KR20090073690A - Socket for test of bga type semiconductor device - Google Patents

Abstract

A socket for a BGA(Ball Grid Array) type semiconductor device test capable of inspecting various sizes of semiconductor devices is provided to adjust the horizontal position and vertical position of the semiconductor device. A spring holder(30) is installed inside a spring in order to expose the both sides of the spring. A ball guide plate(50) forms guide holes guiding the location of a solder ball of a semiconductor device. A mounting space in which a checking object semiconductor device is inserted is formed in the center of a semiconductor supporting plate. A guide rod is inserted in fixing hole in order to pass through from the above semiconductor supporting plate. A cover pressurizes the checking object semiconductor device supported in the semiconductor supporting plate.

Description

Socket for test of BGA type semiconductor device

The present invention relates to a socket for testing a semiconductor type semiconductor device, and more particularly, it is possible to easily adjust the horizontal position and the vertical position of the semiconductor device, and does not require a separate block for the inspection of the low-cost non-type semiconductor device inspection It's about sockets.

In general, the semiconductor device is subjected to a package assembly process, and then a process of checking the reliability of the operation. The inspection of such a semiconductor device mainly performs electrical characteristic tests to check the normal operation or disconnection, and burn-in test to check the life and defect occurrence under severe conditions. The inspection of the semiconductor element proceeds with the semiconductor element attached to the inspection socket.

Recently, many ball grid array (BGA) type semiconductor devices are installed in which a solder ball is provided in a semiconductor device and connected to an external terminal.

However, in the case of a socket for inspecting a BG-type semiconductor device, since a block having a predetermined shape is formed of aluminum anodizing material or plastic material, manufacturing costs are high.

In the case of the conventional BIG type semiconductor device inspection socket, since it is manufactured to a certain standard, it is impossible to apply substrates of various sizes, and it is difficult to effectively respond to various products by inspecting only products of a predetermined standard, and increase inspection cost. Bring it.

The present invention has been made in view of the above point, and the use of the spring holder is installed in the free state inside the spring consisting of the large diameter portion and the small diameter portion Vigie type that can easily adjust the horizontal position and vertical position of the semiconductor device It is an object of the present invention to provide a socket for semiconductor device inspection.

Another object of the present invention is to test a BG semiconductor device capable of inspecting semiconductor devices of various sizes by manufacturing a spring holder to correspond to a substrate of a semiconductor device of a large size and using a semiconductor support plate corresponding to the size of the semiconductor device. To provide a socket for.

According to the present invention, there is provided a PCB for inspecting a semiconductor device having a base plate formed in a plate shape, and a test area mounted on the base plate to form a circuit for inspection and having an inspection target semiconductor device installed therein. A plurality of springs formed in a central portion and connected to respective circuits of the inspection area of the test substrate, the central side being formed by a large diameter portion having a large outer diameter, and both sides being formed by a small diameter portion, and the springs so that both small diameter portions are exposed to upper and lower surfaces. A spring guide inserted into the spring holder, a ball guide plate installed above the spring holder and guide holes for guiding the solder balls of the semiconductor device to be inspected at regular intervals, and formed on a plurality of ball guide plates, and installed above the ball guide plate. And a semiconductor support in which a mounting space into which the semiconductor element to be inspected is inserted is formed at the center Guide rods and fixing bolts comprising a guide portion having a smaller outer diameter and a locking portion having a larger outer diameter inserted into a plate, a fixing hole formed at each corner portion so as to penetrate from the semiconductor support plate to the inspection substrate, and a locking portion of the guide rod passing therethrough. A coupling hole is formed in a state in which a primary coupling portion having a size of the coupling portion and a secondary coupling portion having a size that does not pass through the guide rod are connected, and a cover for contacting and pressing a semiconductor device to be inspected supported by the semiconductor support plate from above; Is done.

The spring holder is composed of three plates of an upper plate, a lower plate and an intermediate plate, and a plurality of contact holes are formed at regular intervals in a size of the upper plate and the lower plate passing through a small diameter portion of the spring and a large diameter portion. Through-holes are arranged in a one-to-one correspondence with the contact holes in a size through which the large diameter portion of the spring passes.

The secondary coupling portion of the coupling hole formed in the cover is preferably formed to be inclined surface to act as a stable pressing force while the bottom of the engaging portion of the guide rod is naturally guided.

According to the non-use semiconductor device inspection socket according to the present invention, since the spring consisting of the large diameter portion and the small diameter portion is installed freely inside the spring holder, it is possible to easily adjust the horizontal position and the vertical position of the semiconductor element. . That is, since the elastic force of the spring operates individually to the spring holder, the horizontal position and the vertical position of the spring holder are automatically balanced and easily adjusted.

In addition, according to the non-GA type semiconductor device inspection socket according to the present invention, an inspection substrate and a spring holder are manufactured in a size corresponding to a semiconductor device of a large size, and inspection is performed using a semiconductor support plate having a size corresponding to the size of each semiconductor device. Since it is possible to carry out, it is possible to inspect semiconductor elements of various sizes.

And according to the non-use type semiconductor element inspection socket according to the present invention, since the inclined surface is formed in the coupling hole formed in the cover, the fixing of the guide rod is made while tightening efficiently.

According to the non-use type semiconductor element inspection socket according to the present invention, since the structure is simple and does not use a block made of aluminum anodized material, plastic, or the like, it is possible to reduce the manufacturing cost to about 1/10 of the conventional one.

Next, a preferred embodiment of a BI-type semiconductor device inspection socket according to the present invention will be described in detail with reference to the accompanying drawings.

First, as shown in FIGS. 1 to 3, one embodiment of a non-GB type semiconductor device inspection socket according to the present invention includes a base plate 10, an inspection substrate 20, a spring 40, a spring holder 30, Ball guide plate 50, the semiconductor support plate 60, the guide rod 80 and the fixing bolt 88, the cover 70 is made.

1 and 2, a circuit for inspection is formed on the inspection substrate 20.

In the center portion of the inspection substrate 20, an inspection region 21 is formed at a position where the inspection target semiconductor device 2 is installed. Lead wires 26 extend in the inspection area 21, and contact points 24 are formed in portions of the lead wires 26 corresponding to positions having sizes corresponding to the specifications of the inspection target semiconductor device 2.

The contact point 24 may be formed in a planar shape as shown in FIG. 4, and in addition to the planar form, the contact point 24 may be manufactured to be in contact with a spring by forming a solder ball. When the contact point 24 is formed of solder balls, a ball guide plate is interposed between the test substrate 20 and the spring holder 30 (not shown). The solder ball formed at the contact point 24 of the test substrate 20 has the same shape as that of the solder ball 3 of the test target semiconductor device 2 of FIG. 4, and the test board 20 and the spring holder 30 are formed. The ball guide plate interposed therebetween can be formed in the same and similar shape as the ball guide plate 30 of FIG.

A fixing hole 28 is formed through the edge of the inspection area 21.

It is also possible to form four fixing holes 28 one at each corner of the inspection area 21, and one or two more at the corners.

A fixing bolt 88 coupled to the guide rod 80 is inserted into the fixing hole 28.

The fixing bolt 88 has a head 87 formed at one end (lower end), and a male screw 89 is formed at the other end (upper end).

2 and 3, the guide rod 80 includes a guide portion 82 having a smaller outer diameter and a locking portion 84 having an outer diameter larger than that of the guide portion 82.

A female thread (not shown) is formed on the inner surface of the lower end of the guide portion 82 to which the male screw 89 of the fixing bolt 88 is coupled.

The guide rod 80 and the fixing bolt 88 are integrally fixed to each other by being screwed together by the female screw of the guide rod 82 and the male screw 89 of the fixing bolt 88. do.

The guide portion 82 of the guide rod 80 penetrates from the cover 70 to the semiconductor support plate 60, the ball guide plate 60, and the spring holder 50, and the engaging portion of the guide rod 80. 84 is located on the upper surface of the cover 70, the fixing bolt 88 is located through the base plate 10 from the test substrate 20, while the guide portion of the guide rod (80) 82 and the fixing bolt 88 is fastened to each other from the base plate 10 to the cover 70 by being installed so as to be coupled to each other.

Although not shown, the guide rod 80 may be formed as a separate member by separating the guide portion 82 and the locking portion 84 from each other without using the fixing bolt 88. In this case, a female screw is formed at the lower end of the locking portion 84 and a male screw is formed at the upper end of the guide portion 82. In addition, the guide portion 82 of the guide rod 80 forms a head at the opposite end of the male screw.

The guide rod 80 configured as described above is integrally coupled to each other by screwing the male screw of the guide portion 82 and the female screw of the locking portion 84.

The guide rod 80 configured as described above is guided through the inspection substrate 20, the spring holder 30, the ball guide plate 50, and the semiconductor support plate 60 from the base plate 10 to the cover 70. The portion 82 is positioned, and the locking portion 84 is disposed on the upper surface of the cover 70 to perform a function of closely fixing the base plate 10 to the cover 70.

As shown in FIG. 2, the base plate 10 is formed in a plate shape.

The base plate 10 is formed to have a larger size than the inspection area 21 of the inspection substrate 20.

The base plate 10 is installed on the bottom side of the test substrate 20.

The base plate 10 is used to maintain flatness of the test substrate 20.

The base plate 10 is formed at a height capable of preventing the semiconductor parts or circuits for various inspections installed on the inspection substrate 20 from touching the floor.

For example, the height of the base plate 10 is set to a size larger than the height of protrusion of various semiconductor components installed to protrude on the bottom surface of the test substrate 20.

The base plate 10 forms a fixing hole 18 communicating with the fixing hole 28 of the test substrate 20 and into which the fixing bolt 88 is inserted.

The head portion 87 formed at one end of the fixing bolt 88 is supported in contact with the bottom surface of the fixing hole 18.

The bottom surface of the fixing hole 18 is formed in a concave shape so that the head 87 of the fixing bolt 88 does not protrude to the surface of the base plate 10.

The spring 40 may use a general straight spring having a constant outer diameter, it is also possible to use a spring of a different shape.

For example, as shown in Figures 4 to 6, the spring 40 may be formed in a jar shape protruding convex in the center.

In the case where the spring 40 is formed in a jar shape as described above, as shown in FIGS. 4 to 6, a large diameter portion 42 having a large outer diameter is formed at the center, and a small outer diameter is formed on both sides of the large diameter portion 42. The neck 44 is formed.

As illustrated in FIG. 4, the spring 40 electrically connects the contact point 24 of the test substrate 20 and the solder balls 3 of the test target semiconductor device 2 to each other. Therefore, the spring 40 is preferably formed using a material having excellent conductivity.

The small diameter portion 44 is formed to have a smaller diameter than the solder ball 3 installed in the semiconductor device 2, so that the solder ball 3 and the solder ball 3 is not inserted completely into the small diameter portion 44 stably. It is preferable because contact is made.

In addition, the small diameter portion 44 is preferably formed with a diameter larger than 1/3 of the diameter of the solder ball (3), since a portion of the solder ball (3) is sufficiently inserted and stable contact is made.

The spring 40 is installed to be arranged at a predetermined interval on the spring holder 30.

The springs 40 installed in the spring holder 30 are arranged at intervals corresponding to the pitches of the solder balls 3 of the inspection target semiconductor device 2.

As illustrated in FIG. 6, the spring holder 30 is inserted into the spring holder 30 so that both small diameter portions 44 of the spring 40 are exposed upward and downward.

As shown in FIGS. 5 and 6, the spring holder 30 is formed by integrally coupling three plates, an upper plate 36, a lower plate 32, and an intermediate plate 34.

The small diameter portion 44 of the spring 40 passes through the upper plate 36 and the lower plate 32, and the large diameter portion 42 is engaged, and a plurality of contact holes 37 and 33 are arranged at regular intervals. Is formed.

The through hole 35 is formed in the intermediate plate 34 so as to pass through the large diameter portion 42 of the spring 40 in a one-to-one correspondence with the contact holes 37 and 33.

In the state in which the lower plate 32 and the intermediate plate 34 of the spring holder 30 configured as described above are integrally coupled, the spring 40 is inserted one by one into each through hole 35, and then the upper plate 36 is inserted. The spring 40 is installed inside the spring holder 30 by integrally coupling the upper portion of the intermediate plate 34.

In the above, the lower plate 32 and the intermediate plate 34 are not formed separately from each other, but may be formed as one member, and the through hole 35 and the contact hole 33 may be formed in a step shape.

The lower plate 32, the intermediate plate 34, the upper plate 36 may be integrally coupled using an adhesive, or may be integrally coupled using a small screw or bolt, and may form protrusions and grooves. It is also possible to combine them integrally.

The pitch of the contact holes 33, 37 and the through hole 35 (the pitch at which the spring 40 is installed) formed in the spring holder 30 is the solder ball 3 of the semiconductor element 2 to be inspected. When the pitch is set so as to correspond to the pitch between the plurality of inspection target semiconductor elements 2, and only the pitch between the solder balls 3 of each inspection target semiconductor element 2 is manufactured to a certain standard, one spring holder 30 It is possible to apply

In addition, the area of the inspection area 21 of the inspection substrate 20 and the installation area of the spring 40 installed in the spring holder 30 are the size of the semiconductor element 2 having a large size (for example, horizontal × When the vertical pitch is set to 40 × 40 pitch, the inspection of the semiconductor element 2 of smaller size (e.g., 30 × 30 pitch or 20 × 20 pitch respectively) is performed. It is also possible to do.

The spring holder 30 has a fixing hole 38 into which the guide portion 82 of the guide rod 80 is inserted is formed at a position corresponding to the fixing hole 28 of the test substrate 20.

In the above, a plurality of springs 40 and spring holders 30 are used as a means for connecting to each circuit of the inspection area 21 of the inspection substrate 20. However, the present invention is not limited thereto. It is also possible to apply elastomers.

For example, as illustrated in FIG. 8, a plurality of conductive filaments 92 connected to respective circuits of the test area 21 of the test board 20 are elastic at regular intervals such as silicone, elastic rubber, soft synthetic resin, and the like. It is also possible to use an elastomer plate 90 arranged on the material instead of the spring holder 30 and the spring 40.

The ball guide plate 50 is installed on the spring holder 30, as shown in Figs.

The ball guide plate 50 is formed with a plurality of guide holes 52 for guiding the position of the solder ball 3 of the inspection target semiconductor element 2 at regular intervals.

The guide holes 56 are formed in a one-to-one correspondence with the contact holes 37 of the spring holder 30.

The ball guide plate 50 is installed above the spring holder 30 so that the upper small diameter portion 44 of the spring 40 installed in the spring holder 30 is inserted into each guide hole 52 (Fig. 4).

The ball guide plate 50 has fixing holes 58 into which the guide portion 82 of the guide rod 80 is inserted, respectively, at positions corresponding to the fixing holes 28 of the test substrate 20.

2 and 3, the semiconductor support plate 60 is provided above the ball guide plate 50.

In the semiconductor support plate 60, a mounting space 66 into which the inspection target semiconductor device 2 is inserted is formed at the center thereof.

In the semiconductor support plate 60, fixing holes 68 into which the guide portion 82 of the guide rod 80 is inserted are formed at positions corresponding to the fixing holes 28 of the test substrate 20, respectively.

When the semiconductor element 2 to be inspected is inserted into the mounting space 66 while the semiconductor support plate 60 is installed above the ball guide plate 50, the solder balls 3 of the semiconductor element 2 to be inspected are provided. Each of the guide holes 52 formed in the ball guide plate 50 is inserted into contact with the upper end diameter 44 of the spring 40 inserted into the guide hole 52 (see FIG. 4).

The semiconductor support plate 60 forms a mounting space 66 according to the size of the inspection target semiconductor element 2 mounted therein, and has a plurality of types corresponding to the inspection target semiconductor elements 2 having different sizes. It is preferable.

The semiconductor support plate 60 may be selected and used corresponding to the size of the semiconductor element 2 to be inspected.

As shown in FIGS. 1 to 3, the cover 70 is provided above the semiconductor support plate 60 so as to contact the inspection target semiconductor element 2 mounted on the semiconductor support plate 60 from above. Is installed.

The cover 70 has a coupling hole 78 into which the guide rod 80 is inserted.

As shown in FIG. 7, the coupling hole 78 includes a primary coupling part 77 having a size through which the locking portion 84 of the guide rod 80 passes, and a locking portion of the guide rod 80. 84 is formed in a state that the secondary coupling portion 79 of a size that does not pass through.

The coupling hole 78 is formed by connecting the primary coupling portion 77 and the secondary coupling portion 79 in a peanut shape.

As shown in FIG. 7, the secondary coupling portion 79 of the coupling hole 78 formed in the cover 70 is guided to a stable pressing force while the bottom surface of the locking portion 84 of the guide rod 80 is naturally guided. It is preferable to form the inclined surface 76 so as to.

The coupling hole 78 is formed such that the secondary coupling portion 79 is positioned at a position corresponding to the position of the fixing hole 28 formed in the test substrate 20.

Next, a process of inspecting the inspection target semiconductor device 2 will be described by using an embodiment of the BG-type semiconductor device inspection socket according to the present invention configured as described above.

First, the fixing bolts 88 are respectively inserted into the fixing holes 18 of the base plate 10, and the fixing plate 28 is inserted into the fixing bolts 88 so that the fixing holes 28 of the test substrate 20 are inserted into the fixing plate 88. 10) Install the inspection board 20 on the upper side.

Then, the spring holder 30 is installed on the inspection substrate 20 so that the spring 40 is installed therein so that the fixing hole 38 is positioned at the same position as the fixing hole 28 of the inspection substrate 20. The ball guide plate 50 is installed by arranging the fixing hole 58 above the spring holder 30 to be at the same position as the fixing hole 38.

The semiconductor support plate 60 is disposed on the ball guide plate 50 so that the fixing hole 68 is positioned at the same position as the fixing hole 58, and the inspection target is placed in the mounting space 66 of the semiconductor support plate 60. The semiconductor element 2 is mounted.

In the above state, the guide portion 82 of the guide rod 80 includes the fixing hole 68 of the semiconductor support plate 60, the fixing hole 58 of the ball guide plate 50, and the fixing hole of the spring holder 30. The fixing rod 88 is installed to penetrate the fixing rod 18 of the base plate 10 and the fixing hole 28 of the test substrate 20. The male screw 89 and the female screw of the guide rod 80 and the guide portion 82 are screwed together to be integrally coupled.

In addition, the cover 70 is installed on the semiconductor support plate 60 in a state where the locking portion 84 of the guide rod 80 is inserted into the primary coupling part 77 of the cover 70. 70 is rotated from the primary coupling portion 77 toward the secondary coupling portion 79.

When the cover 70 is rotated as described above, the locking portion 84 of the guide rod 80 approaches the secondary coupling portion 79 of the cover 70 and presses the cover 70 downward. The base plate 10, the inspection substrate 20, the spring holder 30, the ball guide plate 50, the semiconductor paper support plate 60, the inspection target semiconductor device 2, and the cover 70 closely adhere to each other. State is maintained.

In the present invention, the coupling hole 78 of the cover 70 is not composed of only the primary coupling portion 77 and the secondary coupling portion 79, but between the primary coupling portion 77 and the secondary coupling portion 79. Since the inclined surface 76 is formed to increase toward the secondary coupling portion 79, the guide rod 80 can be reliably coupled to the secondary coupling portion 79 along the inclined surface 76, thereby An effect that the lid 70 is stably fastened to the upper portion of the semiconductor support plate 60 is obtained.

When the coupling is completed as described above, as shown in FIG. 4, the upper small diameter portion 44 of the spring 40 is in contact with the solder ball 3 of the inspection target semiconductor element 2, and the lower small diameter portion of the spring 40 is contacted. 44 is in contact with the contact point 24 of the inspection substrate 20, the inspection substrate 20 and the inspection target semiconductor element 2 is electrically connected to perform the necessary inspection.

According to one embodiment of the non-VSI semiconductor device inspection socket according to the present invention made as described above, the overall assembly is guided to each of the fixing holes (18), (28), (38), (58), (68) Since it consists of inserting the guide portion 82 and the fixing bolt 88 of the rod 80, it is possible to assemble economically and efficiently. Further, by precisely forming the size and position of each of the fixing holes 18, 28, 38, 58, and 68, precise positioning is possible.

In addition, since the spring 40 is freely positioned inside the through hole 35 and the contact holes 33 and 37 of the spring holder 30, the spring 40 is in contact with the solder ball 3 and the contact point 24. ) Excellent in properties

In the above, a preferred embodiment of a non-GE semiconductor device inspection socket according to the present invention has been described, but the present invention is not limited thereto, and various modifications are made within the scope of the claims and the detailed description of the invention and the accompanying drawings. It is possible to implement, and this also belongs to the scope of the present invention.

1 is a perspective view showing an embodiment of a socket for testing a semiconductor device according to the present invention.

Figure 2 is an exploded perspective view showing one embodiment of a socket for testing a semiconductor device according to the present invention.

Figure 3 is an assembled cross-sectional view showing an embodiment of a socket for testing a semiconductor device according to the present invention.

FIG. 4 is a partially enlarged cross-sectional view illustrating a contact state from an inspection target semiconductor element to an inspection substrate in one embodiment of a socket for a semiconductor device inspection according to the present invention.

5 is a partially enlarged exploded perspective view illustrating a spring holder and a spring in one embodiment of a socket for testing a semiconductor device according to the present invention;

FIG. 6 is a partially enlarged cross-sectional view illustrating a coupling state of a spring holder and a spring in one embodiment of a socket for testing a semiconductor device according to the present invention; FIG.

FIG. 7 is a partially enlarged perspective view illustrating a coupling hole of a cover in an embodiment of a Visage-type semiconductor device inspection socket according to the present invention. FIG.

FIG. 8 is a partially enlarged cross-sectional view showing an embodiment of an elastomer plate used in place of a spring and a spring holder in another embodiment of a BSI inspection socket according to the present invention.

Claims (8)

A base plate formed in a plate shape, An inspection substrate which is mounted on the base plate and has a circuit for inspection and an inspection target semiconductor device is installed and electrically connected to each other, the inspection region being formed in a central portion thereof; A plurality of springs respectively connected to respective circuits of the inspection region of the inspection substrate; A spring holder into which the spring is inserted and installed so that both ends of the spring are exposed upward and downward; A ball guide plate installed above the spring holder and formed with a plurality of guide holes arranged at predetermined intervals to guide the positions of the solder balls of the semiconductor device to be inspected; A semiconductor support plate installed above the ball guide plate and having a mounting space in the center of which the semiconductor element to be inspected is inserted; A guide rod comprising a guide portion having a smaller outer diameter inserted into a fixing hole formed at each corner portion to penetrate from the semiconductor support plate to the inspection substrate, and a locking portion having a larger outer diameter; A coupling hole is formed in a state in which a primary coupling portion having a size through which the locking portion of the guide rod passes and a secondary coupling portion having a size where the locking portion cannot pass through the guide rod is connected, and a semiconductor element to be inspected supported by the semiconductor support plate is contacted from above. Socket for testing a semiconductor type semiconductor element including a cover for pressing. A base plate formed in a plate shape, An inspection substrate which is mounted on the base plate and has a circuit for inspection and an inspection target semiconductor device is installed and electrically connected to each other, the inspection region being formed in a central portion thereof; A plurality of springs connected to respective circuits of the inspection area of the test substrate, each having a large diameter portion having a large outer diameter and a small diameter portion at both sides thereof; A spring holder into which the spring is inserted and installed so that both ends of the spring are exposed upward and downward; A ball guide plate installed above the spring holder and formed with a plurality of guide holes arranged at predetermined intervals to guide the positions of the solder balls of the semiconductor device to be inspected; A semiconductor support plate installed above the ball guide plate and having a mounting space in the center of which the semiconductor element to be inspected is inserted; A guide rod comprising a guide portion having a smaller outer diameter inserted into a fixing hole formed at each corner portion to penetrate from the semiconductor support plate to the inspection substrate, and a locking portion having a larger outer diameter; A coupling hole is formed in a state in which a primary coupling portion having a size through which the locking portion of the guide rod passes and a secondary coupling portion having a size where the locking portion cannot pass through the guide rod is connected, and a semiconductor element to be inspected supported by the semiconductor support plate is contacted from above. Socket for testing a semiconductor type semiconductor element including a cover for pressing. The method according to claim 2, The spring holder is made of an upper plate and a lower plate and an intermediate plate, The upper plate and the lower plate pass through the small diameter portion of the spring, and the large diameter portion is formed in such a size that a plurality of contact holes are arranged at regular intervals, and the middle plate has a size through which the large diameter portion of the spring passes through the one-to-one contact hole. A socket for testing a BI-type semiconductor element, which is arranged correspondingly. A base plate formed in a plate shape, An inspection substrate which is mounted on the base plate and has a circuit for inspection and an inspection target semiconductor device is installed and electrically connected to each other, the inspection region being formed in a central portion thereof; An elastomer plate in which a plurality of conductive filaments respectively connected to respective circuits of the inspection region of the inspection substrate are arranged on the elastic material at regular intervals; A ball guide plate installed above the elastomer plate and formed with a plurality of guide holes arranged at regular intervals to guide the position of the solder ball of the semiconductor element to be inspected; A semiconductor support plate installed above the ball guide plate and having a mounting space in the center of which the semiconductor element to be inspected is inserted; A guide rod made up of a guide portion having a smaller outer diameter inserted into a fixing hole formed at each corner portion to penetrate from the semiconductor support plate to the inspection substrate, and a locking portion having a larger outer diameter; A coupling hole is formed in a state in which a primary coupling portion having a size through which the locking portion of the guide rod passes and a secondary coupling portion having a size where the locking portion cannot pass through the guide rod is connected, and a semiconductor element to be inspected supported by the semiconductor support plate is contacted from above. Socket for testing a semiconductor type semiconductor element including a cover for pressing. The method according to any one of claims 1, 2 and 4, The secondary coupling part of the coupling hole formed in the cover is a non-visible semiconductor device inspection socket is formed in the inclined surface that is higher from the primary coupling portion to the secondary coupling portion so that the lower surface of the engaging portion of the guide rod is guided naturally to act a stable pressing force. The method according to claim 5, The guide rods are formed as separate members, each separating the guide portion and the locking portion, The lower end of the guide portion forms a head and the upper end forms a male screw, A socket for testing a semiconductor element, in which the engaging portion forms a female screw to which the male screw of the guide portion is coupled. The method according to claim 5, Further comprising a fixing bolt which penetrates from the base plate to the test substrate, One end of the fixing bolt to form a head and the other end to form a male screw, The guide portion of the guide rod is formed so as to be located from the cover to the test substrate, Socket for testing a semiconductor device to form a female screw threaded to the male screw of the fixing bolt in the lower end of the guide portion of the guide rod. The method according to any one of claims 1, 2 and 4, And a contact point connected to a spring in each circuit of an inspection region of the inspection substrate by solder balls, and additionally interposing a ball guide plate between the inspection substrate and the spring holder.

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