviated and then supplied to the corresponding ink flow paths N1 to N4 (FIG. 8) of the ink discharge head 12.

[Configuration of scanning unit]
As shown in FIG. 1, the scanning unit 18 includes a carriage 30 that holds the ink discharge device 14 and the damper device 26, two long plate-shaped guide rails 32 a and 32 b that guide the carriage 30, and one guide rail. The main pulley 34a provided at one end portion in the longitudinal direction of 32a, the driven pulley 34b provided at the other end portion in the longitudinal direction of the guide rail 32a, and the main pulley 34a and the driven pulley 34b. An annular drive belt 36 and a drive motor 38 for applying a rotational force to the main driving pulley 34 a are provided, and the carriage 30 is fixed to the drive belt 36. Accordingly, when the manual pulley 34a is rotated by the drive motor 38, the drive belt 36 is rotated with the rotation of the main pulley 34a, and the carriage 30 fixed to the drive belt 36 is linearly formed along the guide rails 32a and 32b. It is reciprocated. In the following description, the direction in which the carriage 30 is moved is referred to as “main scanning direction X”, and the direction orthogonal to the “main scanning direction X” is referred to as “sub-scanning direction Y”.

  As shown in FIG. 2, the carriage 30 is a substantially rectangular parallelepiped box-shaped member extending in the sub-scanning direction Y, and includes a holder portion 40 that holds the ink discharge device 14 and a longitudinal direction (sub-portion) that sandwiches the holder portion 40. It has sliding portions 42a and 42b which are formed on both sides in the scanning direction Y) and are slidably attached to the guide rails 32a and 32b in the main scanning direction X, respectively. As shown in FIG. 3, the holder portion 40 is a portion constituting an accommodation space S that accommodates the ink ejection device 14 and the damper portion 26 a of the damper device 26, and the lower surface of the holder portion 40 includes the accommodation space S and A communicating opening 44 is formed, and a protruding head receiving portion 46 that receives the outer peripheral edge of the ink discharge head 12 from above is formed on the inner peripheral surface of the opening 44. Further, as shown in FIG. 2, a concave portion 48 that accommodates the tube connector 26b and the communication portion 26c (FIG. 1) of the damper device 26 is formed on the upper surface of the one sliding portion 42a.

[Configuration of paper transport unit]
The paper transport unit 20 includes a paper transport path R that transports the paper P in the sub-scanning direction Y, an upstream transport roller 50a disposed on the upstream side of the scanning area U in the paper transport path R, and a paper transport path R. It has a downstream conveyance roller 50b disposed downstream of the scanning region U, and a drive motor 52 that rotationally drives these conveyance rollers 50a and 50b at a predetermined timing. When the paper P is transported to the scanning region U by rotating the transport rollers 50 a and 50 b by the drive motor 52, the upper surface of the paper P faces the lower surface (that is, the ejection surface) of the ink ejection head 12 mounted on the carriage 30. Thus, it is possible to form an image on the upper surface of the paper P.

[Configuration of control unit]
The control unit 22 controls drive components such as the drive motor 38 of the scanning unit 18, the drive motor 52 of the paper transport unit 20, and the actuator unit 74 (FIGS. 9 and 10) of the ink ejection head 12. It has a central processing unit (CPU) that executes arithmetic processing and a storage device (RAM, ROM) that stores various programs or data. As shown in FIG. 13, the control unit 22 has a control circuit 54, a low-voltage power circuit 56, and a high-voltage power circuit 58 with respect to the actuator unit 74. From the control circuit 54, “enable”, “strobe”, Various control signals such as “data” and “clock” are output, “low voltage system drive voltage VDD1” and “low voltage system ground voltage VSS1” are output from the low voltage power circuit 56, and “high voltage system drive” is output from the high voltage power circuit 58. "Voltage VDD2" and "High-voltage system ground voltage VSS2" are output.

[Configuration of Ink Ejection Device]
4 is a perspective view showing the configuration of the ink discharge device 14, FIG. 5 is a cross-sectional view taken along line VV in FIG. 4, and FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 7 is an exploded perspective view showing the configuration of the ink ejection device 14.

  As shown in FIG. 7, the ink discharge device 14 includes an ink discharge head 12, a first relay substrate 60a, a second relay substrate 60b, a first substrate holding member 62a, a second substrate holding member 62b, and a substrate. The housing member 64, the first heat sink 66, and the second heat sink 68 are included. Hereinafter, these components will be described in order. However, since the first relay board 60a and the second relay board 60b are integrated with the flexible wiring board 76 of the ink discharge head 12 to constitute the wiring board G (FIG. 12), the components of the wiring board G Will be described.

<Configuration of ink ejection head>
FIG. 8 is an exploded perspective view showing the configuration of the ink discharge head 12. The ink discharge head 12 supplies ink of four colors, black (BK), yellow (Y), cyan (C), and magenta (M), supplied from the ink tanks 24a to 24d (FIG. 1) to the control unit 22 (FIG. 13) selectively ejects from a plurality of nozzles 70 (FIGS. 9 and 10) toward the upper surface of the paper P (FIG. 1) based on various control signals given from 13), as shown in FIG. In addition, a flow path unit 72, an actuator unit 74, a flexible wiring board 76, a sheet-like bonding material 78, a frame 80, and a filter 82 are included.

  9 is a partially enlarged plan view showing a configuration in which the actuator unit 74 is joined to the upper surface of the flow path unit 72. FIG. 10 is a cross-sectional view showing a configuration in which the flexible wiring board 76 is joined to the configuration. .

  As shown in FIG. 10, the flow path unit 72 is configured by stacking five plates, a pressure chamber plate 84, an aperture plate 86, a connection flow path plate 88, a manifold plate 90, and a nozzle plate 92, In these plates 84 to 92, “concave portions” or “through holes” are formed by etching or the like. In the flow path unit 72, as shown in FIGS. 9 and 10, these “recesses” or “through holes” communicate with each other, whereby a plurality of manifolds 94 that collect ink for each color, and manifolds Four ink supply ports 96 that supply ink to each of 94, a plurality of nozzles 70 that discharge ink in the manifold 94 to the outside, a plurality of pressure chambers 98 that communicate with each of the plurality of nozzles 70, and a manifold 94 And an aperture 100 that communicates with the pressure chamber 98. That is, in the flow path unit 72, four ink flow paths N1 to N4 extending from each of the four ink supply ports 96 to the plurality of nozzles 70 are configured for each ink color.

  As shown in FIG. 9, the plurality of nozzles 70 constituting each of the ink flow paths N1 to N4 are arranged on both sides of the manifold 94 so as to form a nozzle row Ln side by side in the sub-scanning direction Y. Accordingly, a plurality of pressure chambers 98 (FIG. 10) communicating with each of the plurality of nozzles 70 are also arranged in the sub-scanning direction Y. In the present embodiment, four ink flow paths N1 to N4 are provided according to the number of ink colors (four colors), but the number of ink flow paths is not particularly limited. If the number of ink colors is one, only one ink flow path may be provided.

  As shown in FIG. 10, the actuator unit 74 constitutes an inner upper surface 98 a of the pressure chamber 98 in the flow path unit 72 and selectively applies ejection pressure to the ink existing in the plurality of pressure chambers 98. And includes a diaphragm 102, a piezoelectric layer 104, and a plurality of individual electrodes 106. The diaphragm 102 is formed of a conductive metal material such as an iron-based alloy such as stainless steel, nickel alloy, aluminum alloy, or titanium alloy, and covers the plurality of pressure chambers 98. Bonded to the top surface. The diaphragm 102 has both a function of causing a volume change in the pressure chamber 98 by being vibrated by the piezoelectric layer 104 and a function of applying an electric field to the piezoelectric layer 104 in cooperation with the plurality of individual electrodes 106. is doing. The piezoelectric layer 104 is made of a piezoelectric material mainly composed of lead zirconate titanate (PZT), and is polarized in the thickness direction. Each of the plurality of individual electrodes 106 is formed of a conductive material containing Ag—Pd or the like. As shown in FIG. 9, the electrode portion 106a facing the pressure chamber 98 (FIG. 10), and the electrode portion 106a And an extended land (that is, individual electrode terminal) 106b. The plurality of lands 106b are arranged so as to form the land row L in the same direction as the nozzle row Ln (that is, the sub-scanning direction Y), and the land 106b exists between two adjacent land rows L. A non-banded region M is formed. Furthermore, a common electrode terminal 108 (FIG. 9) that is electrically connected to the diaphragm 102 is formed on the upper surface of the actuator unit 74. The common electrode terminal 108 and the land 106b are each made of a conductive material made of a metal material containing Ag. A conductive bump 110 is formed.

  FIG. 11 is a view of the configuration when the flexible wiring board 76 is developed on a plane as viewed from below. In the ink ejection device 14, as shown in FIGS. 5 and 7, the flexible wiring board 76 is used by being bent, but the flexible wiring board 76 as one component is formed in a planar shape as shown in FIG. 11. Has been.

  The flexible wiring board 76 is a so-called “COF (chip-on-film)”, and as shown in FIG. 11, a flexible synthetic resin material (polyimide resin, polyester resin, polyamide resin, etc.). An insulating sheet portion 112, two driver ICs 114 </ b> A and 114 </ b> B disposed on the lower surface of the insulating sheet portion 112 in the sub-scanning direction Y, and a plurality of lands 106 b and a common electrode terminal on the lower surface of the insulating sheet portion 112. A plurality of connection terminals 116 arranged to face each of 108 and one end thereof are electrically connected to the corresponding land 106b via the connection terminal 116, and in a direction parallel to the land row L (FIG. 9). A plurality of extended output wirings 118a as “connection wirings”, various wirings 118b to 118g as “connection wirings”, A plurality of connection terminals 120 formed at both ends in the sub-scanning direction Y of the sheet portion 112 and connected to the wirings 118b to 118g, and an insulating coating material (not shown) for covering the wirings 118a to 118g. ing. In the flexible wiring board 76, the connection terminals 116 that are electrically connected to the lands 106 b are arranged so as to face the lands 106 b, so that “facing the belt-like region M between adjacent land rows L in the flexible wiring board 76. A wiring path is secured in the “part to be performed”, and an output wiring 118 a is disposed in this wiring path. The “wiring structure” of the flexible wiring board 76 will be described together with the description of the “wiring structure Gc (FIG. 13)” of the wiring board G.

  Further, as shown in FIG. 8, a reinforcing member having four ink introduction holes 80a corresponding to the four ink supply ports 96 on the outer peripheral portion of the upper surface of the flow path unit 72 via a sheet-like bonding material 78, as shown in FIG. A filter frame 82 for removing bubbles and dust mixed in the ink is joined to a portion corresponding to the four ink introduction holes 80a on the upper surface of the frame 80.

<Configuration of wiring board>
FIG. 12 is a view of the configuration when the wiring board G is developed on a plane as viewed from above, and FIG. 13 is a circuit diagram showing the wiring structure Gc of the wiring board G.

  As shown in FIG. 13, the wiring board G has various control signals (enable, strobe, data, clock) output from the control unit 22, low-voltage power supply voltages (low-voltage drive voltage VDD1, low-voltage ground voltage VSS1). The actuator drive voltage is generated based on the high-voltage power supply voltage (high-voltage system drive voltage VDD2, high-voltage system ground voltage VSS2), and the actuator drive voltage is selected to the plurality of lands 106b of the actuator unit 74 through the plurality of output wirings 118a. As shown in FIG. 12, the first flexible board F1 for applying the actuator driving voltage to the group of lands 106b (FIG. 9) and the actuator to the other group of lands 106b (FIG. 9). With the second flexible substrate F2 for applying the driving voltage, it is substantially Z It is configured to be in.

  As shown in FIG. 12, the first flexible substrate F1 is flexible and has a first insulating sheet portion F1a that is substantially L-shaped when deployed on a plane, and a first insulating sheet portion. Formed on the lower or upper surface of F1a, one end is electrically connected to the corresponding land 106b (FIG. 9), and extends in the direction parallel to the land row L (FIG. 9) (ie, the sub-scanning direction Y). The plurality of first connection wirings F1b are formed on the lower surface or the upper surface of the first insulating sheet portion F1a, one end is electrically connected to the other end of the first connection wiring F1b, and the land row L (FIG. 9) And a plurality of first relay lines F1c formed extending in the orthogonal direction (that is, the main scanning direction X). A plurality of first connection portions F1d that connect the first connection wiring F1b and the first relay wiring F1c are disposed in a portion that bends at a right angle of the first insulating sheet portion F1a, and in the first insulating sheet portion F1a The first driver IC 114A is mounted on the portion where the first connection wiring F1b is formed. On the other hand, the second flexible substrate F2 includes a second insulating sheet portion F2a, a plurality of second connection wirings F2b, and a plurality of second relay wirings F2c, like the first flexible substrate F1, The second connection portion F2d is disposed at a portion that bends at right angles to the second insulating sheet portion F2a, and the second driver IC 114B is mounted on the portion where the second connection wiring F2b is formed in the second insulating sheet portion F2a. ing.

  In the present embodiment, as shown in FIG. 12, the entire wiring board G is configured in a substantially Z shape, and the first relay wiring F1c and the second relay wiring F2c are in relation to the land row L (FIG. 9). In the orthogonal direction (that is, the main scanning direction X), the first connection wiring F1b and the second connection wiring F2b are formed to extend in opposite directions from the respective end portions. Therefore, the first flexible substrate F1 and the second flexible substrate F2 are routed along different paths from each of two opposing edges of the actuator unit 74. Note that the direction in which the first relay wiring F1c and the second relay wiring F2c extend from the respective ends of the first connection wiring F1b and the second connection wiring F2b does not necessarily have to be “opposite directions”. The “same direction” in the direction X may be used. If the direction in which the first relay wiring F1c and the second relay wiring F2c extend is “the same direction”, the first flexible board F1 and the second flexible board F2 can be routed from one edge of the actuator unit 74 in an overlapping manner. it can.

  As shown in FIG. 12, since the wiring board G is composed of the flexible wiring board 76, the first relay board 60a, and the second relay board 60b, the components F1a to F1d and the second flexible board F1 of the first flexible board F1. The components F2a to F2d of the substrate F2 correspond to the components of the flexible wiring board 76, the first relay board 60a, and the second relay board 60b. Therefore, these correspondence relationships will be described below.

  FIG. 14 is a view of a configuration when the flexible wiring board 76, the first relay board 60a, and the second relay board 60b are each developed on a plane, as viewed from above.

  As already described with reference to FIG. 11, the flexible wiring board 76 includes the insulating sheet portion 112, the two driver ICs 114 </ b> A and 114 </ b> B, the plurality of connection terminals 116, the wirings 118 a to 118 g, and the plurality of connection terminals 120. And an insulating covering material (not shown).

  The first relay substrate 60a conducts the flexible wiring substrate 76 and the carriage substrate 122 (FIG. 13), and is formed on the insulating sheet portion 124 and the upper surface of the insulating sheet portion 124 as shown in FIG. A plurality of wirings 118b to 118g, capacitors 126a and 126b and solder points 128 disposed on the upper surface of the insulating sheet portion 124, and an insulating coating material (not shown) for covering the plurality of wirings 118b to 118g. Yes.

  The insulating sheet portion 124 is formed in a substantially L shape by a flexible synthetic resin material (polyimide resin, polyester resin, polyamide resin, etc.). On the upper surfaces of the two sides 124a and 124b of the insulating sheet portion 124, A plurality of wirings 118b to 118g are formed to be bent in a substantially L shape. Of the two sides 124 a and 124 b, an output side side (hereinafter referred to as “output side”) 124 a connected to the flexible wiring board 76 is formed at one edge of the flexible wiring board 76. A plurality of connection terminals 130a connected to the plurality of connection terminals 120 (FIG. 11) are formed. On the other hand, of the two sides 124a and 124b, the input side side (hereinafter referred to as “input side”) 124b connected to the carriage substrate 122 (FIG. 13) is formed on the carriage substrate 122. A plurality of connection terminals 130b connected to the connector 132 (FIG. 3) are formed. The connection terminal 130a and the connection terminal 130b are electrically connected via a plurality of wirings 118b to 118g. Capacitors 126a and 126b and a solder point 128 are provided on the upper surface of the output side 124a in the vicinity of the connection terminal 130a. They are arranged in a line.

  On the other hand, as shown in FIG. 14, the second relay board 60b has the same structure as that of the first relay board 60a. The description to be omitted is omitted.

  Therefore, in this embodiment, “the insulating sheet portion 112 of the flexible wiring substrate 76 and the insulating sheet portion 124 of the first relay substrate 60 a” correspond to the “first insulating sheet portion F1a”, and “the flexible wiring substrate 76 and the first insulating sheet portion F1a”. Of the plurality of wirings 118b to 118g formed on the relay substrate 60a, a portion extending in the direction parallel to the land row L (sub-scanning direction Y) corresponds to the “first connection wiring F1b”. Of the plurality of wirings 118b to 118g formed on the relay board 60a, a portion extending in the direction orthogonal to the land row L (main scanning direction X) corresponds to the “first relay wiring F1c”, and “the first relay board A portion where the plurality of wirings 118b to 118g bend at a right angle in 60a corresponds to the “first connection portion F1d”. Further, “the insulating sheet portion 112 of the flexible wiring board 76 and the insulating sheet portion 124 of the second relay board 60b” correspond to the “second insulating sheet section F2a”, and each of the “flexible wiring board 76 and the second relay board 60b”. The portion extending in the direction parallel to the land row L (sub-scanning direction Y) among the plurality of wirings 118b to 118g formed in FIG. 6 corresponds to the “second connection wiring F2b” and is formed on the second relay substrate 60b. Among the plurality of wirings 118b to 118g, the portion extending in the direction orthogonal to the land row L (main scanning direction X) corresponds to the “second relay wiring F2c”, and “the plurality of wirings in the second relay substrate 60b” A portion where 118b to 118g bend at a right angle corresponds to “second connecting portion F2d”.

  That is, in this embodiment, the portion where the first connection wiring F1b of the first flexible substrate F1 is formed by the “flexible wiring substrate 76” and the portion where the second connection wiring F2b of the second flexible substrate F2 is formed are integrated. A portion where the first relay wiring F1c of the first flexible substrate F1 is formed by the “first relay substrate 60a” is configured, and the second flexible substrate F2 is configured by the “second relay substrate 60b”. A portion where the second relay wiring F2c is formed is configured.

<Wiring structure of wiring board>
FIG. 13 is a circuit diagram showing a wiring structure of the wiring board G. In the inkjet printer 10, as shown in FIG. 13, the control unit 22 is electrically connected to the wiring board G via a carriage board 122 and a flexible flat cable (FFC) 136. As a result, various control signals (enable, strobe, data, clock) output from the control unit 22, the low voltage system power supply voltage (low voltage system drive voltage VDD1, the low voltage system ground voltage VSS1), and the high voltage system power supply voltage (high voltage system drive). A voltage VDD2 and a high-voltage ground voltage VSS2) are applied to the wiring board G, and an actuator driving voltage is generated by the driver IC 114A and the driver IC 114B based on these signals and the like. In FIG. 13, the electrical path from the second relay board 60b to the control unit 22 is omitted, but the electrical path is configured in the same manner as the electrical path from the first relay board 60a to the control unit 22. The carriage substrate 122 and the flexible flat cable (FFC) 136 are shared in both electrical paths.

  The driver IC 114A includes a signal conversion circuit 140 and a drive voltage signal generation circuit 142 as shown in FIG. The signal conversion circuit 140 individually receives control signals (enable, strobe, data, clock) supplied from the control circuit 54 based on drive voltages (for example, 5 V) supplied from the drive VDD1 wiring 118b and the ground VSS1 wiring 118c. The signal is converted into an individual control signal corresponding to the electrode 106 (FIGS. 9 and 10), and includes a shift register 140a, a D flip-flop 140b, and a gate circuit 140c. Of the control signals applied to the wiring board G, the data signal and the clock signal are applied to the shift register 140a through the input signal wiring 118d, and the strobe signal is applied to the D flip-flop 140b through the input signal wiring 118d. Is supplied to the gate circuit 140c through the input signal wiring 118d. Then, in the shift register 140a, the data signal is serial / parallel converted, the converted data signal is output from the D flip-flop 140b based on the strobe signal, and an enable signal (that is, a drive waveform signal) corresponding to the data signal is output. Output from the gate circuit 140c.

  The drive voltage signal generation circuit 142 generates an enable signal (that is, a drive waveform signal) output from the gate circuit 140c based on the drive voltage (for example, 20V) supplied from the drive VDD2 wiring 118e and the ground VSS2 wiring 118f. The voltage is converted into an actuator driving voltage for driving the actuator unit 74, and is constituted by a plurality of drivers 142a corresponding individually to the plurality of lands 106b. Each of the drivers 142a is connected to the output wiring 118a via the resistor 144. In the driver IC 114A, the grounding VSS2 wiring 118f and the grounding VSS1 wiring 118c are connected via a resistor 146, and these are held at the same potential.

  The driver IC 114B is configured in the same manner as the driver IC 114A, and the actuator driving voltage output from one driver IC 114A is applied to the group of lands 106b in the actuator unit 74 through the plurality of output wirings 118a, and the remaining group of lands 106b. Actuator driving voltages output from the other driver ICs 114B are applied to the lands 106b through a plurality of output wirings 118a.

  Outside the driver IC 114A and the driver IC 114B, in addition to the wirings 118a to 118f, a grounding COM wiring 118g for applying a grounding potential (0 V) to the diaphragm 102 is disposed, and an end of the grounding COM wiring 118g is provided. The part is electrically connected to a connection terminal 116 facing the common electrode terminal 108. In the first relay board 60a and the second relay board 60b, the capacitor 126a is bypass-connected between the driving VDD1 wiring 118b and the ground VSS1 wiring 118c, and the driving VDD2 wiring 118e and the ground VSS2 wiring are connected. A capacitor 126b is bypass-connected to 118f, and a solder point 128 is provided between the grounding VSS2 wiring 118f and the grounding COM wiring 118g.

  The capacitors 126a and 126b are for preventing malfunction of the driver ICs 114A and 114B. That is, in the drive voltage signal generation circuit 142 of the driver ICs 114A and 114B, the actuator ON / OFF transistors incorporated in each of the plurality of drivers 142a are connected in series to each other. A transient current flows through the VSS2 wiring 118f. Therefore, if the capacitors 126a and 126b are not provided, a relatively high voltage is generated in the grounding VSS2 wiring 118f due to the wiring resistance and inductance of the flexible wiring board 76, and the voltage of the grounding VSS1 wiring 118c via the resistor 146 is generated. Therefore, the driver ICs 114A and 114B may malfunction. However, in the present embodiment, since the capacitors 126a and 126b are mounted in the vicinity of the driver ICs 114A and 114B, voltage rises in the grounding VSS2 wiring 118f and the grounding VSS1 wiring 118c can be suppressed, and the driver ICs 114A and 114B. Can be prevented from malfunctioning.

  The solder point 128 is “when a plurality of wirings on the wiring board (for example, two wirings adjacent in parallel to each other) need to be conducted, the conduction is performed in a later process using a conducting material such as solder. In this embodiment, in order to prevent the driver ICs 114A and 114B from being destroyed during the polarization process, the following configuration is provided. That is, the solder point 128 includes a planar first connection portion 128a made of a conductive material conducted to the grounding VSS2 wiring 118f and a planar second material made of a conductive material conducted to the grounding COM wiring 118g. It has the connection part 128b, and the electrically-conductive material 128c which conducts the 1st connection part 128a and the 2nd connection part 128b by a post process. The first connection portion 128a and the second connection portion 128b are disposed apart from each other in order to ensure insulation between them, and the first relay substrate 60a is used to attach the conductive material 128c in a subsequent process. And it is exposed on the lower surface or the upper surface of the second relay substrate 60b. The conductive material 128c is connected to the first connection portion 128a and the second connection portion 128b in a later step to make them conductive, and is formed of a conductive material such as solder.

  When the ink discharge head 12 is manufactured, as shown in FIG. 10, after the flow path unit 72, the actuator unit 74, and the flexible wiring board 76 are manufactured separately, they are joined to each other. At the stage of joining, the solder point 128 is not yet conducted, and the piezoelectric layer 104 (FIG. 10) of the actuator unit 74 is not polarized. When the piezoelectric layer 104 is subjected to polarization processing, a voltage (for example, 20V) having the same magnitude as the actuator drive voltage is applied to all output wirings 118a, and a ground potential (0V) is applied to the grounding COM wiring 118g. A lower voltage (for example, −5 V) is applied, and a high voltage (for example, 25 V) generated thereby is applied to the piezoelectric layer 104. Therefore, if the high voltage (for example, 25 V) is applied to the driver ICs 114A and 114B via the wirings 118a to 118g, the driver ICs 114A and 114B may be destroyed by a large current. However, at this stage, since the solder point 128 is not yet conducted, a large current does not flow through the driver ICs 114A and 114B, and the driver ICs 114A and 114B can be prevented from being destroyed. When the polarization process of the piezoelectric layer 104 is finished, in order to keep the grounding VSS2 wiring 118f and the grounding COM wiring 118g at the same potential, the conductive material 128c is attached across the first connection portion 128a and the second connection portion 128b. The first connection portion 128a and the second connection portion 128b are made conductive.

  In the carriage substrate 122 existing on the input side of the wiring board G, as shown in FIG. 13, an electrolytic capacitor 148 is bypass-connected between the drive VDD2 wiring 118e and the ground VSS2 wiring 118f, The VSS2 wiring 118f and the grounding COM wiring 118g are connected, thereby suppressing an undesired voltage drop of the high-voltage drive voltage VDD2.

  The positions where the capacitors 126a and 126b and the solder points 128 are disposed are not limited to the first relay board 60a and the second relay board 60b, but may be the flexible wiring board 76. Since the protection portion E needs to be reinforced (FIG. 16), it is desirable that the first substrate holding member 62a and the second substrate holding member 62b are arranged in a line so that they can be mounted. Moreover, since the connection part of the flexible wiring board 76 and each of the first relay board 60a and the second relay board 60b is also a protection part E (FIG. 16) that needs reinforcement, the first board holding member 62a and the first board holding member 62a It is desirable that the two substrate holding members 62b be formed so as to extend in a straight line so that they can be mounted.

<Arrangement mode of wiring board>
In the ink ejection device 14, the flexible wiring board 76 of the wiring board G is disposed on the upper surface of the actuator unit 74 as shown in FIG. Then, both end portions of the flexible wiring board 76 in the sub-scanning direction Y are routed upward from the upper surface of the actuator unit 74, and the both end portions are folded back toward the central portion of the actuator unit 74 so as to be substantially C-shaped. Accordingly, the first connection portion F1d and the second connection portion F2d are disposed above the actuator unit 74. Further, the portion of the first flexible substrate F1 where the connection wiring F1b (FIG. 12) is formed and the portion of the second flexible substrate F2 where the connection wiring F2b (FIG. 12) is formed are input from the driver ICs 114A and 114B. In the region on the side, the portion is bent in a substantially Z shape, whereby the plan view length of the portion is shortened.

  Then, as shown in FIG. 6, the first relay board 60a (that is, the portion where the first relay wiring F1c is formed in the first flexible board F1) and the second relay board 60b (that is, the second flexible board F2 in the second flexible board F2). 2 relay wiring F2c) is routed upward along the outer surface of the second heat sink 68 from the end of the actuator unit 74 in the direction orthogonal to the land row L (that is, the main scanning direction X). The

  In the present embodiment, as shown in FIG. 5, both the portion of the first flexible substrate F1 where the connection wiring F1b is formed and the portion of the second flexible substrate F2 where the connection wiring F2b is formed are substantially Z-shaped. Although bent, only one of these portions may be bent in a substantially Z shape.

<Configuration of substrate holding member>
FIG. 15 is a perspective view showing the configuration of the first substrate holding member 62a, FIG. 16 is a cross-sectional view showing a first use state of the first substrate holding member 62a, and FIG. It is sectional drawing which shows the 2nd use condition of the member 62a. The second substrate holding member 62b is configured in the same structure as the first substrate holding member 62a, and thus the description of the second substrate holding member 62b is omitted.

  The first board holding member 62a holds the wiring board G by bending it with a predetermined curvature. As shown in FIGS. 16 and 17, the first protection target portion 150a in the wiring board G (FIG. 12) is held. It has the 1st holding member 152a to reinforce, and the 2nd holding member 152b to reinforce the 2nd protection object part 150b. Here, the first protection target portion 150a is a portion (FIG. 13) in which capacitors 126a and 126b and solder points 128 as "protection required portion E" are arranged in a line, and the second protection target portion 150b is The “connection portion between the flexible wiring board 76 and the first relay board 60a” as the “protection part E” is a part formed in a straight line.

  The first holding member 152a includes a base portion 154 formed with a length longer than the width of the wiring board G, and two first locking portions 156 formed at both ends in the length direction of the base portion 154. Have. The base portion 154 is a long plate-like member having a receiving surface 154a that receives the surface of the first protection target portion 150a on which the capacitors 126a and 126b and the solder point 128 are not formed. The width of the receiving surface 154a is: The capacitors 126a and 126b and the solder points 128 are designed to be wider than these widths so that they can be held securely. Further, the corner portions 154b on the receiving surface 154a side at both ends in the width direction of the base portion 154 are formed as “curved surfaces” in order to prevent the wiring board G pressed against the corner portions 154b from being bent.

  Each of the two first locking portions 156 protrudes in the same direction as the protruding directions of the capacitors 126a, 126b and the solder point 128 from both ends in the width direction at the end in the length direction of the receiving surface 154a. Part 156a and a locking piece 156b bridged between the tip ends of the two protrusions 156a, and the receiving part has a receiving surface at the end of the locking piece 156b opposite to the receiving surface 154a side. An inclined surface 156c is formed toward the outside as the distance from 154a increases. The first holding member 152a is integrally formed of a synthetic resin (ABS resin or the like) in order to allow the protrusion 156a to be elastically deformed.

  The second holding member 152b is disposed to face the receiving surface 154a of the first holding member 152a, and is reinforced with the first holding member 152a so as to be integrated with the main body 158 and the main body 158. It has the two 2nd latching | locking parts 160 formed. The main body 158 includes a receiving surface 158a that receives the second protection target portion 150b, and a plurality (three in this embodiment) of receiving holes 158b that store the capacitors 126a and 126b and the solder points 128 of the first protection target portion 150a. The main body portion 158 is designed to have a length substantially the same as the length of the base portion 154 in the first holding member 152a. The width is designed to be wider than the width of the second protection target portion 150b so that the second protection target portion 150b can be held on the receiving surface 158a, and the thickness of the main body portion 158 includes capacitors 126a and 126b and solder points. 128 is designed to be thicker than the highest height so that 128 can be accommodated in the accommodation hole 158b. The “position” and “size” of each accommodation hole 158b are designed according to the “position” and “size” of the protection portion E accommodated therein, and the “number” of the accommodation holes 158b is: It is designed according to the “number” of the protection sections E that are required. In the present embodiment, two preliminary accommodation holes 158c are provided, but the preliminary accommodation holes 158c are not necessarily required.

  Each of the two second locking portions 160 is formed so as to protrude from both end surfaces in the length direction of the main body portion 158 so as to extend in the width direction of the main body portion 158. The first holding member 152a and the second holding member 152b are integrally coupled by being locked to the locking piece 156b of the first holding member 152a. An inclined surface 160a is formed at an end of the second locking portion 160 on the first holding member 152a side so as to go outward as the distance from the first holding member 152a increases. The first holding member of the second locking portion 160 An abutting surface 160b that abuts on the end surface on the receiving surface 154a side of the locking piece 156b is formed at the end opposite to the 152a side. And the 2nd holding member 152b is integrally molded by the synthetic resin (ABS resin etc.) similarly to the 1st holding member 152a.

  In the first use state of the first substrate holding member 62a, as shown in FIG. 16, the receiving surface 154a of the first holding member 152a is covered with the first protection object via the bonding material 162 such as double-sided tape or adhesive. The protection required part E in the part 150a is joined to the surface on the side where it does not protrude. In addition, the receiving surface 158a of the second holding member 152b is bonded to the surface of the second protection target portion 150b opposite to the first holding member 152a side through a bonding material 162 such as a double-sided tape or an adhesive. . In this state, the first protection target portion 150a is reinforced by the first holding member 152a, and the second protection target portion 150b is reinforced by the second holding member 152b.

  In the second use state of the first substrate holding member 62a, as shown in FIG. 17, the second locking portion 160 (FIG. 15) of the second holding member 152b is locked to the locking piece 156b (FIG. 15) of the first holding member 152a. 15), the first holding member 152a and the second holding member 152b are integrally coupled. That is, the second locking portion 160 and the locking piece 156b (FIG. 15) serve as a “coupling portion” that couples the first holding member 152a and the second holding member 152b. In addition, the potting agent 164 is filled in the accommodation hole 158b.

  In the second use state, the first holding member 152a and the second holding member 152b that are integrally coupled reinforce each other, so that the reinforcing strength is higher than that in the first use state. Further, in the second use state, as shown in FIG. 17, the wiring board G is curved in a substantially C shape on the side in the width direction of the second holding member 152 b, but the first protection target portion 150 a and the second protection member 152 b are curved. Since the protection target portion 150b is reinforced by the first holding member 152a and the second holding member 152b on both sides of the bending portion 166, the first protection target portion 150a and the second protection target are restored by the restoring force of the bending portion 166. The portion 150b is not damaged. As shown in FIG. 17, since both openings of the accommodation hole 158b are closed by the wiring board G, and the potting agent 164 is filled in the accommodation hole 158b, the capacitor as the “protection required part E” 126a, 126b and the solder point 128 can be sealed in the accommodation hole 158b, and these can be protected from dust and the like, and corrosion of the wiring exposed to the solder point 128 can be prevented.

  Further, in the second use state, in addition to the function of protecting the protection required portion E of the wiring board G, the function of bending and holding the wiring board G with a predetermined curvature is exhibited. That is, in the second use state, as shown in FIG. 17, the wiring board G is curved in a substantially C shape on the side in the width direction of the second holding member 152 b, and this curved portion (hereinafter, “ Since both end portions of 166 are arranged on both surfaces of the second holding member 152b in the thickness direction, the “curvature” of the bending portion 166 is determined by the thickness H of the second holding member 152b. become. Further, as shown in FIG. 16, the first holding member 152a and the second holding member 152b are fixed on the wiring board G with a gap D therebetween, and therefore, the “length” of the curved portion 166 is It is determined by the interval D. Therefore, by determining the thickness H and the interval D at the design stage, the “curvature” and “length” of the curved portion 166 can be obtained simply by connecting the first holding member 152a and the second holding member 152b at the time of manufacture. Can be determined as designed. In the present embodiment, as shown in FIG. 5, the curved portion 166 of the first flexible substrate F1 and the curved portion 166 of the second flexible substrate F2 face each other above the actuator unit, but the “curvature” of the curved portion 166 and Since the “length” can be determined as designed, it is possible to prevent the two curved portions 166 from interfering with each other.

  Note that the first protection target portion 150a in the present embodiment is a portion (FIG. 13) in which capacitors 126a and 126b and solder points 128 as "protection required portion E" are arranged in a line, and the second protection target portion. Reference numeral 150b denotes a portion where the connecting portion between the flexible wiring board 76 as the “protection required portion E” and the first relay substrate 60a is formed in a straight line, but the type of the protection required portion E is limited to these. It is not a thing. For example, the first protection target portion 150a may be a portion in which the connection portions of two wiring boards are formed in a straight line. In this case, the second holding member 152b having no accommodation hole 158b is used. It may be.

<Configuration of substrate housing member>
18 is a perspective view showing a configuration of the substrate housing member 64, FIG. 19 is a cross-sectional view taken along line XIX-XIX in FIG. 18, and FIG. 20 is a cross-sectional view taken along line XX-XX in FIG.

  The substrate housing member 64 has a function of folding and housing the wiring board G above the ink ejection head 12 (FIGS. 5 and 6) and a function of holding the first heat sink 66 and the second heat sink 68 (FIGS. 21 and 22). 18) and holds the base part 170, the first part support part 172, the second part support part 174, the first heat sink 66, and the second heat sink 68 as shown in FIG. Two heat sink support portions 176a to 176d and two pressing members 178 are provided. Among these, the base portion 170, the first component support portion 172, the second component support portion 174, and the heat sink support portions 176a to 176d are integrally formed of synthetic resin (ABS resin or the like).

  As shown in FIGS. 6 and 7, the base portion 170 covers the region (hereinafter referred to as “terminal region”) T (FIG. 11) where the plurality of connection terminals 116 are formed on the wiring board G. The first component support portion 172, the second component support portion 174, and the heat sink support portions 176a to 176d are supported above the ink discharge head 12, and are formed in a substantially rectangular plate shape in plan view. Yes. As shown in FIGS. 6, 19, and 20, the peripheral portion of the base portion 170 is formed with a joint portion 180 that is joined to the upper surface of the ink ejection head 12, and the base portion 170 in the sub-scanning direction Y is formed. A terminal protection portion 182 that faces the terminal region T (FIG. 11) is formed in the central portion so as to be separated from the terminal region T above the lower surface of the peripheral edge of the base portion 170. As shown in FIGS. 6 and 19, the lower surface 182 a of the terminal protection part 182 is formed in a substantially inverted V shape in cross section where the central part in the main scanning direction X is the highest, whereby the strength of the terminal protection part 182 is increased. Has been enhanced.

  Further, as shown in FIG. 18, the terminal protection part 182 is formed with a jig mounting part 184 on which a jig (not shown) used in the assembly work is mounted. The jig mounting portion 184 has two through holes 184a and 184b formed at a central portion in the sub-scanning direction Y of the terminal protection portion 182 with a spacing in the main scanning direction X. The diameters of the two through holes 184a and 184b are designed to be different from each other, whereby the shape of the jig mounting portion 184 in plan view is asymmetric. Therefore, when trying to mount the jig in the reverse direction with respect to the jig mounting portion 184, the jig interferes with the jig mounting portion 184, and mounting in the reverse direction can be prevented. In order to prevent the jig from being mounted in the reverse direction, the shape of the jig mounting portion 184 in plan view may be asymmetric as a whole, and the “number” and “shape” of the through holes may be changed as appropriate. Also good. For example, only one asymmetrical through-hole may be provided, or three or more through-holes having the same shape may be disposed so as to be asymmetric as a whole.

  Further, in the vicinity of two sides parallel to each other on the upper surfaces of both end portions in the main scanning direction X in the base portion 170, as shown in FIG. 6, projecting guides that guide each of the two flexible substrates F1 and F2 upward. A portion 186 is formed to protrude upward. The angle α formed between the lower surface and the side surface of the peripheral portion of the base portion 170 is designed to be an “acute angle” as shown in FIGS. 19 and 20, and the corner portion formed between the lower surface and the side surface of the peripheral portion of the base portion 170. The outer surface is formed in a “curved surface” as shown in FIGS. 19 and 20. Therefore, in the state where the base portion 170 is disposed on the upper surface (that is, the installation surface) of the ink ejection head 12, as shown in FIGS. 5 and 6, the angle formed between the side surface of the base portion 170 and the installation surface becomes an obtuse angle. The coating material 188 such as a potting agent can be easily applied to the “entrance corner” formed by the installation surface. In addition, since the outer surface of the corner portion formed by the lower surface and the side surface of the peripheral portion of the base portion 170 is a “curved surface”, the area of the corner portion can be secured widely, and the adhesion of the coating material 188 can be improved. it can. As shown in FIG. 5, the flexible substrates F1 and F2 drawn upward from the both end edges in the sub-scanning direction Y of the ink discharge head 12 can be made to follow the “curved surface”. F2 can be prevented from being bent at the corners.

  The first component support portion 172 and the second component support portion 174 are formed to protrude in the same direction as the guide portion 186 from the vicinity of two sides parallel to each other on the upper surfaces of both end portions of the base portion 170 in the sub-scanning direction Y. . The first component support portion 172 is a portion that supports the pressing member 178, a part of the first flexible substrate F1, and the first driver IC 114A mounted on the part, and a first part on which these components are placed. It has the 1 mounting part 190 and the leg part 192 which supports the 1st mounting part 190. FIG. The first placement unit 190 has a first support surface 190a extending in parallel to the upper surface of the ink ejection head 12, and the length (that is, the width) of the first support surface 190a in the sub-scanning direction Y is as follows. The first driver IC 144A is designed to be longer than the width thereof, and the length (that is, the length) of the first support surface 190a in the main scanning direction X is designed to be longer than the width of the first flexible substrate F1. The leg portion 192 is formed to protrude upward from the end portion of the base portion 170 in the sub-scanning direction Y. The length (that is, the thickness) of the leg portion 192 in the sub-scanning direction Y is designed to be shorter than the width of the first support surface 190a. Thus, a concave portion K1 is formed on the base portion 170 side of the first placement portion 190 so as to open toward the center portion of the base portion 170 in the sub-scanning direction Y. As shown in FIG. 20, the first inner surface of the concave portion K1 constituting the surface of the first mounting portion 190 on the base portion 170 side, that is, the opposite surface of the concave portion K1 to the base portion 170 side, A guide surface 190b serving as a guide when a part of the flexible substrate F1 is introduced into the concave portion K1 is formed so as to be closer to the base portion 170 toward the back side of the concave portion K1.

  The second component support part 174 is a part that supports the pressing member 178, a part of the second flexible substrate F2, and the second driver IC 114B mounted on the part, and supports the first part from the base part 170. It protrudes in the same direction as the portion 172 and is formed away from the first component support portion 172. Similar to the first component support portion 172, the second component support portion 174 includes a second placement portion 194 on which these components are placed and a leg portion 196. On the base portion 170 side, a concave portion K2 is formed that opens toward the central portion of the base portion 170 in the sub-scanning direction Y.

  The first support surface 190a of the first component support portion 172 and the second support surface 194a of the second component support portion 174 are disposed at substantially the same height, and the first component support portion 172 and the second component support portion 172 are supported. An accommodation space J for accommodating a part of the flexible substrates F1 and F2 in a folded state is formed in a region closer to the base part 170 than the first support surface 190a and the second support surface 194a between the part 174 and the part 174. Yes. Accordingly, the recesses K1 and K2 are opened toward the accommodation space J on the base 170 side of the support surfaces 190a and 194a. As shown in FIG. 5, the recesses K1 and K2 and the accommodation space J are opened. It is possible to secure a space for disposing the portion where the relay wirings F1c and F2c are formed in the flexible substrates F1 and F2 in the portion where is connected.

  As shown in FIG. 5, the pressing member 178 is bonded to the first support surfaces 190 a and 194 a by using a double-sided tape or a bonding material such as an adhesive, and the surface of the pressing member 178 opposite to the base portion 170 side. The driver ICs 114A and 114B are arranged together with a part of the flexible boards F1 and F2, and the two board holding members 62a and 62b are arranged side by side in the sub-scanning direction in the accommodation space J. As shown in FIG. The portions of F2 where the relay wirings F1c and F2c are formed (that is, the first relay substrates 60a and 60b) are guided from the upper end of the base portion 170, that is, the both end edges in the main scanning direction X on the surface on the accommodation space J side. It is led by and is drawn upwards.

  The heat sink support portions 176a to 176c regulate the movement of the first heat sink 66 and the second heat sink 68 with respect to the driver ICs 114A and 114B mounted on one surface of the flexible boards F1 and F2. Therefore, in the following, the first heat sink 66 and the second heat sink 68 will be described first, and then the heat sink support portions 176a to 176c will be described.

<Configuration of heat sink>
FIG. 21 is a perspective view showing a state in which the second heat sink 68 is attached to the substrate housing member 64, and FIG. 22 is a perspective view showing a state in which the second heat sink 68 and the first heat sink 66 are attached to the substrate housing member 64. It is.

  As shown in FIG. 5, the first heat sink 66 dissipates heat generated in the driver ICs 114A and 114B by contacting the surface of the driver ICs 114A and 114B opposite to the flexible substrates F1 and F2 side. It is. On the other hand, the second heat sink 68 is a driver parallel to a surface (hereinafter referred to as “reference surface”) β of the driver ICs 114A and 114B side of the flexible boards F1 and F2 where the driver ICs 114A and 114B are mounted. The heat generated in the driver ICs 114A and 114B is dissipated by being disposed on the side of the ICs 114A and 114B.

  As shown in FIG. 22, the first heat sink 66 includes a plate-like first heat radiating plate 200a abutting on the driver ICs 114A and 114B (FIG. 5) and a main scanning direction in the first heat radiating plate 200a. The second heat sink 200b formed to extend from one end of X to the side opposite to the driver ICs 114A and 114B, and the driver IC 114A and 114B from the other end of the first heat sink 200a in the main scanning direction X It is a substantially U-shaped member having a third heat radiating plate 200c formed extending to the opposite side, and is integrally formed of a material having high thermal conductivity such as aluminum or copper. In order to improve heat dissipation, it is desirable to design each of the heat sinks 200a to 200c as large as possible. However, since the first heat sink 66 is housed in the housing space S of the carriage 30 (FIG. 3), these The size is limited by the size of the accommodation space S.

  As shown in FIG. 22, the first heat radiating plate 200a is formed with four locking portions 202a to 202c to which the four heat sink support portions 176a to 176c are locked. Of the four locking portions 202a to 202c, the locking portions 202a and 202c are “concave portions” that are “a part of the outer peripheral edge of the first heat sink 66”, and the locking portions 202b and 202d are the first heat dissipation. It is a “through hole” formed in the plate 200a, and each of the locking portions 202a to 202c has a driver IC 114A, 114B side in the first heat radiating plate 200a as shown in FIGS. A first locking surface 204a constituted by a part of the opposite surface, a second locking surface 204b extending in parallel with the sub-scanning direction Y, and a third locking surface 204c extending in parallel with the main scanning direction X Is formed. The portion where the first locking surface 204a is formed is a portion protruding inward from the inner surface of the “recess” or “through hole”, and the second locking surface 204b and the third locking surface 204c are “recessed”. Or a part of the inner surface of the “through hole”.

  As shown in FIG. 21, the second heat sink 68 has a substantially rectangular shape in plan view joined to the surface on the reference plane β side of the first heat sink 200a (FIG. 22) of the first heat sink 66 so as to allow heat transfer. Accommodating windows 206a and 206b for accommodating the driver ICs 114A and 114B are formed in portions corresponding to the driver ICs 114A and 114B in the second heat sink 68, which are flat plate members, and four corner portions of the second heat sink 68 are formed. As shown in FIG. 24 (A), a notch-shaped locking having a first locking surface 208a extending in parallel to the sub-scanning direction Y and a second locking surface 208b extending in parallel to the main scanning direction X is provided. A portion 208 is formed. And this 2nd heat sink 68 is arrange | positioned through the insulating sheet | seat 209 on the flexible substrates F1 and F2 folded in the accommodation space J, as shown in FIG.5 and FIG.7.

  In the present embodiment, the four locking portions 208 are formed as “notches (recesses)” that constitute a part of the “outer peripheral edge of the second heat sink 68”, but at least one of these is “penetrated” You may form as a "hole." Further, an insulating sheet 209 (FIGS. 5 and 7) is interposed between the flexible boards F1 and F2 folded in the accommodation space J and the second heat sink 68, thereby causing an accident such as a short circuit in the flexible boards F1 and F2. However, the insulating sheet 209 may be omitted by forming the second heat sink 68 with an insulating material.

<Configuration of heat sink support>
FIG. 23 is a partially enlarged perspective view showing a state in which the first heat sink 66 and the second heat sink 68 are held by the heat sink support portion. FIG. 24 is a diagram showing a process of holding two heat sinks, (A) is a partially enlarged perspective view showing a process of holding the second heat sink 68, and (B) is a process of holding the first heat sink 66. It is a partial expansion perspective view which shows the process to do.

  As shown in FIG. 24 (B), each of the heat sink support portions 176a to 176c includes a first front end holding piece 210a that is locked to the first locking surface 204a of the first heat sink 66, and a second locking surface. It has the 2nd tip side holding piece 210b locked to 204b, and the 3rd tip side holding piece 210c locked to the 3rd locking face 204c, and as shown in Drawing 24 (A). In addition, a first base end holding piece 212a locked to the first locking surface 208a of the second heat sink 68 and a second base end holding piece 212b locked to the second locking surface 208b are provided. Further, as shown in FIG. 24B, the temporary holding piece temporarily fixed to the surface opposite to the reference surface β side of the second heat sink 68 in a state where the first heat sink 66 is not held. 214.

  In the present embodiment, the distal end side holding pieces 210a to 210c, the proximal end side holding pieces 212a and 212b, and the temporary holding piece 214 are configured as “surfaces”, but a specific structure for realizing them. Is not particularly limited, and may be configured as a “projection” formed at the tip of each of the heat sink support portions 176a to 176c. However, when the respective front end portions of the heat sink support portions 176a to 176c are accommodated in the “recesses” or “through holes” constituting either the locking portions 202a to 202c or the four locking portions 208, It is necessary to design the tip portion to have a “shape” or “size” that can be accommodated in a “recess” or “through hole”. Further, in order to bring the first heat sink 66 and the second heat sink 68 into full contact, it is necessary to design the distance between the first tip side holding piece 210 a and the temporary holding piece 214 to be smaller than the thickness of the first heat sink 66. There is.

  According to the heat sink support portions 176a to 176c, the movement of the first heat sink 66 and the second heat sink 68 with respect to the driver ICs 114A and 114B mounted on the reference plane β of the flexible boards F1 and F2 can be restricted. That is, the first tip-side holding piece 210a can restrict the movement of the first heat sink 66 in the direction away from the reference surface β, and the second tip-side holding piece 210b and the third tip-side holding piece 210c The horizontal movement of the first heat sink 66 with respect to the reference plane β can be restricted. Further, the first base end side holding piece 212a and the second base end side holding piece 212b can restrict the horizontal movement of the second heat sink 68 with respect to the reference plane β, and the temporary holding piece 214 can The movement of the heat sink 68 in the direction away from the reference plane β can be restricted. The movement of the first heat sink 66 in the direction approaching the reference plane β can be regulated by the restoring force (pressing force) of the pressing member 178 that presses the driver ICs 114A and 114B toward the first heat sink 66. The movement of the two heat sinks 68 in the direction approaching the reference plane β can be restricted by the restoring force (pressing force) of the flexible boards F1 and F2 folded in the accommodation space J.

  Of the heat sink support portions 176a to 176c, the two heat sink support portions 176a and 176b (FIG. 18) facing each other in the sub-scanning direction Y and the other two heat sink support portions 176c and 176d (FIG. 18) are flexible. A path for routing the substrates F1 and F2 in the main scanning direction X is configured, and the shortest distance between the two heat sink support portions 176a and 176b and the shortest distance between the other two heat sink support portions 176c and 176d are: It is designed to be narrower than the width of the flexible substrates F1 and F2. Accordingly, the flexible boards F1 and F2 drawn out between the two heat sink support portions can be locked to at least the shortest interval portion of the two heat sink support portions, and the ink discharge device 14 can be accommodated in the storage space of the holder portion 40. When mounting in S, workability can be improved by preventing the flexible substrates F1 and F2 from moving in an undesired direction. Further, in the step before attaching the first heat sink 66, when the ultraviolet curable coating material 188 (FIGS. 5 and 6) is applied around the base portion 170, the flexible substrates F1 and F2 emit ultraviolet rays. The workability can be improved by preventing the blocking.

F1 ... 1st flexible substrate F2 ... 2nd flexible substrate F1a, F2a ... Insulation sheet | seat part F1b, F2b ... Connection wiring F1c, F2c ... Relay wiring F1d, F2d ... Connection part G ... Wiring board L ... Land row Ln ... Nozzle row M ... belt-like regions N1 to N4 ... ink flow path U ... scanning region 10 ... ink jet printer 12 ... ink discharge head 14 ... ink discharge device (liquid discharge device)
22 ... Control unit 26 ... Damper device 60a ... First relay board 60b ... Second relay board 62a ... First board holding member 62b ... Second board holding member 64 ... Substrate housing member 66 ... First heat sink 68 ... Second heat sink 70 ... Nozzle 72 ... Flow path unit 74 ... Actuator unit 76 ... Flexible wiring board 98 ... Pressure chamber 102 ... Diaphragm 104 ... Piezoelectric layer 106 ... Individual electrode 106a ... Electrode portion 106b ... Land (individual electrode terminal)
112 ... Insulating sheet 114A, 114B ... Driver IC
116 ... Connection terminals 118a to 118g ... Wiring 128 ... Solder point 172 ... First component support portion 174 ... Second component support portion 190 ... First placement portion 190a ... First support surface 194 ... Second placement portion 194a ... First 2 Support surface

Claims (5)

A first flexible substrate having flexibility and a first electronic component disposed on a surface thereof; and a second flexible substrate having flexibility and a second electronic component disposed on a surface thereof. A substrate housing member for housing,
A base part;
A first component support portion that protrudes from the base portion and has a first support surface that supports the first electronic component together with a part of the first flexible substrate;
A second protrusion that protrudes from the base portion in the same direction as the first component support portion and is spaced apart from the first component support portion, and supports the second electronic component together with a part of the second flexible substrate. A second component support portion having two support surfaces,
The first flexible substrate and the second flexible substrate are located in a region closer to the base portion than the first support surface and the second support surface between the first component support portion and the second component support portion. The board | substrate accommodation member by which the accommodation space which accommodates another one part is comprised.   At least one of the first component support portion and the second component support portion has a recess that is open toward the accommodation space on the base portion side than the first support surface and the second support surface. The substrate housing member according to claim 1.   A guide surface that serves as a guide for introducing a part of the first flexible substrate or the second flexible substrate is provided on the inner surface of the recess opposite to the base portion side. The board | substrate accommodating member of Claim 2 currently formed so that it may incline so that it may approach the said base part as it goes to the side. The base portion is a plate shape having a substantially rectangular shape in plan view,
The first component support portion and the second component support portion are formed in the vicinity of two parallel sides of the base portion,
In the vicinity of the other two parallel sides of the base portion, a guide portion serving as a guide for pulling out the first flexible substrate and the second flexible substrate accommodated in the accommodation space is provided from the base portion to the first side. The board | substrate accommodating member in any one of Claim 1 thru | or 3 currently protruded and formed in the same direction as the 1 component support part and the said 2nd component support part. A flow path unit having a plurality of nozzles for discharging liquid and a plurality of pressure chambers individually communicated with each of the plurality of nozzles;
An actuator having a plurality of lands individually corresponding to each of the plurality of pressure chambers on the surface, and applying discharge pressure to the liquid in the pressure chamber corresponding to the lands based on an actuator driving voltage applied to the lands Unit,
A first driver IC having flexibility and having a first driver IC disposed on a surface thereof, and applying an actuator driving voltage to the group of lands;
A second flexible substrate having a flexibility and a second driver IC disposed on the surface thereof, for applying an actuator driving voltage to the other group of the lands;
A substrate housing member for housing the first flexible substrate and the second flexible substrate;
The substrate housing member is
A base part;
A first component support part that protrudes from the base part and has a first support surface that supports the first driver IC together with a part of the first flexible substrate;
A second protrusion that protrudes from the base portion in the same direction as the first component support portion and is spaced apart from the first component support portion and supports the second driver IC together with a part of the second flexible substrate. A second component support portion having two support surfaces;
The first flexible substrate and the second flexible substrate are disposed between the first component support portion and the second component support portion in a region closer to the base portion than the first support surface and the second support surface. A liquid ejecting apparatus in which a housing space for housing another part of the housing is configured.

Images